CN1799820A - Hot compressing link method of polymer microfluid system - Google Patents
Hot compressing link method of polymer microfluid system Download PDFInfo
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- CN1799820A CN1799820A CN 200410103236 CN200410103236A CN1799820A CN 1799820 A CN1799820 A CN 1799820A CN 200410103236 CN200410103236 CN 200410103236 CN 200410103236 A CN200410103236 A CN 200410103236A CN 1799820 A CN1799820 A CN 1799820A
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Abstract
The invention relates to a thermal compression bonding method of polymer micro-liquid system. First, cleaning the surface of a polymer with micro structure and the surface of another polymer without micro structure and keeping them dry, which is characterized in that adding the monomer or homologue of said polymer into the surface of polymer without said micro structure, while the added amount is 10-40% of the weight of added polymer surface, and the adding depth is 0.1-10 micrometers; arranging said two surfaces face-to-face between two plates and adding the pressure of 0.5-5MPa to be heated in the temperature which is lower 5-20Deg. C than the vitrification temperature of said polymer for 2 minutes; removing pressure to be cooled slowly to room temperature to attain bonded polymer micro-liquid system. The adding method can select steam method, rotary plating method or dipping method. The invention can reduce the vitrification temperature of polymer surface, solve the bonding strength problem, and improve the bonding efficiency via adding polymer monomer or homologue, while it has simple process and the application to the bonding of polymer micro structures with different surface flatness.
Description
Technical field:
The invention belongs to the bonding method technical field of microelectromechanical systems, particularly relate to the thermocompression bonding technology of micro polymer fluid system.
Background technology:
Along with the development of Micrometer-Nanometer Processing Technology, come into one's own day by day in the research of micro-fluidic chip and biochip based on the processing technology of polymeric material, formed the new biochemical microfluid system device of a class.Polymeric material not only has good bio-compatibility, and it is of a great variety, cheap, and be easy to realize the production of large-scale low-cost, overcome the expensive low-producing limitation of producing biochemical micro-system based on the processing technology of silicon or glass material by mold pressing, injection moulding and other reproduction technology.Simultaneously, polymeric material is easy to change EOF by surface modification, has broad application prospects.
Bonding is the process procedure of a key during biochemical microfluid system is made, for polymeric material, and the bonding or thermal bonding of many at present employings.Bonding is a kind of bonding techniques very easily, but has also existed a lot of deficiencies.U.S.'s " analytical chemistry " (Anal.Chem., 73,2001, point out that p4196-4201) because bonding agent is different with matrix material, may produce the broadening of sample area band, simultaneously, bonding agent stops up the microchannel again easily, and has possible pollution problem.Thermal bonding is more common bonding techniques, and bonding temperature is high more usually, and bond strength is also big more, the easy more realization of bonding, but the thermal deformation of polymer micro-structural is also just big more.So the thermal bonding temperature is lower than the glass transition temperature of polymer usually, this has just brought the low problem of bond strength, is difficult to satisfy the needs of microfluid system practicability.In order to address this problem, and Britain's " microelectronics " (Microelectronics Journal, 34 (3), 2003, p179-185) proposed to adopt the method for local heat fusion to make the regional area that needs bonding melting adhered and other position is in low-temperature condition.But this method control is complicated, uniformity is difficult to guarantee that simultaneously, its bonding efficiency is very low, a convenience point bonding and line bonding.In order to adapt to the needs of polymerization object plane bonding, Germany " microsystems technology " (Microsystem technologies, 10,2004, p372-374) proposed to utilize the method for ultraviolet degradation polymer to reduce the molecular weight on the nearly surface of polymer, thereby reduce the glass transition temperature of bonding surface, so just can select suitable thermocompression bonding temperature, make it be higher than the glass transition temperature of polymer surfaces and be lower than the glass transition temperature of polymer body, can when improving bond strength, reduce the thermal deformation of micro-structural.Though this method is simple, also exist tangible deficiency: at first, be applicable to that the type of polymer of ultraviolet degradation is less, the glass transition temperature of most polymer can not reduce behind ultraviolet irradiation; Secondly, change has taken place in a lot of performances of degradation polymer, and this can change the performance of microfluid system widely.
Summary of the invention:
The present invention proposes a kind of thermocompression bonding method of micro polymer fluid system, by monomer that adds polymer or the glass transition temperature that homologue reduces polymer surfaces, to solve the thermocompression bonding strength problem of the still unsolved micro polymer fluid system of prior art.
The thermocompression bonding method of micro polymer fluid system of the present invention, to need of mutual bonding to contain micro-structural and another polymer flake surface that does not contain micro-structural earlier carries out cleaning and keeps dry, it is characterized in that adding the monomer or the homologue of this polymer to do not contain micro-structural polymer surfaces, the addition of described monomer or homologue is the 10%-40% of the polymer surfaces weight that is added, adds the degree of depth at the 0.1-10 micron; These two surfaces are put between two flat boards face-to-face, added 0.5-5Mpa pressure, keep down being no less than 2 minutes being lower than 5-20 ℃ of polymer glass temperature; Remove pressure, slowly cool to room temperature, promptly obtain the micro polymer fluid system of bonding.
According to the dissolution properties of the polymer that is adopted and monomer whose or homologue and the required interpolation degree of depth, optional in order to descend method to add monomer or homologue:
If 1 monomer or homologue are that the good solvent of its polymer, the required interpolation degree of depth are more shallow, can select steaming process for use: polymer is put into the steam of monomer or homologue, and temperature is controlled at the boiling point of room temperature to monomer or homologue, and the time is 1 minute-1 hour; Can control addition and add the degree of depth by control time and/or temperature, the degree of depth of interpolation be generally the 0.1-1 micron;
If 2 monomers or homologue are not that the good solvent of its polymer, the required interpolation degree of depth are more shallow, can select the rotation smear method for use: monomer or homologue are dropped in polymer surfaces, rotated polymer 0.1-1 minute with 500-2000 rev/min speed, temperature is controlled at room temperature between the vitrification point of polymer, makes its surface evenly be coated monomer or homologue; Can control addition by control rotary speed, time and/or temperature, it adds the degree of depth and is generally the 0.1-2 micron;
If the 3 required interpolation degree of depth are darker, can select infusion process for use: polymer was immersed in monomer or the homologue 0.1-5 minute, and temperature is controlled at room temperature between the polymer glass temperature; Can and add the degree of depth by control time and/or temperature control addition, the degree of depth of its interpolation is generally the 1-10 micron.
Compared with prior art, because having adopted at the polymer surfaces that does not contain micro-structural, the present invention adds polymer monomer or homologue, reduced the glass transition temperature of polymer surfaces, thereby realized on the glass transition temperature of polymer, carrying out the thermocompression bonding of polymer micro-structural, overcome the deficiency of conventional hot-press bonding techniques, solve the bond strength problem of micro polymer fluid system effectively, shortened the bonding time simultaneously, improved bonding efficiency.The inventive method technology is simple, the bonding that can adapt to the polymer micro-structural of different surfaces flatness, adopting the monomer or the homologue of polymer can not bring pollution problem simultaneously, is improving and expanding thermocompression bonding fabrication techniques micro polymer fluid system method.
In order when realizing bonding, not change the size and the surface property of polymer micro-structural as far as possible, should guarantee to add more a spot of polymer monomer or homologue to polymer surfaces under the prerequisite that two bonding faces fully contact on the technology.If it is better to contain the polymer surfaces flatness of micro-structural, then the monomer of polymer or homologue add the degree of depth of the polymer surfaces that does not contain micro-structural to can be more shallow, otherwise then need darker, to satisfy the abundant contact on two surfaces.
The specific embodiment:
Below in conjunction with embodiment the detailed process of polymer micro-structural thermocompression bonding further is illustrated.
The bonding of embodiment 1. polymethyl methacrylates (PMMA) microfluid system
1) cleaning of PMMA thin slice, drying
Get two PMMA thin slices that 2mm is thick, a slice contains microstructure graph, and its surface smoothness is less than 1 micron, and a slice does not contain figure, and size all is 5cm * 5cm.Use ethanol that two PMMA thin slice cleanings are clean earlier, it is clean to spend deionised water again, then two PMMA thin slices is put into 80 ℃ of bakings of baking oven 4 hours, puts into drying box at last and preserves.
2) surface modification of PMMA thin slice
The PMMA thin slice that does not contain microstructure graph is placed on the photoresist spinner, on thin slice, drips polymer monomer methyl methacrylate (MMA), 1000 rev/mins of spin coateds 10 seconds.
MMA can dissolve PMMA, but it is not the good solvent of PMMA.If it is better to contain the PMMA surface smoothness of micro-structural, can adopts and rotate the surface modification that smear method carries out the PMMA thin slice, the surface of less MMA being added to PMMA.
3) thermocompression bonding of PMMA microfluid system
Two PMMA thin slices are put between two flat boards, had the one side of micro-structural relative with the one side of handling with MMA.Kept 2 minutes under 85 ℃, 0.5Mpa condition.
In the thermocompression bonding technology, bond strength is the increase of raising, bonding pressure along with bonding temperature and the prolongation of bonding time and increase gradually, carries out bonding and can obtain better bond strength under higher temperature, big pressure and long period condition.
Because the interpolation of polymer monomer has reduced the glass transition temperature of polymer surfaces, make thermocompression bonding to carry out being higher than on the vitrification point of polymer surfaces, this just makes bonding carry out easily, and the bonding time can shorten greatly, and common thermocompression bonding generally needs 1 hour.
4) remove temperature and pressure
Remove pressure, slowly cool the temperature to room temperature, rate of temperature fall is 2 ℃/minute, obtains the PMMA microfluid system of bonding.
The bonding of embodiment 2. polymethyl methacrylates (PMMA) microfluid system
1) cleaning of PMMA thin slice, drying
Get two PMMA thin slices that 2mm is thick, a slice contains microstructure graph, and its surface smoothness is greater than 1 micron, and a slice does not contain figure, and size all is 5cm * 5cm.Use ethanol that two PMMA thin slice cleanings are clean earlier, it is clean to spend deionised water again, then two PMMA thin slices is put into 80 ℃ of bakings of baking oven 4 hours, puts into drying box at last and preserves.
2) surface modification of PMMA thin slice
Add polymer monomer MMA in glass container, the PMMA thin slice that will not contain microstructure graph is then put into MMA, takes out after 1 minute, with nitrogen surface attachment MMA is blown away.
MMA can dissolve PMMA, but it is not the good solvent of PMMA.If it is bad to contain the PMMA surface smoothness of micro-structural, can adopt infusion process to carry out the surface modification of PMMA thin slice, more MMA is added to the surface of PMMA.
3) thermocompression bonding of PMMA microfluid system
Two PMMA thin slices are put between two flat boards, had the one side of micro-structural relative with the one side of handling with MMA.Kept 2 minutes under 85 ℃, 0.5Mpa condition.
4) remove temperature and pressure
Remove pressure, slowly cool the temperature to room temperature, rate of temperature fall is 2 ℃/minute, obtains the PMMA microfluid system of bonding.
The bonding of embodiment 3. polystyrene (PS) microfluid system
1) cleaning of PS thin slice, drying
Get two PS thin slices that 2mm is thick, a slice contains microstructure graph, and its surface irregularity degree is less than 1 micron, and a slice does not contain figure, and size all is 5cm * 5cm.Use ethanol that two PS thin slice cleanings are clean earlier, it is clean to spend deionised water again, then two PS thin slices is put into 75 ℃ of bakings of baking oven 4 hours, puts into drying box at last and preserves.
2) surface modification of PS thin slice
In glass container, add polymer monomer styrene, put into glass container after the PS thin slice that will not contain microstructure graph then is heated to 75 ℃, in cinnamic steam, place after 5 minutes and take out.
Styrene is the good solvent of PS, if adopt rotation smear method or infusion process to carry out the surface modification of PS thin slice, the surface that too many styrene may be added to PS is so adopt steaming process proper.In addition, temperature controlling can realize by the temperature that changes polymer and monomer respectively in the steaming process.
3) thermocompression bonding of PS microfluid system
Two PS thin slices are put between two flat boards, had the one side of micro-structural relative with the one side of handling with styrene.Kept 2 minutes under 80 ℃, 0.5Mpa condition.
4) remove temperature and pressure
Remove pressure, slowly cool the temperature to room temperature, rate of temperature fall is 2 ℃/minute, obtains the PS microfluid system of bonding.
Effect detection:
The micro polymer fluid system that obtains in the foregoing description is carried out the detection of thermocompression bonding intensity:
The PMMA of bonding and PS microfluid system are put into the MTS material testing machine respectively carry out extension test, test is force control mode, progressively reinforcing to microfluid system is drawn back, and afterburning speed was 30 newton/seconds, and the pulling force of this moment is the thermocompression bonding intensity of micro polymer fluid system.Employing detects the thermocompression bonding intensity of the micro polymer fluid system that utilizes the acquisition of conventional hot-press bonding with quadrat method.
Test result shows that the thermocompression bonding intensity among the embodiment 1 is 0.07Mpa, and adopting the thermocompression bonding intensity of conventional hot-press bonding is 0.01Mpa; Thermocompression bonding intensity among the embodiment 2 is 0.08Mpa, adopts the conventional hot-press bonding to fail to realize effective thermal bonding; Thermocompression bonding intensity among the embodiment 3 is 0.03Mpa, and adopting the thermocompression bonding intensity of conventional hot-press bonding is 0.01Mpa.So the micro polymer fluid system thermocompression bonding intensity of adding polymer monomer is 3-7 times of conventional hot-press bond strength, the present invention can improve thermocompression bonding intensity effectively.
Claims (4)
1, a kind of thermocompression bonding method of micro polymer fluid system, to need of mutual bonding to contain micro-structural and another polymer flake surface that does not contain micro-structural earlier carries out cleaning and keeps dry, it is characterized in that adding the monomer or the homologue of this polymer to do not contain micro-structural polymer surfaces, the addition of described monomer or homologue is the 10%-40% of the polymer surfaces weight that is added, adds the degree of depth at the 0.1-10 micron; These two surfaces are put between two flat boards face-to-face, added 0.5-5Mpa pressure, keep down being no less than 2 minutes being lower than 5-20 ℃ of polymer glass temperature; Remove pressure, slowly cool to room temperature, promptly obtain the micro polymer fluid system of bonding.
2, the thermocompression bonding method of micro polymer fluid system according to claim 1, it is characterized in that describedly adding polymer monomer or homologue to do not contain micro-structural polymer surfaces and adopting steaming process, that is: polymer is put into the steam of monomer or homologue, temperature is controlled at the boiling point of room temperature to monomer or homologue, and the time is 1 minute-1 hour.
3, the thermocompression bonding method of micro polymer fluid system according to claim 1, it is characterized in that describedly adding polymer monomer or homologue to do not contain micro-structural polymer surfaces and adopting the rotation smear method, that is: monomer or homologue are dropped in polymer surfaces, rotated polymer 0.1-1 minute with 500-2000 rev/min speed, temperature is controlled at room temperature between the vitrification point of polymer, makes its surface evenly be coated monomer or homologue.
4, the thermocompression bonding method of micro polymer fluid system according to claim 1, it is characterized in that describedly adding polymer monomer or homologue to do not contain micro-structural polymer surfaces and adopting infusion process, that is: polymer was immersed in monomer or the homologue 0.1-5 minute, temperature is controlled at room temperature between the polymer glass temperature.
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| CN 200410103236 CN1799820A (en) | 2004-12-31 | 2004-12-31 | Hot compressing link method of polymer microfluid system |
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| CN 200410103236 CN1799820A (en) | 2004-12-31 | 2004-12-31 | Hot compressing link method of polymer microfluid system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101853795A (en) * | 2010-05-07 | 2010-10-06 | 华中科技大学 | Low-temperature thermocompression bonding method |
| CN102190287A (en) * | 2011-03-24 | 2011-09-21 | 大连理工大学 | Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| CN103172018A (en) * | 2013-03-18 | 2013-06-26 | 哈尔滨工业大学 | Organic solvent auxiliary bonding method based on organic polymer material micro-fluidic chip |
| CN106226195A (en) * | 2016-09-28 | 2016-12-14 | 长江水利委员会长江科学院 | The automatic control experimental device of Sediment Siltation thing dry density change and experimental technique thereof |
| CN107150996A (en) * | 2016-03-03 | 2017-09-12 | 中国科学院微电子研究所 | A kind of alignment bonding structure being used in microfluid system and preparation method thereof |
| CN108162413A (en) * | 2017-12-27 | 2018-06-15 | 北京百奥芯科技有限公司 | A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding |
| CN115038517A (en) * | 2020-01-21 | 2022-09-09 | 苏州恒瑞宏远医疗科技有限公司 | Reaction device and processing method thereof, and preparation equipment and preparation method of embolism microsphere |
-
2004
- 2004-12-31 CN CN 200410103236 patent/CN1799820A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101853795A (en) * | 2010-05-07 | 2010-10-06 | 华中科技大学 | Low-temperature thermocompression bonding method |
| CN101853795B (en) * | 2010-05-07 | 2011-09-14 | 华中科技大学 | Low-temperature thermocompression bonding method |
| CN102190287A (en) * | 2011-03-24 | 2011-09-21 | 大连理工大学 | Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| CN102190287B (en) * | 2011-03-24 | 2013-10-16 | 大连理工大学 | Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| CN103172018A (en) * | 2013-03-18 | 2013-06-26 | 哈尔滨工业大学 | Organic solvent auxiliary bonding method based on organic polymer material micro-fluidic chip |
| CN107150996A (en) * | 2016-03-03 | 2017-09-12 | 中国科学院微电子研究所 | A kind of alignment bonding structure being used in microfluid system and preparation method thereof |
| CN107150996B (en) * | 2016-03-03 | 2020-07-21 | 中国科学院微电子研究所 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
| CN106226195A (en) * | 2016-09-28 | 2016-12-14 | 长江水利委员会长江科学院 | The automatic control experimental device of Sediment Siltation thing dry density change and experimental technique thereof |
| CN106226195B (en) * | 2016-09-28 | 2023-06-23 | 长江水利委员会长江科学院 | Automatic control experimental device and experimental method for dry volume weight change of sediment sludge |
| CN108162413A (en) * | 2017-12-27 | 2018-06-15 | 北京百奥芯科技有限公司 | A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding |
| CN115038517A (en) * | 2020-01-21 | 2022-09-09 | 苏州恒瑞宏远医疗科技有限公司 | Reaction device and processing method thereof, and preparation equipment and preparation method of embolism microsphere |
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