CN107150996A - A kind of alignment bonding structure being used in microfluid system and preparation method thereof - Google Patents
A kind of alignment bonding structure being used in microfluid system and preparation method thereof Download PDFInfo
- Publication number
- CN107150996A CN107150996A CN201610121968.9A CN201610121968A CN107150996A CN 107150996 A CN107150996 A CN 107150996A CN 201610121968 A CN201610121968 A CN 201610121968A CN 107150996 A CN107150996 A CN 107150996A
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- Prior art keywords
- polymer
- alignment
- light transmissive
- bonding
- microfluid system
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 95
- 229920000642 polymer Polymers 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 35
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 25
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000002203 pretreatment Methods 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- -1 polydimethylsiloxane Polymers 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 1
- 150000004702 methyl esters Chemical class 0.000 claims 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 24
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 21
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010219 correlation analysis Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000000382 optic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
- B81C3/005—Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
Abstract
The invention discloses a kind of alignment bonding structure being used in microfluid system and preparation method thereof, polymer is fixed using hard light transmissive material for this method, by the alignment of hard light transmissive material and base material and it is bonded, and then realize that polymer is bonded with the alignment of base material, avoid and be directed at the problem of bonding is inaccurate because the material of polymer is caused in itself, improve the alignment precision of bonding.Technique is simple, improves the efficiency of bonding.
Description
Technical field
The application is related to the bonding techniques field of microfluid system, more particularly to a kind of in microfluid system
Alignment bonding structure and preparation method thereof.
Background technology
From 1990s, micro-fluidic technologies as analysis system, biological medicine device, chemistry and
Biochemical tools have given play to more and more important effect, mainly realize biochemical correlation analysis equipment
Be miniaturized, it is integrated, and improve its portability.Bonding is a crucial skill during microfluid makes
The yardstick of the effective passage of fluid, fluid matasomatism part in art link, microfluid system is at least in a dimension
It is that, in micron order, this has very high requirement with regard to para-linkage craft precision.
With the development of Micrometer-Nanometer Processing Technology, the microfluid system based on polymer is increasingly paid attention to, and gathers
The bonding techniques research of the base material such as compound and polymer, metal, silicon chip, glass and quartz has very
Important meaning.In general bonding, polymer contains micro-structural, and substrate does not contain micro-structural, so polymerization
Alignment issues are not present in thing and substrate bonding.When substrate also contains micro-structural, pair of polymer and substrate
Quasi- bonding and its high-precision requirement are just into urgent problem to be solved.Polymeric material is special because of the material of itself
Property, and malformation etc. caused by bonding method, it is bonded, by auxiliary in the manual alignment with substrate
During the semi-automatic alignment bonding for helping viewing tool, the problem of alignment bonding is inaccurate is also easy to produce.
The content of the invention
Invention provides a kind of alignment bonding structure and preparation method thereof being used in microfluid system, with
Solve the inaccurate technical problem of alignment bonding.
In order to solve the above technical problems, the invention provides a kind of alignment bonding junction being used in microfluid system
The preparation method of structure, methods described includes:
Polymer is fixed using hard light transmissive material；
The hard light transmissive material is aligned and is bonded with base material, and then realizes the polymer
Alignment with the base material is bonded.
It is preferred that, the one side of the polymer has micro-structural.
It is preferred that, polymer is fixed the utilization hard light transmissive material, specifically includes：
The one side for not having micro-structural in the polymer is fixed on the hard light transmissive material.
It is preferred that, the hard light transmissive material is the substrate with optical clarity, can pass through any wavelength model
The light enclosed.
It is preferred that, the hard light transmissive material includes：Glass, or quartz, or sapphire, or silicon chip, or
Gallium nitride.
It is preferred that, the polymer includes polydimethylsiloxane, or polymethyl methacrylate
PMMA, or polystyrene PS.
It is preferred that, it is described the hard light transmissive material is aligned and is bonded with base material before, institute
Stating method also includes：Bonding pre-treatment is carried out to the polymer.
It is preferred that, the base material includes metal or polymeric material.
In the embodiment of the present invention with there is provided a kind of alignment bonding structure being used in microfluid system, institute
It is sandwich structure to state alignment bonding structure, and the sandwich structure passes through the side described in above-mentioned technical proposal
Method is prepared.
By one or more technical scheme of the present invention, the invention has the advantages that or excellent
Point：
The invention provides a kind of alignment bonding structure being used in microfluid system and preparation method thereof, the party
Polymer is fixed using hard light transmissive material for method, passes through the alignment of hard light transmissive material and base material
And bonding, and then realize that polymer is bonded with the alignment of base material, it is to avoid due to the material sheet of polymer
The problem of alignment bonding is inaccurate caused by body, improves the alignment precision of bonding.Technique is simple, improves
The efficiency of bonding.
In addition, alignment bonding structure disclosed by the invention, simple in construction, it is adaptable to various materials, micro-structural
The alignment that the polymer of figure is bonded with base material.
Brief description of the drawings
Fig. 1 is the schematic diagram of alignment bonding structure in the embodiment of the present invention；
Fig. 2 is the implementation process figure for the preparation method that the embodiment of the present invention is directed at bonding structure.
Embodiment
Because polymer has light-transmissive, easy processing, low cost and other advantages, miniflow system is become
The standby common used material of controlling.But meanwhile, polymer is deformed by easily being caused by factors such as temperature, pressure,
It is set easily to occur the problem of alignment bonding is inaccurate during alignment bonding.For this point, the present invention
Propose and polymer (such as glass, quartz, sapphire) be fixed using hard light transmissive material,
The bonding of polymer and base material is replaced with the alignment bonding of hard light transmissive material and base material.
In order that the application the technical staff in the technical field is more clearly understood that the application, with reference to
Accompanying drawing, is described in detail by specific embodiment to technical scheme.
The present invention introduces a kind of alignment bonding structure being used in microfluid system first, is easy in bonding
Alignment, improves the efficiency of alignment.Fig. 1 is refer to, the alignment bonding structure is " sandwich " structure, " three
Mingzhi " structure is made up of hard light transmissive material, polymer and base material successively.Polymer does not have micro- knot
The one side and hard light transmissive material of structure are fixed, furthermore with hard light transmissive material optical clarity and be difficult
Morphotropism, by adjusting the alignment of hard light transmissive material and substrate, realizes the alignment of polymer and substrate.
And for the preparation method of alignment bonding structure described above, will be situated between in following embodiment
Continue.
Fig. 2 is refer to below, is the implementation process of the preparation method for the alignment bonding structure that the present invention is introduced
Figure.
Bonding is referred to two panels surface cleaning, the homogeneity of atomically flating or heterogeneous semiconductor material through table
Face is cleaned and activation process, under certain condition directly in conjunction with even former by Van der Waals force, molecular force
Sub- power makes the technology that bonding chip is integrally formed.
And it is a kind of technique to be directed at bonding.Alignment bonding structure is then that a kind of obtained knot is closed using alignment
Structure.
Specifically, during alignment bonding is bonding technology, for the bonding relative positions of two bonding objects
Alignment Process, and then propose a kind of manufacture craft applied to bonding technology alignment issues.
The technical process of bonding is directed at, is that polymer is fixed on hard light transmissive material, chooses bonding side
Formula, carries out bonding pre-treatment, by being directed at hard light transmissive material and base material, implements at specific bonding
Reason, realizes alignment bonding.
Specific description is refer to below.
S1, polymer is fixed using hard light transmissive material.
Hard light transmissive material is introduced first.
Hard light transmissive material is specifically referred to the good substrate of optical transmittance (the i.e. base of optical clarity
Piece), such as glass, quartz, sapphire, silicon chip, gallium nitride etc..And visible ray is not limited to that,
Can be the light of any wave-length coverage, such as infrared light, ultraviolet light.
Polymer is the polymeric material commonly used in microfluid system, and micro-structural contained by polymer has any
Property.
Polymer in the present invention can be PDMS (polydimethylsiloxane, polydimethylsiloxanes
Alkane).PDMS is used as a kind of the macromolecule organic silicon compound, commonly known as organosilicon.With optical lens
It is bright, and in general, it is considered to be inertia, it is nontoxic, it is nonflammable.Dimethyl silicone polymer
(PDMS) it is organic polymer material based on most widely used silicon.
In addition, the polymer in the present invention can also be PMMA (PolymethylMethacrylate, poly- first
Base methyl acrylate).Optical grade PMMA (polymethyl methacrylate) is because of its excellent translucency, electricity
Insulating properties, aft-loaded airfoil etc. are widely used, and are described as " plastics queen ".PMMA high-performance optical classes and grades in school liquid
Brilliant material, mainly using the high-end city such as liquid crystal display light guide plate, fiber optic materials, solar-energy photo-voltaic cell
.
In addition, polymer can also be polystyrene PS.
And before polymer is fixed using hard light transmissive material, can first carry out the system of polymer
It is standby.For example prepare a polymer flake containing micro-structural.It is poly- using SU-8 in preparation process
The methods such as compound mould, silicon substrate mould prepare the polymer flake containing micro-structural.
The polymer of preparation has two sides, simultaneously with micro-structural, simultaneously without micro-structural, and is utilizing
When polymer is fixed hard light transmissive material, the one side without micro-structural of polymer is fixed on hard
On light transmissive material.
In order to which firm is fixed, the material or object for having viscous glutinous function using adhesive etc. are carried out
It is fixed.
S2, the hard light transmissive material is aligned and is bonded with base material, and then is realized described poly-
Compound is bonded with the alignment of the base material.
Base material is first introduced below.
Base material is probably containing micro-structural, it is also possible to do not contained.
And for the material of base, it is probably any one in metal, polymeric material.Certainly
Can also be the backing materials such as silicon chip.
And before hard light transmissive material is aligned and is bonded with base material, in addition it is also necessary to described poly-
Compound carries out bonding pre-treatment.Being bonded pre-treatment is specifically：To polymer or base material, or polymer
And base material, that takes promotes the processing of bonding effect.Bonding pre-treatment is obtained according to specific bonding method
It is different and different.For example, hydroxylated polymer surface, spin coating adhesive etc..
It is that being fixed with for hard light transmissive material is poly- when by the alignment of hard light transmissive material and base material
The one side of compound is aligned with base material.
The hard light transmissive material is aligned and is bonded with base material actually comprising two parts,
Will the hard light transmissive material be aligned with base material；And by the hard light transmissive material and base
Bottom material is bonded.
When hard light transmissive material is aligned with base material, it can be carried out using alignment mark, figure etc. straight
Connect alignment.Alignment mark can be cross, rectangle, square, numeral etc..
When hard light transmissive material is bonded with base material, using specific bonding method, corresponded to
Bonding processing.Alignment bonding in the present invention does not limit bonding method, and such as surface is modified bonding side
Method, adhesive bonding etc..
The method of the present invention is illustrated below by specific embodiment, but it should be noted that this hair
Bright method is not limited thereto.
Example 1：Graphical PDMS is bonded with graphical Au alignment.
(1) the graphical PDMS containing micro-structural is prepared, the PDMS raw materials of commercialization are injected into micro- knot
Structure SU-8 polymeric molds, the regular hour is solidified according to commodity operation instruction, required for obtaining
PDMS thin slices.
(2) PDMS thin slices are fixed on sheet glass, utilize spin coating liquid PDMS (liquid on the glass sheet
Body PDMS is a kind of binder), PDMS thin slices are placed on liquid PDMS, make it according to PDMS
Operation instruction is solidified.
(3) the graphical Au of nano thickness is sputtered on quartz plate, quartz is used as non-patterned on PDMS
Partial substrate, patterned Au as graphical PDMS substrate.
(4) PDMS and Au bonding method are realized as adhesive using PDMS, it is thin to PDMS
Piece apply PDMS bonding pre-treatment.
(5) using alignment mark is set, carry out sheet glass and be aligned with the patterned Au on silicon chip so that
Graphical PDMS is aligned with both graphical Au figure.
(6) bonding is realized in adhesive PDMS solidification.
By one or more embodiment of the present invention, the invention has the advantages that or excellent
Point：
The invention provides a kind of alignment bonding structure being used in microfluid system and preparation method thereof, the party
Polymer is fixed using hard light transmissive material for method, passes through the alignment of hard light transmissive material and base material
And bonding, and then realize that polymer is bonded with the alignment of base material, it is to avoid due to the material sheet of polymer
The problem of alignment bonding is inaccurate caused by body, improves the alignment precision of bonding.Technique is simple, improves
The efficiency of bonding.
In addition, alignment bonding structure disclosed by the invention, simple in construction, it is adaptable to various materials, micro-structural
The alignment that the polymer of figure is bonded with base material.
Although having been described for the preferred embodiment of the application, one of ordinary skilled in the art once learns
Basic creative concept, then can make other change and modification to these embodiments.So, appended power
Profit requires to be intended to be construed to include preferred embodiment and falls into having altered and changing for the application scope.
Obviously, those skilled in the art can carry out various changes and modification without departing from this Shen to the application
Spirit and scope please.So, if these modifications and variations of the application belong to the application claim and
Within the scope of its equivalent technologies, then the application is also intended to comprising including these changes and modification.
Claims (9)
1. a kind of preparation method for the alignment bonding structure being used in microfluid system, it is characterised in that institute
The method of stating includes:
Polymer is fixed using hard light transmissive material；
The hard light transmissive material is aligned and is bonded with base material, and then realizes the polymer
Alignment with the base material is bonded.
2. a kind of making of alignment bonding structure being used in microfluid system according to claim 1
Method, it is characterised in that the one side of the polymer has micro-structural.
3. a kind of making of alignment bonding structure being used in microfluid system according to claim 2
Method, it is characterised in that polymer is fixed the utilization hard light transmissive material, specifically includes：
The one side for not having micro-structural in the polymer is fixed on the hard light transmissive material.
4. a kind of making of alignment bonding structure being used in microfluid system according to claim 1
Method, it is characterised in that the hard light transmissive material is the substrate with optical clarity, be can pass through any
The light of wave-length coverage.
5. a kind of making of alignment bonding structure being used in microfluid system according to claim 4
Method, it is characterised in that the hard light transmissive material includes：Glass, or quartz, or sapphire, or silicon
Piece, or gallium nitride.
6. a kind of making of alignment bonding structure being used in microfluid system according to claim 1
Method, it is characterised in that the polymer includes polydimethylsiloxane, or polymethylacrylic acid
Methyl esters PMMA, or polystyrene PS.
7. a kind of making of alignment bonding structure being used in microfluid system according to claim 1
Method, it is characterised in that the hard light transmissive material is aligned and is bonded with base material described
Before, methods described also includes：
Bonding pre-treatment is carried out to the polymer.
8. a kind of alignment bonding method being used in microfluid system according to claim 1, it is special
Levy and be, the base material includes metal or polymeric material.
9. a kind of alignment bonding structure being used in microfluid system, it is characterised in that the alignment bonding
Structure is sandwich structure, and the sandwich structure passes through the side described in any claims of claim 1-8
Method is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121968.9A CN107150996B (en) | 2016-03-03 | 2016-03-03 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121968.9A CN107150996B (en) | 2016-03-03 | 2016-03-03 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107150996A true CN107150996A (en) | 2017-09-12 |
| CN107150996B CN107150996B (en) | 2020-07-21 |
Family
ID=59791334
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610121968.9A Expired - Fee Related CN107150996B (en) | 2016-03-03 | 2016-03-03 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1648663A (en) * | 2005-02-06 | 2005-08-03 | 中国科学院上海微系统与信息技术研究所 | Glass microflow control chip and producing method |
| CN1799820A (en) * | 2004-12-31 | 2006-07-12 | 中国科学技术大学 | Hot compressing link method of polymer microfluid system |
| US20110269131A1 (en) * | 2008-10-30 | 2011-11-03 | Chiu Daniel T | Substrate for manufacturing disposable microfluidic devices |
| CN103818876A (en) * | 2014-03-12 | 2014-05-28 | 杭州霆科生物科技有限公司 | Rapid bonding method for micro-fluidic chip |
| CN104907113A (en) * | 2015-06-10 | 2015-09-16 | 复旦大学 | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays |
-
2016
- 2016-03-03 CN CN201610121968.9A patent/CN107150996B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799820A (en) * | 2004-12-31 | 2006-07-12 | 中国科学技术大学 | Hot compressing link method of polymer microfluid system |
| CN1648663A (en) * | 2005-02-06 | 2005-08-03 | 中国科学院上海微系统与信息技术研究所 | Glass microflow control chip and producing method |
| US20110269131A1 (en) * | 2008-10-30 | 2011-11-03 | Chiu Daniel T | Substrate for manufacturing disposable microfluidic devices |
| CN103818876A (en) * | 2014-03-12 | 2014-05-28 | 杭州霆科生物科技有限公司 | Rapid bonding method for micro-fluidic chip |
| CN104907113A (en) * | 2015-06-10 | 2015-09-16 | 复旦大学 | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays |
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| CN107150996B (en) | 2020-07-21 |
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Granted publication date: 20200721 |