CN107150996B - Manufacturing method of alignment bonding structure used in micro-fluidic system - Google Patents
Manufacturing method of alignment bonding structure used in micro-fluidic system Download PDFInfo
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- CN107150996B CN107150996B CN201610121968.9A CN201610121968A CN107150996B CN 107150996 B CN107150996 B CN 107150996B CN 201610121968 A CN201610121968 A CN 201610121968A CN 107150996 B CN107150996 B CN 107150996B
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- bonding
- polymer
- alignment
- light
- hard light
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 85
- 229920000642 polymer Polymers 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 27
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 27
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 9
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- -1 Polydimethylsiloxane Polymers 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 16
- 239000011521 glass Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
- B81C3/005—Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a method for manufacturing an alignment bonding structure in a microfluidic system, which fixes a polymer by using a hard light-transmitting material, and further realizes the alignment bonding of the polymer and a substrate material by aligning and bonding the hard light-transmitting material and the substrate material, thereby avoiding the problem of inaccurate alignment bonding caused by the material of the polymer and improving the alignment precision of bonding. The process is simple, and the bonding efficiency is improved.
Description
Technical Field
The present application relates to the field of bonding technologies of microfluidic systems, and in particular, to a method for manufacturing an alignment bonding structure in a microfluidic system.
Background
Since the 90 s of the 20 th century, microfluidics has played an increasingly important role as analytical systems, biomedical devices, chemical and biochemical tools, mainly to achieve miniaturization and integration of biochemical related analytical equipment and to improve portability thereof. Bonding is a key technical link in microfluidic fabrication, and the dimensions of the effective fluid channel and the fluid action part in the microfluidic system are in the micron order in at least one dimension, which has high requirements on the precision of the bonding process.
With the development of micro-machining technology, polymer-based microfluidic systems are receiving more and more attention, and the research on the bonding technology of polymers and substrate materials such as polymers, metals, silicon wafers, glass, quartz and the like has very important significance. In general, in bonding, the polymer contains microstructures, and the substrate does not contain microstructures, so that no alignment problem exists in bonding the polymer and the substrate. When the substrate also contains microstructures, the alignment bonding of the polymer and the substrate and its high precision requirement become problems to be solved. Due to the material characteristics of the polymer material, structural deformation caused by a bonding method and the like, the polymer material is prone to the problem of inaccurate alignment bonding in the manual alignment bonding process of the polymer material and the substrate and the semi-automatic alignment bonding process of the polymer material by means of an auxiliary observation tool.
Disclosure of Invention
The invention provides a manufacturing method of an alignment bonding structure used in a micro-fluidic system, which aims to solve the technical problem of inaccurate alignment bonding.
In order to solve the above technical problem, the present invention provides a method for manufacturing an alignment bonding structure in a microfluidic system, the method comprising:
fixing the polymer by using a hard light-transmitting material;
and aligning and bonding the hard light-transmitting material and a substrate material to realize the alignment bonding of the polymer and the substrate material.
Preferably, one side of the polymer has a microstructure.
Preferably, the fixing of the polymer by using the hard light-transmitting material specifically includes:
and fixing the side without the microstructures in the polymer on the hard light-transmitting material.
Preferably, the hard light-transmitting material is a substrate having optical transparency, and can transmit light in any wavelength range.
Preferably, the hard light-transmitting material includes: glass, or quartz, or sapphire, or silicon wafer, or gallium nitride.
Preferably, the polymer comprises polydimethylsiloxane PDMS, or polymethylmethacrylate PMMA, or polystyrene PS.
Preferably, before the aligning and bonding the hard light-transmitting material and the base material, the method further comprises: and carrying out bonding pretreatment on the polymer.
Preferably, the substrate material comprises a metal or a polymeric material.
In the embodiment of the present invention, an alignment bonding structure for use in a microfluidic system is provided, where the alignment bonding structure is a sandwich structure, and the sandwich structure is prepared by the method according to the above technical solution.
Through one or more technical schemes of the invention, the invention has the following beneficial effects or advantages:
the invention provides an alignment bonding structure used in a microfluidic system and a manufacturing method thereof. The process is simple, and the bonding efficiency is improved.
In addition, the alignment bonding structure disclosed by the invention is simple in structure and is suitable for the alignment of bonding of polymers of various materials and microstructure patterns and a base material.
Drawings
FIG. 1 is a schematic diagram of an alignment bonding structure in an embodiment of the present invention;
fig. 2 is a diagram illustrating an implementation process of a method for manufacturing an alignment bonding structure according to an embodiment of the present invention.
Detailed Description
The polymer has the advantages of light transmission, easy processing, low cost and the like, so that the polymer becomes a common material for preparing a microfluidic system. At the same time, however, the polymer is easily deformed by factors such as temperature and pressure, so that the problem of inaccurate alignment bonding is easily caused in the alignment bonding process. In this regard, the present invention proposes to fix a polymer (e.g., glass, quartz, sapphire, etc.) using a hard light-transmitting material, and to replace the bonding of the polymer and the base material with an aligned bonding of the hard light-transmitting material and the base material.
In order to make the present application more clearly understood by those skilled in the art to which the present application pertains, the following detailed description of the present application is made with reference to the accompanying drawings by way of specific embodiments.
The invention firstly introduces an alignment bonding structure used in a microfluidic system, which facilitates alignment in bonding and improves alignment efficiency. Referring to fig. 1, the alignment bonding structure is a "sandwich" structure, which is sequentially composed of a rigid light-transmitting material, a polymer, and a base material. The side of the polymer without the microstructure is fixed with the hard light-transmitting material, and the alignment of the polymer and the substrate is realized by adjusting the alignment of the hard light-transmitting material and the substrate by utilizing the optical light-transmitting property and the non-deformability of the hard light-transmitting material.
The following embodiments will be described with respect to the above-described method for fabricating the alignment bonding structure.
Referring to fig. 2, a process diagram of the manufacturing method of the alignment bonding structure according to the present invention is shown.
Bonding refers to a technique of bonding two homogeneous or heterogeneous semiconductor materials with clean surfaces and flat atomic levels into a whole by directly combining the materials through surface cleaning and activating treatment under certain conditions and through van der waals force, molecular force and even atomic force.
And alignment bonding is one process. The alignment bonding structure is a structure obtained by using alignment bonding.
Specifically, the alignment bonding is an alignment process for the bonding relative position of two bonded objects in the bonding process, and further provides a manufacturing process applied to the alignment problem of the bonding process.
The alignment bonding process comprises the steps of fixing a polymer on a hard light-transmitting material, selecting a bonding mode, carrying out bonding pretreatment, and implementing specific bonding treatment by aligning the hard light-transmitting material and a substrate material to realize alignment bonding.
Reference is now made to the detailed description.
And S1, fixing the polymer by using a hard light-transmitting material.
First, a hard light-transmitting material will be described.
The hard light-transmitting material specifically refers to a substrate having good optical transmittance (i.e., a substrate having optical transparency), such as glass, quartz, sapphire, a silicon wafer, gallium nitride, or the like. And it is not limited to visible light and may be light of any wavelength range, such as infrared light, ultraviolet light, and the like.
Polymers are commonly used polymeric materials in microfluidic systems, and the microstructure of the polymer is arbitrary.
The polymer in the present invention may be PDMS (polydimethylsiloxane). PDMS is commonly referred to as silicone as a high molecular organosilicon compound. Has optical transparency and is generally considered inert, non-toxic and non-flammable. Polydimethylsiloxane (PDMS) is the most widely used silicon-based organic polymer material.
In addition, the polymer in the present invention may be PMMA (polymethyl methacrylate). Optical-grade PMMA (polymethyl methacrylate) is known as "plastic queen" because of its excellent light transmittance, electrical insulation, post-processability, and other wide applications. The PMMA high-performance optical-grade liquid crystal material is mainly applied to high-end markets such as liquid crystal display light guide plates, optical fiber materials, solar photovoltaic cells and the like.
In addition, the polymer may also be polystyrene PS.
Before the polymer is fixed by the hard light-transmitting material, the polymer is prepared. For example, a polymer sheet containing microstructures is prepared. In the preparation process, the polymer sheet containing the microstructure can be prepared by using methods such as SU-8 polymer molds, silicon-based molds and the like.
The prepared polymer has two sides, one side has a microstructure and the other side has no microstructure, and when the polymer is fixed by the hard light-transmitting material, the side without the microstructure of the polymer is fixed on the hard light-transmitting material.
For stable fixation, materials or objects with adhesive function such as adhesive can be used for fixation.
And S2, aligning and bonding the hard light-transmitting material and a substrate material, thereby realizing the alignment bonding of the polymer and the substrate material.
The base material will be described first.
The substrate material may or may not contain microstructures.
And for the base material, it may be any one of metal and polymer material. Of course, the substrate material may be a silicon wafer or the like.
Before the hard light-transmitting material is aligned and bonded with the substrate material, the polymer needs to be subjected to bonding pretreatment. The bonding pretreatment specifically comprises the following steps: a treatment is applied to the polymer or the substrate material, or both, to promote bonding. The bonding pretreatment differs depending on the specific bonding method. Such as hydroxylated polymer surfaces, spin-on adhesives, and the like.
When the hard light-transmitting material is aligned with the base material, the surface of the hard light-transmitting material to which the polymer is fixed is aligned with the base material.
Aligning and bonding the hard light-transmitting material with a base material actually comprises two parts, namely aligning the hard light-transmitting material with the base material; and bonding the hard light-transmitting material with a base material.
In aligning the hard light-transmitting material with the base material, direct alignment may be performed using an alignment mark, a pattern, or the like. The alignment marks may be cross-shaped, rectangular, square, numeric, etc.
When the hard light-transmitting material is bonded with the substrate material, a specific bonding method is adopted to perform corresponding bonding treatment. The alignment bonding in the present invention does not limit a bonding method such as a surface modification bonding method, an adhesive bonding, and the like.
The process of the present invention is illustrated below by means of specific examples, but it should be noted that the process of the present invention is not limited thereto.
Example 1: and (3) aligning and bonding the patterned PDMS and the patterned Au.
(1) Preparing graphical PDMS containing a microstructure, injecting a commercialized PDMS raw material into an SU-8 polymer mold of the microstructure, and curing for a certain time according to commercial instructions to obtain the required PDMS sheet.
(2) The PDMS sheet was fixed to a glass plate, and a liquid PDMS (liquid PDMS is a kind of adhesive) was spin-coated on the glass plate, and the PDMS sheet was placed on the liquid PDMS and cured according to the PDMS usage instructions.
(3) And sputtering patterned Au with a nanometer thickness on a quartz plate, wherein the quartz is used as a substrate of a non-patterned part on the PDMS, and the patterned Au is used as a substrate of the patterned PDMS.
(4) The bonding method of PDMS and Au is realized by adopting PDMS as an adhesive, and the bonding pretreatment of PDMS coating is carried out on a PDMS sheet.
(5) And aligning the glass sheet with the patterned Au on the silicon wafer by setting an alignment mark, so that the patterns of the patterned PDMS and the patterned Au are aligned.
(6) And curing the adhesive PDMS to realize bonding.
Through one or more embodiments of the present invention, the present invention has the following advantageous effects or advantages:
the invention provides an alignment bonding structure used in a microfluidic system and a manufacturing method thereof. The process is simple, and the bonding efficiency is improved.
In addition, the alignment bonding structure disclosed by the invention is simple in structure and is suitable for the alignment of bonding of polymers of various materials and microstructure patterns and a base material.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (2)
1. A method of fabricating an alignment bonding structure for use in a microfluidic system, the method comprising:
fixing the polymer by using a hard light-transmitting material;
aligning and bonding the hard light-transmitting material and a substrate material to realize the alignment bonding of the polymer and the substrate material;
prior to said aligning and bonding said rigid light transmissive material with a base material, said method further comprising: carrying out bonding pretreatment on the polymer; the bonding pretreatment specifically comprises the following steps: treatment of the polymer or substrate material, or both, to promote bonding; the bonding pretreatment is different according to different specific bonding methods;
the substrate material comprises a metal or polymer material; the base material contains microstructures;
one side of the polymer is provided with a microstructure; the microstructure contained in the polymer has arbitrariness;
the fixing of the polymer by using the hard light-transmitting material specifically comprises the following steps: fixing one side of the polymer without the microstructures on the hard light-transmitting material;
the hard light-transmitting material is a substrate with optical light-transmitting property, and can transmit light in any wavelength range;
the hard light-transmitting material comprises: quartz, or sapphire, or silicon wafers, or gallium nitride.
2. The method of claim 1, wherein the polymer comprises Polydimethylsiloxane (PDMS), Polymethylmethacrylate (PMMA), or Polystyrene (PS).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121968.9A CN107150996B (en) | 2016-03-03 | 2016-03-03 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610121968.9A CN107150996B (en) | 2016-03-03 | 2016-03-03 | Manufacturing method of alignment bonding structure used in micro-fluidic system |
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| CN107150996A CN107150996A (en) | 2017-09-12 |
| CN107150996B true CN107150996B (en) | 2020-07-21 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1648663A (en) * | 2005-02-06 | 2005-08-03 | 中国科学院上海微系统与信息技术研究所 | Glass microflow control chip and producing method |
| CN1799820A (en) * | 2004-12-31 | 2006-07-12 | 中国科学技术大学 | Hot compressing link method of polymer microfluid system |
| CN103818876A (en) * | 2014-03-12 | 2014-05-28 | 杭州霆科生物科技有限公司 | Rapid bonding method for micro-fluidic chip |
| CN104907113A (en) * | 2015-06-10 | 2015-09-16 | 复旦大学 | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110091524A (en) * | 2008-10-30 | 2011-08-11 | 유니버시티 오브 워싱톤 | Substrate for manufacturing disposable microfluidic devices |
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- 2016-03-03 CN CN201610121968.9A patent/CN107150996B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799820A (en) * | 2004-12-31 | 2006-07-12 | 中国科学技术大学 | Hot compressing link method of polymer microfluid system |
| CN1648663A (en) * | 2005-02-06 | 2005-08-03 | 中国科学院上海微系统与信息技术研究所 | Glass microflow control chip and producing method |
| CN103818876A (en) * | 2014-03-12 | 2014-05-28 | 杭州霆科生物科技有限公司 | Rapid bonding method for micro-fluidic chip |
| CN104907113A (en) * | 2015-06-10 | 2015-09-16 | 复旦大学 | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays |
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