WO2017035947A1 - Fast constant-temperature flat hot-embossing process for forming polymer microstructure - Google Patents

Fast constant-temperature flat hot-embossing process for forming polymer microstructure Download PDF

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WO2017035947A1
WO2017035947A1 PCT/CN2015/093750 CN2015093750W WO2017035947A1 WO 2017035947 A1 WO2017035947 A1 WO 2017035947A1 CN 2015093750 W CN2015093750 W CN 2015093750W WO 2017035947 A1 WO2017035947 A1 WO 2017035947A1
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polymer
temperature
microstructure
hot stamping
mold
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PCT/CN2015/093750
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French (fr)
Chinese (zh)
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吴大鸣
刘颖
郑秀婷
杨振洲
许红
赵中里
孙靖尧
敬鹏生
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北京化工大学
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate

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  • the invention relates to a process method for flat hot stamping, in particular to a rapid polymer microstructure isothermal flat hot stamping process which is formed by plastic deformation in a solid state of a polymer, and belongs to the technical field of micro-nano manufacturing.
  • This application is based on the Chinese invention patent with the patent application number 2015105525566 and the application date being September 1, 2015.
  • Polymer devices with micro-nano structure have important applications in precision optics, biomedical and other fields.
  • research on polymer micro-nano-structure devices has developed rapidly, and polymer micro-structures have considerable potential in the field of micro-technology. market.
  • Hot stamping technology is one of the main processes for preparing polymer micro/nano structure devices, which has the characteristics of high micro-nano structure replication rate and high molding precision.
  • Chou S.Y. of Princeton University in the United States first proposed a method of imprinting a solid polymer at a high temperature, and fabricated trenches having a feature size of 25 nm and 100 nm on a polymer substrate.
  • the hot stamping process is divided into five steps: (1) placing the polymer substrate between the mold and the liner; (2) heating the mold and the polymer sheet to a suitable imprint temperature under a certain pressure condition.
  • CN200410052383.3 discloses a hot stamping method, which comprises providing a substrate and a stamper having a predetermined pattern; aligning the stamper with the substrate in the vacuum chamber; introducing a small molecular substance vapor; heating the stamper and the substrate Above the glass transition temperature of the substrate, and applying pressure; thereafter, the stamper is cooled to the substrate, and finally the stamper is separated from the substrate to complete the imprint process.
  • the invention realizes the transfer of the micro-nano pattern structure by introducing a small molecular substance vapor to reduce the adsorption energy between the stamper and the substrate interface.
  • CN201210168800.5 discloses a hot stamping preparation method for a TPU film drag reducing micro-groove for an airship skin, which is prepared by: preparing an Al-made template having a "V"-shaped groove structure on the surface; Coating the release agent; 3. Ultrasonic cleaning of the TPU film with anhydrous ethanol; 4. At a temperature of 130-135 ° C and a pressure of 50-70 N, embossing for 15-20 min, stopping heating, holding pressure 2 to 2.5 h, complete hot stamping preparation of drag reducing microchannels.
  • the present invention is directed to the problem of the prior art, and provides a rapid polymer microstructure isothermal plate hot stamping process by using a polymer near the glass transition temperature Tg (for an amorphous polymer) or a crystalline melting point Tm (pair)
  • Tg glass transition temperature
  • Tm crystalline melting point
  • the plastic deformation of the crystalline polymer is subjected to microstructure molding, and the mold temperature is kept constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling of the mold in the prior art, thereby realizing the rapid completion of the micro-plate hot stamping; And through the temperature control, the plastic deformation is carried out in the strain flow phase, avoiding the plastic deformation into the strain hardening stage, and ensuring the high replication rate of the microstructure.
  • the microstructure of the mold is at a temperature of 5 ° C ⁇ 20 ° C below the glass transition temperature Tg of the amorphous polymer to be hot stamped or at a temperature to be hot pressed
  • the polymer substrate is subjected to hot stamping under the conditions of a crystalline melting point Tm of the printed crystalline polymer of 10 ° C to 50 ° C, and is directly released from the mold after the hot stamping is completed, and the mold temperature is maintained.
  • the method further comprises preheating the polymer substrate, in particular, preheating the polymer substrate to a temperature above 5 ° C to 20 ° C of the glass transition temperature Tg. Embossed.
  • the preheating operation of the polymer substrate allows the pressure surface temperature distribution of the polymer substrate to be uniform.
  • the temperature of the mold is set to the highest temperature at which the polymer substrate does not adhere to the mold.
  • the hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
  • the amorphous polymer includes, but is not limited to, PMMA, PC, PS or PVC, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
  • the mold directly heat-embosses the crystalline polymer substrate at a temperature below the melting point of the polymer crystal.
  • the temperature of the mold is set such that the polymer substrate does not adhere to the highest temperature of the mold and maintains a constant temperature throughout the imprint process.
  • the hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
  • the crystalline polymer includes, but is not limited to, PP, PE or PET, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
  • the invention relates to a rapid polymer microstructure isothermal plate hot stamping process, wherein the microstructure mold is at a temperature of 5 ° C to 20 ° C below the glass transition temperature Tg of the hot imprinted amorphous polymer or at a temperature of hot stamping.
  • the polymer substrate is hot-embossed under the conditions of a crystalline melting point Tm of the crystalline polymer of 10 ° C to 50 ° C, and is maintained after the hot stamping is completed.
  • the mold is directly demolded without changing the mold temperature to obtain a polymer device having a microstructure on the surface.
  • the polymer microstructure forming process mainly utilizes the plastic deformation under the polymer solid state, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good;
  • the process has lower temperature than the traditional hot stamping process, and solves the defects of demoulding caused by the difference in heat shrinkage rate between the polymer and the mold, and is beneficial to reducing energy consumption.
  • a rapid polymer microstructure isothermal plate hot stamping process the polymer substrate is amorphous, specifically by the following steps.
  • preheating preheating the polymer substrate, specifically preheating the polymer substrate to a glass transition temperature Tg of 5 ° C to 20 ° C, followed by hot stamping, preheating operation to ensure polymerization
  • Tg glass transition temperature
  • the microstructured mold is hot stamped and hot pressed under the condition that the temperature is the temperature of the amorphous polymer to be hot stamped by the glass transition temperature Tg of 5 ° C ⁇ 20 ° C.
  • the printing pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
  • 1 is a temperature pressure control process curve of the fast polymer microstructure isothermal plate hot stamping process of the present invention applied to an amorphous polymer.
  • the process of the present invention thermally stamps a polymer substrate while maintaining a constant mold temperature.
  • the hot embossing process includes embossing, holding and demolding processes.
  • the amorphous polymer includes, but is not limited to, PMMA, PC, PS or PVC materials, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure
  • Tg glass transition temperature
  • the hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
  • the microstructured mold is directly hot-imprinted on a crystalline polymer substrate having a temperature ranging from room temperature to below the melting point of the crystal at a temperature of 10 ° C to 50 ° C below the crystalline melting point Tm of the crystalline polymer to be hot-embossed.
  • the mold was directly demolded while keeping the mold temperature constant, and a polymer device having a microstructure on the surface was obtained.
  • the pressure of the hot stamping is 2-10 MPa and the time is 5 s-30 s.
  • FIG. 2 is a temperature pressure control process curve of the fast polymer microstructure isothermal flat hot stamping process of the present invention applied to the crystalline polymer.
  • the crystalline polymer includes, but is not limited to, PP, PE or PET, and the polymer substrate may be a thin plate, a sheet or a film having a thickness of 0.01 mm to 2.00 mm.
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat
  • Tm crystalline melting point
  • the embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, Easy to achieve large-scale industrial production.
  • This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PMMA (polymethyl methacrylate) as a substrate.
  • PMMA polymethyl methacrylate
  • the amorphous polymer PMMA substrate has a glass transition temperature Tg of 105 ° C.
  • the microstructure of the mold surface used was a V-Cut structure having a feature size of 50 ⁇ m.
  • the rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
  • Preheating preheating the PMMA substrate to 110 ° C, and controlling the temperature of the pressed surface of the polymer substrate to be evenly distributed during the preheating process;
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure
  • Tg glass transition temperature
  • the hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
  • the present embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PP (polypropylene) as a substrate.
  • PP polypropylene
  • the crystalline polymer PP substrate has a crystalline melting point Tm of 160 ° C, and the microstructure of the mold surface is characterized. V-Cut structure with a size of 50 ⁇ m.
  • the rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
  • Imprint the temperature of the flat mold is set to 115 ° C, and the mold directly performs hot stamping on the PP substrate at normal temperature, the imprint pressure is 5 Mpa, and the imprinting time is 20 s;
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat
  • Tm crystalline melting point
  • the embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
  • This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PVC (polyvinyl chloride) as a substrate, and the glass transition temperature Tg of the amorphous polymer PVC substrate is 80 °C.
  • the microstructure of the mold surface used was a V-Cut structure having a feature size of 50 ⁇ m.
  • the rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
  • the PVC substrate is preheated to 90 ° C, and the preheating process ensures uniform temperature distribution of the pressed surface of the polymer;
  • the temperature of the microstructured mold is set to 70 °C to ensure uniform temperature distribution on the surface of the flat mold.
  • the flat mold is micro-embossed on the preheated polymer substrate, the embossing pressure is 8Mpa, and the embossing time is 10s. ;
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure
  • Tg glass transition temperature
  • the hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the time-consuming and energy-consuming defects caused by the plate shortened the hot stamping cycle of the flat plate, realized rapid plate hot stamping, and the operation was simple, and it was easy to realize large-scale industrial production.
  • This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PE (polyethylene) as a substrate.
  • PE polyethylene
  • the crystalline polymer PE substrate has a crystalline melting point Tm of 127 ° C, and the microstructure of the mold surface is characterized. V-Cut structure with a size of 50 ⁇ m.
  • the rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
  • Embossing the temperature of the flat mold is set to 110 ° C, and the mold directly performs hot stamping on the PE substrate at normal temperature, the imprinting pressure is 7 Mpa, and the imprinting time is 11 s;
  • the process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat
  • Tm crystalline melting point
  • the embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
  • the process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method.
  • the hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
  • the process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
  • the rapid polymer microstructure isothermal plate hot stamping process of the invention realizes rapid flat hot stamping, and is easy to operate, and is easy to realize large-scale industrial production.

Abstract

Provided is a fast constant-temperature flat hot-embossing process for forming a polymer microstructure. A microstructure mold is used to perform hot-embossing on a polymer substrate at a temperature 5°C-20°C below a glass transition temperature (Tg) of an amorphous polymer to be hot-embossed, or at a temperature 10°C-50°C below a crystalline melting point (Tm) of a crystalline polymer to be hot-embossed. After the hot-embossing has been completed, the mold is directly released when the temperature thereof remains unchanged, thereby obtaining a polymer device having a surface microstructure. The process employs plastic deformation at a temperature near a glass transition temperature (Tg) or a temperature below a crystalline melting point (Tm) of a polymer in a solid state to perform microstructure formation. The mold maintains a constant temperature during the hot-embossing process so that a time consuming problem caused by repeated heating and cooling processes can be prevented, thereby realizing a fast flat hot-embossing process for forming a microstructure. Moreover, the plastic deformation is performed at a strain yield stage by controlling temperatures, thereby preventing the plastic deformation from being performed at a strain hardening stage, and ensuring a higher reproduction rate of the microstructure.

Description

一种快速聚合物微结构等温平板热压印工艺Rapid polymer microstructure isothermal flat hot stamping process 技术领域Technical field
本发明涉及一种平板热压印的工艺方法，具体涉及一种利用聚合物固态下的塑性变形进行成型的快速聚合物微结构等温平板热压印工艺，属于微纳制造技术领域。本申请是以专利申请号为2015105525566、申请日为2015年9月1日的中国发明专利为基础的。The invention relates to a process method for flat hot stamping, in particular to a rapid polymer microstructure isothermal flat hot stamping process which is formed by plastic deformation in a solid state of a polymer, and belongs to the technical field of micro-nano manufacturing. This application is based on the Chinese invention patent with the patent application number 2015105525566 and the application date being September 1, 2015.
背景技术Background technique
具有微纳结构的聚合物器件在精密光学、生物医疗等领域有重要的应用，近些年来，聚合物微纳结构器件的研究快速发展，聚合物微结构在微技术领域存在着相当大的潜在市场。Polymer devices with micro-nano structure have important applications in precision optics, biomedical and other fields. In recent years, research on polymer micro-nano-structure devices has developed rapidly, and polymer micro-structures have considerable potential in the field of micro-technology. market.
热压印技术是制备聚合物微纳结构器件的主要工艺方法之一，其具有微纳结构复制率高、成型精度高的特点。1995年，美国普林斯顿大学的Chou S.Y.等人首次提出高温下压印固态聚合物的方法，并在聚合物基片上制造出特征尺寸为25nm和100nm的沟槽。热压印过程分为五步：(1)将聚合物基片放在模具与衬板之间；(2)在一定的压力条件下，将模具和聚合物片材加热到合适的压印温度；(3)持续对模具施加压力进行压印，此过程需保证聚合物充分填充到微结构模腔中；(4)在脱模前将模具和聚合物降温到Tg以下，使压印得到的微结构定型同时防止最后脱模时聚合物粘附模具；(5)脱模，得到表面带有微纳结构的聚合物片材制品，完成压印过程。Hot stamping technology is one of the main processes for preparing polymer micro/nano structure devices, which has the characteristics of high micro-nano structure replication rate and high molding precision. In 1995, Chou S.Y. of Princeton University in the United States first proposed a method of imprinting a solid polymer at a high temperature, and fabricated trenches having a feature size of 25 nm and 100 nm on a polymer substrate. The hot stamping process is divided into five steps: (1) placing the polymer substrate between the mold and the liner; (2) heating the mold and the polymer sheet to a suitable imprint temperature under a certain pressure condition. (3) continue to apply pressure to the mold for imprinting, this process needs to ensure that the polymer is fully filled into the microstructure cavity; (4) the mold and polymer are cooled to below Tg before demolding, so that the imprint is obtained The microstructure is shaped to prevent the polymer from adhering to the mold during the final demolding; (5) demolding, obtaining a polymer sheet product having a micro-nano structure on the surface, and completing the imprint process.
CN200410052383.3公开一种热压印方法，该方法包括提供一基底和一具有预定图案的压模；将压模与基底在真空腔室内对准；通入小分子物质蒸汽；加热压模与基底至基底的玻璃化温度之上，并施压；之后，将压模与基底冷却，最后将压模与基底分离，从而完成压印工艺。该发明通过通入小分子物质蒸汽以降低压模与基底界面间的吸附能，实现微纳米图形结构的转移。CN200410052383.3 discloses a hot stamping method, which comprises providing a substrate and a stamper having a predetermined pattern; aligning the stamper with the substrate in the vacuum chamber; introducing a small molecular substance vapor; heating the stamper and the substrate Above the glass transition temperature of the substrate, and applying pressure; thereafter, the stamper is cooled to the substrate, and finally the stamper is separated from the substrate to complete the imprint process. The invention realizes the transfer of the micro-nano pattern structure by introducing a small molecular substance vapor to reduce the adsorption energy between the stamper and the substrate interface.
CN201210168800.5公开一种飞艇蒙皮用TPU薄膜减阻微沟槽的热压印制备方法，制备方法为：一、制备表面具有“V”型沟槽结构的Al制模板；二、清洗模板并涂覆脱模剂；三、用无水乙醇超声清洗TPU薄膜；四、在温度为130～135℃、压力为50～70N的条件下，压印15～20min，停止加热，保压2～2.5h，完成减阻微沟槽的热压印制备。CN201210168800.5 discloses a hot stamping preparation method for a TPU film drag reducing micro-groove for an airship skin, which is prepared by: preparing an Al-made template having a "V"-shaped groove structure on the surface; Coating the release agent; 3. Ultrasonic cleaning of the TPU film with anhydrous ethanol; 4. At a temperature of 130-135 ° C and a pressure of 50-70 N, embossing for 15-20 min, stopping heating, holding pressure 2 to 2.5 h, complete hot stamping preparation of drag reducing microchannels.
以上专利都对传统的热压方法进行改进，使操作更简单、成本更低廉。但是仍采用了非等温热压印工艺，即在每一个压印周期内，压印模具都要需经过先加热后冷却的非等温热压印。制备过程中模具需要反复的加热冷却，导致耗时严重，延长了平板热压印的周期；另外脱模时由于冷却不足导致脱模容易出现脱模缺陷。这些缺点是平板热压印技术尚未解决的技术难题。 All of the above patents improve the conventional hot pressing method to make the operation simpler and less expensive. However, a non-isothermal hot stamping process is still used, that is, in each imprinting cycle, the imprinting mold is subjected to a non-isothermal hot stamping which is cooled by heating first. During the preparation process, the mold needs repeated heating and cooling, which leads to severe time consuming and prolongs the cycle of hot stamping of the flat plate; in addition, demolding is prone to mold release defects due to insufficient cooling during demolding. These shortcomings are technical problems that have not been solved by flat hot stamping technology.
因此，针对现有技术不足，提供一种快速聚合物微结构等温平板热压印工艺以克服现有技术不足甚为必要。Therefore, in view of the deficiencies of the prior art, it is necessary to provide a rapid polymer microstructure isothermal plate hot stamping process to overcome the shortcomings of the prior art.
发明内容Summary of the invention
本发明针对现有技术存在的问题，提供一种快速聚合物微结构等温平板热压印工艺，通过利用聚合物在玻璃化转变温度Tg附近(对无定型聚合物)或结晶熔点Tm以下(对结晶型聚合物)的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免现有技术中对模具反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The present invention is directed to the problem of the prior art, and provides a rapid polymer microstructure isothermal plate hot stamping process by using a polymer near the glass transition temperature Tg (for an amorphous polymer) or a crystalline melting point Tm (pair) The plastic deformation of the crystalline polymer is subjected to microstructure molding, and the mold temperature is kept constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling of the mold in the prior art, thereby realizing the rapid completion of the micro-plate hot stamping; And through the temperature control, the plastic deformation is carried out in the strain flow phase, avoiding the plastic deformation into the strain hardening stage, and ensuring the high replication rate of the microstructure.
为了解决上述问题，本发明所采用的技术方案是：In order to solve the above problems, the technical solution adopted by the present invention is:
提供一种快速聚合物微结构等温平板热压印工艺，微结构的模具在温度为待热压印的无定型型聚合物玻璃化转变温度Tg以下5℃～20℃或者在温度为待热压印的结晶型聚合物的结晶熔点Tm以下10℃～50℃的条件下，对聚合物基片进行热压印，在热压印结束后，保持模具温度不变的情况下直接脱模，得到表面具有微结构的聚合物器件。Providing a rapid polymer microstructure isothermal plate hot stamping process, the microstructure of the mold is at a temperature of 5 ° C ~ 20 ° C below the glass transition temperature Tg of the amorphous polymer to be hot stamped or at a temperature to be hot pressed The polymer substrate is subjected to hot stamping under the conditions of a crystalline melting point Tm of the printed crystalline polymer of 10 ° C to 50 ° C, and is directly released from the mold after the hot stamping is completed, and the mold temperature is maintained. A polymer device having a microstructure on its surface.
优选的，聚合物基片为无定型时，还包括对聚合物基片进行预热操作，具体是将聚合物基片预热到其玻璃化转变温度Tg以上5℃～20℃以后再进行热压印。Preferably, when the polymer substrate is amorphous, the method further comprises preheating the polymer substrate, in particular, preheating the polymer substrate to a temperature above 5 ° C to 20 ° C of the glass transition temperature Tg. Embossed.
进一步的，对聚合物基片预热操作使聚合物基片的受压表面温度分布均匀。Further, the preheating operation of the polymer substrate allows the pressure surface temperature distribution of the polymer substrate to be uniform.
进一步的，模具的温度设置为聚合物基片不粘附模具的最高温度。Further, the temperature of the mold is set to the highest temperature at which the polymer substrate does not adhere to the mold.
进一步的，热压印的压力为2～10Mpa，时间为5s～30s。Further, the hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
进一步的，无定型聚合物包括但不限于PMMA、PC、PS或者PVC材质，聚合物基片可为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。Further, the amorphous polymer includes, but is not limited to, PMMA, PC, PS or PVC, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
另一优选的，聚合物基片为结晶型时，模具直接对常温至聚合物结晶熔点以下的结晶型聚合物基片进行热压印。Alternatively, when the polymer substrate is in a crystalline form, the mold directly heat-embosses the crystalline polymer substrate at a temperature below the melting point of the polymer crystal.
进一步的，模具的温度设置为聚合物基片不粘附模具的最高温度，并在整个压印过程保持温度恒定。Further, the temperature of the mold is set such that the polymer substrate does not adhere to the highest temperature of the mold and maintains a constant temperature throughout the imprint process.
进一步的，热压印的压力为2～10Mpa，时间为5s～30s。Further, the hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
进一步的，结晶型聚合物包括但不限于PP、PE或者PET材质，聚合物基片可为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。Further, the crystalline polymer includes, but is not limited to, PP, PE or PET, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
本发明的一种快速聚合物微结构等温平板热压印工艺，微结构模具在温度为热压印的无定型聚合物玻璃化转变温度Tg以下5℃～20℃或者在温度为热压印的结晶型聚合物的结晶熔点Tm以下10℃～50℃的条件下，对聚合物基片进行热压印，在热压印结束后，保持 模具温度不变的情况下直接脱模，得到表面具有微结构的聚合物器件。The invention relates to a rapid polymer microstructure isothermal plate hot stamping process, wherein the microstructure mold is at a temperature of 5 ° C to 20 ° C below the glass transition temperature Tg of the hot imprinted amorphous polymer or at a temperature of hot stamping. The polymer substrate is hot-embossed under the conditions of a crystalline melting point Tm of the crystalline polymer of 10 ° C to 50 ° C, and is maintained after the hot stamping is completed. The mold is directly demolded without changing the mold temperature to obtain a polymer device having a microstructure on the surface.
本发明相对于现有技术的有益效果是：The beneficial effects of the present invention over the prior art are:
(1)简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。(1) Simplified the flat hot stamping process, avoiding the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortening the flat hot stamping cycle, and realizing rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
(2)通过温度控制使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好；(2) Through the temperature control, the polymer microstructure forming process mainly utilizes the plastic deformation under the polymer solid state, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good;
(3)本工艺较传统热压印工艺的温度低，解决了因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。(3) The process has lower temperature than the traditional hot stamping process, and solves the defects of demoulding caused by the difference in heat shrinkage rate between the polymer and the mold, and is beneficial to reducing energy consumption.
附图说明DRAWINGS
图1为本发明中适用于无定型聚合物的温度压力控制工艺曲线；1 is a temperature pressure control process curve suitable for an amorphous polymer in the present invention;
图2为本发明中适用于结晶型聚合物的温度压力控制工艺曲线。2 is a temperature pressure control process curve suitable for a crystalline polymer in the present invention.
具体实施方式detailed description
下面通过实施例对本发明做进一步详细说明，这些实施例仅用来说明本发明，并不限制本发明的范围。The invention is further illustrated by the following examples, which are intended to illustrate the invention and not to limit the scope of the invention.
实施例1。Example 1.
一种快速聚合物微结构等温平板热压印工艺，聚合物基片为无定型，具体通过如下步骤进行。A rapid polymer microstructure isothermal plate hot stamping process, the polymer substrate is amorphous, specifically by the following steps.
(1)预热，对聚合物基片进行预热操作，具体是将聚合物基片预热到其玻璃化转变温度Tg以上5℃～20℃以后再进行热压印，预热操作确保聚合物基片的受压表面温度分布均匀。(1) preheating, preheating the polymer substrate, specifically preheating the polymer substrate to a glass transition temperature Tg of 5 ° C to 20 ° C, followed by hot stamping, preheating operation to ensure polymerization The pressure surface temperature distribution of the substrate is uniform.
(2)热压印，微结构的模具在温度为待热压印的无定型聚合物玻璃化转变温度Tg以下5℃～20℃的条件下，对聚合物基片进行热压印，热压印的压力为2～10Mpa，时间为5s～30s。图1是本发明快速聚合物微结构等温平板热压印工艺适用于无定型型聚合物的温度压力控制工艺曲线。(2) Hot stamping, the microstructured mold is hot stamped and hot pressed under the condition that the temperature is the temperature of the amorphous polymer to be hot stamped by the glass transition temperature Tg of 5 ° C ~ 20 ° C. The printing pressure is 2 to 10 MPa, and the time is 5 s to 30 s. 1 is a temperature pressure control process curve of the fast polymer microstructure isothermal plate hot stamping process of the present invention applied to an amorphous polymer.
(3)脱模，在热压印结束后，保持模具温度不变的情况下直接脱模，得到表面具有微结构的聚合物器件。(3) Demolding, after the hot stamping is finished, the mold is directly released from the mold while maintaining the mold temperature, and a polymer device having a microstructure on the surface is obtained.
本发明的工艺是在保持模具温度恒定的条件下对聚合物基片进行热压印，热压印过程包括压印、保压和脱模过程。The process of the present invention thermally stamps a polymer substrate while maintaining a constant mold temperature. The hot embossing process includes embossing, holding and demolding processes.
需要说明的是，无定型聚合物包括但不限于PMMA、PC、PS或者PVC材质，聚合物基片可为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。 It should be noted that the amorphous polymer includes, but is not limited to, PMMA, PC, PS or PVC materials, and the polymer substrate may be a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
本发明的工艺方法通过利用聚合物固态下玻璃化转变温度(Tg)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure The hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。The process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
实施例2。Example 2.
一种快速聚合物微结构等温平板热压印工艺，聚合物基片为结晶型，具体通过如下步骤进行。A rapid polymer microstructure isothermal plate hot stamping process, the polymer substrate is crystalline, specifically by the following steps.
微结构的模具在温度为待热压印的结晶型聚合物的结晶熔点Tm以下10℃～50℃的条件下，直接对常温至结晶熔点以下温度的结晶型聚合物基片进行热压印，在热压印结束后，保持模具温度不变的情况下直接脱模，得到表面具有微结构的聚合物器件。热压印的压力为2～10Mpa，时间为5s～30s，图2是本发明快速聚合物微结构等温平板热压印工艺适用于结晶型聚合物的温度压力控制工艺曲线。The microstructured mold is directly hot-imprinted on a crystalline polymer substrate having a temperature ranging from room temperature to below the melting point of the crystal at a temperature of 10 ° C to 50 ° C below the crystalline melting point Tm of the crystalline polymer to be hot-embossed. After the end of the hot stamping, the mold was directly demolded while keeping the mold temperature constant, and a polymer device having a microstructure on the surface was obtained. The pressure of the hot stamping is 2-10 MPa and the time is 5 s-30 s. FIG. 2 is a temperature pressure control process curve of the fast polymer microstructure isothermal flat hot stamping process of the present invention applied to the crystalline polymer.
需要说明的是，结晶型聚合物包括但不限于PP、PE或者PET材质，聚合物基片可为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。It should be noted that the crystalline polymer includes, but is not limited to, PP, PE or PET, and the polymer substrate may be a thin plate, a sheet or a film having a thickness of 0.01 mm to 2.00 mm.
本发明的工艺方法通过利用聚合物固态下结晶熔点(Tm)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat The embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便， 易实现大规模工业化生产。The process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, Easy to achieve large-scale industrial production.
实施例3。Example 3.
本实施例提供以PMMA(聚甲基丙烯酸甲酯Polymethylmethacrylate)为基材的快速聚合物微结构等温平板热压印工艺，无定型聚合物PMMA基材的玻璃化转变温度Tg为105℃。所采用微结构的模具表面为特征尺寸为50μm的V-Cut结构。This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PMMA (polymethyl methacrylate) as a substrate. The amorphous polymer PMMA substrate has a glass transition temperature Tg of 105 ° C. The microstructure of the mold surface used was a V-Cut structure having a feature size of 50 μm.
该快速聚合物微结构等温平板热压印工艺包括以下步骤：The rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
(1)预热：将PMMA基片预热到110℃，预热过程中控制使聚合物基片的受压表面的温度呈均匀分布；(1) Preheating: preheating the PMMA substrate to 110 ° C, and controlling the temperature of the pressed surface of the polymer substrate to be evenly distributed during the preheating process;
(2)压印：使微结构的模具温度保持100℃，确保平板状模具表面温度分布均匀，平板状模具对预热好的聚合物基片进行热压印，压印压力为4Mpa，压印时间为15s；(2) Imprinting: Keep the temperature of the microstructured mold at 100 °C to ensure uniform temperature distribution on the surface of the flat mold. The flat mold is hot stamped on the preheated polymer substrate, and the imprint pressure is 4Mpa. The time is 15s;
(3)脱模：热压印完成后，使模具温度保持不变，直接脱模，得到表面具有V-Cut微结构的聚合物器件。(3) Demoulding: After the hot stamping is completed, the mold temperature is kept constant, and the mold is directly released to obtain a polymer device having a V-Cut microstructure on the surface.
本发明的工艺方法通过利用聚合物固态下玻璃化转变温度(Tg)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure The hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。The process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
实施例4。Example 4.
本实施例提供以PP(聚丙烯)为基材的快速聚合物微结构等温平板热压印工艺，结晶型聚合物PP基材的结晶熔点Tm为160℃，所采用微结构的模具表面为特征尺寸50μm的V-Cut结构。The present embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PP (polypropylene) as a substrate. The crystalline polymer PP substrate has a crystalline melting point Tm of 160 ° C, and the microstructure of the mold surface is characterized. V-Cut structure with a size of 50 μm.
该快速聚合物微结构等温平板热压印工艺包括以下步骤：The rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
(1)压印：平板模具温度设置115℃，模具直接对常温的PP基材进行热压印，压印压力为5Mpa，压印时间为20s；(1) Imprint: the temperature of the flat mold is set to 115 ° C, and the mold directly performs hot stamping on the PP substrate at normal temperature, the imprint pressure is 5 Mpa, and the imprinting time is 20 s;
(2)脱模：热压印完成后，模具温度保持不变，直接脱模，得到表面具有V-Cut微结构 的聚合物器件。(2) Demoulding: After the hot stamping is completed, the mold temperature remains unchanged, and the mold is directly released, and the surface has a V-Cut microstructure. Polymer device.
本发明的工艺方法通过利用聚合物固态下结晶熔点(Tm)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat The embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。The process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
实施例5。Example 5.
本实施例提供以PVC(聚氯乙烯)为基材的快速聚合物微结构等温平板热压印工艺，无定型型聚合物PVC基材的玻璃化转变温度Tg为80℃。所采用微结构的模具表面为特征尺寸为50μm的V-Cut结构。This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PVC (polyvinyl chloride) as a substrate, and the glass transition temperature Tg of the amorphous polymer PVC substrate is 80 °C. The microstructure of the mold surface used was a V-Cut structure having a feature size of 50 μm.
该快速聚合物微结构等温平板热压印工艺包括以下步骤：The rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
(1)预热：将PVC基片预热到90℃，预热过程保证聚合物受压表面温度分布均匀；(1) Preheating: The PVC substrate is preheated to 90 ° C, and the preheating process ensures uniform temperature distribution of the pressed surface of the polymer;
(2)压印：微结构模具温度设置为70℃，保证平板模具表面温度分布均匀，平板模具对预热好的聚合物基片进行微压印，压印压力为8Mpa，压印时间为10s；(2) Embossing: The temperature of the microstructured mold is set to 70 °C to ensure uniform temperature distribution on the surface of the flat mold. The flat mold is micro-embossed on the preheated polymer substrate, the embossing pressure is 8Mpa, and the embossing time is 10s. ;
(3)脱模：热压印完成后，模具温度保持不变，直接脱模，得到表面具有V-Cut微结构的聚合物器件。(3) Demoulding: After the hot stamping is completed, the mold temperature remains unchanged, and the mold is directly released to obtain a polymer device having a V-Cut microstructure on the surface.
本发明的工艺方法通过利用聚合物固态下玻璃化转变温度(Tg)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the glass transition temperature (Tg) of the polymer solid state, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure The hot stamping of the flat plate is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷 却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。The process simplifies the flat hot stamping process, and avoids the need for repeated heating and cooling in the prior art flat hot stamping process. However, the time-consuming and energy-consuming defects caused by the plate shortened the hot stamping cycle of the flat plate, realized rapid plate hot stamping, and the operation was simple, and it was easy to realize large-scale industrial production.
实施例6。Example 6.
本实施例提供以PE(聚乙烯)为基材的快速聚合物微结构等温平板热压印工艺，结晶型聚合物PE基材的结晶熔点Tm为127℃，所采用微结构的模具表面为特征尺寸50μm的V-Cut结构。This embodiment provides a rapid polymer microstructure isothermal plate hot stamping process using PE (polyethylene) as a substrate. The crystalline polymer PE substrate has a crystalline melting point Tm of 127 ° C, and the microstructure of the mold surface is characterized. V-Cut structure with a size of 50 μm.
该快速聚合物微结构等温平板热压印工艺包括以下步骤：The rapid polymer microstructure isothermal plate hot stamping process comprises the following steps:
(1)压印：平板模具温度设置110℃，模具直接对常温的PE基材进行热压印，压印压力为7Mpa，压印时间为11s；(1) Embossing: the temperature of the flat mold is set to 110 ° C, and the mold directly performs hot stamping on the PE substrate at normal temperature, the imprinting pressure is 7 Mpa, and the imprinting time is 11 s;
(2)脱模：热压印完成后，模具温度保持不变，直接脱模，得到表面具有V-Cut微结构的聚合物器件。(2) Demoulding: After the hot stamping is completed, the mold temperature remains unchanged, and the mold is directly released to obtain a polymer device having a V-Cut microstructure on the surface.
本发明的工艺方法通过利用聚合物固态下结晶熔点(Tm)附近的塑性变形进行微结构成型，热压印过程中保持模具温度恒定避免反复加热冷却造成的耗时，以此实现微结构平板热压印的快速完成；并通过温度控制使其塑性变形在应变流动阶段进行，避免塑性变形进入应变硬化阶段，保证微结构有较高的复制率。The process of the invention realizes microstructure formation by utilizing plastic deformation near the crystalline melting point (Tm) in the solid state of the polymer, and keeps the mold temperature constant during the hot stamping process to avoid the time consuming caused by repeated heating and cooling, thereby realizing the microstructure flat heat The embossing is completed quickly; and the plastic deformation is carried out in the strain flow phase by temperature control, so that the plastic deformation is prevented from entering the strain hardening stage, and the microstructure has a high replication rate.
本发明的工艺方法通过控制模具温度使聚合物微结构成型过程主要利用聚合物固态下的塑性变形，整个成型过程更加可控，微结构成型精度高、整体一致性好，该工艺方法所采用的热压印工艺较传统工艺温度低，避免了现有技术中因聚合物与模具热收缩率不同造成的脱模的缺陷，同时有利于减低耗能。The process of the invention controls the mold temperature to make the polymer microstructure forming process mainly utilize the plastic deformation under the solid state of the polymer, the whole molding process is more controllable, the microstructure forming precision is high, and the overall consistency is good, and the method adopts the method. The hot stamping process has lower temperature than the conventional process, and avoids the defects of demolding caused by the difference in heat shrinkage ratio between the polymer and the mold in the prior art, and is advantageous in reducing energy consumption.
该工艺方法简化了平板热压印工艺，避免了现有技术中平板热压印工艺需要反复加热冷却造成的耗时耗能缺陷，显著缩短了平板热压印周期，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。The process simplifies the flat hot stamping process, avoids the time-consuming energy consumption defects caused by repeated heating and cooling in the prior art flat hot stamping process, significantly shortens the flat hot stamping cycle, and realizes rapid flat hot stamping. And easy to operate, easy to achieve large-scale industrial production.
最后应当说明的是，以上实施例仅用以说明本发明的技术方案而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of the present invention. Although the present invention is described in detail with reference to the preferred embodiments, those skilled in the art The technical solutions of the present invention are modified or equivalently substituted without departing from the spirit and scope of the technical solutions of the present invention.
工业实用性Industrial applicability
本发明的快速聚合物微结构等温平板热压印工艺，实现了快速平板热压印，且操作简便，易实现大规模工业化生产。 The rapid polymer microstructure isothermal plate hot stamping process of the invention realizes rapid flat hot stamping, and is easy to operate, and is easy to realize large-scale industrial production.

Claims (10)

  1. 一种快速聚合物微结构等温平板热压印工艺，其特征在于：A rapid polymer microstructure isothermal plate hot stamping process characterized by:
    微结构的模具在温度为待热压印的无定型型聚合物玻璃化转变温度Tg以下5℃～20℃或者在温度为待热压印的结晶型聚合物的结晶熔点Tm以下10℃～50℃的条件下，在保持模具温度恒定的条件下对聚合物基片进行热压印，所述热压印过程包括压印、保压和脱模过程。The microstructured mold is at a temperature of 5 ° C to 20 ° C below the glass transition temperature Tg of the amorphous polymer to be hot stamped or 10 ° C to 50 below the crystalline melting point Tm of the crystalline polymer to be hot stamped. The polymer substrate was hot embossed under conditions of ° C while maintaining a constant mold temperature, including embossing, holding and demolding processes.
  2. 根据权利要求1所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal flat hot stamping process according to claim 1, wherein:
    聚合物基片为无定型型时，还包括对聚合物基片进行预热操作，具体是将聚合物基片预热到其玻璃化转变温度Tg以上5℃～20℃以后再进行热压印。When the polymer substrate is of an amorphous type, the method further comprises preheating the polymer substrate, specifically, preheating the polymer substrate to a temperature above 5 ° C to 20 ° C of the glass transition temperature Tg, and then performing hot stamping. .
  3. 根据权利要求2所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 2, wherein:
    对聚合物基片预热操作使聚合物基片的受压表面温度分布均匀。The preheating operation of the polymer substrate provides a uniform distribution of the pressure surface temperature of the polymer substrate.
  4. 根据权利要求3所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 3, wherein:
    模具的温度设置为聚合物基片不粘附模具的最高温度。The temperature of the mold is set to the highest temperature at which the polymer substrate does not adhere to the mold.
  5. 根据权利要求4所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 4, wherein:
    热压印的压力为2～10Mpa，时间为5s～30s。The hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
  6. 根据权利要求5所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 5, wherein:
    无定型型聚合物包括PMMA、PC、PS或者PVC材质，聚合物基片为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。The amorphous polymer comprises PMMA, PC, PS or PVC, and the polymer substrate is a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
  7. 根据权利要求1所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal flat hot stamping process according to claim 1, wherein:
    聚合物基片为结晶型时，模具直接对温度为常温至结晶熔点以下温度的结晶型聚合物基片进行热压印。When the polymer substrate is in a crystalline form, the mold directly thermally embosses the crystalline polymer substrate having a temperature ranging from normal temperature to a temperature below the crystalline melting point.
  8. 根据权利要求7所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 7, wherein:
    模具的温度设置为聚合物基片不粘附为模具的最高温度，并在整个压印过程保持温度恒定。The temperature of the mold is set such that the polymer substrate does not adhere to the highest temperature of the mold and maintains a constant temperature throughout the imprint process.
  9. 根据权利要求8所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 8, wherein:
    热压印的压力为2～10Mpa，时间为5s～30s。The hot stamping pressure is 2 to 10 MPa, and the time is 5 s to 30 s.
  10. 根据权利要求9所述的快速聚合物微结构等温平板热压印工艺，其特征在于：The rapid polymer microstructure isothermal plate hot stamping process according to claim 9, wherein:
    结晶型聚合物包括PP、PE或者PET材质，聚合物基片为厚度0.01mm至2.00mm的薄板、薄片或者薄膜。 The crystalline polymer includes PP, PE or PET, and the polymer substrate is a thin plate, sheet or film having a thickness of 0.01 mm to 2.00 mm.
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