CN102205639A - Method for polymer extruding and micro embossing shaping - Google Patents

Method for polymer extruding and micro embossing shaping Download PDF

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Publication number
CN102205639A
CN102205639A CN2011100511249A CN201110051124A CN102205639A CN 102205639 A CN102205639 A CN 102205639A CN 2011100511249 A CN2011100511249 A CN 2011100511249A CN 201110051124 A CN201110051124 A CN 201110051124A CN 102205639 A CN102205639 A CN 102205639A
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micro
embossing
polymer
heating
forming method
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吴大鸣
刘颖
刘文龙
张亚军
郑秀婷
庄俭
王晓伟
许红
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Beijing University of Chemical Technology
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Beijing University of Chemical Technology
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Abstract

Polymer micro embossing is a shaping method for forming micro-nano-structured patterns on polymer substrate materials by hot embossing. Polymer micro embossing method is widely applied in the manufacturing of various polymer micro-nano structures. The experiment apparatus mainly comprises: a polymer substrate extruder, a substrate pressing and thickness adjusting apparatus, a temperature controlling apparatus, an embossing apparatus, a pressure controlling apparatus, a pressure maintaining cooling apparatus, and a pulling apparatus. The pressing and thickness adjusting apparatus is used for flattening the extruded polymer; the temperature controlling apparatus is used for ensuring the surface temperature of the polymer substrate requiring flattening; the embossing apparatus is provided with embossing molds with micro embossing structures, wherein the micro embossing structures are transferred with applied pressures; the pressure controlling apparatus is used for adjusting the pressures applied to the polymer substrate; and the pressure maintaining cooling apparatus is used for cooling and shaping the micro structures. With the shaping method, a large amount of time and energy required by heating and cooling can be saved, the embossing equipment can be greatly simplified, the production efficiency is high, the operation is simple, and the cost is low.

Description

Polymer-extruded micro-embossing forming method
Technical field
The present invention relates to a kind of polymer-extruded micro-embossing forming method, be mainly used in the polymer matrix film surface pressure and make microstructure graph, application mainly contains: the fields such as making of polymer grating, polymer light conducting plate, polymer base radiator, micro polymer Mechatronic Systems, polymeric micro-fluidic chip, surface-mounted integrated circuit.
Background technology
Polymer hot padding moulding is a kind of emerging graph copying technology, it is compared with traditional photoetching technique has following characteristics: equipment is simple, easy to operate, operation succinct (technological parameter is less), the accuracy of repetition height of fine structure, mould that processing charges is low, more expensive only need be processed once, can realize advantages such as duplicating in enormous quantities of same microstructure, owing to the demand to microstructural articles increases gradually, its development speed is also more and more faster in recent years.
The basic principle of this technology is: at first polymer matrix film is heated to its more than vitrification point 30 ℃~100 ℃ (for crystal polymer thing substrate, temperature will reach more than the melt temperature), then under certain pressure effect, impressing mould (needed microstructure graph is arranged on it) is pressed on the polymer matrix film, polymer is filled in the micro-structural on the mould, the demoulding behind the cooling and shaping reaches the purpose that graph copying shifts.
Mostly the forming method that is used for micro-embossing at present is to adopt flat hot stamp machine, nano marking press described in patent 200510019944.4, its principle all is that the polymer matrix film under the room temperature is fixed on the lower plate of hot stamp machine, and heating-cooling device and positioner are housed on the lower plate.Impressing mould is fixed on the upper plate, and heating-cooling device also is installed on it.During work, at first the polymer matrix film that is fixed on the lower plate is heated, make it reach the needed temperature of impression.Mould also will be heated to certain temperature, and is can mold filling complete to guarantee polymer.Upper substrate drive mould pressurizes to polymer matrix film then, and polymer is filled in the impressing mould, after pressurize cooling a period of time, carries out the demoulding.Thereby finish the time processing process.This method belongs to discontinuous formula production, infrabasal plate heating cooling is too frequent and speed is slow, and energy consumption is big, and the flowability of the polymer matrix film after the post bake is difficult to reach desired degree, often cause the graph copying low precision, micro-structural shifts imperfect.In addition, when upper substrate was exerted pressure, owing to adopt direct press type, the pressurization area was big, and upper substrate is easy to unbalance stress, causes the upper substrate buckling deformation to cause the polymer matrix film discontinuity, not only impressed area and was restricted, also influence impression Products Quality.
For this reason, invented a variety of mode of heatings and be used for improving the slow-footed problem of heating cooling, as employed electromagnetic wave heating in the patent 200410050075.7 etc., the heating cooling effectiveness when these methods have improved hot padding has been saved molding time.Patent 02131969.3 and patent 200510069953.4 have been invented a kind of thermal marking method that pressurizes with gas, because the equal pressure distribution character of gas molecule, the homogeneity question of pressure distribution in the time of can solving hot padding makes the impression area unrestricted, the pressurization good uniformity.The production equipment of these methods more complicated all but, production efficiency is low, and the repeatable accuracy of product is poor.
In order to improve the above-mentioned shortcoming of dull and stereotyped thermal marking method, patent 200810068662.7, designed the continuous micro-embossing method of pulley type, basic principle is that two rollers that rotate synchronously of employing are finished the impression to polymer matrix film, one of them roller has the micro-embossing mould, polymer matrix film heats by impression roller, regulates the pressure that is applied on the polymer matrix film by regulating two distances between the roller.This structure can realize continous way production, owing to be the line contact, has reduced to impress the required power that applies when impressing simultaneously, and the Embosser distortion is little, has improved the uniformity of pressure distribution.But, when being applied to the polymer hot padding, this kind method require the efficiency of heating surface of roller very high, could guarantee that like this polymer matrix film can reach temperature required fast when continuous rolling.The while calcining temperature is high and the dwell time is short, and these all can cause the elastic recovery phenomenon occurring behind the polymer micro-structural shaping and demoulding, can't guarantee the precision of graph copying.In addition, owing in the roller heater will be installed, reduce the rigidity of roller like this when this method is applied to micro-embossing, increased the uneven possibility of pressure distribution.Patent 200620022753.3 has designed the structure of multiple roll, specialized designs preheat roll be used for heating, also have the pressurize chill roll simultaneously.But the number of roller is more, makes installation and positioning accuracy be difficult to guarantee, poor synchronization when organizing the roller operation, complex structure more; Simultaneous temperature also can't accurately be controlled, the bad adjusting of technological parameter.
Summary of the invention
Micro-embossing forming method among the present invention has been realized the connect use of micro-embossing machine with extruder, directly carries out micro-embossing after the polymer matrix film of extruding is flattened, simultaneously by the improvement of micro-embossing equipment being realized the serialization of production technology.
Existing invention all is to use the finished product polymer matrix film to carry out hot padding mostly, polymer matrix film under the room temperature is heated to when impression needed temperature needs a lot of energy, and the flowability of polymer matrix film is lower than the substrate good fluidity when extruder is extruded just after the post bake.In addition,, be easy to take place buckling deformation during the heating pressurization, influence impression quality if polymer matrix film is fixing bad during post bake.Among the present invention, we are the use of connecting with extruder of micro-embossing machine, directly carry out micro-embossing after the sheet material of extruding is flattened, and have so not only saved complicated heating and cooling system, have saved a large amount of heat energy, and the flowability of polymer matrix film is guaranteed.In order to realize above purpose, the present invention has mainly done following improvement to the micro-embossing method.
1. flatten and transfer thick device: polymer is relatively more responsive for process conditions such as temperature and pressures.Owing to be subjected to various condition effect, the thickness after polymer matrix film is extruded may be inhomogeneous, and this inhomogeneities shows that polymer matrix film extrudes direction and thickness direction, and we more are concerned about its inhomogeneities at thickness direction herein.Generally speaking, the thickness error after substrate is directly extruded is greatly between ± 100~200 microns, and this microstructure size that may will impress greater than us.So if carry out micro-embossing after polymer matrix film is directly extruded, roughly the substrate pressure distribution is inhomogeneous, thick place pressure is big, and thin place pressure is little, influence impression quality.Therefore, how to guarantee that the thickness before the polymer matrix film impression is evenly most important.
The uniformity of polymer matrix film thickness when guaranteeing micro-embossing, we are provided with one and flatten and transfer thick device after polymer matrix film is extruded, with this substrate of extruding is flattened, and guarantee that its thickness is even, can regulate the thickness of substrate simultaneously.Flatten and transfer thick device mainly to be made up of two pre-THICKNESS CONTROL rollers that flatten, its spacing can accurately be regulated according to different needs, and the spacing degree of regulation requires to reach in the 0.01mm.Simultaneously, on two cylinders the precise dose control device is installed all, be used to control roller temperature, two pre-THICKNESS CONTROL rollers that flatten can adopt anisothermal temperature control method, the roller temperature height that is used for micro-embossing to guarantee the good flowability of polymer, fully flattens its surface, the backing roll temperature is lower, so that polymer matrix film has cooling and shaping to a certain degree.But the temperature of two rollers all will be controlled at more than the polymer matrix film vitrification point, otherwise impression the time make polymer matrix film need just can be warmed up to for a long time temperature required, thereby influence the speed of micro-embossing.When substrate is very thin, also can adopt the isothermal control mode.Polymer matrix film is behind the pre-pressing THICKNESS CONTROL roller through two, and its thickness is guaranteed.Because polymer is relatively responsive to temperature, thus temperature control precision require to reach ± 1 ℃ in.
2. the installation of heating and heat-insulating device: because we directly carry out micro-embossing after polymer matrix film will being extruded pressing, and polymer matrix film is easy to cooling.Therefore, in order to guarantee that polymer sheet still remained on certain temperature before entering the micro-embossing machine, simultaneously also in order to control process conditions more accurately, we have installed a heating and heat-insulating device between cross-head and micro-embossing machine, be used to guarantee that polymer matrix film impresses needed different temperatures process conditions when treating the temperature of stamping surface and controlling different polymer to impress.
Because the size of the micro-structural of impression has only the hundreds of micron, even littler.Different with common impression, only need during micro-embossing will be to be impressed the heating of polymer matrix film surface get final product, and firing rate wants fast, temperature control precision is wanted height
In addition, heater need adopt contactless heating, and adopts the closed loop thermal control system that the temperature on polymer matrix film surface is accurately controlled, and temperature control precision is in ± 1 ℃ of scope.Mode of heating can have: modes such as infrared heating, ultraviolet heating, resistance heated, eddy-current heating, hot blast heating, can select according to different actual conditions.
3. three-roller type imprinting apparatus: it is to add a pressurize cooling roller that is used for the pressurize typing on the basis of two roller platens again, be installed in a side of impression roller, angle between it and the roller platen can be regulated, so that regulate different pressurize cool times according to different materials.Polymer matrix film has impressed and has entered into to advance between pressurize chill roll and the roller platen cold pressurize cooling after the micro-structural, to guarantee polymer matrix film cooling and shaping fully, the precision of assurance graph copying.It with impression roller between be connected with spring, to guarantee having certain pressure between the roller.Coat the soft coating of one deck rubber-like simultaneously on the roller surface, destroyed with the micro-structural that prevents to impress.After pressurize cooled off roller and remove, can also carry out the hot padding of the double-side micro structure of polymer matrix film.
Effect of the present invention: flatten and transfer thick device to guarantee polymer matrix film after extruding, carry out the micro-embossing uniformity of thickness before.After polymer matrix film is extruded, also keeping very high temperature, heater is easy to just to make its surface reach desired imprint temperature, has improved the efficiency of heating surface, makes speed of imprint can improve a lot.Simultaneously because the polymer matrix film flowability of just having extruded is more much better than post bake, so can mold filling complete.The installation of the cooling of pressurize simultaneously roller has guaranteed enough pressurize shaping times, has guaranteed the dimensional stability after the demoulding of impression goods.
Specific embodiments
The operation principle of the polymer-extruded micro-embossing forming method of the present invention as shown in Figure 2, extruder (1) is extruded the needed polymer matrix film of micro-embossing (3) through squeezing sheet head (2), polymer matrix film (3) flattens and transfers thickly through flatten transferring the pre-THICKNESS CONTROL rollers (4) that flatten of two of thick device, guarantees the uniformity of polymer matrix film (3) thickness.After the pressing, polymer matrix film (3) enters heating and heat-insulating device (5), the technological temperature that its surface temperature control is being set.Then, polymer matrix film (3) enters between impression roller (6) and the back-up roller (7), wherein, impression roller is equipped with the hot padding mould on (6), the pressure that relies on impression roller (6) and support between the roller (7) comes polymer matrix film (3) is pressurizeed, and finishes the transfer of duplicating of micro-structural.After the polymer matrix film impression is finished, enter between impression roller (6) and the cooling pressurize roller (8), position between cooling pressurize roller (8) and the impression roller (6) can be regulated in the certain angle scope, to increase or to reduce the cooling dwell time, to satisfy the requirement of different technology conditions, as shown in Figure 3.Simultaneously, the cooling pressurize roller (8) with impression roller (6) between be connected by a spring (12), to guarantee between two rollers certain pressure being arranged, also can adopt other connected mode, as long as guaranteeing has certain pliable pressure between this two roller, a structure (10) that is used to regulate angle position between this two roller also is installed simultaneously as shown in Figure 4.Pressure-regulating device is used for regulating the pressure between impression roller (6) and the support roller (7), and overall structure figure as shown in Figure 5.
Description of drawings
The two-sided hot padding structure principle chart of Fig. 1
Fig. 2 is the fundamental diagram of continous way hot padding former
Fig. 3 is a roller position-adjustable schematic diagram
Fig. 4 connects and position adjustments figure for roller
Fig. 5 overall structure schematic diagram

Claims (12)

1. a polymer-extruded micro-embossing forming method comprises: flatten and transfer thick device, temperature control equipment, imprinting apparatus, pressure control device, pressurize cooling device and draw-gear.For the polymer matrix film wall thickness that guarantees to enter the micro-embossing roller even, two precompressed THICKNESS CONTROL rollers are set, the substrate that extruder sheet material head is extruded flattens in advance, pass through temperature control equipment again after the pressing accent is thick, make and treat that stamping surface reaches the needed temperature of micro-embossing, enter imprinting apparatus subsequently and carry out micro-embossing, behind impression and the cooling and shaping, under the effect of draw-gear, finish the micro-structural demoulding.
2. require described polymer-extruded micro-embossing forming method as right 1, it is characterized in that described polymer matrix film comprises thermoplastic polymers such as PMMA, PC, PS, PP, PET, PBT.
3. require described polymer-extruded micro-embossing forming method as right 1, it is characterized in that, described pressing transfers thick device to be made up of two precompressed THICKNESS CONTROL rollers that rotate synchronously, and its spacing can accurately be regulated, and is adjustable with the homogeneous of thickness before the hot padding of assurance polymer matrix film.
4. require described polymer-extruded micro-embossing forming method as right 3, it is characterized in that, described pressing transfers two precompressed THICKNESS CONTROL rollers of thick device that temperature control equipment is installed, and adopts isothermal or anisothermal mode of heating to guarantee that polymer matrix film treats that stamping surface can flatten and reach the required temperature of technology.
5. require described polymer-extruded micro-embossing forming method as right 1, it is characterized in that, the mode of heating of described temperature control equipment must be contactless, can not contact with polymer matrix film during heating.
6. require described polymer-extruded micro-embossing forming method as right 5, it is characterized in that, described mode of heating only needs the stamping surface for the treatment of of heated polymerizable thing substrate, requires efficiency of heating surface height, temperature-controlled precision height, is quick on the draw.Can adopt modes such as infrared heating, ultraviolet heating, resistance heated, eddy-current heating, hot blast heating to finish heating to polymer matrix film.
7. require described polymer-extruded micro-embossing forming method as right 5, it is characterized in that, described temperature control system adopts closed-loop control system, realizes the polymer matrix film accuracy control over temperature.In temperature-controlled precision requires ± 1 ℃.
8. require described polymer-extruded micro-embossing forming method as right 1, it is characterized in that, described imprinting apparatus is made up of two rollers that rotate synchronously.
9. require described polymer-extruded micro-embossing forming method as right 8, it is characterized in that, described two rollers can all have the micro-embossing mould, but also one of them cylinder has the micro-embossing mould, in order to realize the hot padding of the two-sided or single face micro-structural of polymer matrix film.
10. require described polymer-extruded micro-embossing forming method as right 1, it is characterized in that, described pressurize cooling device adopts a pressurize cooling roller that links to each other with impression roller to realize.
11. require described polymer-extruded micro-embossing forming method, it is characterized in that described pressurize cooling roller adopts a tensioning apparatus to link to each other with impression roller, and certain pressure is arranged between the assurance as right 11.Simultaneously it can be regulated in the certain angle scope with the locus of impression roller, with the requirement of realization different process.
12. require described polymer-extruded micro-embossing forming method, it is characterized in that described pressurize cooling roller is coated with one deck soft material, in order to avoid micro-structural is destroyed as right 11.
CN2011100511249A 2011-03-03 2011-03-03 Method for polymer extruding and micro embossing shaping Pending CN102205639A (en)

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CN102700123A (en) * 2012-06-21 2012-10-03 上海交通大学 Reel-to-reel hot rolling forming device for fine structures of polymer thin film products
CN103624992A (en) * 2013-11-22 2014-03-12 北京化工大学 Pressing device and method of polymer microstructure
CN104053627A (en) * 2011-11-02 2014-09-17 3M创新有限公司 Method of making a nozzle
CN104523366A (en) * 2014-11-20 2015-04-22 江门大诚医疗器械有限公司 Manufacturing technology of disposable body surface heating blanket
CN105500685A (en) * 2015-11-23 2016-04-20 南通天鸿镭射科技有限公司 Forming device for material with micro-nano structure on surface and processing technology thereof
CN105666771A (en) * 2016-03-08 2016-06-15 深圳市帝显电子有限公司 Hot rolling method of light guide plate
CN106994777A (en) * 2016-01-26 2017-08-01 北京化工大学 A kind of new photocuring micro-embossing forming technique and equipment
CN107116782A (en) * 2017-05-27 2017-09-01 武汉现代精工机械股份有限公司 The surface forming emebosser and its production technology of a kind of PVB films
CN107718590A (en) * 2017-09-19 2018-02-23 惠州博洋玩具工业有限公司 A kind of special-shaped adhesive tape production equipment
CN107884870A (en) * 2017-12-27 2018-04-06 翰博高新材料(合肥)股份有限公司 A kind of light conducting plate structure for solving the problems, such as lamp shadow and preparation method thereof
WO2018145372A1 (en) * 2016-10-10 2018-08-16 北京化工大学 Method for preparing high-performance polymer based conductive composite material using micro-nano precision assembly method within confinement space
CN108466415A (en) * 2018-05-04 2018-08-31 湖南烁普新材料有限公司 Wet method diaphragm membrane preparation facilities and preparation method
US10899044B2 (en) 2014-06-05 2021-01-26 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Mold, method for the production and use thereof, plastic film and plastic component
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US10406537B2 (en) 2011-11-02 2019-09-10 3M Innovative Properties Company Method of making a nozzle
CN102700123B (en) * 2012-06-21 2014-12-10 上海交通大学 Reel-to-reel hot rolling forming device for fine structures of polymer thin film products
CN102700123A (en) * 2012-06-21 2012-10-03 上海交通大学 Reel-to-reel hot rolling forming device for fine structures of polymer thin film products
CN103624992A (en) * 2013-11-22 2014-03-12 北京化工大学 Pressing device and method of polymer microstructure
US10899044B2 (en) 2014-06-05 2021-01-26 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Mold, method for the production and use thereof, plastic film and plastic component
CN104523366A (en) * 2014-11-20 2015-04-22 江门大诚医疗器械有限公司 Manufacturing technology of disposable body surface heating blanket
CN105500685A (en) * 2015-11-23 2016-04-20 南通天鸿镭射科技有限公司 Forming device for material with micro-nano structure on surface and processing technology thereof
CN106994777A (en) * 2016-01-26 2017-08-01 北京化工大学 A kind of new photocuring micro-embossing forming technique and equipment
CN105666771B (en) * 2016-03-08 2018-08-03 深圳市帝显电子有限公司 The hot rolling methods of light guide plate
CN105666771A (en) * 2016-03-08 2016-06-15 深圳市帝显电子有限公司 Hot rolling method of light guide plate
GB2573914A (en) * 2016-10-10 2019-11-20 Univ Beijing Chem Tech Method for preparing high-performance polymer based conductive composite material using micro-nano precision assembly method within confinement space
WO2018145372A1 (en) * 2016-10-10 2018-08-16 北京化工大学 Method for preparing high-performance polymer based conductive composite material using micro-nano precision assembly method within confinement space
GB2573914B (en) * 2016-10-10 2022-05-25 Univ Beijing Chem Tech A Method for preparing high performance polymer-based conductive composites by space-limited micro-nano precision assembly method
CN107116782A (en) * 2017-05-27 2017-09-01 武汉现代精工机械股份有限公司 The surface forming emebosser and its production technology of a kind of PVB films
CN107718590A (en) * 2017-09-19 2018-02-23 惠州博洋玩具工业有限公司 A kind of special-shaped adhesive tape production equipment
CN107884870A (en) * 2017-12-27 2018-04-06 翰博高新材料(合肥)股份有限公司 A kind of light conducting plate structure for solving the problems, such as lamp shadow and preparation method thereof
CN108466415A (en) * 2018-05-04 2018-08-31 湖南烁普新材料有限公司 Wet method diaphragm membrane preparation facilities and preparation method
CN108466415B (en) * 2018-05-04 2023-11-24 湖南烁普新材料有限公司 Wet diaphragm membrane preparation device and preparation method
CN113501488A (en) * 2021-06-15 2021-10-15 武汉大学 Flexible substrate micro-nano structure forming device and flexible pressure sensor processing system
CN113501488B (en) * 2021-06-15 2024-01-30 武汉大学 Flexible substrate micro-nano structure forming device and flexible pressure sensor processing system
CN115709582A (en) * 2022-11-16 2023-02-24 中南大学 Roll-to-roll integrated efficient integrated manufacturing system for micro-fluidic chip
CN115709582B (en) * 2022-11-16 2024-05-28 中南大学 Roll-to-roll integrated high-efficiency manufacturing system of microfluidic chip

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Application publication date: 20111005