TW201332745A - Heat pressure molding method - Google Patents

Heat pressure molding method Download PDF

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Publication number
TW201332745A
TW201332745A TW101103440A TW101103440A TW201332745A TW 201332745 A TW201332745 A TW 201332745A TW 101103440 A TW101103440 A TW 101103440A TW 101103440 A TW101103440 A TW 101103440A TW 201332745 A TW201332745 A TW 201332745A
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Taiwan
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mold
forming method
hot press
press forming
cavity
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TW101103440A
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Chinese (zh)
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Yuan-Li Chuang
Hsueh-Tsu Chang
Chung-Hsien Huang
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Chenming Mold Ind Corp
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Priority to TW101103440A priority Critical patent/TW201332745A/en
Priority to CN2012100552629A priority patent/CN103240871A/en
Publication of TW201332745A publication Critical patent/TW201332745A/en

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Abstract

The primary objective of the present invention is to provide a heat pressure molding method, which separates the heating device and the pressing device from the light guide panel manufacturing mold in prior art, so as to preheat the panel outside the mold and then convey the heated panel into the mold via a conveyer. Finally, the pressing procedure could be individually applied inside the mold. By this means, the negative influence led by nonuniform temperature in the mold would be avoided during the panel pressing procedure, and the yield rate of the manufacturing could be efficiently enhanced.

Description

熱壓成型方法Hot press forming method

本發明是有關於一種熱壓成型方法,特指一種利用預先加熱,而後於模具中加壓的導光板成型方法。
The invention relates to a hot press forming method, in particular to a light guide plate forming method which uses preheating and then pressurizes in a mold.

習知的導光板(Light Guide Panel,LGP)熱壓成型方式主要係將待壓印物放置於一壓印模具的模腔內,壓印模具包含一組上第一模板,此上第一模板各具一有壓印光學紋路的壓印面,將壓印物置於上第一模板具有壓印光學紋路的表面之間後閉合此壓印模具,此時上第一模板會形成一個封閉模腔,而壓印物即存在此封閉模腔內,壓印模具閉合後,壓印模具會加熱使壓印物軟化至可塑狀態,再由壓印模具施壓於壓印物,使上第一模板的壓印紋路於壓印物上成型,最後再加以冷卻壓印物,壓印模具打開後取出成型品。The conventional Light Guide Panel (LGP) hot press forming method mainly places the object to be embossed in a cavity of an imprinting mold, and the imprinting mold comprises a set of first template, the first template Each of the embossing surfaces having an embossed optical grain is formed by placing the embossing between the surfaces of the first stencil having the embossed optical lines, and then the first stencil forms a closed cavity. The embossed material is present in the closed cavity, and after the embossing die is closed, the embossing die is heated to soften the embossed material to a plastic state, and then the embossing die presses the embossed material to make the first template The embossed lines are formed on the embossed material, and finally the embossed material is cooled, and the embossed mold is opened to take out the molded article.


而現有技術中的加壓裝置係以油壓、氣壓或其他驅動器作為輸出壓力的來源,且習知的加熱裝置係於上第一模板或是壓印模具上鑽孔設置水路,再通以熱液體或是冷液體加熱或冷卻壓印物,而由於加壓裝置及加熱裝置為配置於一體上,且上述的習知加熱方式,皆要先加熱壓印模具本體後,再經由熱傳導將熱能傳至壓印物,此種方式熱能的傳遞容易因為壓印模具的大小、加熱管或是水路埋設的位置以及壓印物的尺寸等原因,而形成傳遞不等速,進而出現壓印物受到壓印模具本身溫度不平均的影響,導致轉寫不均之問題,因此壓印成品在量產中良率不容易提升,故基於上述原因考量,本發明之發明人思索並設計一種熱壓成型方法,以期針對現有技術之缺失加以改善,進而增進產業上之實施利用。

In the prior art, the pressurizing device uses oil pressure, air pressure or other driver as a source of output pressure, and the conventional heating device is configured to drill a water path on the upper first template or the imprinting mold, and then pass the heat. The liquid or the cold liquid heats or cools the embossed material, and since the pressing device and the heating device are integrally disposed, and the above-mentioned conventional heating method, the embossing mold body is heated first, and then the heat energy is transmitted through heat conduction. To the imprinted material, the transfer of thermal energy in this way is easily caused by the size of the imprinting mold, the position of the heating pipe or the waterway embedding, and the size of the imprinted material, etc., and the transfer is not constant, and the imprinted material is pressed. The influence of uneven temperature of the printing mold itself leads to the problem of uneven transfer, so the yield of the imprinted product in mass production is not easy to be improved. Therefore, based on the above reasons, the inventors of the present invention contemplate and design a hot press forming method. In order to improve the lack of existing technology, and to enhance the implementation of the industry.

有鑑於上述習知之問題,本發明之主要目的就是在提供一種具備新穎性、進步性及產業利用性等專利要件之熱壓成型方法,以期克服現有技術之難點。In view of the above-mentioned problems, the main object of the present invention is to provide a hot press forming method having novelty, advancement and industrial utilization, etc., in order to overcome the difficulties of the prior art.


為達到上述目的,本發明所採用之技術手段為設計一種熱壓成型方法,其包含:
A.預加熱步驟,其係為將一具有導光板所需之光學特性之熱塑性材料,透過一加熱模組進行加溫動作以令其軟化至可受壓印之狀態;B.輸送原物料步驟,其係為將經過A.預加熱步驟後之該熱塑性材料以一傳輸模組自該加熱模組處傳輸至一壓印模具內,而其中該壓印模具包含一上模具、一下模具與至少一轉寫板;其中該上模具可對應與該下模具組合,並於其中包圍形成一壓印模穴以容納該熱塑性材料,而該轉寫板係為設於該壓印模穴內之一上壁面、一下壁面或者一上壁面與一下壁面處;C.合模步驟,其係為將該上模具與該下模具做對應接合而合模,以將該熱塑性材料密合於該壓印模穴內;D.壓印步驟,其係為讓該壓印模穴之上壁面壓迫於該熱塑性材料並施加一壓迫力;E.降溫硬化步驟,其係為透過於該壓印模具內預設之冷卻系統以降低該壓印模穴之溫度;及F.開模步驟,其係於該E.降溫硬化步驟後,進一步將該上模具與該下模具分離。

In order to achieve the above object, the technical means adopted by the present invention is to design a hot press forming method, which comprises:
A. a preheating step of heating a thermoplastic material having the optical properties required for the light guide plate through a heating module to soften it to an embossable state; B. transporting the raw material step The thermoplastic material is transferred from the heating module to an imprinting mold by a transfer module after the A. preheating step, wherein the imprinting mold comprises an upper mold, a lower mold and at least a transfer plate; wherein the upper mold is combinable with the lower mold, and surrounds therein to form an imprint mold cavity for accommodating the thermoplastic material, and the transfer plate is disposed in the imprint mold cavity a top wall surface, a lower wall surface or an upper wall surface and a lower wall surface; C. a clamping step of clamping the upper mold and the lower mold to perform the mold clamping to adhere the thermoplastic material to the stamping mold The step of embossing is to press the upper surface of the embossing cavity against the thermoplastic material and apply a pressing force; E. the step of cooling and hardening, which is preset through the embossing die Cooling system to reduce the temperature of the imprinting cavity F. and the mold opening step, which is based on the E. cool after the hardening step, and further the upper mold and the lower mold separation.


其中,該上模具或該下模具內配置有至少一可對該壓印模穴進行抽真空之真空控制管路,以做控制壓印及開模之手段;其中,該熱塑性材料為甲基丙烯酸甲酯或聚碳酸酯原料之塊體;其中,該加熱模組為一加熱板;其中,該加熱模組具有至少一溫控單元,該溫控單元以輻射熱或熱對流方式進行溫度控制;其中,該傳輸模組為一輸送帶、一挾持移動具或者一機械手臂;其中,該轉寫板上具有一轉印表面,其上設有精密圖形之刻紋;其中,該轉寫板為可自該壓印模穴中做拆卸之分離式獨立構件;其中,該冷卻系統係透過液溫或氣流做模具降溫之手段。

Wherein, the upper mold or the lower mold is provided with at least one vacuum control line for vacuuming the imprinting mold cavity for controlling the imprinting and mold opening; wherein the thermoplastic material is methacrylic acid a block of a material of a methyl ester or a polycarbonate; wherein the heating module is a heating plate; wherein the heating module has at least one temperature control unit, and the temperature control unit performs temperature control by radiant heat or heat convection; The transfer module is a conveyor belt, a holding movable tool or a mechanical arm; wherein the transfer plate has a transfer surface on which a precise pattern is formed; wherein the transfer plate is A separate independent member that is disassembled from the embossing cavity; wherein the cooling system is a means for cooling the mold through liquid temperature or air flow.


而本發明之熱壓成型方法於設計上係透過利用將傳統導光板熱壓印製程中原本為一體的加熱裝置與加壓轉印裝置做分離,而可於模具外先進行昇溫動作,而後再透過一傳輸手段把材料輸送進入模具內,進而完成加壓轉印之動作,透過如此之動作配合,即能使得熱壓印製程可以不受壓印模具本身的溫度容易不均的影響,導致表面之轉寫不均而產生產品瑕疵,可期於量產中提升生產良率,而為了讓上述目的、技術特徵以及實際實施後之增益性更為明顯易懂,於下文中將係以較佳之實施範例輔佐對應相關之圖式來進行更詳細之說明。

The hot press forming method of the present invention is designed to be separated from the pressurizing transfer device by using a heating device which is originally integrated in the hot stamping process of the conventional light guide plate, and can be heated outside the mold first, and then Through a transmission means to convey the material into the mold, and then complete the action of pressure transfer, through such action, the hot stamping process can be affected by the uneven temperature of the imprinting mold itself, resulting in a surface If the product is not evenly transferred, the product yield can be improved, and the production yield can be improved in mass production. In order to make the above objectives, technical features and gain after actual implementation more obvious, it will be better in the following. The implementation examples are accompanied by a corresponding schema for a more detailed description.

為利貴審查員瞭解本發明之發明特徵、內容與優點及其所能達成之功效,茲將本發明配合附圖,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係侷限本發明於實際實施上的專利範圍。The present invention will be described in conjunction with the accompanying drawings in the accompanying drawings, and the drawings The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope of the accompanying drawings and the configuration relationship should not be limited to the scope of the invention.


本發明之優點、特徵以及達到之技術方法將參照例示性實施例及所附圖式進行更詳細地描述而更容易理解,且本發明或可以不同形式來實現,故不應被理解僅限於此處所陳述的實施例,相反地,對所屬技術領域具有通常知識者而言,所提供的實施例將使本揭露更加透徹與全面且完整地傳達本發明的範疇,且本發明將僅為所附加的申請專利範圍所定義。

The advantages and features of the present invention, as well as the technical methods of the present invention, are described in more detail with reference to the exemplary embodiments and the accompanying drawings, and the present invention may be implemented in various forms and should not be construed as limited thereby. The embodiments of the present invention, and the embodiments of the present invention are intended to provide a more complete and complete and complete disclosure of the scope of the present invention, and The scope of the patent application is defined.


而除非另外定義,所有使用於後文的術語(包含科技及科學術語)與專有名詞,於實質上係與本發明所屬該領域的技術人士一般所理解之意思相同,而例如於一般所使用的字典所定義的那些術語應被理解為具有與相關領域的內容一致的意思,且除非明顯地定義於後文,將不以過度理想化或過度正式的意思理解,合先敘明。

Unless otherwise defined, all terms (including technical and scientific terms) and proper nouns used hereinafter are used in the same meaning as commonly understood by those skilled in the art to which the invention belongs. Those terms defined by the dictionary should be understood to have the meaning consistent with the relevant fields, and unless explicitly defined in the following text, they will not be understood in terms of excessive idealization or excessive formality.


請配合參看第一圖所示,本發明係為提出一種熱壓成型方法,以有效率地改善導光板於製程上之量產,其可包含有下述之步驟:
A.預加熱步驟;
B.輸送原物料步驟;
C.合模步驟;
D.壓印步驟;
E.降溫硬化步驟;及
F.開模步驟。

Referring to the first figure, the present invention proposes a hot press forming method for efficiently improving the mass production of the light guide plate in the process, which may include the following steps:
A. preheating step;
B. The step of conveying raw materials;
C. clamping step;
D. Imprinting step;
E. cooling and hardening step; and
F. The mold opening step.


請進一步配合參看第二圖所示,前述之A.預加熱步驟係為將一具有良好光學特性之熱塑性材料(10),例如該熱塑性材料(10)為甲基丙烯酸甲酯、聚碳酸酯等原料之塊體,透過一加熱模組(20)進行加溫動作以令其軟化至可受模具壓印之狀態,而其中該加熱模組(20)或可為一加熱板,且該加熱模組(20)或可具有至少一溫控單元,該溫控單元或可為以輻射熱或者是熱對流等方式進行溫度控制。

Please further refer to the second figure. The foregoing A. preheating step is to use a thermoplastic material (10) having good optical properties, for example, the thermoplastic material (10) is methyl methacrylate, polycarbonate, etc. The heating block (20) may be softened to a state in which the mold is embossed by a heating module (20), wherein the heating module (20) may be a heating plate, and the heating mold The group (20) may have at least one temperature control unit, which may be temperature controlled in the form of radiant heat or thermal convection.


請進一步配合參看第三圖所示,前述之B.輸送原物料步驟係為將經過A.預加熱步驟後之該熱塑性材料(10)以一傳輸模組(30)自該加熱模組(20)處傳輸至一壓印模具(40)內,該傳輸模組(30)或可能為一輸送帶、一挾持移動具或者一機械手臂,而其中該壓印模具(40)包含一上模具(41)、一下模具(42)與至少一轉寫板(43);其中該上模具(41)可對應與該下模具(42)組合,並於其中包圍形成一壓印模穴(44),而該傳輸模組(30)所傳輸至之熱塑性材料(10)即進入該壓印模穴(44),而該轉寫板(43)係為設於該壓印模穴(44)之一上壁面、一下壁面或者一上壁面與一下壁面處,於圖式中係以配置於下壁面做案例說明,而該轉寫板(43)上具有一轉印表面,該轉印表面上設有精密圖形之刻紋,以於壓印時將該精密圖形做轉印;此外,該上模具(41)或該下模具(42)內配置有至少一可對該壓印模穴(44)進行抽真空之真空控制管路(45)。

Please further refer to the third figure. The B. conveying raw material step is to pass the thermoplastic material (10) after the A. preheating step to the heating module by a transmission module (30). Transferring to an imprint mold (40), which may be a conveyor belt, a holding mover or a robot arm, wherein the imprint mold (40) comprises an upper mold ( 41) a lower mold (42) and at least one transfer plate (43); wherein the upper mold (41) is correspondingly combined with the lower mold (42) and surrounded therein to form an impression cavity (44), The thermoplastic material (10) to which the transfer module (30) is transferred enters the stamping cavity (44), and the transfer plate (43) is disposed in the stamping cavity (44). The upper wall surface, the lower wall surface or an upper wall surface and the lower wall surface are illustrated in the figure as being disposed on the lower wall surface, and the transfer plate (43) has a transfer surface on which the transfer surface is provided. a precision pattern engraving for transferring the precision pattern during imprinting; further, at least one of the upper mold (41) or the lower mold (42) is disposed for the imprinting mold cavity (44) Vacuum control line (45).


此外,該轉寫板(43)於一變形實施方式中,或可為可自該壓印模穴(44)中做拆卸之可分離式獨立構件。

Furthermore, the transfer plate (43) may be in a variant embodiment or may be a detachable separate member detachable from the impression cavity (44).


請進一步配合參看第四圖所示,前述之C.合模步驟係為將該上模具(41)與該下模具(42)做對應接合而合模,以將該熱塑性材料(10)密合於該壓印模穴(44)之內。

Please further refer to the fourth figure. The C. clamping step is to mold the upper mold (41) and the lower mold (42) to form the mold to close the thermoplastic material (10). Within the stamping cavity (44).


請進一步配合參看第五圖所示,前述之D.壓印步驟係為透過自該真空控制管路(45)而對該壓印模穴(44)內部做真空抽取之動作,進而讓該壓印模穴(44)之上壁面與下壁面壓迫於該熱塑性材料(10)並提供一壓迫力,進而可讓該轉寫板(43)上之該轉印表面對該熱塑性材料(10)做精密圖形之壓印。

Please further refer to the fifth figure, the D. embossing step is to vacuum the inside of the embossing cavity (44) through the vacuum control line (45), and then let the pressure The upper wall surface and the lower wall surface of the impression cavity (44) are pressed against the thermoplastic material (10) and provide a pressing force, thereby allowing the transfer surface on the transfer plate (43) to be made of the thermoplastic material (10) Imprint of precision graphics.


前述之E.降溫硬化步驟係為透過於該壓印模具(40)內預設之冷卻系統以降低該壓印模穴(44)之溫度,而該冷卻系統或可能為透過液溫或氣流做模具降溫之手段,此部份為現有技術中該技術領域內具有通常知識者所能無歧異了解之習知技術,故不於說明書中對此部分進一步多加著墨來做贅述。

The foregoing E. cooling hardening step is to reduce the temperature of the imprinting cavity (44) through a preset cooling system in the imprinting mold (40), and the cooling system may be made of liquid temperature or air flow. The means for cooling the mold, which is a conventional technique in the prior art that has ordinary knowledge in the technical field, and therefore does not further add ink to this part in the specification.


請進一步配合參看第六圖所示,前述之F.開模步驟則係於該E.降溫硬化步驟後,進一步透過該真空控制管路(45)朝壓印模穴(44)中注入空氣,進而破除該壓印模穴(44)中之真空狀態,而將該上模具(41)與該下模具(42)分離,並取出已轉印完畢後之熱塑性材料(10),亦即轉印完成之導光板成品。

Please further refer to the sixth figure, the F. mold opening step is after the E. cooling hardening step, and further inject air into the stamping cavity (44) through the vacuum control line (45). Further, the vacuum state in the imprinting mold cavity (44) is broken, and the upper mold (41) is separated from the lower mold (42), and the transferred thermoplastic material (10) is removed, that is, transferred. Finished light guide finished product.


透過本發明之熱壓成型方法於設計上之巧思變化,利用將傳統導光板熱壓印製程中原本為一體的加熱裝置與加壓轉印裝置做分離,而可於模具外先進行昇溫動作,而後再透過一傳輸手段把材料輸送進入模具內,進而完成加壓轉印之動作,透過如此之動作配合,即能使得熱壓印製程可以不受壓印模具本身的溫度容易不均的影響,導致表面之轉寫不均而產生產品瑕疵,可期於量產中提升生產良率,為現有技術所不能及者,故可見其增益性所在。

Through the hot press forming method of the present invention, the design is ingeniously changed, and the heating device originally integrated into the conventional light guide plate hot stamping process is separated from the pressure transfer device, and the temperature rising action can be performed outside the mold. Then, the material is conveyed into the mold through a transmission means, thereby completing the action of pressure transfer, and by such action, the hot stamping process can be prevented from being easily affected by the temperature unevenness of the stamping die itself. As a result of uneven surface transfer and product defects, it is expected that the production yield will be improved in mass production, which is impossible for the prior art, so that the gain is visible.


以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。

The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.


綜觀上述,可見本發明在突破先前之技術第一,確實已達到所欲增進之功效,且也非熟悉該項技藝者所易於思及,其所具之進步性、實用性,顯已符合專利之申請要件,爰依法提出專利申請,懇請貴局核准本件發明專利申請案,以勵發明,至感德便。

Looking at the above, it can be seen that the present invention breaks through the prior art first, and has indeed achieved the desired effect, and is also unfamiliar to those skilled in the art, and its progress and practicability have been consistent with patents. The application requirements, 提出 file a patent application according to law, and ask your bureau to approve the application for this invention patent, in order to invent invention, to the sense of virtue.

(10)...熱塑性材料(10). . . Thermoplastic material

(20)...加熱模組(20). . . Heating module

(30)...傳輸模組(30). . . Transmission module

(40)...壓印模具(40). . . Imprinting mold

(41)...上模具(41). . . Upper mold

(42)...下模具(42). . . Lower mold

(43)...轉寫板(43). . . Transfer board

(44)...壓印模穴(44). . . Imprinting cavity

(45)...真空控制管路(45). . . Vacuum control line

A至F...流程步驟A to F. . . Process step

第一圖為本發明之熱壓成型方法之流程示意圖。
第二圖為本發明之熱壓成型方法之連續流程動作示意圖。
第三圖為本發明之熱壓成型方法之連續流程動作示意圖。
第四圖為本發明之熱壓成型方法之連續流程動作示意圖。
第五圖為本發明之熱壓成型方法之連續流程動作示意圖。
第六圖為本發明之熱壓成型方法之連續流程動作示意圖。

The first figure is a schematic flow chart of the hot press forming method of the present invention.
The second figure is a schematic diagram of the continuous flow of the hot press forming method of the present invention.
The third figure is a schematic diagram of the continuous flow of the hot press forming method of the present invention.
The fourth figure is a schematic diagram of the continuous flow of the hot press forming method of the present invention.
The fifth figure is a schematic diagram of the continuous flow of the hot press forming method of the present invention.
The sixth figure is a schematic diagram of the continuous flow of the hot press forming method of the present invention.

A至F...步驟A to F. . . step

Claims (9)

一種熱壓成型方法,其包含:
A.預加熱步驟,其係為將一具有導光板所需之光學特性之熱塑性材料,透過一加熱模組進行加溫動作以令其軟化至可受壓印之狀態;
B.輸送原物料步驟,其係為將經過A.預加熱步驟後之該熱塑性材料以一傳輸模組自該加熱模組處傳輸至一壓印模具內,而其中該壓印模具包含一上模具、一下模具與至少一轉寫板;其中該上模具可對應與該下模具組合,並於其中包圍形成一壓印模穴以容納該熱塑性材料,而該轉寫板係為設於該壓印模穴內之一上壁面、一下壁面或者一上壁面與一下壁面處;
C.合模步驟,其係為將該上模具與該下模具做對應接合而合模,以將該熱塑性材料密合於該壓印模穴內;
D.壓印步驟,其係為讓該壓印模穴之上壁面壓迫於該熱塑性材料並施加一壓迫力;
E.降溫硬化步驟,其係為透過於該壓印模具內預設之冷卻系統以降低該壓印模穴之溫度;及
F.開模步驟,其係於該E.降溫硬化步驟後,進一步將該上模具與該下模具分離。
A hot press forming method comprising:
A. a preheating step of heating a thermoplastic material having the optical properties required for the light guide plate through a heating module to soften it to an embossable state;
B. The step of conveying the raw material, wherein the thermoplastic material after the A. preheating step is transferred from the heating module to an imprinting mold by a transfer module, wherein the imprinting mold comprises an upper part a mold, a lower mold and at least one transfer plate; wherein the upper mold is combinable with the lower mold, and is surrounded therein to form an impression cavity to accommodate the thermoplastic material, and the transfer plate is disposed at the pressure One of the upper wall surface, the lower wall surface or an upper wall surface and the lower wall surface of the impression cavity;
C. The mold clamping step is to mold the upper mold and the lower mold to form a mold to adhere the thermoplastic material to the impression cavity;
D. an embossing step of pressing a wall surface of the embossing cavity against the thermoplastic material and applying a pressing force;
E. a step of cooling and hardening, which is to reduce the temperature of the imprinting cavity by a predetermined cooling system in the imprinting mold;
F. A mold opening step, after the E. temperature-hardening step, further separating the upper mold from the lower mold.
如申請專利範圍第1項所述之熱壓成型方法,其中該上模具或該下模具內配置有至少一可對該壓印模穴進行抽真空之真空控制管路,以做控制壓印及開模之手段。The hot press forming method according to claim 1, wherein the upper mold or the lower mold is provided with at least one vacuum control line for vacuuming the stamping cavity to control the stamping and The means of opening the mold. 如申請專利範圍第2項所述之熱壓成型方法,其中該熱塑性材料為甲基丙烯酸甲酯或聚碳酸酯原料之塊體。The hot press forming method according to claim 2, wherein the thermoplastic material is a block of a methyl methacrylate or polycarbonate raw material. 如申請專利範圍第3項所述之熱壓成型方法,其中該加熱模組為一加熱板。The hot press forming method according to claim 3, wherein the heating module is a heating plate. 如申請專利範圍第4項所述之熱壓成型方法,其中該加熱模組具有至少一溫控單元,該溫控單元以輻射熱或熱對流方式進行溫度控制。The hot press forming method according to claim 4, wherein the heating module has at least one temperature control unit, and the temperature control unit performs temperature control by radiant heat or heat convection. 如申請專利範圍第5項所述之熱壓成型方法,其中該傳輸模組為一輸送帶、一挾持移動具或者一機械手臂。The hot press forming method according to claim 5, wherein the transport module is a conveyor belt, a holding implement or a robot arm. 如申請專利範圍第6項所述之熱壓成型方法,其中該轉寫板上具有一轉印表面,其上設有精密圖形之刻紋。The hot press forming method according to claim 6, wherein the transfer plate has a transfer surface on which a precise pattern is formed. 如申請專利範圍第7項所述之熱壓成型方法,其中該轉寫板為可自該壓印模穴中做拆卸之分離式獨立構件。The hot press forming method according to claim 7, wherein the transfer plate is a separate independent member detachable from the imprint cavity. 如申請專利範圍第8項所述之熱壓成型方法,其中該冷卻系統係透過液溫或氣流做模具降溫之手段。The hot press forming method according to claim 8, wherein the cooling system is a means for cooling the mold by a liquid temperature or a gas flow.
TW101103440A 2012-02-02 2012-02-02 Heat pressure molding method TW201332745A (en)

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