CN108162413A - A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding - Google Patents
A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding Download PDFInfo
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- CN108162413A CN108162413A CN201711448805.2A CN201711448805A CN108162413A CN 108162413 A CN108162413 A CN 108162413A CN 201711448805 A CN201711448805 A CN 201711448805A CN 108162413 A CN108162413 A CN 108162413A
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- Prior art keywords
- chip
- bonding
- prepared
- solvent
- fluidic chip
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
Abstract
The invention discloses a kind of methods that polymeric micro-fluidic chip is prepared using solvent bonding, organic solvent is taken to be placed in fixing device, and polymer cover plate single side is pasted onto at the top of fixing device, and the fixing device is placed on heater, polymer cover plate is fumigated using the organic solvent, by cover plate rapid link to the chip that must be bonded on the substrate with chip raceway groove, then using the chip of hot press print bonding, and irradiated using ultraviolet light.This method shortens the preparation time of polymer chip, improves chip bonding intensity, increases the stability of polymer chip, while solves the problems, such as that conventional solvent bonding coating is uneven.
Description
Technical field
The present invention relates to micro-fluidic chip processing technique fields, and in particular to it is micro- that a kind of utilization solvent bonding prepares polymer
The method of fluidic chip.
Background technology
Making for high molecular polymer micro-fluidic chip is related to microelectromechanical systems processing and making process and side
Method, imprint, be molded and be bonded including photoetching, burn into and etc., wherein, as the final step of chip manufacturing, bonding effect
Quality directly determine the success or failure of chip manufacturing, traditional bonding method mainly has thermocompression bonding, ultrasonic bond, solvent to be bonded
With vacuum plasma bonding, microwave method, ultrasonic bonding etc..
Bonding method is mainly thermocompression bonding in industrial production at present, has the characteristics that free of contamination, but thermocompression bonding
Its surface is made to reach glass transition temperature (Tg) by heating polymer chip, and be pressurized so as to fulfill mirofluidic chip and cover plate
Gluing, but in thermocompression bonding, polymer chip is heated, and micro-fluidic structure easily collapses, and seriously affects the section of micro-fluidic structure
Shape reduces the quality of micro-fluidic chip, and the whole process being bonded needs to complete in clean room, the table before chip bonding
Surface treatment can be completed in the Clean room of lower grade, but the pre- bonding process of chip needs the purification condition of requirements at the higher level.
In order to solve the problem on deformation during thermocompression bonding, it has been proposed that using plasma/UVO auxiliary bonding methods,
Greatly reduce the deformation of micro-structure.However, this method bond strength is relatively low.Solvent liquid is mainly used in solvent binding experiments
It is bonded, this needs to solve the problems, such as that solvent liquid is coated uniformly on chip, and the painting method being currently mainly used has rotation
Painting, spraying, capillary flow etc., but the effect of above method coating solvent is also bad, and uniformity has very big uncertainty,
Also coating solvent layer is thicker, not only influences chip bonding effect, but also easily changes the hydrophobic intensity in raceway groove.
Invention content
In view of the above problems, the present invention provides a kind of side that polymeric micro-fluidic chip is prepared using solvent bonding
Method, this method shorten the preparation time of polymer chip, improve chip bonding intensity, increase the stabilization of polymer chip
Property, while solve the problems, such as that conventional solvent bonding coating is uneven.
To achieve the above object, the present invention adopts the following technical scheme that：
A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding, the method are specially：Take organic solvent
It is placed in fixing device, and polymer cover plate single side is pasted onto at the top of device, and the device is placed on heater, use institute
It states organic solvent and fumigates polymer cover plate, by cover plate rapid link to the chip that must be bonded on the substrate with chip raceway groove, so
The chip of hot press print bonding is used afterwards, and is irradiated using ultraviolet light.
Preferably, the organic solvent is hexamethylene.
It is highly preferred that the dosage of the organic solvent is 0.1-0.3mL.
Accordingly, when above-mentioned organic solvent selects hexamethylene, the material of the chip is cyclic olefine copolymer (COC).
Preferably, the heating temperature of the heater is 70-90 DEG C.And fumigate polymer cover plate using organic solvent
Time is 10-120s.
More specifically, the condition imprinted using hot press：40-60 DEG C of temperature, pressure 1-2bar.
Further, the use of the time of the chip of hot press print bonding is 1-2min.
Preferably, the wavelength of the ultraviolet light is 365nm, the use of the time that ultraviolet light irradiates is 1-2min.
The method of the present invention has the following advantages that：
(1) present invention prepares polymer chip using solvent bonding, and it is low (40-60 DEG C) to test temperature in use, during bonding not
Reach Tg (thermal distorsion temperature or glass transition temperature) value (COC materials hot deformations temperature is 130 DEG C) of material, will not cause to gather
The deformation of object material is closed, is collapsed so as to avoid chip structure, the generation of raceway groove clogging.
(2) present invention prepares polymer chip using solvent bonding, has stronger solvent bond strength, uses the present invention
The maximum pressure that polymer chip prepared by the solvent bonding method can be born is 34.6MPa, i.e., can protect at this pressure
Hold not rupturing for raceway groove.
(3) present invention prepares polymer chip using solvent bonding, different from conventional solvent bonding method, and the present invention uses
Solvent vapour acts on polymer chip surface, forms dissolving layer or swell layer, solvent vapour are evenly distributed, and content is less,
It avoids that raceway groove internal solvent molecule is excessive, and bonding force is too strong, blocks raceway groove.The single side of polymer cover plate is fumigated simultaneously, is avoided
The problem of traditional two-sided stifling influence translucency.
(4) present invention prepares polymer chip using solvent bonding, and simple preparation process shortens polymer chip
Preparation time, it is thus only necessary to which 5-10min is needed relative to traditional thermal bonding method for 15-20min, and the time is reduced, and is carried significantly
Efficiency prepared by high chip.
(5) increase in the present invention and irradiated using UV, promote bonding process break key and crosslinking, enhance bond strength, simultaneously
Improve chip optical performance.
Description of the drawings
Fig. 1 is that the method for the present invention and conventional method are made and prepare chip interior channel design comparison diagram；
Fig. 2 is solvent layer thickness measurement result on chip after the fumigating method with the present invention.
Specific embodiment
The present invention will be described in detail by specific embodiment below.These embodiments are provided to be to be able to more
Thoroughly understand the present invention, and the scope of the present invention can be completely communicated to those skilled in the art.
"comprising" or " comprising " as mentioned in working as in specification in the whole text and claim are an open language, therefore should
It is construed to " including but not limited to ".Specification subsequent descriptions are to implement the better embodiment of the present invention, and so description is
For the purpose of the rule of specification, it is not limited to the scope of the present invention.Protection scope of the present invention is when regarding appended power
Profit is required subject to institute's defender.
Embodiment 1
0.1mL organic solvent hexamethylenes is taken to be placed in fixing device, and polymer cover plate single side is pasted onto fixing device
Top, and the device is placed on heater, heating temperature is 70 DEG C, fumigates polymer cover plate 10s using organic solvent, will cover
The chip being bonded on piece rapid link to the substrate with chip raceway groove.
Then the chip 1min of hot press print bonding is used, imprinting conditions are 40 DEG C, pressure 1bar of temperature, and are used
The UV irradiations 1min of 365nm.
Embodiment 2
0.2mL organic solvent hexamethylenes is taken to be placed in fixing device, and polymer cover plate single side is pasted onto fixing device
Top, and the device is placed on heater, heating temperature is 75 DEG C, fumigates polymer cover plate 30s using organic solvent, will cover
The chip being bonded on piece rapid link to the substrate with chip raceway groove.
Then the chip 1.5min of hot press print bonding is used, imprinting conditions are temperature 45 C, pressure 1.5bar, and are made
1.5min is irradiated with the UV of 365nm.
Embodiment 3
0.3mL organic solvent hexamethylenes is taken to be placed in fixing device, and polymer cover plate single side is pasted onto fixing device
Top, and the device is placed on heater, heating temperature is 80 DEG C, fumigates polymer cover plate 50s using organic solvent, will cover
The chip being bonded on piece rapid link to the substrate with chip raceway groove.
Then the chip 1min of hot press print bonding is used, imprinting conditions are temperature 50 C, pressure 2bar, and are used
The UV irradiations 2min of 365nm.
Embodiment 4
0.2mL organic solvent hexamethylenes is taken to be placed in fixing device, and polymer cover plate single side is pasted onto fixing device
Top, and the device is placed on heater, heating temperature is 85 DEG C, fumigates polymer cover plate 70s using organic solvent, will cover
The chip being bonded on piece rapid link to the substrate with chip raceway groove.
Then the chip 1min of hot press print bonding is used, imprinting conditions are temperature 60 C, pressure 2bar, and are used
The UV irradiations 2min of 365nm.
Embodiment 5
0.3mL organic solvent hexamethylenes is taken to be placed in fixing device, and polymer cover plate single side is pasted onto fixing device
Top, and the device is placed on heater, heating temperature is 90 DEG C, and polymer cover plate 120s is fumigated using organic solvent, will
The chip being bonded on cover plate rapid link to the substrate with chip raceway groove.
Then the chip 2min of hot press print bonding is used, imprinting conditions are temperature 60 C, pressure 1bar, and are used
The UV irradiations 1.5min of 365nm.
In order to verify beneficial effects of the present invention, applicant has also carried out following experiment, specific as follows：
Chip is prepared as shown in Figure 1, two figure of the left side is conventional solvent bonding, one figure of the right is to be prepared using the method for the present invention
Chip channel state, it can be seen from the figure that the solvent layer thickness of conventional method is difficult to control, respectively solvent layer thickness mistake
Die bonding deficiency caused by thin and blocked up is blocked with raceway groove；For the solvent layer thickness of the method for the present invention, test equipment is used
Solvent layer thickness obtains as shown in Figure 2 as a result, being obtained by software processing fitting molten on chip cover plate after stifling for measurement
Oxidant layer thickness is 108.3712 ± 2.4275 A (about 10 ran), and therefore, the solvent layer that the present invention obtains is very thin, thickness
Only Nano grade, effectively prevent solvent layer thickness it is blocked up caused by raceway groove block and hydrophobicity enhance the problem of.So
Chip smoothness is more preferable made from the method for the present invention, and optical property is more preferably.
Chip and the compression pump in laboratory that the method according to the invention is prepared, liquid storage tank connection, and according to from small
Different air pressures are given to big sequence, chip status are observed, as a result, it has been found that when air pressure reaches 34.6MPa, the raceway groove of chip is also protected
It holds and does not rupture completely, it is seen that its anti-pressure ability greatly improves.
Although above having used general explanation and specific embodiment, the present invention is described in detail, at this
On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore,
These modifications or improvements without departing from theon the basis of the spirit of the present invention belong to the scope of protection of present invention.
Claims (10)
- A kind of 1. method that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that the method is specially：It takes Organic solvent is placed in fixing device, and polymer cover plate single side is pasted onto at the top of fixing device, and the fixing device is put In on heater, polymer cover plate is fumigated using the organic solvent, cover plate is adhered on the substrate with chip raceway groove and is obtained The chip of bonding then using the chip of hot press print bonding, and is irradiated using ultraviolet light.
- 2. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that institute Organic solvent is stated as hexamethylene.
- 3. the method according to claim 1 or 2 that polymeric micro-fluidic chip is prepared using solvent bonding, feature are existed In the dosage of the organic solvent is 0.1-0.3mL.
- 4. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that institute The material for stating chip is cyclic olefine copolymer.
- 5. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that institute The heating temperature for stating heater is 70-90 DEG C.
- 6. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that make The time that polymer cover plate is fumigated with organic solvent is 10-120s.
- 7. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that make The condition imprinted with hot press：40-60 DEG C of temperature, pressure 1-2bar.
- 8. the method that polymeric micro-fluidic chip is prepared using solvent bonding according to claim 1 or 7, feature are existed In the time using the chip of hot press print bonding is 1-2min.
- 9. the method according to claim 1 that polymeric micro-fluidic chip is prepared using solvent bonding, which is characterized in that institute The wavelength for stating ultraviolet light is 365nm.
- 10. the method that polymeric micro-fluidic chip is prepared using solvent bonding according to claim 1 or 9, feature are existed In the time using ultraviolet light irradiation is 1-2min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448805.2A CN108162413A (en) | 2017-12-27 | 2017-12-27 | A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448805.2A CN108162413A (en) | 2017-12-27 | 2017-12-27 | A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding |
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| CN108162413A true CN108162413A (en) | 2018-06-15 |
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| CN201711448805.2A Pending CN108162413A (en) | 2017-12-27 | 2017-12-27 | A kind of method that polymeric micro-fluidic chip is prepared using solvent bonding |
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| US20130115728A1 (en) * | 2011-11-07 | 2013-05-09 | Sony Dadc Corporation | Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer |
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| EP2441518A3 (en) * | 2010-10-18 | 2013-12-04 | Sony Corporation | Method and device for thermocompression bonding |
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| CN103213943B (en) * | 2013-04-23 | 2015-08-05 | 山东省科学院海洋仪器仪表研究所 | A kind of processing of polymer chip microchannel and leveling method |
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| WO2017202932A2 (en) * | 2016-05-24 | 2017-11-30 | Cellix Limited | An apparatus for microfluidic flow cytometry analysis of a particulate containing fluid |
-
2017
- 2017-12-27 CN CN201711448805.2A patent/CN108162413A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140238599A1 (en) * | 2004-10-13 | 2014-08-28 | Rheonix, Inc. | Laminated microfluidic structures and method for making |
| CN1799820A (en) * | 2004-12-31 | 2006-07-12 | 中国科学技术大学 | Hot compressing link method of polymer microfluid system |
| WO2009006933A1 (en) * | 2007-07-06 | 2009-01-15 | Agilent Technologies, Inc. | Layered microfluidic device with structure to receive adhesive for affixing layers |
| EP2441518A3 (en) * | 2010-10-18 | 2013-12-04 | Sony Corporation | Method and device for thermocompression bonding |
| CN102452639A (en) * | 2010-11-01 | 2012-05-16 | 香港理工大学 | Binding method of plastic microfluidic chip and plastic microfluidic chip |
| US20130115728A1 (en) * | 2011-11-07 | 2013-05-09 | Sony Dadc Corporation | Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer |
| CN103172018A (en) * | 2013-03-18 | 2013-06-26 | 哈尔滨工业大学 | Organic solvent auxiliary bonding method based on organic polymer material micro-fluidic chip |
| CN103213943B (en) * | 2013-04-23 | 2015-08-05 | 山东省科学院海洋仪器仪表研究所 | A kind of processing of polymer chip microchannel and leveling method |
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| WO2017202932A2 (en) * | 2016-05-24 | 2017-11-30 | Cellix Limited | An apparatus for microfluidic flow cytometry analysis of a particulate containing fluid |
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Application publication date: 20180615 |
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