CN108178123A - A kind of novel PDMS micro-fluidic chips bonding method - Google Patents
A kind of novel PDMS micro-fluidic chips bonding method Download PDFInfo
- Publication number
- CN108178123A CN108178123A CN201711450486.9A CN201711450486A CN108178123A CN 108178123 A CN108178123 A CN 108178123A CN 201711450486 A CN201711450486 A CN 201711450486A CN 108178123 A CN108178123 A CN 108178123A
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- pdms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
Abstract
The invention discloses a kind of novel PDMS micro-fluidic chips bonding methods, include the following steps：Glass and PDMS chips are passed through into plasma treatment respectively；In the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment；Then by the glass of spin coating PDMS liquid rotating speed be 1000rpm sol evenning machine on 30~60s of spin coating, which, which is attached on glass, forms PDMS film；Then the PDMS liquid curings after the glass with PDMS film is heat-treated；Glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded, bonding can be realized.This method selection is more wide in range, and of less demanding for the clean level of glass surface, can reduce the consumption of water and other chemical reagent such as acetone, ethyl alcohol etc. in cleaning process, and then saves cleaning cost；This chip since micro- raceway groove surrounding is PDMS hydrophobic dielectric layers, can Water-In-Oil prepare droplet etc. for microchannel have hydrophobicity require technical field applied.
Description
Technical field
The present invention relates to micro-fluidic chip processing technique fields, and in particular to a kind of novel PDMS micro-fluidic chips bonding side
Method.
Background technology
Current PDMS chip bondings are typically to be carried out using PDMS is bonded with glass in a manner that, PDMS and glass it
Between bonding required generally for the material of glass and very high to the requirement of the clean level of glass surface, if glass material becomes
Change or glass surface clean level not enough can cause bond strength not enough so as to leakage.To realize good bonding, in glass
It is also very stringent for the cleaning requirement of glass in the case of glass material, usually by ethyl alcohol, acetone, deionized water ultrasonic technique with
And the modes such as plasma cleaning are repeated, technique is cumbersome and causes the wasting of resources.
Solve in PDMS and glass bonding process for the select permeability of glass material, in the prior art mainly using
It is carried out when PDMS is bonded with glass using soda-lime glass, for quartz, tempered glass, ito glass, is coated with other function films
The glass bonding effect of other materials such as (Ag films, Au films etc.) is undesirable, if accounted for for the glass electrode area for being coated with electrode
It is bigger also result in be bonded between PDMS and glass it is insecure.
Invention content
In view of the above problems, the present invention provides a kind of novel PDMS micro-fluidic chips bonding method, this method choosing
Material is more wide in range, and of less demanding for the clean level of glass surface, can reduce water and other chemistry in cleaning process
The consumption of reagent such as acetone, ethyl alcohol etc., and then save cleaning cost.
To achieve the above object, the present invention adopts the following technical scheme that：
A kind of novel PDMS micro-fluidic chips bonding method, described method includes following steps：
(1) glass and PDMS chips are passed through into plasma treatment respectively；
(2) in the PDMS (polydimethylsiloxanes of one layer of addition curing agent of glass one side spin coating after plasma treatment
Alkane) liquid, then 30~60s of spin coating on the sol evenning machine that rotating speed is 1000rpm, which, which is attached on glass, forms PDMS
Film；
(3) the PDMS liquid curings after and then the glass with PDMS film is heat-treated；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The plasma is low-voltage plasma or atmospheric plasma.Preferably, the plasma that uses of the present invention for
Oxygen plasma.
Preferably, the time of plasma treatment is 15min.
Preferably, the curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are according to body
Product is than being 1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
Preferably, PDMS film is attached to the very thin thickness on glass, and thickness is not more than 10um under normal circumstances.
PDMS stostes are a kind of thick liquid, and after adding in curing agent polymerization friendship can occur for scientific name dimethyl siloxane
Connection reaction forms polymer, and this polymer is known as the PDMS after polymethyl siloxane cures.This polymerization under room ambient conditions
Cross-linking reaction can also carry out but speed is very slow, and heating can accelerate the progress of this polymerisation, and usual experiment condition can use
The mode of heating carries out the shortening process time.It is therefore preferred that the glass with PDMS film is heat-treated, the heat
The temperature of processing is 75-100 DEG C, and preferably 90 DEG C, the time of heat treatment is 1-15min, preferably 5min.
Wherein, glass of the present invention is of less demanding to its material, including soda-lime glass, quartz glass, tempered glass,
Ito glass, for being coated with the glass of electrode (plating Ag film glass, plating Au film glass etc.) and other functional form structures (such as
Heating glass) it can equally realize effective bonding.
The method of the present invention has the following advantages that：
1st, the PDMS bonding patterns do not require glass material, more tolerant for the clean level of glass surface；Often
Rule bonding method needs very totally just to can be used glass cleaning, in this way cleaning when need to add some acetone, ethyl alcohol and
The chemical reagent such as hydrogen peroxide and soda acid carry out the ultrasonic pollutant for removing glass surface, and usually such cleaning needs to expend a large amount of
Chemical reagent and time are cleaned by ultrasonic under the cooperation of chemical reagent and usually require 45min or so.And the present invention due to for
The purity requirements degree of glass surface is not high, usual 10% EtOH Sonicate 10min can meet demand, when operation is greatly saved
Between, and reduce caused sewage discharge in cleaning.
2nd, it is dredging for PDMS interfaces that the PDMS bonding patterns, which are bonded not only reliable and stable but also chip interior channel surrounding,
Water layer, chip bonding intensity higher obtained.
3rd, this chip is since micro- raceway groove surrounding is PDMS hydrophobic dielectric layers, can Water-In-Oil prepare droplet etc. for
The technical field that microchannel has hydrophobicity to require is applied.
Specific embodiment
The present invention will be described in detail by specific embodiment below.These embodiments are provided to be to be able to more
Thoroughly understand the present invention, and the scope of the present invention can be completely communicated to those skilled in the art.
"comprising" or " comprising " as mentioned in working as in specification in the whole text and claim are an open language, therefore should
It is construed to " including but not limited to ".Specification subsequent descriptions are to implement the better embodiment of the present invention, and so description is
For the purpose of the rule of specification, it is not limited to the scope of the present invention.Protection scope of the present invention is when regarding appended power
Profit is required subject to institute's defender.
Unless otherwise specified, reagent used in the present invention, material and instrument can directly be bought from market.
Embodiment 1
A kind of novel PDMS micro-fluidic chips bonding method, specially：
(1) soda-lime glass and PDMS chips are handled respectively by low-voltage plasma；Wherein soda-lime glass 230W processing
15min, PDMS chip 230W handle 55s；
(2) in the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment；Again in rotating speed
For spin coating 30s on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；Its thickness is less than 10um；
(3) and then by the glass with PDMS film after temperature is heat treatment 1min under the conditions of 100 DEG C the PDMS liquid
Curing；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are to be according to volume ratio
1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
Embodiment 2
A kind of novel PDMS micro-fluidic chips bonding method, specially：
(1) quartz glass and PDMS chips are handled respectively by low-voltage plasma；Wherein quartz glass 230W processing
15min, PDMS chip 230W handle 55s；
(2) in the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment, then in rotating speed
For spin coating 60s on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；Its thickness is less than 10um；
(3) and then by the glass with PDMS film after temperature is heat treatment 15min under the conditions of 75 DEG C the PDMS liquid
Curing；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are to be according to volume ratio
1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
Embodiment 3
A kind of novel PDMS micro-fluidic chips bonding method, specially：
(1) tempered glass and PDMS chips are handled respectively by low-voltage plasma；At wherein tempered glass glass 230W
Manage 15min, PDMS chips 230W processing 55s；
(2) in the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment, then in rotating speed
For spin coating 40s on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；Its thickness is less than 10um；
(3) and then by the glass with PDMS film the PDMS liquid is consolidated after temperature is heat treatment 5min under the conditions of 90 DEG C
Change；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are to be according to volume ratio
1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
Embodiment 4
A kind of novel PDMS micro-fluidic chips bonding method, specially：
(1) ito glass and PDMS chips are handled respectively by low-voltage plasma；Wherein ito glass 230W processing
15min, PDMS chip 230W handle 55s；
(2) in the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment, then in rotating speed
For spin coating 50s on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；Its thickness is less than 10um；
(3) and then by the glass with PDMS film after temperature is heat treatment 10min under the conditions of 80 DEG C the PDMS liquid
Curing；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are to be according to volume ratio
1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
Embodiment 5
A kind of novel PDMS micro-fluidic chips bonding method, specially：
(1) Ag film glass and PDMS chips will be plated to handle by low-voltage plasma respectively；At wherein plating Ag film glass 230W
Manage 15min, PDMS chips 230W processing 55s；
(2) in the PDMS liquid of one layer of addition curing agent of glass one side spin coating after plasma treatment, then in rotating speed
For spin coating 45s on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；Its thickness is less than 10um；
(3) and then by the glass with PDMS film the PDMS liquid is consolidated after temperature is heat treatment 8min under the conditions of 85 DEG C
Change；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
The curing agent is silane coupling agent, and when specifically used, the curing agent and PDMS stostes are to be according to volume ratio
1：10 ratio mixing, then uniformly can be used afterwards with glass bar stirring 10min.
In order to prove effectiveness of the invention and advantageous effect, inventor has also carried out following experiment, specific as follows：
Applicant makes the deep microchannel of 100um wide, 10mm long, 50um respectively by two kinds of bonding methods, obtains two kinds
Chip A and B, wherein, A kinds chip is that conventional bonding method obtains, totally 7.B kinds chip is obtained for the method for the present invention, totally 5.
The PDMS thickness of two kinds of chips is 3mm, and substrate of glass thickness is 1mm.Under the conditions of water filling voltage-withstand test no leakage
Maximum pressure voltage, the maximum pressure voltage of A group chips is respectively 0.8Bar, 1.1Bar, 1.0Bar, 0.7Bar, 0.9Bar, 1.0Bar
And 0.8Bar；And the maximum pressure voltage of this method B group chips is respectively 1.7Bar, 1.5Bar, 1.9Bar, 2.2Bar, 2.0Bar.
By comparison it can be found that the whole pressure-resistant higher of chip prepared by this method, illustrates that bond strength is more preferable.
Although above having used general explanation and specific embodiment, the present invention is described in detail, at this
On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore,
These modifications or improvements without departing from theon the basis of the spirit of the present invention belong to the scope of protection of present invention.
Claims (10)
1. a kind of novel PDMS micro-fluidic chips bonding method, which is characterized in that described method includes following steps：
(1) glass and PDMS chips are passed through into plasma treatment respectively；
(2) in the PDMS liquid of one layer of the glass one side spin coating addition curing agent after plasma treatment, then in rotating speed it is
30~60s of spin coating on the sol evenning machine of 1000rpm, which, which is attached on glass, forms PDMS film；
(3) and then by the glass with PDMS film it is heat-treated, makes the PDMS liquid curings；
(4) glass through the one side that PDMS is handled with the PDMS chips Jing Guo plasma treatment is bonded and bonding can be realized.
2. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that the plasma is low
Press plasma or atmospheric plasma.
3. novel PDMS micro-fluidic chips bonding method according to claim 1 or 2, which is characterized in that the plasma
For oxygen plasma.
4. novel PDMS micro-fluidic chips bonding method according to claim 1 or 2, which is characterized in that plasma treatment
Time be 15min.
5. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that the curing agent is silicon
Alkane coupling agent.
6. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that the curing agent with
PDMS stostes are according to 1:Then 10 volume ratio mixing uniformly can be used afterwards with glass bar stirring 10min again.
7. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that the thickness of PDMS film
No more than 10um.
8. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that in the step (3)
The temperature of heat treatment is 75-100 DEG C, and the time of heat treatment is 1-15min.
9. novel PDMS micro-fluidic chips bonding method according to claim 8, which is characterized in that in the step (3)
The temperature of heat treatment is 90 DEG C, and the time of heat treatment is 5min.
10. novel PDMS micro-fluidic chips bonding method according to claim 1, which is characterized in that the glass includes
Soda-lime glass, quartz glass, tempered glass, ito glass, plating Ag film glass, plating Au film glass.
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Cited By (3)
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| CN109835871A (en) * | 2019-02-15 | 2019-06-04 | 武汉纺织大学 | A kind of glass-PDMS micro-fluidic chip bonding method |
| CN110164630A (en) * | 2019-06-13 | 2019-08-23 | 大连海事大学 | A kind of processing unit (plant) and method of minute yardstick ITO electrode |
| CN113426500A (en) * | 2021-07-13 | 2021-09-24 | 哈尔滨工业大学 | Preparation method of nanofluidic chip based on nano-corrugated structure |
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Application publication date: 20180619 |