CN112063341A - UV (ultraviolet) adhesive for high water resistance of electronic product and preparation method thereof - Google Patents

UV (ultraviolet) adhesive for high water resistance of electronic product and preparation method thereof Download PDF

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Publication number
CN112063341A
CN112063341A CN202010960130.5A CN202010960130A CN112063341A CN 112063341 A CN112063341 A CN 112063341A CN 202010960130 A CN202010960130 A CN 202010960130A CN 112063341 A CN112063341 A CN 112063341A
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adhesive
water resistance
high water
electronic products
coupling agent
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CN202010960130.5A
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CN112063341B (en
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严梦
徐伟
张丽
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Nuobantai New Materials Shenzhen Co ltd
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Nuobantai New Materials Shenzhen Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/18—Spheres

Abstract

The invention relates to the technical field of UV (ultraviolet) glue, in particular to a UV glue with high water resistance for electronic products and a preparation method thereof. The UV adhesive for the high water resistance of electronic products comprises the following components in percentage by weight: 30% -35% of acrylate prepolymer; 15% -20% of amine modified polyether acrylate; 30% -40% of monofunctional and multifunctional monomers; 3% -5% of cationic active diluent; 2% -8% of a photoinitiator; 4% -6% of a novel silane coupling agent; 1 to 3 percent of gas silicon. The invention controls the percentage of the novel silane coupling agent to be 4-6% by re-preparing the formula of the UV adhesive, so that the surface drying property and the water-blocking effect of the UV adhesive are also the best while the bonding strength is ensured.

Description

UV (ultraviolet) adhesive for high water resistance of electronic product and preparation method thereof
Technical Field
The invention relates to the technical field of UV (ultraviolet) glue, in particular to a UV glue with high water resistance for electronic products and a preparation method thereof.
Background
With the rapid development of the information age, the places where electronic products are applied to the UV glue are very wide, such as: and sensitive components such as circuit boards, relays, chips and the like. Because some electronic devices of electronic products are very sensitive to water, the existing UV adhesive is difficult to adapt to new requirements, and therefore a novel water-blocking UV adhesive needs to be developed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-water-resistance UV adhesive for electronic products and a preparation method thereof.
The purpose of the invention is realized by the following technical scheme:
the UV adhesive for the high water resistance of electronic products comprises the following components in percentage by weight: 30% -35% of acrylate prepolymer; 15% -20% of amine modified polyether acrylate; 30% -40% of monofunctional and multifunctional monomers; 3% -5% of cationic active diluent; 2% -8% of a photoinitiator; 4% -6% of a novel silane coupling agent; 1 to 3 percent of gas silicon.
Specifically, the acrylate prepolymer is spherical acrylate prepolymer, and the amine modified polyether acrylate is spherical amine modified polyether acrylate.
Specifically, inorganic materials having hydrophobicity are also included.
Specifically, the inorganic material is glass.
Specifically, the novel silane coupling agent is a hydrophobic novel silane coupling agent. Through the coupling and crosslinking mode of chemical bond, the reaction and the infiltration of the effectual hydrone that have prevented avoid moisture to the destruction of glue film, effectively avoid electronic device to damage.
In particular, the monofunctional groups are: one or more of IBOA, IBOMA and HEMA; the difunctional monomers are: TPGDA, HDDA, DEGDA, NPGDA one or more, trifunctional and multifunctional monomer: one or more of TMPTA and PETA.
Specifically, the photoinitiator is as follows: one or more of Irgacure 1173, Irgacure 184, Irgacure 907, Irgacure 651 and Irgacure 819.
Specifically, the cationic diluent is: one or more of dibutyl phthalate, dioctyl phthalate and m-dihydroxybenzene diglycidyl ester.
The preparation method of the UV adhesive for the high water resistance of the electronic product is characterized by comprising the following steps of:
s101: mixing the acrylate prepolymer with amine modified polyether acrylate to obtain a resin mixture A;
s102: mixing the resin mixture A with a novel silane coupling agent to obtain a mixture B;
s103: and mixing the mixture B with monofunctional and multifunctional monomers, a cationic reactive diluent, a photoinitiator and gas silicon to obtain the UV adhesive.
Specifically, in step S103, the mixing is performed by negative pressure stirring at 1500-2000 rpm/min for 20-60 min. All the components are uniformly mixed by high-speed stirring, and the negative-pressure stirring is to eliminate air bubbles introduced in the high-speed stirring process.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the invention controls the percentage of the novel silane coupling agent to be 4-6% by re-preparing the formula of the UV adhesive, so that the surface drying property and the water-blocking effect of the UV adhesive are also the best while the bonding strength is ensured. The glue was applied to the protection of the electronic devices, and then the whole was taken out after being left in water for one week, and the electronic devices were inspected to find that there was no damage. Meanwhile, the selected silicon-air has hydrophobic property, so that the water resistance of the glue is better. The glue is not yellow and can be stored for a long time.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The UV adhesive for the high water resistance of electronic products comprises the following components in percentage by weight: 30% -35% of acrylate prepolymer; 15% -20% of amine modified polyether acrylate; 30% -40% of monofunctional and multifunctional monomers; 3% -5% of cationic active diluent; 2% -8% of a photoinitiator; 4% -6% of a novel silane coupling agent; 1 to 3 percent of gas silicon.
Specifically, the acrylate prepolymer is spherical acrylate prepolymer, and the amine modified polyether acrylate is spherical amine modified polyether acrylate.
Specifically, inorganic materials having hydrophobicity are also included. The inorganic material is glass. The inorganic material functions to fill the gap. The gas silicon is hydrophobic gas silicon.
Specifically, the novel silane coupling agent is a hydrophobic novel silane coupling agent. The novel silane coupling agent is a colorless transparent solution, is a multiple organic synthesis product, and effectively prevents the reaction and permeation of water molecules by the coupling and crosslinking mode of chemical bonds, avoids the damage of moisture to the glue layer and effectively avoids the damage of electronic devices. Preferably, the novel silane coupling agent is NXT.
In particular, the monofunctional groups are: one or more of IBOA, IBOMA and HEMA; the difunctional monomers are: TPGDA, HDDA, DEGDA, NPGDA one or more, trifunctional and multifunctional monomer: one or more of TMPTA and PETA.
Specifically, the photoinitiator is as follows: one or more of Irgacure 1173, Irgacure 184, Irgacure 907, Irgacure 651 and Irgacure 819.
Specifically, the cationic diluent is: one or more of dibutyl phthalate, dioctyl phthalate and m-dihydroxybenzene diglycidyl ester.
The UV adhesive developed by the invention uses spherical acrylate prepolymer and spherical amine modified polyether acrylate, has high UV curing speed, has excellent bonding effect on electronic devices made of different materials, and can be used in any humidity environment. The glue was applied to the protection of the electronic devices, and then the whole was taken out after being left in water for one week, and the electronic devices were inspected to find that there was no damage. Meanwhile, the selected silicon gas has hydrophobicity, so that the water resistance of the glue is better. The glue is not yellow and can be stored for a long time.
The preparation method of the UV adhesive for the high water resistance of the electronic product is characterized by comprising the following steps of:
s101: mixing the acrylate prepolymer with amine modified polyether acrylate to obtain a resin mixture A;
s102: mixing the resin mixture A with a novel silane coupling agent to obtain a mixture B;
s103: and mixing the mixture B with monofunctional and multifunctional monomers, a cationic reactive diluent, a photoinitiator and gas silicon to obtain the UV adhesive.
Specifically, in step S103, the mixing is performed by negative pressure stirring at a high rotation speed of 1500-2000 rpm/min for 20-60 min. All the components are uniformly mixed by high-speed stirring, and the negative-pressure stirring is to eliminate air bubbles introduced in the high-speed stirring process.
The specific implementation process of the invention is as follows:
examples of the present invention and comparative examples are given below.
The preparation method of the UV glue in the embodiment comprises the following steps: mixing the acrylate prepolymer with amine modified polyether acrylate to obtain a resin mixture A; mixing the resin mixture A with a novel silane coupling agent to obtain a mixture B; and mixing the mixture B with monofunctional and multifunctional monomers, a cationic reactive diluent, a photoinitiator and gas silicon to obtain the UV adhesive.
The method for preparing the UV paste in the comparative example is different from that of the examples in the ratio of the amount of the novel silane coupling agent.
The surface dryness, water resistance and bonding strength of the UV adhesive were evaluated by the following evaluation methods:
surface drying: the UV cured film was observed in contact: when the surface is not well dried, the surface of the curing film is contacted with fingers, and fingerprint marks are left;
water resistance: after curing the glue into 5cm by 5cm blocks, weighing was performed, and the weight was recorded as: g1, soaking the blocks in water for one week, taking out, wiping the surfaces of the blocks with a paper towel, and weighing, wherein the weight is recorded as: g2, weight before and after soaking, percentage change in weight as evaluation criterion. The weight change percentage is within 0.01 percent, the water resistance is good, and the water resistance is poor when the weight change percentage exceeds 0.01 percent;
bonding strength: the same procedure is adopted for a Japan Wucang dispenser, 2 substrates are irradiated and cured and bonded together after quantitative dispensing, and a tensile test is carried out on an instron tensile testing machine, so that the specific bonding force is displayed finally.
The formulation ingredients of the examples and comparative examples are shown in tables 1 and 2.
Figure BDA0002680245240000041
Table 1: the formulation ingredients are listed in the table, where the amounts of the components are in weight percent relative to the total weight of the UV glue.
Figure BDA0002680245240000051
Table 2: formulation ingredients the following table shows the amounts of the components in weight percent relative to the total weight of the UV glue.
The experimental result data of examples and comparative examples are shown in tables 3 and 4.
Performance of Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Example 1
Curing wavelength 364nm 364nm 364nm 364nm 364nm
Curing time 15s 15s 15s 15s 15s
Adhesive strength MPa 60 60 60 60 60
Surface drying agent Difference (D) Difference (D) Good taste Good taste Good taste
Water-blocking property Difference (D) Difference (D) Difference (D) Difference (D) Good taste
Table 3: the data of the experimental results are shown in the table.
Performance of Example 2 Example 3 Comparative example 5 Comparative example 6 Comparative example 7 Comparative example 8
Curing wavelength 364nm 364nm 364nm 364nm 364nm 364nm
Curing time 15s 15s 15s 15s 15s 15s
Adhesive strength MPa 60 60 55 40 32 11
Surface drying agent Good taste Good taste Good taste Good taste Good taste Good taste
Water-blocking property Good taste Good taste Good taste Good taste Good taste Good taste
Table 4: the experimental results data are shown in the table below.
It can be seen from the combination of tables 1, 2, 3 and 4 that when the ratio of the novel silane coupling agent to the UV paste is greater than 6%, the adhesive property of the UV paste is lowered. When the weight percentage of the novel silane coupling agent is less than 4%, the surface drying property and the water resistance of the UV glue are poor. The novel silane coupling agent has the best performance of adhesive strength, surface dryness and water resistance when the weight percentage of the novel silane coupling agent is 4-6%. Therefore, it can be understood that the optimum amount of the novel silane coupling agent used in the electronic device of the present invention should be 4% to 6%.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The UV adhesive for the high water resistance of electronic products is characterized by comprising the following components in percentage by weight: 30% -35% of acrylate prepolymer; 15% -20% of amine modified polyether acrylate; 30% -40% of monofunctional and multifunctional monomers; 3% -5% of cationic active diluent; 2% -8% of a photoinitiator; 4% -6% of a novel silane coupling agent; 1 to 3 percent of gas silicon.
2. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the acrylate prepolymer is a spherical acrylate prepolymer, and the amine-modified polyether acrylate is a spherical amine-modified polyether acrylate.
3. The UV adhesive for high water resistance of electronic products according to claim 1, further comprising an inorganic material with hydrophobicity.
4. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the inorganic material is glass.
5. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the novel silane coupling agent is a hydrophobic novel silane coupling agent.
6. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the monofunctional group is: one or more of IBOA, IBOMA and HEMA; the difunctional monomers are: TPGDA, HDDA, DEGDA, NPGDA one or more, three-functional and multi-functional monomer is: one or more of TMPTA and PETA.
7. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the photoinitiator is: one or more of Irgacure 1173, Irgacure 184, Irgacure 907, Irgacure 651 and Irgacure 819.
8. The UV adhesive for high water resistance of electronic products according to claim 1, wherein the cationic diluent is: one or more of dibutyl phthalate, dioctyl phthalate and resorcinol diglycidyl ester.
9. The preparation method of the UV adhesive for the high water resistance of the electronic product, which is disclosed by the claims 1 to 9, is characterized by comprising the following steps of:
s101: mixing the acrylate prepolymer with amine modified polyether acrylate to obtain a resin mixture A;
s102: mixing the resin mixture A with a novel silane coupling agent to obtain a mixture B;
s103: and mixing the mixture B with monofunctional and multifunctional monomers, a cationic reactive diluent, a photoinitiator and gas silicon to obtain the UV adhesive.
10. The method for preparing the UV adhesive for the high water resistance of the electronic product according to claim 9, wherein in the step S103, the mixing is performed in a negative pressure stirring manner at a high rotation speed of 1500-2000 rpm/min for 20-60 min.
CN202010960130.5A 2020-09-14 2020-09-14 UV (ultraviolet) adhesive for high water resistance of electronic product and preparation method thereof Active CN112063341B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114940867A (en) * 2022-07-06 2022-08-26 诺邦泰新材料(深圳)有限公司 Uv adhesive for high-adhesion thin-coating joint filling of electronic products and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005049755A1 (en) * 2003-11-24 2005-06-02 Samsung Electronics Co., Ltd Uv-hardenable adhesive composition, optical reading head using said composition and optical recording/reproducing device comprising said reading head
AU2003303317A1 (en) * 2003-11-24 2005-06-08 Samsung Electronics Co., Ltd Uv-hardenable adhesive composition, optical reading head using said composition and optical recording/reproducing device comprising said reading head
CN104271697A (en) * 2011-07-25 2015-01-07 汉高股份有限公司 Adhesive composition
CN107936903A (en) * 2017-09-26 2018-04-20 广州机械科学研究院有限公司 A kind of ultraviolet photo-curing cementing agent and its preparation method and application

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005049755A1 (en) * 2003-11-24 2005-06-02 Samsung Electronics Co., Ltd Uv-hardenable adhesive composition, optical reading head using said composition and optical recording/reproducing device comprising said reading head
AU2003303317A1 (en) * 2003-11-24 2005-06-08 Samsung Electronics Co., Ltd Uv-hardenable adhesive composition, optical reading head using said composition and optical recording/reproducing device comprising said reading head
CN104271697A (en) * 2011-07-25 2015-01-07 汉高股份有限公司 Adhesive composition
CN107936903A (en) * 2017-09-26 2018-04-20 广州机械科学研究院有限公司 A kind of ultraviolet photo-curing cementing agent and its preparation method and application

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114940867A (en) * 2022-07-06 2022-08-26 诺邦泰新材料(深圳)有限公司 Uv adhesive for high-adhesion thin-coating joint filling of electronic products and preparation method thereof

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