CN1797076A - Composite crystal structure of glass, and LCD of using the composite crystal structure of glass - Google Patents
Composite crystal structure of glass, and LCD of using the composite crystal structure of glass Download PDFInfo
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- CN1797076A CN1797076A CN 200410091811 CN200410091811A CN1797076A CN 1797076 A CN1797076 A CN 1797076A CN 200410091811 CN200410091811 CN 200410091811 CN 200410091811 A CN200410091811 A CN 200410091811A CN 1797076 A CN1797076 A CN 1797076A
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Abstract
The invention discloses a crystal-on-glass (COG) structure and a LCD adopting the structure. And the COG structure comprises a driving IC with plural functional bumps, an anisotropic conductive film and a glass substrate, where the anisotropic conductive film is between the glass substrate and the driving IC and corresponds to the functional bumps, the driving IC is connected with an external circuit on the glass substrate and arranged on the glass substrate and on the opposite side of the external circuit. The invention can reduce the thickness and bulk of the LCD, thus reducing the occupied space of the LCD.
Description
[technical field]
The present invention relates to a kind of LCD that is used for the glass flip chip structure of liquid crystal display-driving IC (Integrated Circuit) encapsulation and adopts this glass flip chip structure.
[background technology]
LCD is because itself and cathode-ray tube display (Cathode Ray Tube, CRT) compare have low voltage drive, little power consumption, the capacity of display are big, low radiation and frivolous advantage, various audio-visual devices and communication apparatus have been widely used in, the packaged type of liquid crystal display-driving IC also develops into glass flip chip of today (Chip on Glass by early stage COB (Chip on Board), TAB (Tape CarrierBonding), COG), (Chip on Film COF) waits packaged type to membrane of flip chip.
See also Fig. 1 to Fig. 3, be used for the glass flip chip structural representation of LCD for a kind of prior art.Wherein Fig. 2 is the cut-open view of LCD 1 shown in Figure 1 along the II-II line, and Fig. 3 is the cut-open view of LCD 1 shown in Figure 2 along the III-III line.This LCD 1 comprises top glass substrate 11, lower glass substrate 12, be clipped in liquid crystal layer (figure does not show) between top glass substrate 11 and the lower glass substrate 12, be positioned at the back light system 100 and the drive IC 13 of lower glass substrate 12 belows.
12 of this drive IC 13 and this lower glass substrate are provided with anisotropic conducting film 17, and this anisotropic conducting film 17 is made up of binder and the conducting particles that is positioned at wherein.
Drive IC 13 comprises the first function projection 151 and the second function projection 152, and wherein the position of the extension line 161 of the LCD 1 on the position of the first function projection 151 and this lower glass substrate 12 is corresponding; (Flexible Printed Circuit Board, FPC) extension line 162 positions below 14 are corresponding for the position of the second function projection 152 and flexible circuit board.
This drive IC 13 is positioned on the lower glass substrate 12 and top glass substrate 11 adjacent sides, its first function projection 151 is electrically connected with this LCD 1 by the extension line 161 of this LCD 1 and the anisotropic conducting film 17 of these first function projection, 151 belows, 152 anisotropic conducting films 17 by extension line 162 and these second function projection, 152 belows of the second function projection are electrically connected with FPC 14, and FPC 14 is electrically connected with external circuit.
Be electrically connected by crimping anisotropic conducting film 17 with the extension line 161 of this LCD 1 in this drive IC 13.At a certain temperature, this drive IC 13 is exerted pressure, can make the insulation skin breakage on the conducting particles surface of this anisotropic conductive film 17, thereby vertically conduct electricity, horizontal direction then keeps insulation, that is, vertically conduct electricity, and keep electrical isolation in other direction corresponding to the anisotropic conductive film 17 at the first function projection, 151 places of drive IC 13.The second function projection 152 of this drive IC 13 is identical with the aforementioned electric connected mode with FPC 14 ways of connecting.
In this LCD 1, because drive IC 13 is arranged on the lower glass substrate 12 and top glass substrate 11, FPC 14 same side, and the thickness of drive IC 13 top glass substrate 11 than LCD 1 is thick usually, thereby pass through to need more exceptional space when FPC 14 connects external circuits, thereby increase the thickness and the volume of LCD 1.
[summary of the invention]
For overcoming the defective that prior art glass flip chip structure makes that when being used for LCD LCD thickness and volume increase, the invention provides a kind of glass flip chip structure, when this glass flip chip structure is used for LCD, can make full use of the space, reduce the thickness and the volume of LCD.
The present invention also provides a kind of LCD that adopts above-mentioned glass flip chip structure.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of glass flip chip structure is provided, it comprises that one has drive IC, an anisotropic conducting film and a glass substrate of a plurality of function projections, this anisotropic conducting film is between this glass substrate and drive IC and corresponding with this function bump position, the external circuit that this drive IC and is positioned on this glass substrate is electrically connected, and this drive IC is positioned on the glass substrate and this external circuit opposition side.
The present invention solves the technical scheme that another technical matters adopts: a kind of LCD is provided, and it comprises that a drive IC, top glass substrate, a lower glass substrate, relative with this top glass substrate are clipped in a liquid crystal layer and a back light system between this upper and lower glass substrate.This back light system is positioned on this lower glass substrate and the different side of top glass substrate, this drive IC has a plurality of function projections, and be positioned on the lower glass substrate and this back light system homonymy, this anisotropic conducting film is between this lower glass substrate and drive IC and corresponding with this function projection number and position.
Compared with prior art, the glass flip chip structure that is used for LCD of the present invention, because the media FPC that is connected with external circuit is positioned at going up and top glass substrate one side of this lower glass substrate, and drive IC is positioned on the lower glass substrate and the FPC opposition side, promptly this drive IC is positioned on the lower glass substrate and the top glass substrate opposition side, drive IC space between mechanisms such as can making full use of this backlight liquid crystal display system and lower glass substrate is set, can reduce the thickness and the volume of this LCD, thereby dwindle the shared space of this LCD.
[description of drawings]
Fig. 1 is the glass flip chip structural representation that a kind of prior art is used for LCD.
Fig. 2 is the cut-open view of LCD shown in Figure 1 along the II-II line.
Fig. 3 is the cut-open view of LCD shown in Figure 2 along the III-III line.
Fig. 4 is the glass flip chip structural representation of LCD of the present invention.
Fig. 5 is the cut-open view of LCD shown in Figure 4 along the V-V line.
[embodiment]
Please consult Fig. 4 and Fig. 5 together, Fig. 4 is the glass flip chip structural representation that the present invention is used for LCD, and Fig. 5 is along the sectional view of V-V line among Fig. 4.Wherein this LCD 4 comprises top glass substrate 41, lower glass substrate 42, is clipped in liquid crystal layer (figure does not show), back light system 400 and drive IC 43 between top glass substrate 41 and the lower glass substrate 42.
This drive IC 43 is positioned at lower glass substrate 42 and top glass substrate 41 mutually on the same side, and it has a plurality of first function projections 451 and a plurality of second function projections 452, and this first function projection 451 and the second function projection 452 are disconnected from each other.
This lower glass substrate 42 is provided with first anisotropic conducting film 471, second anisotropic conducting film 472 and runs through the through hole 46 of this lower glass substrate 42.This through hole 46 comprises first through hole 461 and second through hole 462, and this first through hole 461 is corresponding with the first function projection 451, and this second through hole 462 is corresponding with the second function projection 452.The both sides of lower glass substrate 42 are respectively arranged with first lead 481 and second lead 482 in this first through hole 461 and second through hole 462 so that can be conducted electricity.
First anisotropic conducting film 471 is positioned on the lower glass substrate 42 and top glass substrate 41 opposition sides, and its position is corresponding with drive IC 43, first through hole 461 and second through hole 462; Second anisotropic conducting film 472 is positioned on the lower glass substrate 42 and top glass substrate 41 same side, and its position is corresponding with second through hole 462 and second lead 482.
FPC 44 is positioned on the lower glass substrate 42 and top glass substrate 41 the same side mutually, the media that this FPC 44 is electrically connected with external circuit as this LCD 4.
The first function projection 451 of drive IC 43 is electrically connected with the extension line 49 of LCD 4 by first lead 481 and first anisotropic conducting film 471 that runs through first through hole 461, and the second function projection 452 of drive IC 43 is electrically connected with FPC 44 by second lead 482 that runs through second through hole 462.
LCD 4 of the present invention is as follows with the process that drive IC 43 and FPC 44 engage:
At first, on this lower glass substrate 42, form a plurality of functional conductive films; First anisotropic conducting film 471 and second anisotropic conducting film 472 are pasted on this lower glass substrate 42, wherein first anisotropic conducting film 471 be positioned on the lower glass substrate 42 with top glass substrate 41 different sides on, and this first anisotropic conducting film 471 and first lead 481 that runs through first through hole 461 and to run through second lead 482 of second through hole 462 corresponding; The position of second anisotropic conducting film 472 on lower glass substrate 42 with top glass substrate 41 same side, and this second anisotropic conducting film 472 is corresponding with second lead 482 that runs through second through hole 462.This drive IC 43 is placed on first anisotropic conducting film 471 with top glass substrate 41 different sides, and the first function projection 451, the second function projection 452 are all corresponding with first anisotropic conducting film 471; Under uniform temperature, speed and pressure condition, carry out precompressed and this press operation, make the first function projection 451 of drive IC 43 and the second function projection 452 realize electrically connecting, to realize engaging of drive IC 43 and lower glass substrate 42 by first lead 481 in first through hole 461 of the conducting particles of this first anisotropic conducting film 471 and lower glass substrate 42 and second lead 482 in second through hole 462; At last, with the lower glass substrate 42 of this drive IC opposition side on, FPC 44 by binding on lower glass substrate 42 with second through hole, 462 corresponding second anisotropic conducting films 472, and is realized being electrically connected with second lead 482 in second through hole 462.
Wherein, the first function projection 451 can be bumping square or round bump with this second function projection 452, can adopt gold or leypewter to make.
The present invention is used for the glass flip chip structure of LCD 4, because drive IC 43 is positioned on the lower glass substrate 42 homonymy not with FPC 44, the media FPC44 that is connected with external circuit is positioned at going up and top glass substrate 41 1 sides of this lower glass substrate 42, the space that mechanisms such as the back light system 400 that being provided with of drive IC 43 can make full use of this LCD 4 and lower glass substrate are 42, can reduce the thickness and the volume of this LCD 4, thereby dwindle the shared space of this LCD 4.
Claims (8)
1. glass flip chip structure, it comprises that a drive IC with a plurality of function projections, a glass substrate, one are between this glass substrate and drive IC and the anisotropic conducting film corresponding with this function bump position of its position, the external circuit that this drive IC and is positioned on this glass substrate is electrically connected, and it is characterized in that: this drive IC is positioned on the glass substrate and this external circuit opposition side.
2. glass flip chip structure as claimed in claim 1, it is characterized in that: the part to function projection that should drive IC on this glass substrate has through hole, be provided with this glass substrate of conducting electric conductor up and down in this through hole, the function projection of drive IC is electrically connected with this circuit above glass substrate via the electric conductor in this through hole by this anisotropic conducting film.
3. glass flip chip structure as claimed in claim 1 is characterized in that: this drive IC is a strip.
4. glass flip chip structure as claimed in claim 1 is characterized in that: the function projection of this drive IC is bumping square or round bump.
5. LCD, it comprises that a drive IC, top glass substrate, a lower glass substrate, relative with this top glass substrate are clipped in a liquid crystal layer and a back light system between this upper and lower glass substrate, this back light system is positioned at an opposite side with top glass substrate on this lower glass substrate, this drive IC has a plurality of function projections, this anisotropic conducting film is characterized in that between this lower glass substrate and drive IC and corresponding with this function projection number and position: this drive IC is positioned on the lower glass substrate and this back light system the same side mutually.
6. LCD as claimed in claim 5, it is characterized in that: the part to function projection that should drive IC on this lower glass substrate has through hole, be provided with this glass substrate of conducting electric conductor up and down in this through hole, the function projection of drive IC is electrically connected with this circuit above lower glass substrate via the electric conductor in this through hole by this anisotropic conducting film.
7. LCD as claimed in claim 5 is characterized in that: this drive IC is a strip.
8. LCD as claimed in claim 5 is characterized in that: the function projection of this drive IC is bumping square or round bump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100918113A CN100480786C (en) | 2004-12-22 | 2004-12-22 | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100918113A CN100480786C (en) | 2004-12-22 | 2004-12-22 | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1797076A true CN1797076A (en) | 2006-07-05 |
| CN100480786C CN100480786C (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100918113A Expired - Fee Related CN100480786C (en) | 2004-12-22 | 2004-12-22 | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass |
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| CN (1) | CN100480786C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014044166A1 (en) * | 2012-09-19 | 2014-03-27 | 深圳市柔宇科技有限公司 | Display screen |
| CN106909005A (en) * | 2017-04-18 | 2017-06-30 | 武汉华星光电技术有限公司 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
| CN109143658A (en) * | 2017-06-28 | 2019-01-04 | 展晶科技(深圳)有限公司 | liquid crystal display substrate |
| CN109979316A (en) * | 2019-03-22 | 2019-07-05 | 维沃移动通信有限公司 | The display screen of terminal device, the preparation method of display screen and terminal device |
| CN117518640A (en) * | 2023-12-07 | 2024-02-06 | 惠科股份有限公司 | Display device and display panel |
-
2004
- 2004-12-22 CN CNB2004100918113A patent/CN100480786C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014044166A1 (en) * | 2012-09-19 | 2014-03-27 | 深圳市柔宇科技有限公司 | Display screen |
| CN106909005A (en) * | 2017-04-18 | 2017-06-30 | 武汉华星光电技术有限公司 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
| CN109143658A (en) * | 2017-06-28 | 2019-01-04 | 展晶科技(深圳)有限公司 | liquid crystal display substrate |
| CN109979316A (en) * | 2019-03-22 | 2019-07-05 | 维沃移动通信有限公司 | The display screen of terminal device, the preparation method of display screen and terminal device |
| CN117518640A (en) * | 2023-12-07 | 2024-02-06 | 惠科股份有限公司 | Display device and display panel |
| CN117518640B (en) * | 2023-12-07 | 2024-08-16 | 惠科股份有限公司 | Display device and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100480786C (en) | 2009-04-22 |
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