CN106909005A - Reduce the method and narrow frame liquid crystal display device in outer pin pressing region - Google Patents
Reduce the method and narrow frame liquid crystal display device in outer pin pressing region Download PDFInfo
- Publication number
- CN106909005A CN106909005A CN201710253460.9A CN201710253460A CN106909005A CN 106909005 A CN106909005 A CN 106909005A CN 201710253460 A CN201710253460 A CN 201710253460A CN 106909005 A CN106909005 A CN 106909005A
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- China
- Prior art keywords
- chip
- pressing
- outer pin
- anisotropic conductive
- fpc
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to a kind of method and narrow frame liquid crystal display device for reducing outer pin pressing region, it is related to technical field of liquid crystal display, the utilization rate for improving chip and FPC space in vertical direction reduces outer pin pressing region with this.The method of the present invention is included in the step of pressing connector in the installation region on base material；The pre-pressing chip and the step of FPC on the connector；The step of main pressing is carried out jointly with the chip to the base material, the FPC；It is laminated in vertical direction with chip by making FPC, it is possible to increase the utilization rate of vertical space, to reduce outer pin pressing region.
Description
Technical field
The present invention relates to technical field of liquid crystal display, a kind of particularly method for reducing outer pin pressing region and narrow
Frame liquid crystal display device.
Background technology
With the development of industrial technology technology, module group assembling is also increasingly modernized, wherein pressing (Bonding) technology is
Important process in module group procedure, a finished product display device is necessarily required to realize lighting by pressing technology.
In the exploitation and evolution of present Display Technique, especially outer pin presses (outer lead to narrow frame technology
Bonding, OLB) region narrow be after develop inexorable trend.Outer pin presses region by pressing region and connection pressing area
The circuit composition of domain and viewing area, in traditional process for pressing, chip (IC) is that one side is pressed with base material, i.e. chip
Only have one side to contact with base material, also need pressing FPC (FPC) to be coordinated, as shown in figure 1, therefore making chip 3 and soft
The space that property wiring board 5 takes in the horizontal direction is more, and space in vertical direction is not effectively utilized,
Therefore outer pin is pressed region cannot reduce.
The content of the invention
The present invention provides a kind of method for reducing outer pin pressing region, for improving chip and FPC vertical
The utilization rate in the space on direction, outer pin pressing region is reduced with this.
The present invention provides a kind of method for reducing outer pin pressing region, comprises the following steps：
S10：Connector is pressed in installation region on base material；
S20：Place FPC on the chip after pre-pressing chip on the connector, and make the flexibility
Wiring board is connected with the chip；
Or the chip is pressed with the connector again after the FPC is connected with the chip；
In one embodiment, in step S10, the connector is the first anisotropic conductive film.
In one embodiment, in step S20, first the anisotropy of bottom pre-pressing second in the FPC is led
After electric glued membrane, then the second anisotropic conductive film is connected with the chip pre-pressing.
In one embodiment, pressed based on when chip is pressed in step S20, on the connector, described second is different
Pressed based on when property conductive adhesive film in side's is pressed on the chip；
Or when pressing chip on the connector be pre-pressing, second anisotropic conductive film presses to the chip
It was pre-pressing when upper；And after the completion of step S20, then the base material, the chip and the FPC are led jointly
Pressing.
In one embodiment, the pre-pressing temperature of first anisotropic conductive film is less than second anisotropy
The pre-pressing temperature of conductive adhesive film；The main pressing-in temp of first anisotropic conductive film is conductive less than second anisotropy
The main pressing-in temp of glued membrane.
In one embodiment, the main pressing pressure of first anisotropic conductive film is led with second anisotropy
The main pressing pressure of electric glued membrane is identical.
In one embodiment, in step S20, the FPC is made with the chip phase by eutectic technology
Even.
In one embodiment, the chip be can two-sided pressing chip.
In one embodiment, the FPC be can two-sided pressing FPC.
In one embodiment, in step S30, the base material is rigid base material, semi-flexible base material or Grazing condition base material.
The present invention also provides a kind of narrow frame liquid crystal display device, and it is adopted to make with the aforedescribed process and obtains；The narrow side
The frame size of frame liquid crystal display device is less than or equal to 2mm.
Compared with prior art, the advantage of the invention is that：
(1) connected mode by FPC and base material pressing in traditional handicraft is changed, by FPC and core
Piece is pressed, and chip is attached by connector with base material, chip is overlapped in vertical space with FPC, so as to reduce
Pressing region, reaches and reduces the purpose that outer pin presses region.
(2) chip pressing technology is integrated with flexible circuit board pressing technology, the upper and lower surface of chip is carried out
Effective utilization.
Brief description of the drawings
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.
Fig. 1 is the connected mode schematic diagram of prior art chips and FPC and base material；
Fig. 2 is the method flow diagram in reduction outer pin pressing region in one embodiment of the present of invention；
Fig. 3 is the connected mode schematic diagram of one embodiment of the present of invention chips and FPC and base material；
Fig. 4 is the method flow diagram in reduction outer pin pressing region in an alternative embodiment of the invention；
Fig. 5 is the connected mode schematic diagram of an alternative embodiment of the invention chips and FPC and base material.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not drawn according to actual ratio.
Reference：
1- base materials；2- connectors；3- chips；
The anisotropic conductive films of 4- second；5- FPCs.
Specific embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Fig. 2 reducing the method that outer pin presses region the invention provides a kind of, it is comprised the following steps：
The first step：Connector 2 is pressed in installation region on base material 1.
Wherein, connector 2 can select the first anisotropic conductive film, and the first anisotropic conductive film is connected with base material 1
Shi Caiyong pre-pressings.
Base material 1 can select the rigid base material such as glass or printed circuit board (PCB), also can select plastic cement (PI)+glass or modeling
The semi-flexible base material such as glue+steel disc；Also can select the Grazing condition base materials such as plastic cement.
Second step：As shown in figure 3, pressing chip 3 on connector 2；Then first in the bottom pressing the of FPC 5
Two anisotropic conductive films 4, then the second anisotropic conductive film 4 is pressed with chip 3 be connected.I.e. FPC 5 is located at core
The surface of piece 3, is improved the utilization rate of vertical space, reduces pressing region, that is, reduce outer pin pressing region.
Alternatively, pressed based on when chip 3 is pressed on connector 2, the second anisotropic conductive film 4 is pressed on chip 3
Shi Weizhu is pressed.That is pressed based on the pressing of the anisotropic conductive film of chip 3 and first and the second anisotropic conductive film 4 is equal.
In the process, because the temperature value and pressure value of main pressing use are above the temperature value and pressure of pre-pressing use
Force value, thus need to consider the respective pre-pressing temperature of both the first anisotropic conductive film and the second anisotropic conductive film 4 with
And main pressing-in temp.Preferably, master of the main pressing-in temp of the first anisotropic conductive film less than the second anisotropic conductive film 4
Pressing-in temp, prevents the first anisotropic conductive film to be damaged.
Preferably, it is pre-pressing when pressing chip 3 on connector 2, the second anisotropic conductive film 4 pressed on chip 3
When be pre-pressing；And after the completion of step S20, then main pressing is carried out jointly to base material 1, chip 3 and FPC 5.By this
The scheme of kind, makes base material 1, chip 3 and FPC 5 to carry out main pressing as an entirety, can reduce technique stream
Journey and equipment usage amount, so that economic benefit is lifted.
In the process, in order to prevent the first anisotropic conductive film to be damaged, also need to make the first anisotropic conductive film
Pre-pressing temperature less than the second anisotropic conductive film 4 pre-pressing temperature.
Wherein, chip 3 for can two-sided pressing chip, i.e. the top and bottom of chip 3 can be effectively utilized, specifically
Ground, the lower surface of chip 3 is connected with the first anisotropic conductive film, the upper surface of chip 3 and the phase of the second anisotropic conductive film 4
Even.
Additionally, the main pressing pressure of the main pressing pressure of the first anisotropic conductive film 2 and the second anisotropic conductive film 4
It is identical, or the main pressing pressure of the two is substantially close, prevents pressure excessive and makes one of failure.
In another embodiment of the invention, chip 2 is made to be connected with FPC 5 in different ways, such as Fig. 4 institutes
Show, specific step is as follows：
The first step：Connector 2 is pressed in installation region on base material 1.
Wherein, connector 2 is the first anisotropic conductive film, and it is pre-pressing with the pressing of base material 1.
Second step, again presses chip 3 with connector 2 after FPC 5 is connected with chip 3 by eutectic technology
(as shown in Figure 5).
FPC 5 is first set to be connected with chip 3, then by the pre-pressing of chip 3 to the first anisotropic conductive film, with
It is overall again afterwards to carry out main pressing, to reduce technological process and equipment usage amount.
The present invention also provides a kind of narrow frame liquid crystal display device, and it is adopted to make with the aforedescribed process and obtains；Wherein narrow side
The frame size of frame liquid crystal display is less than or equal to 2mm.
The method that the reduction outer pin provided according to the present invention presses region, the liquid crystal display device of acquisition has narrow frame
The characteristics of.
Although by reference to preferred embodiment, invention has been described, is not departing from the situation of the scope of the present invention
Under, various improvement can be carried out to it and part therein can be replaced with equivalent.Especially, as long as in the absence of structure punching
Prominent, the every technical characteristic being previously mentioned in each embodiment can combine in any way.The invention is not limited in text
Disclosed in specific embodiment, but all technical schemes including falling within the scope of the appended claims.
Claims (10)
1. it is a kind of to reduce the method that outer pin presses region, it is characterised in that to comprise the following steps：
S10：Connector is pressed in installation region on base material；
S20：FPC is placed on the chip after pressing chip on the connector, and makes the FPC
It is connected with the chip；
Or the chip is pressed with the connector again after the FPC is connected with the chip.
2. it is according to claim 1 to reduce the method that outer pin presses region, it is characterised in that in step S10, the company
Junctor is the first anisotropic conductive film.
3. it is according to claim 2 to reduce the method that outer pin presses region, it is characterised in that in step S20, first in institute
After stating second anisotropic conductive film of bottom pressing of FPC, then the second anisotropic conductive film is pressed into the core
On piece.
4. it is according to claim 3 to reduce the method that outer pin presses region, it is characterised in that in step S20, the company
On junctor press chip when based on press, when second anisotropic conductive film is pressed on the chip based on press；
Or on the connector press chip when be pre-pressing, when second anisotropic conductive film is pressed on the chip
It is pre-pressing；And after the completion of step S20, then main pressing is carried out jointly to the base material, the chip and the FPC.
5. it is according to claim 4 to reduce the method that outer pin presses region, it is characterised in that first anisotropy is led
Pre-pressing temperature of the pre-pressing temperature of electric glued membrane less than second anisotropic conductive film；First anisotropic conductive
Main pressing-in temp of the main pressing-in temp of film less than second anisotropic conductive film.
6. it is according to claim 4 to reduce the method that outer pin presses region, it is characterised in that first anisotropy is led
The main pressing pressure of electric glued membrane is identical with the main pressing pressure of second anisotropic conductive film.
7. it is according to claim 1 and 2 to reduce the method that outer pin presses region, it is characterised in that in step S20, to lead to
Hypereutectic technology makes the FPC be connected with the chip.
8. the method that the reduction outer pin according to any one in claim 1-4 presses region, it is characterised in that described
Chip be can two-sided pressing chip.
9. the method that the reduction outer pin according to any one in claim 1-4 presses region, it is characterised in that step
In S30, the base material is rigid base material, semi-flexible base material or Grazing condition base material.
10. a kind of narrow frame liquid crystal display device, it is characterised in that using the method described in any one in claim 1-9
Making is obtained；The frame size of the narrow frame liquid crystal display device is less than or equal to 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253460.9A CN106909005A (en) | 2017-04-18 | 2017-04-18 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253460.9A CN106909005A (en) | 2017-04-18 | 2017-04-18 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106909005A true CN106909005A (en) | 2017-06-30 |
Family
ID=59209709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710253460.9A Pending CN106909005A (en) | 2017-04-18 | 2017-04-18 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
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| Country | Link |
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| CN (1) | CN106909005A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114206020A (en) * | 2021-12-10 | 2022-03-18 | 苏州华星光电技术有限公司 | Binding device and binding method |
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| CN1570718A (en) * | 2004-01-27 | 2005-01-26 | 友达光电股份有限公司 | Method for joining chip and other devices to liquid crystal display panel and display device |
| CN1591524A (en) * | 2003-08-26 | 2005-03-09 | 日本东北先锋公司 | Display panel device |
| CN1797076A (en) * | 2004-12-22 | 2006-07-05 | 群康科技(深圳)有限公司 | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass |
| CN104852172A (en) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | Electronic equipment and circuit board connection method |
| CN106526943A (en) * | 2017-01-12 | 2017-03-22 | 京东方科技集团股份有限公司 | Liquid crystal display device |
-
2017
- 2017-04-18 CN CN201710253460.9A patent/CN106909005A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1591524A (en) * | 2003-08-26 | 2005-03-09 | 日本东北先锋公司 | Display panel device |
| CN1570718A (en) * | 2004-01-27 | 2005-01-26 | 友达光电股份有限公司 | Method for joining chip and other devices to liquid crystal display panel and display device |
| CN1797076A (en) * | 2004-12-22 | 2006-07-05 | 群康科技(深圳)有限公司 | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass |
| CN104852172A (en) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | Electronic equipment and circuit board connection method |
| CN106526943A (en) * | 2017-01-12 | 2017-03-22 | 京东方科技集团股份有限公司 | Liquid crystal display device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114206020A (en) * | 2021-12-10 | 2022-03-18 | 苏州华星光电技术有限公司 | Binding device and binding method |
| CN114206020B (en) * | 2021-12-10 | 2024-03-22 | 苏州华星光电技术有限公司 | Bonding device and bonding method |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170630 |