CN104852172A - Electronic equipment and circuit board connection method - Google Patents
Electronic equipment and circuit board connection method Download PDFInfo
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- CN104852172A CN104852172A CN201410056895.0A CN201410056895A CN104852172A CN 104852172 A CN104852172 A CN 104852172A CN 201410056895 A CN201410056895 A CN 201410056895A CN 104852172 A CN104852172 A CN 104852172A
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Abstract
The invention discloses electronic equipment and a circuit board connection method. The electronic equipment comprises a first circuit board, a second circuit board, a third circuit board, a first anisotropic conductive adhesive film and a second anisotropic conductive adhesive film. The first circuit board comprises a first pin. The second circuit board comprises a second pin. The third circuit board is arranged between the first circuit board and the second circuit board. The third circuit board is provided with a third pin and a fourth pin corresponding to and opposite to the third pin in position. The first anisotropic conductive adhesive film is arranged between the first pin and the third pin and is used for connecting the first pin with the third pin. The second anisotropic conductive adhesive film is arranged between the second pin and the fourth pin and is used for connecting the second pin with the fourth pin.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment and circuit board method of attachment.
Background technology
Usually be provided with two or more circuit board in electronic equipment, described circuit board can be printed circuit board (PCB), also can be flexible PCB, or one is flexible PCB, and one is printed circuit board (PCB).When assembling described electronic equipment, usually need two or more circuit board to be electrically connected.
In prior art, described in usually making in the following manner, two or more circuit board is electrically connected.First, connector is set on circuit boards, then, is connected the connector on two circuit boards by winding displacement etc., with the company's of making circuit board electrical connection.If when a circuit board needs to be electrically connected with two circuit boards simultaneously, then need to arrange connector on two of this circuit board different positions, a connector and another circuit board are electrically connected, thus are connected with two circuit boards while of realizing a circuit board.
But present inventor in the process realizing technical scheme, at least find that above-mentioned prior art exists following technical problem:
Because when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, thus the size of this circuit board is increased, be unfavorable for the development of electronics miniaturization.
Summary of the invention
The application provides a kind of electronic equipment and circuit board method of attachment, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, is unfavorable for the technical problem of the development of electronics miniaturization.
The application provides a kind of electronic equipment, and described electronic equipment comprises first circuit board, second circuit board, tertiary circuit plate, the first anisotropic conductive film and the second anisotropic conductive film, and described first circuit board comprises the first pin; Described second circuit board comprises the second pin; Described tertiary circuit plate is arranged between described first circuit board and described second circuit board, and described tertiary circuit plate is provided with the 3rd pin and four pin corresponding and opposing with described 3rd Pin locations; Described first anisotropic conductive film is arranged between described first pin and described 3rd pin, for being electrically connected described first pin and the 3rd pin; With described second anisotropic conductive film is arranged between described second pin and described 4th pin, for being electrically connected described second pin and described 4th pin.
Preferably, described first anisotropic conductive film is different with the high temperature resistant temperature of described second anisotropic conductive film.
Preferably, described first circuit board is transparent is printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate is flexible PCB, and the high temperature resistant temperature of described first anisotropic conductive film is greater than described second anisotropic conductive film.
Preferably, described first anisotropic conductive film is made up of the exotic material of 140 degree of-180 degree.
Preferably, described second anisotropic conductive film is made up of the exotic material of 80 degree of-120 degree.
Preferably, described second circuit board is transparent printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate is flexible PCB, and the high temperature resistant temperature of described second anisotropic conductive film is greater than described first anisotropic conductive film.
Preferably, described second anisotropic conductive film is made up of the exotic material of 140 degree of-180 degree.
Preferably, described first anisotropic conductive film is made up of the exotic material of 80 degree of-120 degree.
A kind of circuit board method of attachment, described method comprises:
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, be oppositely arranged by 4th pin of the second pin of second circuit board and tertiary circuit plate, described 3rd pin is corresponding with described 4th Pin locations and be opposingly arranged on described tertiary circuit plate;
Between described first pin and described 3rd pin, place described first anisotropic conductive film, between described second pin and described 4th pin, place the second anisotropic conductive film;
First circuit board, described first anisotropic conductive film, described tertiary circuit plate, described second anisotropic conductive film and described second circuit board described in hot pressing, described first pin and described 3rd pin are electrically connected, and described second pin and described 4th pin are electrically connected.
The application's beneficial effect is as follows:
Above-mentioned electronic equipment and circuit board method of attachment by arranging the 3rd pin and four pin corresponding and opposing with described 3rd Pin locations on described tertiary circuit plate, and by described first anisotropic conductive film described first pin of electrical connection and the 3rd pin, by described second anisotropic conductive film described second pin of electrical connection and described 4th pin, thus avoid described 3rd pin and the 4th pin to need to take different positions, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, be unfavorable for the technical problem of the development of electronics miniaturization.
By being transparent printed circuit board (PCB) or flexible PCB by described first circuit board, described tertiary circuit plate is flexible PCB, described first pin is observed in the direction made it possible to from first circuit board to tertiary circuit plate and second circuit board, whether described first anisotropic conductive film, described 3rd pin align, and whether the 4th pin, described second anisotropic conductive film and described second pin align.
By the high temperature resistant temperature of described first anisotropic conductive film is set to be greater than described second anisotropic conductive film, make when from first circuit board to the heating of the direction of tertiary circuit plate and second circuit board, can ensure that described first anisotropic conductive film and the heating of the second anisotropic conductive film make binder solidify, keep conducting state.
By being transparent printed circuit board (PCB) or flexible PCB by described second circuit board, described tertiary circuit plate is flexible PCB, whether the direction made it possible to from second circuit board to tertiary circuit plate and first circuit board is observed described second pin, described second anisotropic conductive film and the 4th pin and is alignd, and whether described 3rd pin, described first anisotropic conductive film and described first pin be corresponding.
By the high temperature resistant temperature of described second anisotropic conductive film is set to be greater than described first anisotropic conductive film, make when from second circuit board to the heating of the direction of tertiary circuit plate and first circuit board, can ensure that described first anisotropic conductive film and the heating of the second anisotropic conductive film make binder solidify, keep conducting state.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the structural representation of the application one better embodiment electronic equipment;
Fig. 2 is the structural representation of another better embodiment electronic equipment of the application;
Fig. 3 is the flow chart of the application's another better embodiment circuit board method of attachment.
Embodiment
The embodiment of the present application is by providing a kind of electronic equipment and circuit board method of attachment, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, is unfavorable for the technical problem of the development of electronics miniaturization.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of electronic equipment, described electronic equipment comprises first circuit board, second circuit board, tertiary circuit plate, the first anisotropic conductive film and the second anisotropic conductive film, and described first circuit board comprises the first pin; Described second circuit board comprises the second pin; Described tertiary circuit plate is arranged between described first circuit board and described second circuit board, and described tertiary circuit plate is provided with the 3rd pin and four pin corresponding and opposing with described 3rd Pin locations; Described first anisotropic conductive film is arranged between described first pin and described 3rd pin, for being electrically connected described first pin and the 3rd pin; With described second anisotropic conductive film is arranged between described second pin and described 4th pin, for being electrically connected described second pin and described 4th pin.
A kind of circuit board method of attachment, described method comprises:
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, be oppositely arranged by 4th pin of the second pin of second circuit board and tertiary circuit plate, described 3rd pin is corresponding with described 4th Pin locations and be opposingly arranged on described tertiary circuit plate;
Between described first pin and described 3rd pin, place described first anisotropic conductive film, between described second pin and described 4th pin, place the second anisotropic conductive film;
First circuit board, described first anisotropic conductive film, described tertiary circuit plate, described second anisotropic conductive film and described second circuit board described in hot pressing, described first pin and described 3rd pin are electrically connected, and described second pin and described 4th pin are electrically connected.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
Embodiment one
As shown in Figure 1, be the structural representation of the application one better embodiment electronic equipment 100.Described electronic equipment 100 can be any equipment comprising circuit board such as computer, mobile phone, TV, refrigerator, air-conditioning, server.Described electronic equipment 100 comprises first circuit board 10, second circuit board 20, tertiary circuit plate 30, first anisotropic conductive film 40 and the second anisotropic conductive film 50.
Described first circuit board 10 comprises the first pin 11.
Described second circuit board 20 comprises the second pin 22.
Described tertiary circuit plate 30 is arranged between described first circuit board 10 and described second circuit board 20, and described tertiary circuit plate 30 is provided with the 3rd pin 33 and four pin 34 corresponding and opposing with described 3rd pin 33 position.
Particularly, described first pin 11, second pin 22, the 3rd pin 33 and the 4th pin 34 can be copper-plated pin, also can be gold-plated pin, can also for the pin of aluminizing.
Described first anisotropic conductive film 40 is arranged between described first pin 11 and described 3rd pin 33, for being electrically connected described first pin 11 and the 3rd pin 33.
Described second anisotropic conductive film 50 is arranged between described second pin 22 and described 4th pin 34, for being electrically connected described second pin 22 and described 4th pin 34.
Anisotropic conductive film, English full name is Anisotropic Conductive Film, is called for short ACF.The feature of anisotropic conductive is: the resistance characteristic of Z axis electrically conducting direction and XY insulating planar has obvious otherness.After the difference of Z axis conduction resistance value and XY planar insulative resistance value exceedes certain ratio, both can be described as good conduction anisotropy.The conducting principle of anisotropic conductive is: the electrode utilizing conducting particles to connect between the device needing electrical connection makes it to become conducting, can avoid again conducting short circuit between adjacent two electrodes simultaneously, and reach only in the object of Z-direction conducting.
Above-mentioned electronic equipment 100 is electrically connected described first pin 11 and the 3rd pin 33 by described first anisotropic conductive film 40, can carry out transfer of data to make described first circuit board 10 and described tertiary circuit plate 30; Be electrically connected described second pin 22 and described four pin 34 corresponding and opposing with described 3rd pin 33 position by described second anisotropic conductive film 50, can transfer of data be carried out to make described second circuit board 20 and described tertiary circuit plate 30.
Above-mentioned electronic equipment 100 by arranging the 3rd pin 33 and four pin 34 corresponding and opposing with described 3rd pin 33 position on described tertiary circuit plate 30, and be electrically connected described first pin 11 and the 3rd pin 33 by described first anisotropic conductive film 40, described second pin 22 and described 4th pin 34 is electrically connected by described second anisotropic conductive film 50, thus avoid described 3rd pin 33 and the 4th pin 34 to need to take different positions, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, be unfavorable for the technical problem of the development of electronics miniaturization.
Described first pin 11 and the 3rd pin 33 is electrically connected at described first anisotropic conductive film 40 of use, when described second anisotropic conductive film 50 is electrically connected described second pin 22 and described 4th pin 34, usually need to carry out hot pressing, conducting particles dielectric film in described anisotropic conductive film is broken, and having the portion extrusion of circuit together mutually, form conducting, heating makes binder solidify, and keeps conducting state.
Existing heating and pressurization are carried out from same direction usually, as pressed down from first circuit board 11 to the direction of tertiary circuit plate 30 and second circuit board 20 and heat, or the direction from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 is pressed and heating, therefore, require that described first anisotropic conductive film 40 is different with the high temperature resistant temperature of described second anisotropic conductive film 50.In other embodiments, if heating adopts different directions to heat simultaneously, then can be identical with the high temperature resistant temperature of described second anisotropic conductive film 50 by described first anisotropic conductive film 40.
Particularly, compression aspect how is selected to become key issue.Select below compression aspect Main Basis: select to be convenient to observe described first pin 11, whether described first anisotropic conductive film 40, described 3rd pin 33 align, and the direction whether the 4th pin 34, described second anisotropic conductive film 50 and described second pin 22 align is compression aspect.Therefore, when described compression aspect is the direction from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20, described first circuit board 10 is transparent printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate 30 is flexible PCB.Described second circuit board 20 can be flexible PCB, also can be printed circuit board (PCB).By being transparent printed circuit board (PCB) or flexible PCB by described first circuit board 10, described tertiary circuit plate 30 is flexible PCB, described first pin 11 is observed in the direction made it possible to from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20, whether described first anisotropic conductive film 40, described 3rd pin 33 align, and whether the 4th pin 34, described second anisotropic conductive film 50 and described second pin 22 align.
Particularly, when in described heating direction being also the direction from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20, the high temperature resistant temperature of described first anisotropic conductive film 40 is greater than described second anisotropic conductive film 50.By the high temperature resistant temperature of described first anisotropic conductive film 40 is set to be greater than described second anisotropic conductive film 50, make when from first circuit board 11 to the heating of the direction of tertiary circuit plate 30 and second circuit board 20, can ensure that described first anisotropic conductive film 40 and the heating of the second anisotropic conductive film 50 make binder solidify, keep conducting state.
Particularly, in the present embodiment, described first anisotropic conductive film 40 is made up of the exotic material of 140 degree of-180 degree, and described second anisotropic conductive film 50 is made up of the exotic material of 80 degree of-120 degree.
In other embodiments, when described compression aspect is the direction from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11, described second circuit board 20 is transparent printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate 30 is flexible PCB.Described first circuit board 10 can be flexible PCB, also can be printed circuit board (PCB).By being transparent printed circuit board (PCB) or flexible PCB by described second circuit board 20, described tertiary circuit plate 30 is flexible PCB, whether the direction made it possible to from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 is observed described second pin 22, described second anisotropic conductive film 50 and the 4th pin 34 and is alignd, and whether described 3rd pin 33, described first anisotropic conductive film 40 and described first pin 11 be corresponding.
Particularly, when in described heating direction being also the direction from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11, the high temperature resistant temperature of described second anisotropic conductive film 50 is greater than described first anisotropic conductive film 40.By the high temperature resistant temperature of described second anisotropic conductive film 50 is set to be greater than described first anisotropic conductive film 40, make when from second circuit board 20 to the heating of the direction of tertiary circuit plate 30 and first circuit board 11, can ensure that described first anisotropic conductive film 40 and the heating of the second anisotropic conductive film 50 make binder solidify, keep conducting state.
Particularly, in the present embodiment, described second anisotropic conductive film 50 is made up of the exotic material of 140 degree of-180 degree, and described first anisotropic conductive film 40 is made up of the exotic material of 80 degree of-120 degree.
Above-mentioned electronic equipment 100 by arranging the 3rd pin 33 and four pin 34 corresponding and opposing with described 3rd pin 33 position on described tertiary circuit plate 30, and be electrically connected described first pin 11 and the 3rd pin 33 by described first anisotropic conductive film 40, described second pin 22 and described 4th pin 34 is electrically connected by described second anisotropic conductive film 50, thus avoid described 3rd pin 33 and the 4th pin 34 to need to take different positions, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, be unfavorable for the technical problem of the development of electronics miniaturization.
By being transparent printed circuit board (PCB) or flexible PCB by described first circuit board 10, described tertiary circuit plate 30 is flexible PCB, described first pin 11 is observed in the direction made it possible to from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20, whether described first anisotropic conductive film 40, described 3rd pin 33 align, and whether the 4th pin 34, described second anisotropic conductive film 50 and described second pin 22 align.
By the high temperature resistant temperature of described first anisotropic conductive film 40 is set to be greater than described second anisotropic conductive film 50, make when from first circuit board 11 to the heating of the direction of tertiary circuit plate 30 and second circuit board 20, can ensure that described first anisotropic conductive film 40 and the heating of the second anisotropic conductive film 50 make binder solidify, keep conducting state.
By being transparent printed circuit board (PCB) or flexible PCB by described second circuit board 20, described tertiary circuit plate 30 is flexible PCB, whether the direction made it possible to from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 is observed described second pin 22, described second anisotropic conductive film 50 and the 4th pin 34 and is alignd, and whether described 3rd pin 33, described first anisotropic conductive film 40 and described first pin 11 be corresponding.
By the high temperature resistant temperature of described second anisotropic conductive film 50 is set to be greater than described first anisotropic conductive film 40, make when from second circuit board 20 to the heating of the direction of tertiary circuit plate 30 and first circuit board 11, can ensure that described first anisotropic conductive film 40 and the heating of the second anisotropic conductive film 50 make binder solidify, keep conducting state.
Embodiment two
As shown in Figure 2, be the structural representation of another better embodiment electronic equipment 200 of the application; Electronic equipment 200 is only from the difference of electronic equipment 100: the length of described first anisotropic conductive film 40 and the second anisotropic conductive film 50 is different, described first circuit board 10 is different from the relative position of described tertiary circuit plate 30, and described second circuit board 20 is different from the relative position of described tertiary circuit plate 30.
Particularly, in the present embodiment, the length of described first anisotropic conductive film 40 and the second anisotropic conductive film 50 is greater than the length of described first anisotropic conductive film 40 in embodiment one and the second anisotropic conductive film 50, because the length of described first anisotropic conductive film 40 and the second anisotropic conductive film 50 increases, make described first circuit board 10, relative position between described second circuit board 20 and described tertiary circuit plate 30 can carry out equipment as required, as according to as described in space in electronic equipment 200 carry out as described in first circuit board 10, the position of described second circuit board 20 and described tertiary circuit plate 30 is put.
Embodiment three
As shown in Figure 3, be the flow chart of the application's another better embodiment circuit board method of attachment.Described circuit board method of attachment comprises the following steps:
Step 310,3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, be oppositely arranged by 4th pin of the second pin of second circuit board and tertiary circuit plate, described 3rd pin is corresponding with described 4th Pin locations and phase is arranged on described tertiary circuit plate privately;
Step 320, places described first anisotropic conductive film between described first pin and described 3rd pin, between described second pin and described 4th pin, place the second anisotropic conductive film;
Step 330, first circuit board, described first anisotropic conductive film, described tertiary circuit plate, described second anisotropic conductive film and described second circuit board described in hot pressing, described first pin and described 3rd pin are electrically connected, and described second pin and described 4th pin are electrically connected.
First circuit board described in hot pressing, described first anisotropic conductive film, described tertiary circuit plate, when described second anisotropic conductive film and described second circuit board, if described first circuit board, described first anisotropic conductive film, described tertiary circuit plate, relative position relation between described second anisotropic conductive film and described second circuit board is identical as shown in fig. 1, then, can the first pin 11 described in disposable pressing, described first anisotropic conductive film, described 3rd pin, described 4th pin, described second anisotropic conductive film and described second pin, described first pin and described 3rd pin can be electrically connected, described 4th pin can be electrically connected with described second pin.
At described first circuit board, described first anisotropic conductive film, described tertiary circuit plate, relative position relation between described second anisotropic conductive film and described second circuit board is identical as shown in Figure 2, then, three times can be divided to described first circuit board, described first anisotropic conductive film, described tertiary circuit plate, described second anisotropic conductive film and described second circuit board carry out pressing, namely pressing is carried out to described first pin and described first anisotropic conductive film, to described 3rd pin, described first anisotropic conductive film carries out pressing and described 4th pin carries out pressing, pressing is carried out with to described second pin and described second anisotropic conductive film.
The method of attachment of foregoing circuit plate by arranging the 3rd pin 33 and four pin 34 corresponding and opposing with described 3rd pin 33 position on described tertiary circuit plate 30, and be electrically connected described first pin 11 and the 3rd pin 33 by described first anisotropic conductive film 40, described second pin 22 and described 4th pin 34 is electrically connected by described second anisotropic conductive film 50, thus avoid described 3rd pin 33 and the 4th pin 34 to need to take different positions, to solve in prior art when circuit board needs to be connected with two circuit boards simultaneously, need to arrange connector on two of this circuit board different positions, the size of this circuit board is increased, be unfavorable for the technical problem of the development of electronics miniaturization.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. an electronic equipment, described electronic equipment comprises:
First circuit board, comprises the first pin;
Second circuit board, comprises the second pin;
Tertiary circuit plate, is arranged between described first circuit board and described second circuit board, and described tertiary circuit plate is provided with the 3rd pin and four pin corresponding and opposing with described 3rd Pin locations;
First anisotropic conductive film, is arranged between described first pin and described 3rd pin, for being electrically connected described first pin and the 3rd pin; With
Second anisotropic conductive film, is arranged between described second pin and described 4th pin, for being electrically connected described second pin and described 4th pin.
2. electronic equipment as claimed in claim 1, it is characterized in that, described first anisotropic conductive film is different with the high temperature resistant temperature of described second anisotropic conductive film.
3. electronic equipment as claimed in claim 2, it is characterized in that, described first circuit board is transparent is printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate is flexible PCB, and the high temperature resistant temperature of described first anisotropic conductive film is greater than described second anisotropic conductive film.
4. electronic equipment as claimed in claim 3, is characterized in that, described first anisotropic conductive film is made up of the exotic material of 140 degree of-180 degree.
5. electronic equipment as claimed in claim 3, is characterized in that, described second anisotropic conductive film is made up of the exotic material of 80 degree of-120 degree.
6. electronic equipment as claimed in claim 2, it is characterized in that, described second circuit board is transparent printed circuit board (PCB) or flexible PCB, and described tertiary circuit plate is flexible PCB, and the high temperature resistant temperature of described second anisotropic conductive film is greater than described first anisotropic conductive film.
7. electronic equipment as claimed in claim 6, is characterized in that, described second anisotropic conductive film is made up of the exotic material of 140 degree of-180 degree.
8. electronic equipment as claimed in claim 6, is characterized in that, described first anisotropic conductive film is made up of the exotic material of 80 degree of-120 degree.
9. a circuit board method of attachment, described method comprises:
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, be oppositely arranged by 4th pin of the second pin of second circuit board and tertiary circuit plate, described 3rd pin is corresponding with described 4th Pin locations and be opposingly arranged on described tertiary circuit plate;
Between described first pin and described 3rd pin, place described first anisotropic conductive film, between described second pin and described 4th pin, place the second anisotropic conductive film;
First circuit board, described first anisotropic conductive film, described tertiary circuit plate, described second anisotropic conductive film and described second circuit board described in hot pressing, described first pin and described 3rd pin are electrically connected, and described second pin and described 4th pin are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056895.0A CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056895.0A CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104852172A true CN104852172A (en) | 2015-08-19 |
| CN104852172B CN104852172B (en) | 2017-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410056895.0A Active CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
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| CN (1) | CN104852172B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106909005A (en) * | 2017-04-18 | 2017-06-30 | 武汉华星光电技术有限公司 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
| CN109152208A (en) * | 2018-08-28 | 2019-01-04 | 福建华佳彩有限公司 | A kind of flexible circuit board structure, display screen and electronic equipment |
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| US20110121847A1 (en) * | 2008-06-02 | 2011-05-26 | Advantest Corporation | Probe, electronic device test apparatus, and method of producing the same |
| CN102648667A (en) * | 2009-09-15 | 2012-08-22 | R&D电路股份有限公司 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5574382A (en) * | 1991-09-17 | 1996-11-12 | Japan Synthetic Rubber Co., Ltd. | Inspection electrode unit for printed wiring board |
| US6297652B1 (en) * | 1999-02-24 | 2001-10-02 | Jsr Corporation | Electric resistance measuring apparatus and method for circuit board |
| CN101455131A (en) * | 2006-05-22 | 2009-06-10 | 日本电气株式会社 | Circuit board device, wiring board connecting method, and circuit board module device |
| US20110121847A1 (en) * | 2008-06-02 | 2011-05-26 | Advantest Corporation | Probe, electronic device test apparatus, and method of producing the same |
| CN102648667A (en) * | 2009-09-15 | 2012-08-22 | R&D电路股份有限公司 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106909005A (en) * | 2017-04-18 | 2017-06-30 | 武汉华星光电技术有限公司 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
| CN109152208A (en) * | 2018-08-28 | 2019-01-04 | 福建华佳彩有限公司 | A kind of flexible circuit board structure, display screen and electronic equipment |
| CN109152208B (en) * | 2018-08-28 | 2024-04-12 | 福建华佳彩有限公司 | Flexible circuit board structure, display screen and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN104852172B (en) | 2017-12-29 |
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