CN1786781B - 混合电路板及具有该混合电路板的显示装置 - Google Patents

混合电路板及具有该混合电路板的显示装置 Download PDF

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Publication number
CN1786781B
CN1786781B CN2005101094859A CN200510109485A CN1786781B CN 1786781 B CN1786781 B CN 1786781B CN 2005101094859 A CN2005101094859 A CN 2005101094859A CN 200510109485 A CN200510109485 A CN 200510109485A CN 1786781 B CN1786781 B CN 1786781B
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CN
China
Prior art keywords
circuit board
auxiliary
auxiliary body
hybrid circuit
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005101094859A
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English (en)
Chinese (zh)
Other versions
CN1786781A (zh
Inventor
张铉龙
朴哲珍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1786781A publication Critical patent/CN1786781A/zh
Application granted granted Critical
Publication of CN1786781B publication Critical patent/CN1786781B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2005101094859A 2004-12-09 2005-10-20 混合电路板及具有该混合电路板的显示装置 Expired - Fee Related CN1786781B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020040103611 2004-12-09
KR1020040103611A KR20060064924A (ko) 2004-12-09 2004-12-09 하이브리드 회로기판 및 이를 갖는 표시장치
KR10-2004-0103611 2004-12-09

Publications (2)

Publication Number Publication Date
CN1786781A CN1786781A (zh) 2006-06-14
CN1786781B true CN1786781B (zh) 2011-04-13

Family

ID=36584575

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005101094859A Expired - Fee Related CN1786781B (zh) 2004-12-09 2005-10-20 混合电路板及具有该混合电路板的显示装置

Country Status (5)

Country Link
US (2) US7273379B2 (enExample)
JP (1) JP2006165490A (enExample)
KR (1) KR20060064924A (enExample)
CN (1) CN1786781B (enExample)
TW (1) TWI343768B (enExample)

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US20050190824A1 (en) * 2004-02-26 2005-09-01 Grande Brad L. Method and apparatus for mounting a modem to a carrier assembly
KR101301954B1 (ko) * 2006-06-30 2013-08-30 엘지디스플레이 주식회사 백라이트 유닛 및 이를 포함하는 액정표시장치모듈
KR20080027599A (ko) * 2006-09-25 2008-03-28 삼성전자주식회사 백라이트 어셈블리 및 이를 포함하는 표시 장치
TWI350931B (en) * 2007-09-12 2011-10-21 Au Optronics Corp Backlight structure
US8007286B1 (en) * 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
FR2928066A1 (fr) * 2008-02-27 2009-08-28 Thomson Licensing Sas Systeme d'interconnexion de deux substrats comportant chacun au moins une ligne de transmission
DE102008012443B4 (de) * 2008-03-04 2015-05-21 Ifm Electronic Gmbh Verbindungsanordnung zweier Leiterplatten für einen optischen Näherungsschalter
DE102008001557A1 (de) * 2008-05-05 2009-11-12 Robert Bosch Gmbh Messerleisten-Kontaktierung über Zwischenleiterplatten
US7972143B2 (en) * 2009-02-02 2011-07-05 Tyco Electronics Corporation Printed circuit assembly
JP2011129708A (ja) * 2009-12-17 2011-06-30 Panasonic Electric Works Co Ltd プリント配線板の接続構造
US8289729B2 (en) * 2010-02-26 2012-10-16 Corsair Memory, Inc. PCB interconnect scheme for PSU
CN102340087A (zh) * 2010-07-28 2012-02-01 鸿富锦精密工业（深圳）有限公司 电源转接卡
GB2494919B (en) * 2011-09-23 2015-06-17 Control Tech Ltd Method for connecting printed circuit boards.
WO2013157098A1 (ja) * 2012-04-18 2013-10-24 三菱電機株式会社 ノイズフィルタ装置
CN106465542B (zh) * 2014-05-22 2019-07-05 飞利浦照明控股有限公司 印刷电路板装置和用于将产品安装至主印刷电路板的方法
US10163687B2 (en) * 2015-05-22 2018-12-25 Qualcomm Incorporated System, apparatus, and method for embedding a 3D component with an interconnect structure
US10608359B2 (en) * 2016-12-16 2020-03-31 Samsung Electronics Co., Ltd. Connection structure between flat cable and electronic circuit board
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
WO2018136736A1 (en) * 2017-01-20 2018-07-26 Fci Usa Llc Compact card edge connector
CN109754748B (zh) * 2017-11-03 2021-05-14 上海和辉光电股份有限公司 一种显示面板的驱动电路、显示面板及显示装置
US11266018B2 (en) * 2017-12-08 2022-03-01 Mitsubishi Electric Corporation Printed wiring board and method for manufacturing the same
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
KR102808379B1 (ko) * 2020-05-26 2025-05-16 주식회사 케이엠더블유 Pcb 조립체
DE102020116621A1 (de) * 2020-06-24 2021-12-30 Bayerische Motoren Werke Aktiengesellschaft Telematikvorrichtung und kraftfahrzeug
CN114597707A (zh) 2020-12-04 2022-06-07 安费诺商用电子产品(成都)有限公司 带有锁定系统的卡边缘连接器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455742A (en) * 1994-03-21 1995-10-03 Eaton Corporation Direct circuit board connection
US5629839A (en) * 1995-09-12 1997-05-13 Allen-Bradley Company, Inc. Module interconnect adapter for reduced parasitic inductance
CN1188389A (zh) * 1996-12-25 1998-07-22 佳能株式会社 电路板连接结构

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US2894241A (en) * 1956-03-28 1959-07-07 United Carr Fastener Corp Right-angle printed wire connector
US4513064A (en) * 1982-12-17 1985-04-23 The United States Of America As Represented By The Secretary Of The Army Package for rugged electronics
US5110298A (en) * 1990-07-26 1992-05-05 Motorola, Inc. Solderless interconnect
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
JP3901501B2 (ja) * 2001-12-12 2007-04-04 アルプス電気株式会社 電子回路ユニットの取付構造
JP3090836U (ja) * 2002-06-19 2002-12-26 船井電機株式会社 立ち基板の固定構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455742A (en) * 1994-03-21 1995-10-03 Eaton Corporation Direct circuit board connection
US5629839A (en) * 1995-09-12 1997-05-13 Allen-Bradley Company, Inc. Module interconnect adapter for reduced parasitic inductance
CN1188389A (zh) * 1996-12-25 1998-07-22 佳能株式会社 电路板连接结构

Also Published As

Publication number Publication date
US7419381B2 (en) 2008-09-02
CN1786781A (zh) 2006-06-14
US7273379B2 (en) 2007-09-25
JP2006165490A (ja) 2006-06-22
US20060128174A1 (en) 2006-06-15
TW200635453A (en) 2006-10-01
TWI343768B (en) 2011-06-11
US20070291454A1 (en) 2007-12-20
KR20060064924A (ko) 2006-06-14

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SAMSUNG DISPLAY CO., LTD.

Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD.

Effective date: 20121228

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20121228

Address after: Gyeonggi Do, South Korea

Patentee after: Samsung Display Co., Ltd.

Address before: Gyeonggi Do, South Korea

Patentee before: Samsung Electronics Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20121020