CN1758422A - Optically coupled packaging method for thick film printing circuit - Google Patents
Optically coupled packaging method for thick film printing circuit Download PDFInfo
- Publication number
- CN1758422A CN1758422A CNA2004100804165A CN200410080416A CN1758422A CN 1758422 A CN1758422 A CN 1758422A CN A2004100804165 A CNA2004100804165 A CN A2004100804165A CN 200410080416 A CN200410080416 A CN 200410080416A CN 1758422 A CN1758422 A CN 1758422A
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- glue
- thick film
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- millimeter
- room temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
This invention relates to a package method for a photo coupler used in the thick film printing circuit, which coats three layers of insulation glues on photo coupler bare chips distributed on the thick film printing circuit to package them, the first layer is a transparent glue covering the golden wire and the bare chips on the printing circuit, the solidifying temperature rises to 125 deg. C from room temperature for two hours, then a second layer of scattering glue is coated with the thickness of 0.1-1mm, the solidifying temperature rises to 125deg. C from room temperature for 2 hours, finally the third layer of shading glue is coated with the thickness of 0.1-1mm and the solidifying temperature of 125deg .C for two hours, which provides a new package technology for the thick film circuit.
Description
Technical field
The present invention relates to a kind of optically coupled packaging method that is used for thick-film printed circuit, this method encapsulates single optocoupler with insulating cement, prevents on the thick film circuit interfering with each other between a plurality of optocouplers.
Background technology
Chinese patent 02123191 discloses a kind of semiconductor package part and method for making thereof, this packaging part has a lead frame, this lead frame is made of some pins at least, form the convex section of a thickness on this pin less than pin, on this convex section first surface pre-defined go out on a gold thread welding region and the convex section opposing second surface to plant in order to the welding block that provides many conductive components to connect to establish connect the zone and misplace and separate; The lead frame that is loaded with a plurality of chips and this conductive component is moved into when implementing routing in the anchor clamps, since this welding block plant connect the zone with this gold thread welding region be separated by very far away, therefore the downward pressure that produces during the bonding wire crimping can be avoided planting of conductive component fully and connect the position, in case assembly pressurized rhegma; Relatively, this gold thread welding region also can be away from the operating environment of conductive component, avoids the solution stained pin preplating surface of using in the operation and influences the welding quality of gold thread.This encapsulation can provide machinery and environmental protection to internal circuit; but when a plurality of optical-coupling bare chips in the thick film circuit are carried out single encapsulation; should control the size of optocoupler transfer ratio; prevent again that the encapsulating material stress is excessive and spun gold is broken; also to prevent in the encapsulating shell on the thick film circuit interfering with each other between a plurality of optocouplers; existing encapsulation technology can't satisfy above-mentioned requirements, therefore, need to propose a kind of optically coupled packaging method of new thick-film printed circuit.
Summary of the invention
The object of the present invention is to provide a kind of optically coupled packaging method that is used for thick-film printed circuit, this method can solve in the encapsulating shell on the thick film circuit interfering with each other between a plurality of optocouplers, and can provide machinery and environmental protection to internal circuit.
The objective of the invention is to be realized by following technical proposals: a kind of optically coupled packaging method that is used for thick-film printed circuit is characterized in that: use coating method to encapsulate the optical-coupling bare chip that is distributed on the thick-film printed circuit with three-layer insulated glue; Ground floor is a transparent adhesive tape, cover spun gold and optical-coupling bare chip on the printed circuit, curing temperature begins to be warming up to gradually 125 ℃ from room temperature, be 2 hours curing time, apply second layer scattering glue then, the thickness of described scattering glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time; Apply the 3rd layer of shading glue at last, the thickness of described shading glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time.
The invention has the beneficial effects as follows,, solved in the encapsulating shell on the thick film circuit difficult problem interfering with each other between a plurality of optocouplers, and can prevent from spun gold to be broken because of the stress of encapsulating material is excessive for thick film circuit provides a kind of new encapsulation technology.Process stabilizing of the present invention is fit to produce in batches, has reduced material cost.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the optocoupler encapsulation cross section view on the thick-film printed circuit
Embodiment
Embodiment one:
Referring to Fig. 1, a kind of optically coupled packaging method that is used for thick-film printed circuit uses coating method to encapsulate a plurality of optical-coupling bare chips that are distributed on the thick-film printed circuit with three-layer insulated glue; Ground floor is a transparent adhesive tape 5, cover spun gold 2 and optical-coupling bare chip 1 on the printed circuit, curing temperature begins to be warming up to gradually 125 ℃ from room temperature, be 2 hours curing time, apply second layer scattering glue 4 then, the thickness of described scattering glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time; Apply the 3rd layer of shading glue 3 at last, the thickness of described shading glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time.
In the present embodiment, can control the size of optocoupler transfer ratio by the thickness of adjusting transparent adhesive tape, and can raise the efficiency, and not influence the stress of three layers of glue spun gold by curing temperature and the curing time of adjusting three layers of glue.Can adopt the coating method of manual brushing in the present embodiment, also can adopt the coating method of spraying.The thickness of ground floor glue can adopt thicker coating, is mainly used in spun gold on the printed circuit and optical-coupling bare chip are covered, and its thickness is usually between the 0.5-2 millimeter.Described transparent adhesive tape is a kind of organogel, and its model is GN521.Described scattering glue is formed by weight configuration by following material: MgO: TiO
2: transparent adhesive tape=1: 1: 3.Described shading glue is formed by weight configuration by following material: powdered carbon: transparent adhesive tape=1: 4.In the present embodiment, the environmental condition of encapsulation is: purify grade: 100000 grades, and temperature: 25 ℃ ± 10 ℃, humidity: 45-75%.
Claims (1)
1, a kind of optically coupled packaging method that is used for thick-film printed circuit is characterized in that:
Use coating method to encapsulate the optical-coupling bare chip that is distributed on the thick-film printed circuit with three-layer insulated glue; Ground floor is a transparent adhesive tape, cover spun gold and optical-coupling bare chip on the printed circuit, curing temperature begins to be warming up to gradually 125 ℃ from room temperature, be 2 hours curing time, apply second layer scattering glue then, the thickness of described scattering glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time; Apply the 3rd layer of shading glue at last, the thickness of described shading glue is 0.1 millimeter-1 millimeter, and curing temperature begins to be warming up to gradually 125 ℃ from room temperature, and be 2 hours curing time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100804165A CN1758422A (en) | 2004-10-09 | 2004-10-09 | Optically coupled packaging method for thick film printing circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100804165A CN1758422A (en) | 2004-10-09 | 2004-10-09 | Optically coupled packaging method for thick film printing circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1758422A true CN1758422A (en) | 2006-04-12 |
Family
ID=36703705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100804165A Pending CN1758422A (en) | 2004-10-09 | 2004-10-09 | Optically coupled packaging method for thick film printing circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1758422A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339764A (en) * | 2011-06-04 | 2012-02-01 | 湖北东光电子股份有限公司 | Thick-film hybrid integrated circuit surface enveloping process |
| CN103760881A (en) * | 2014-02-20 | 2014-04-30 | 北京七星华创电子股份有限公司 | Method and system for monitoring and managing use condition of materials |
| CN104282698A (en) * | 2013-07-08 | 2015-01-14 | 胜开科技股份有限公司 | Two-stage packaging method for image sensor |
-
2004
- 2004-10-09 CN CNA2004100804165A patent/CN1758422A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339764A (en) * | 2011-06-04 | 2012-02-01 | 湖北东光电子股份有限公司 | Thick-film hybrid integrated circuit surface enveloping process |
| CN102339764B (en) * | 2011-06-04 | 2013-03-20 | 湖北东光电子股份有限公司 | Thick-film hybrid integrated circuit surface enveloping process |
| CN104282698A (en) * | 2013-07-08 | 2015-01-14 | 胜开科技股份有限公司 | Two-stage packaging method for image sensor |
| CN104282698B (en) * | 2013-07-08 | 2017-10-20 | 胜丽国际股份有限公司 | Two-stage packaging method for image sensor |
| CN103760881A (en) * | 2014-02-20 | 2014-04-30 | 北京七星华创电子股份有限公司 | Method and system for monitoring and managing use condition of materials |
| CN103760881B (en) * | 2014-02-20 | 2016-01-27 | 北京七星华创电子股份有限公司 | A kind of method for managing and monitoring of material service condition and system |
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