CN103760881A - Method and system for monitoring and managing use condition of materials - Google Patents
Method and system for monitoring and managing use condition of materials Download PDFInfo
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- CN103760881A CN103760881A CN201410058284.XA CN201410058284A CN103760881A CN 103760881 A CN103760881 A CN 103760881A CN 201410058284 A CN201410058284 A CN 201410058284A CN 103760881 A CN103760881 A CN 103760881A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
The invention provides a method and system for monitoring and managing the use condition of materials. The method includes the steps that a material management record standard configuration file is set and acquired; a record file for recording each material in each wafer loader participating in the technological process is set, and the record files are relevant to a device state record file and change according to the change of parameters of device state files. After each process, the record files for recording the values of the number of use times and the values of film thicknesses of the materials in the wafer loaders are accumulated and updated through an iteration method, whether the parameters of the updated record files reach or exceed corresponding configuration items in the configuration file are compared and judged, and if yes, alarms are output and corresponding processing is executed. The method and system are suitable for the control design of a SEMI standard semiconductor device, and accuracy of management records of the materials, update real-time performance and notification accuracy can be guaranteed.
Description
Technical field
The present invention relates to semiconductor equipment factory automation (Factory Automation) technical field, more particularly, relate to a kind of method for managing and monitoring and system of material service condition.
Background technology
The factory automation monitoring management function (Factory Automation) of semiconductor equipment is very important function of semiconductor equipment, is also the key point that semiconductor equipment adds plant produced line.The quality of management accuracy directly has influence on the height of the qualification rate of silicon chip (material).
Specifically, the handling of goods and materials of material equipment, relates to the service condition that records material, according to the service condition of technique real-time update material, after reaching restriction, how to notify main frame, the management of material not only requires accuracy, the real-time of renewal and the accuracy of notice of record.
Factory automation has very strict limitation standard to the service condition of material, and these standard conditions occur when abnormal, also can produce larger harm to equipment and product.
Those skilled in the art know that, in field of semiconductor manufacture, wafer has Four types, is respectively to accompany sheet (Dummy), the special sheet (ExtraDummy) of accompanying, product sheet (Product) and detection lug (Monitor).Dummy and ExtraDummy have the restriction of access times and accumulation thickness, and Product and Monitor can only be used once and can not repeatedly use, so the material management method of invention is for Dummy and ExtraDummy.
Accompanying sheet (Dummy) and special material of accompanying sheet (ExtraDummy) type is for monitoring process parameter, accompanies sheet to be also referred to as control wafer, can reuse, but control wafer has certain access times, after exceeding, just should scrap or demote and do the control wafer of other techniques.Therefore,, when the access times of the material of Dummy and ExtraDummy type or accumulation thickness reach maximum constraints, the main frame on notice production line, stops in time this material and participates in technique and transport out equipment in time.
But, access times or the monitoring management of accumulation thickness of the Dummy that current industry is more common and the material of ExtraDummy type, or take artificial or semi-artificially record monitoring management as main, there are the following problems grasping in time and exactly aspect the use current state of material for it:
1., due to the impact of artificial factor, can make the comprehensive and accurate property of record data bring error;
2., the renewal of data has certain delay.
3., power-off restarting or software systems are when restart, and can not keep the service condition record of material.
Summary of the invention
The object of the present invention is to provide a kind of method for managing and monitoring to material service condition, it is set to access times (Usage Count) or accumulation thickness (Accumulate Thickness), is adopted and record the method that XML file structure designs, material service condition is upgraded of material service condition and trigger and use method and the event design of transfiniting by configuration file, realizes the management method that a kind of material with accuracy, renewal real-time and notice accuracy is used.
For achieving the above object, technical scheme of the present invention is as follows:
A method for managing and monitoring for material service condition, described method comprises:
Step S1: arrange and obtain handling of goods and materials record standard configuration file, wherein, the configuration item of described configuration file comprises the access times standard of material and the accumulative total Film thickness standard of material;
Step S2: be provided for record and participate in each wafer carrying device of this technological process and the log file of each parameter of materials thereof, wherein, the parameter of log file comprises type, the access times of material and the accumulation thickness of material of the title of material, material; Described log file is associated with equipment state log file and changes according to the variation of equipment state file parameters;
Step S3: after each technique completes, the management of material is take the access times of wafer carrying device and thickness as benchmark, use the method for iteration to travel through access times and the accumulation thickness of all materials in wafer carrying device, obtain maximum access times and the cumulative maximum thickness of material in this wafer carrying device, be access times and the thickness of wafer carrying device, and the accumulative total that the access times value to each wafer carrying device and each material thereof and film thickness value carry out log file is upgraded; Wherein, the access times of wafer carrying device equal the maximum access times of all materials that comprise in wafer carrying device, and in like manner the thickness of wafer carrying device equals the cumulative maximum thickness of all materials that comprise in wafer carrying device;
Step S4: compare and judge whether the log file parameter of upgrading rear wafer carrying device reaches or exceed corresponding configuration item in described configuration file, if so, the corresponding processing of output alarm execution; If not, continue execution step S3.
Preferably, described material is in each carrier, to accompany sheet and/or the special sheet of accompanying, the configuration item of described configuration file to comprise to accompany the maximum access times value of sheet, the special maximum access times value of sheet, the largest cumulative film thickness value of accompanying sheet and/or the special largest cumulative film thickness value of accompanying sheet of accompanying.
Preferably, described step S3 specifically comprises the steps:
Step S31: take carrier as judging unit, determine the maximum access times of all materials in each carrier, travel through and use the access times of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32: if wherein the access times of certain material are greater than its maximum access times, the maximum access times of this carrier equal the access times of this material, until after completeer last material, the access times of carrier are determined by the maximum access times that obtain material.
Preferably, described step 4 specifically comprises: start and read configuration file, in technique, finish to have upgraded after material service condition, read the maximum access times of material in configuration item, then, judge whether the access times of carrier exceed the maximum access times of setting, if go beyond the scope trigger event the warning message of dishing out.
Preferably, described step S3 specifically comprises the steps:
Step S31 ': take carrier as judging unit, determine the largest cumulative film thickness value of all materials in each carrier, travel through and use the accumulative total film thickness value of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32 ': if wherein the accumulative total film thickness value of certain material is greater than its largest cumulative film thickness value, the maximum access times of this carrier equal the accumulative total film thickness value of this material, until after completeer last material, the accumulative total film thickness value of carrier is determined by the largest cumulative film thickness value that obtains material.
Preferably, described step 4 specifically comprises: start and read configuration file, in technique, finish to have upgraded after material service condition, read the largest cumulative film thickness value of material in configuration item, then, judge whether the accumulative total film thickness value of carrier exceeds the largest cumulative film thickness value of setting, if go beyond the scope trigger event the warning message of dishing out.
For achieving the above object, technical scheme of the present invention also comprises as follows:
A monitoring management system for material service condition, described system comprises: material service condition log file, it is associated with equipment state log file by data linkage unit; Also comprise material situation recording configuration unit, control unit, processing unit and warning limiting unit; After each technique completes, access times value and the film thickness value of the method for described control unit controlled processing unit use iteration to each material in each wafer carrying device carries out the accumulative total renewal of log file, compare and judge whether the log file parameter of upgrading rear wafer carrying device reaches or exceed corresponding configuration item in described configuration file, and by described warning limiting unit output alarm the corresponding processing of execution.
Preferably, described control unit, processing unit and warning consist of frame structure; Wherein, slave computer is Programmable Logic Controller.
From technique scheme, can find out, method for managing and monitoring and the system of a kind of material service condition of the present invention, it mainly contains following four part compositions, is respectively administrative standard configuration, material service condition record, material service condition is upgraded and is exceeded restriction trigger event.The present invention, for meeting the semiconductor equipment Software for Design of SEMI standard, can guarantee accuracy, the real-time of renewal and the accuracy of notice of the management accounts of material.
Accompanying drawing explanation
Fig. 1 is the structural representation of monitoring management system one preferred embodiment of material service condition of the present invention
Fig. 2 is the schematic flow sheet of method for managing and monitoring one preferred embodiment of material service condition of the present invention
Fig. 3 is that in the embodiment of the present invention, user's configuration arranges structural drawing
Fig. 4 is material service condition interrecord structure figure in the embodiment of the present invention
Fig. 5 is that in the embodiment of the present invention, material service condition is upgraded process flow diagram
Fig. 6 is event StockerManagerEventArgs class formation figure in the embodiment of the present invention
Embodiment
Below in conjunction with accompanying drawing 1-6, the specific embodiment of the present invention is described in further detail.
Refer to Fig. 1, Fig. 1 is the structural representation of monitoring management system one preferred embodiment of material service condition of the present invention.As shown in the figure, this system comprises: material service condition log file, and it is associated with equipment state log file by data linkage unit; Also comprise material situation recording configuration unit, control unit, processing unit and warning limiting unit; After each technique completes, access times value and the film thickness value of the method for control unit controlled processing unit use iteration to each wafer carrying device and each material thereof carries out the accumulative total renewal of log file, compare and judge whether the log file parameter of upgrading rear wafer carrying device reaches or exceed corresponding configuration item in configuration file, and by warning limiting unit output alarm the corresponding processing of execution.
It should be noted that, in said system, module or unit can be by the realizations that combines of hardware, software or software and hardware, and in the present embodiment, said units consists of host computer+slave computer framework; Wherein, slave computer is Programmable Logic Controller (Programmable Logic Device is called for short PLD).
Refer to Fig. 2, Fig. 2 is the schematic flow sheet of method for managing and monitoring one preferred embodiment of material service condition of the present invention.As shown in the figure, the method can specifically comprise the steps:
Step S1: arrange and obtain handling of goods and materials record standard configuration file, wherein, the configuration item of configuration file comprises the access times standard of material and the accumulative total Film thickness standard of material.
Wherein, this material can be for accompanying sheet (Dummy) and/or the special sheet (ExtraDummy) of accompanying in each carrier (Carrier), at this moment, the configuration item of configuration file comprises and accompanies the maximum access times value of sheet, the special maximum access times value of sheet, the largest cumulative film thickness value of accompanying sheet and/or the special largest cumulative film thickness value of accompanying sheet of accompanying.In the present embodiment, mounting software in host computer, can add user's config option, by choosing configuration file, user can choice for use number of times (Usage Count) or accumulation thickness (Accumulate Thickness) as the administrative standard of material service condition.
Refer to Fig. 3 and Fig. 4, Fig. 3 is that in the embodiment of the present invention, user's configuration arranges structural drawing; Fig. 4 is material service condition interrecord structure figure in the embodiment of the present invention.That is to say, CarrierCompleteOption option is set, for selecting the record standard of handling of goods and materials, UsageCount represents take material access times as administrative standard, and AccuThickness is the accumulation thickness of material.MaxUsageCountForDummy and MaxUsageCountForED represent the maximum access times of Dummy and ExtraDummy, and MaxAccuThicknessForDummy and MaxAccuThicknessForED represent the cumulative maximum thickness of Dummy and ExtraDummy.These parameters are all recorded in relevant XML file, and user can modify at any time according to the requirement of the actual conditions of equipment and factory.
After having configured, special XML file just can be set for recording the service condition of each material, the equipment state log file of this log file and software systems is associated, and changes according to the variation of equipment state file.The parameter of the log file record of material service condition comprises the title of material, the type of material, the accumulation thickness of the access times of material and material.Carry out:
Step S2: be provided for record and participate in each wafer carrying device of this technological process and the log file of each parameter of materials thereof, wherein, the parameter of log file comprises type, the access times of material and the accumulation thickness of material of the title of material, material; Described log file is associated with equipment state log file and changes according to the variation of equipment state file parameters.
Above-mentioned configuration file can be read in system process start-up course, and the log file of recording material service condition after technique completes is updated, and comprises access times and accumulation thickness.Carry out:
Step S3: after each technique completes, the management of material is take the access times of wafer carrying device and thickness as benchmark, use the method for iteration to travel through access times and the accumulation thickness of all materials in wafer carrying device, obtain maximum access times and the cumulative maximum thickness of material in this wafer carrying device, be access times and the thickness of wafer carrying device, use the method for iteration and to each wafer carrying device and the accumulative total that wherein the access times value of each material and film thickness value carry out log file upgrade; Wherein, the access times of wafer carrying device equal the maximum access times of all materials that comprise in wafer carrying device, and in like manner the thickness of wafer carrying device equals the cumulative maximum thickness of all materials that comprise in wafer carrying device.
Particularly, below, we divide the access times of material and two kinds of situations of accumulation thickness to describe.Refer to Fig. 5, Fig. 5 is that in the embodiment of the present invention, material service condition is upgraded process flow diagram.
As shown in the figure, for carrier (Carrier), its access times equal all sheet and special maximum access times of accompanying sheet of accompanying in Carrier, and renewal can adopt the method for iteration.First, sheet and the special maximum access times of sheet of accompanying are accompanied in definition, then travel through all sheet and special access times of accompanying sheet of accompanying in Carrier, if access times are greater than maximum access times, maximum access times equal this access times, by that analogy, and completeer last accompany sheet and special accompanying after sheet, obtain and accompany sheet and special maximum access times of accompanying sheet, be the access times of Carrier.Similarly, the accumulation thickness of material also can adopt similar method to obtain.
embodiment 1:
In the present embodiment step S3, the accumulative total of using the method for iteration to carry out log file to the access times value of each material in each wafer carrying device is upgraded and can specifically be comprised the steps:
Step S31: take carrier as judging unit, determine the maximum access times of all materials in each carrier, travel through and use the access times of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32: if wherein the access times of certain material are greater than its maximum access times, the maximum access times of this carrier equal the access times of this material, until after completeer last material, the access times of carrier are determined by the maximum access times that obtain material.
embodiment 2:
In the present embodiment step S3, the accumulative total of using the method for iteration to carry out log file to the accumulative total film thickness value of each material in each wafer carrying device is upgraded and can specifically be comprised the steps:
Step S31 ': take carrier as judging unit, determine the largest cumulative film thickness value of all materials in each carrier, travel through and use the accumulative total film thickness value of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32 ': if wherein the accumulative total film thickness value of certain material is greater than its largest cumulative film thickness value, the maximum access times of this carrier equal the accumulative total film thickness value of this material, until after completeer last material, the accumulative total film thickness value of carrier is determined by the largest cumulative film thickness value that obtains material.
Next, refer in conjunction with Fig. 6 and consult Fig. 2, Fig. 6 is event StockerManagerEventArgs class formation figure in the embodiment of the present invention.
Step S4: compare and judge whether the log file parameter of upgrading rear wafer carrying device reaches or exceed corresponding configuration item in described configuration file, if so, the corresponding processing of output alarm execution; If not, continue execution step S3.
Particularly, if what user selected is that material access times (UsageCount) judge, can after finishing to have upgraded material service condition, technique read the maximum access times that user arranges, then, judge whether the access times UsageCount of carrier exceeds the maximum access times of setting, the trigger event StockerManagerEventArgs if gone beyond the scope, transmits carrier identifier parameter (CarrierID), and the user interface of reporting to the police of dishing out.
If user selects the thick Accumulate Thickness of material built up film, after technique finishes, whether the accumulative total thickness Accumulate Thickness that judges carrier goes beyond the scope, if transfinited, same trigger event StockerManagerEventArgs, transmit carrier identifier parameter (CarrierID), and the user interface of reporting to the police of dishing out.
Above-described is only the preferred embodiments of the present invention; described embodiment is not in order to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization instructions of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.
Claims (8)
1. a method for managing and monitoring for material service condition, is characterized in that, described method comprises:
Step S1: arrange and obtain handling of goods and materials record standard configuration file, wherein, the configuration item of described configuration file comprises the access times standard of material and the accumulative total Film thickness standard of material;
Step S2: be provided for record and participate in each wafer carrying device of this technological process and the log file of each parameter of materials thereof, wherein, the parameter of log file comprises type, the access times of material and the accumulation thickness of material of the title of material, material; Described log file is associated with equipment state log file and changes according to the variation of equipment state file parameters;
Step S3: after each technique completes, the management of material is take the access times of wafer carrying device and thickness as benchmark, use the method for iteration to travel through access times and the accumulation thickness of all materials in wafer carrying device, obtain maximum access times and the cumulative maximum thickness of material in this wafer carrying device, determine that these maximum access times and cumulative maximum thickness are access times and the thickness of wafer carrying device, and the accumulative total that the access times value to each wafer carrying device and each material thereof and film thickness value carry out log file is upgraded; Wherein, the access times of wafer carrying device equal the maximum access times of all materials that comprise in wafer carrying device, and in like manner, the thickness of wafer carrying device equals the cumulative maximum thickness of all materials that comprise in wafer carrying device;
Step S4: compare and judge whether the wafer carrying device log file parameter after upgrading reaches or exceed corresponding configuration item in described configuration file, and if so, output alarm is also carried out accordingly and processed; If not, continue execution step S3.
2. method for managing and monitoring as claimed in claim 1, it is characterized in that, described material is in each carrier, to accompany sheet and/or the special sheet of accompanying, the configuration item of described configuration file to comprise to accompany the maximum access times value of sheet, the special maximum access times value of sheet, the largest cumulative film thickness value of accompanying sheet and/or the special largest cumulative film thickness value of accompanying sheet of accompanying.
3. method for managing and monitoring as claimed in claim 1 or 2, is characterized in that, described step S3 specifically comprises the steps:
Step S31: take carrier as judging unit, determine the maximum access times of all materials in each carrier, travel through and use the access times of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32: if wherein the access times of certain material are greater than its maximum access times, the maximum access times of this carrier equal the access times of this material, until after completeer last material, the access times of carrier are determined by the maximum access times that obtain material.
4. method for managing and monitoring as claimed in claim 3, it is characterized in that, described step 4 specifically comprises: start and read configuration file, in technique, finish to have upgraded after material service condition, read the maximum access times of material in configuration item, then, judge whether the access times of carrier exceed the maximum access times of setting, if go beyond the scope trigger event the warning message of dishing out.
5. method for managing and monitoring as claimed in claim 1 or 2, is characterized in that, described step S3 specifically comprises the steps:
Step S31 ': take carrier as judging unit, determine the largest cumulative film thickness value of all materials in each carrier, travel through and use the accumulative total film thickness value of all materials in each carrier that the method accumulative total of iteration is associated with current device state recording file;
Step S32 ': if wherein the accumulative total film thickness value of certain material is greater than its largest cumulative film thickness value, the maximum access times of this carrier equal the accumulative total film thickness value of this material, until after completeer last material, the accumulative total film thickness value of carrier is determined by the largest cumulative film thickness value that obtains material.
6. method for managing and monitoring as claimed in claim 5, it is characterized in that, described step 4 specifically comprises: start and read configuration file, in technique, finish to have upgraded after material service condition, read the largest cumulative film thickness value of material in configuration item, then, judge whether the accumulative total film thickness value of carrier exceeds the largest cumulative film thickness value of setting, if go beyond the scope trigger event the warning message of dishing out.
7. a monitoring management system that adopts method described in claim 1, is characterized in that: described system comprises: material service condition log file, and it is associated with equipment state log file by data linkage unit; Also comprise material situation recording configuration unit, control unit, processing unit and warning limiting unit; After each technique completes, access times value and the film thickness value of the method for described control unit controlled processing unit use iteration to each wafer carrying device and each material thereof carries out the accumulative total renewal of log file, compare and judge whether the wafer carrying device log file parameter after upgrading reaches or exceed corresponding configuration item in described configuration file, and processing accordingly by described warning limiting unit output alarm execution.
8. monitoring management system as claimed in claim 7, is characterized in that, described control unit, processing unit and warning consist of host computer+slave computer framework; Wherein, slave computer is Programmable Logic Controller.
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| TR01 | Transfer of patent right |
Effective date of registration: 20180111 Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |