CN1739202B - 光发射器件 - Google Patents
光发射器件 Download PDFInfo
- Publication number
- CN1739202B CN1739202B CN2003801086175A CN200380108617A CN1739202B CN 1739202 B CN1739202 B CN 1739202B CN 2003801086175 A CN2003801086175 A CN 2003801086175A CN 200380108617 A CN200380108617 A CN 200380108617A CN 1739202 B CN1739202 B CN 1739202B
- Authority
- CN
- China
- Prior art keywords
- light
- electroluminescent cell
- optical element
- light emitting
- partially transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 126
- 238000009826 distribution Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 44
- 238000007493 shaping process Methods 0.000 claims description 19
- 238000013461 design Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 230000008901 benefit Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000014509 gene expression Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 230000001195 anabolic effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
- G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
- G02B5/1885—Arranged as a periodic array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02405977.6 | 2002-11-13 | ||
EP02405977A EP1420462A1 (en) | 2002-11-13 | 2002-11-13 | Light emitting device |
PCT/CH2003/000721 WO2004044995A1 (en) | 2002-11-13 | 2003-11-04 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1739202A CN1739202A (zh) | 2006-02-22 |
CN1739202B true CN1739202B (zh) | 2010-06-09 |
Family
ID=32116357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2003801086175A Expired - Lifetime CN1739202B (zh) | 2002-11-13 | 2003-11-04 | 光发射器件 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8487519B2 (zh) |
EP (3) | EP1420462A1 (zh) |
JP (1) | JP4478028B2 (zh) |
CN (1) | CN1739202B (zh) |
AT (1) | ATE362658T1 (zh) |
AU (1) | AU2003273712A1 (zh) |
DE (1) | DE60313884T2 (zh) |
HK (1) | HK1087246A1 (zh) |
TW (1) | TWI333697B (zh) |
WO (1) | WO2004044995A1 (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005034523A1 (en) * | 2003-04-16 | 2005-04-14 | Upstream Engineering Oy | 2d/3d data projector |
EP1622205A3 (en) * | 2004-07-29 | 2006-02-08 | Schott AG | Electronic package incorporating electronic components generating and/or receiving light-based signals |
CN100521266C (zh) | 2004-08-06 | 2009-07-29 | 皇家飞利浦电子股份有限公司 | Led灯系统 |
DE102005028748A1 (de) * | 2004-10-25 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse |
ATE442671T1 (de) * | 2005-03-10 | 2009-09-15 | Nanogate Advanced Materials Gmbh | Leuchtiode |
EP1715521B1 (en) * | 2005-04-21 | 2012-02-22 | C.R.F. Società Consortile per Azioni | Use of a transparent display having light-emitting diodes (LED) in a motor vehicle |
WO2006123917A1 (en) * | 2005-05-20 | 2006-11-23 | Luxpia Co., Ltd. | Light emitting diode package having a reflector cup by metal thin film and its manufacturing method |
WO2006126809A1 (en) * | 2005-05-26 | 2006-11-30 | Luxpia Co., Ltd. | Very small light emitting diode package and manufacturing methods of it |
DE102005026206A1 (de) | 2005-06-07 | 2006-12-14 | Siemens Ag | Lichterzeugende Anordnung |
JP4449837B2 (ja) * | 2005-06-27 | 2010-04-14 | パナソニック電工株式会社 | 発光装置 |
WO2007031929A1 (en) * | 2005-09-16 | 2007-03-22 | Koninklijke Philips Electronics N.V. | Method for manufacturing led wafer with light extracting layer |
US7521727B2 (en) | 2006-04-26 | 2009-04-21 | Rohm And Haas Company | Light emitting device having improved light extraction efficiency and method of making same |
US7955531B1 (en) | 2006-04-26 | 2011-06-07 | Rohm And Haas Electronic Materials Llc | Patterned light extraction sheet and method of making same |
KR100770424B1 (ko) * | 2006-12-13 | 2007-10-26 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
EP1962350A1 (en) * | 2007-02-22 | 2008-08-27 | LEXEDIS Lighting GmbH | Emitting surface of light emitting diode packages |
WO2008138156A1 (en) * | 2007-05-14 | 2008-11-20 | Heptagon Oy | Illumination system |
WO2009006747A1 (en) * | 2007-07-12 | 2009-01-15 | Heptagon Oy | Optical element, illumination system and method of designing an optical element |
CN101918884A (zh) * | 2008-01-08 | 2010-12-15 | 杜比实验室特许公司 | 视差减小 |
WO2009122364A1 (en) * | 2008-04-04 | 2009-10-08 | Philips Intellectual Property & Standards Gmbh | Projection module for a headlamp |
DE102008021658A1 (de) | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung mit Volumenstrukturierung |
US20100260945A1 (en) * | 2009-02-13 | 2010-10-14 | Luminus Devices, Inc. | System and methods for optical curing using a reflector |
FR2947385B1 (fr) | 2009-06-26 | 2011-11-11 | Saint Gobain | Diode electroluminescente integrant un element optique plan a modulation d'indice de refraction |
US8253798B2 (en) * | 2010-02-03 | 2012-08-28 | Unitechno Corporation | Video surveillance device with infrared LED |
AT509562A1 (de) * | 2010-02-24 | 2011-09-15 | Thallner Erich | Leuchteinrichtung und verfahren zur herstellung einer solchen |
KR20130085373A (ko) | 2010-05-28 | 2013-07-29 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 빔 성형 광학 스택, 광원 및 조명기구 |
ES2408860B1 (es) * | 2011-12-13 | 2014-04-24 | Lledo Iluminación Sa | Luminaria led con simetría de revolución. |
JP2013190522A (ja) * | 2012-03-13 | 2013-09-26 | Stanley Electric Co Ltd | 光学素子、照明装置 |
CN102788281B (zh) * | 2012-08-13 | 2014-11-05 | 无锡奥普顿光电子有限公司 | 一种用于led照明的二次光学元件 |
KR102008315B1 (ko) | 2013-01-23 | 2019-10-21 | 삼성전자주식회사 | 발광 소자 패키지 |
US9752925B2 (en) * | 2015-02-13 | 2017-09-05 | Taiwan Biophotonic Corporation | Optical sensor |
DE102016116439A1 (de) | 2016-09-02 | 2018-03-08 | Osram Opto Semiconductors Gmbh | Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement |
DE102016116468A1 (de) | 2016-09-02 | 2018-03-08 | Osram Opto Semiconductors Gmbh | Optoelektronische anordnung |
WO2018234086A1 (en) * | 2017-06-19 | 2018-12-27 | Philips Lighting Holding B.V. | LED OUTPUT LENSES AND METHOD OF FORMING AN OUTPUT LENS |
DE102018126297A1 (de) * | 2018-10-23 | 2020-04-23 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge |
DE102018221634A1 (de) * | 2018-12-13 | 2020-06-18 | Osram Gmbh | Vorrichtung zum entkeimen eines fluids |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
US5814870A (en) * | 1996-01-05 | 1998-09-29 | Siemens Aktiengesellschaft | Semiconductor component |
US6102552A (en) * | 1996-10-18 | 2000-08-15 | Hewlett-Packard Company | Laser-array based digital illuminator |
CN2426640Y (zh) * | 2000-05-19 | 2001-04-11 | 张开开 | 定向光高效发光二极管 |
EP1235281A1 (en) * | 1999-11-30 | 2002-08-28 | Omron Corporation | Optical device and apparatus comprising the optical device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1966059A (en) * | 1933-03-13 | 1934-07-10 | George Slaff | Production of white light |
JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
US4843280A (en) * | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
DE3929477A1 (de) * | 1989-09-05 | 1991-03-07 | Siemens Ag | Led-anordnung |
JPH05102528A (ja) * | 1991-10-11 | 1993-04-23 | Omron Corp | 光半導体素子 |
EP0813667B1 (en) * | 1995-03-03 | 1999-05-26 | Minnesota Mining And Manufacturing Company | Light directing film having variable height structured surface and light directing article constructed therefrom |
JPH08330635A (ja) | 1995-05-30 | 1996-12-13 | Canon Inc | 発光装置 |
DE19527026C2 (de) * | 1995-07-24 | 1997-12-18 | Siemens Ag | Optoelektronischer Wandler und Herstellverfahren |
US5698941A (en) * | 1996-01-16 | 1997-12-16 | Motorola | Optical correction layer for a light emitting apparatus |
US5919551A (en) * | 1996-04-12 | 1999-07-06 | 3M Innovative Properties Company | Variable pitch structured optical film |
WO1999025031A1 (en) * | 1997-11-06 | 1999-05-20 | Donnelly Corporation | Light emitting element having an optical element molded in a surface thereof |
FR2785364B1 (fr) | 1998-11-03 | 2000-12-22 | Valeo Vision | Feu de signalisation a diffraction, notamment pour vehicule automobile |
US6752505B2 (en) * | 1999-02-23 | 2004-06-22 | Solid State Opto Limited | Light redirecting films and film systems |
GB9919689D0 (en) | 1999-08-19 | 1999-10-20 | Microsharp Corp Limited | Back-lighting arrangement and the like |
JP3652945B2 (ja) * | 1999-12-28 | 2005-05-25 | 松下電器産業株式会社 | 光情報処理装置 |
GB0017658D0 (en) * | 2000-07-19 | 2000-09-06 | Secr Defence | Light emitting diodes |
JP2002076440A (ja) * | 2000-08-28 | 2002-03-15 | Stanley Electric Co Ltd | 発光装置及び光空間伝送装置 |
US6891200B2 (en) * | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
JP2004536350A (ja) * | 2001-07-16 | 2004-12-02 | オイ アイシーエス インテリジェント コントロール システムズ リミテッド | 空間的に部分的にコヒーレントな光ビームの強度分布の回折成形 |
-
2002
- 2002-11-13 EP EP02405977A patent/EP1420462A1/en not_active Withdrawn
-
2003
- 2003-11-04 JP JP2004550602A patent/JP4478028B2/ja not_active Expired - Lifetime
- 2003-11-04 CN CN2003801086175A patent/CN1739202B/zh not_active Expired - Lifetime
- 2003-11-04 AT AT03757622T patent/ATE362658T1/de not_active IP Right Cessation
- 2003-11-04 EP EP07008822A patent/EP1808904A1/en not_active Ceased
- 2003-11-04 AU AU2003273712A patent/AU2003273712A1/en not_active Abandoned
- 2003-11-04 DE DE60313884T patent/DE60313884T2/de not_active Expired - Lifetime
- 2003-11-04 EP EP03757622A patent/EP1561246B1/en not_active Expired - Lifetime
- 2003-11-04 WO PCT/CH2003/000721 patent/WO2004044995A1/en active IP Right Grant
- 2003-11-04 US US10/533,966 patent/US8487519B2/en active Active
- 2003-11-10 TW TW092131429A patent/TWI333697B/zh not_active IP Right Cessation
-
2006
- 2006-06-27 HK HK06107260.2A patent/HK1087246A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
US5814870A (en) * | 1996-01-05 | 1998-09-29 | Siemens Aktiengesellschaft | Semiconductor component |
US6102552A (en) * | 1996-10-18 | 2000-08-15 | Hewlett-Packard Company | Laser-array based digital illuminator |
EP1235281A1 (en) * | 1999-11-30 | 2002-08-28 | Omron Corporation | Optical device and apparatus comprising the optical device |
CN2426640Y (zh) * | 2000-05-19 | 2001-04-11 | 张开开 | 定向光高效发光二极管 |
Non-Patent Citations (3)
Title |
---|
BART DHOEDT,PETER DE DOBBELAERE, ET AL.Monolithic Integration of Diffractive Lenses with LED-arraysforBoard-to-Board Free Space Optical Interconnect.JOURNAL OF LITHTWAVE TECHNOLOGY13 6.1995,13(6),1065-1073. |
BART DHOEDT,PETER DE DOBBELAERE, ET AL.Monolithic Integration of Diffractive Lenses with LED-arraysforBoard-to-Board Free Space Optical Interconnect.JOURNAL OF LITHTWAVE TECHNOLOGY13 6.1995,13(6),1065-1073. * |
JP特开平5-102528A 1993.04.23 |
Also Published As
Publication number | Publication date |
---|---|
ATE362658T1 (de) | 2007-06-15 |
EP1420462A1 (en) | 2004-05-19 |
JP4478028B2 (ja) | 2010-06-09 |
HK1087246A1 (en) | 2006-10-06 |
JP2006506803A (ja) | 2006-02-23 |
DE60313884D1 (de) | 2007-06-28 |
EP1561246B1 (en) | 2007-05-16 |
TW200410417A (en) | 2004-06-16 |
EP1561246A1 (en) | 2005-08-10 |
WO2004044995A1 (en) | 2004-05-27 |
US20060279955A1 (en) | 2006-12-14 |
AU2003273712A1 (en) | 2004-06-03 |
DE60313884T2 (de) | 2008-01-17 |
TWI333697B (en) | 2010-11-21 |
US8487519B2 (en) | 2013-07-16 |
EP1808904A1 (en) | 2007-07-18 |
CN1739202A (zh) | 2006-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1739202B (zh) | 光发射器件 | |
CN209525546U (zh) | 显示器 | |
CN103828042B (zh) | 光电子模块及其制造方法和应用、光电子设备 | |
CN102667543B (zh) | 透反制品和灯组件 | |
US7927003B2 (en) | Light guide plate with micro-structured reflective film and light-emitting apparatus | |
CN103163576B (zh) | 发光二极管镜片及其发光装置 | |
CN103511987B (zh) | 光控制镜片及其光源装置 | |
US20160047521A1 (en) | Light assembly | |
US20060044806A1 (en) | Light emitting diode system packages | |
CN103109587A (zh) | 光电子板上芯片模块的涂层方法 | |
JP2015531149A (ja) | 回折抽出フィーチャのパターン化印刷を有する照明装置 | |
CN105593596B (zh) | 模块化光导灯具 | |
EP2457017A1 (en) | Light assembly | |
US20080302977A1 (en) | Light emitting module for producing a visible light by passive ultraviolet excitation | |
CN103185912A (zh) | 微结构导光板及侧光式背光模组 | |
CN112835139A (zh) | 一种光学元件及光学模组 | |
CN110764168A (zh) | 一种光学透镜结构、背光模组及透镜成型方法 | |
US11598912B2 (en) | Single edge lit lighting module with bi-lobed light distribution | |
US11635179B2 (en) | Linear lighting assembly with single edge-lit light scattering optical element | |
CN102313241A (zh) | 照明装置的光学元件及其设计方法 | |
CN114127469B (zh) | 照明装置 | |
US11060693B2 (en) | Output lenses for LEDs and a method of forming an output lens | |
US20090316435A1 (en) | Electronic device and decoration element thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1087246 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1087246 Country of ref document: HK |
|
ASS | Succession or assignment of patent right |
Owner name: HEPTAGON MICRO OPTICS PTE. LTD. Free format text: FORMER OWNER: HEPTAGON OY Effective date: 20120905 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120905 Address after: Singapore Singapore Patentee after: HEPTAGON MICRO OPTICS Pte. Ltd. Address before: Espoo, Finland Patentee before: Heptagon OY |
|
C56 | Change in the name or address of the patentee |
Owner name: SINGAPORE HENGLI PRIVATE LTD. Free format text: FORMER NAME: HEPTAGON MICRO OPTICS PTE. LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Singapore Singapore Patentee after: HEPTAGON MICRO OPTICS Pte. Ltd. Address before: Singapore Singapore Patentee before: HEPTAGON MICRO OPTICS Pte. Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20100609 |
|
CX01 | Expiry of patent term |