CN1735567A - 多通道且多层的制药器件 - Google Patents
多通道且多层的制药器件 Download PDFInfo
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
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- OMOVVBIIQSXZSZ-UHFFFAOYSA-N [6-(4-acetyloxy-5,9a-dimethyl-2,7-dioxo-4,5a,6,9-tetrahydro-3h-pyrano[3,4-b]oxepin-5-yl)-5-formyloxy-3-(furan-3-yl)-3a-methyl-7-methylidene-1a,2,3,4,5,6-hexahydroindeno[1,7a-b]oxiren-4-yl] 2-hydroxy-3-methylpentanoate Chemical compound CC12C(OC(=O)C(O)C(C)CC)C(OC=O)C(C3(C)C(CC(=O)OC4(C)COC(=O)CC43)OC(C)=O)C(=C)C32OC3CC1C=1C=COC=1 OMOVVBIIQSXZSZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
通过一种方法形成在制药工业中用于混合和测试材料的板(10),其中通过材料移除方法在一组生片中形成孔(22)(24),至少一些孔(25)填充有在烧结期间逸出的易消失材料(222)。
Description
技术领域
本发明的领域是同时测试许多生物/化学相互作用的化合物的领域。特别地,本发明是一种器件/结构以及一种测试药物相互作用的方法。
背景技术
在制药工业中,测试化学物质A对化学物质B1…Bn(其中n可以是较大的数,约数百万)的反应(包括生物活性)是有必要的。
一般的方法是在塑料卡片上提供一系列物质B1…Bn,并放置物质A与每个Bn接触。市场上可买到的塑料卡片阵列包括96和384槽(well)。槽的直径约为几个毫米量级。化学物质放置或分配的方法通常借助移液管。使用计算机辅助扫描装置来记录(type)化学物质的相互作用。
由于需要测试数百万的化学物质的组合以穷尽可能性,因此耗费了致力于药品发现的公司数年的时间以推出成功的药品到市场上。以计算机辅助扫描装置现在的速度可以减少药品发现时间,例如通过增加每次扫描的采样次数。这是可能的,如果我们能例如在给定的体积内叠置更多数量的槽。给定体积内更多数量的槽还减少用在给定槽中的昂贵的化学物质的数量。
该塑料卡片通常由挤压形成,孔的直径及其在阵列内位置的精度并不足以制造微孔和通道。这实质上限制了塑料在该领域中的可延伸性。
制药工业正在积极寻找这样的微器件,该微器件带有直径约为100微米的数千个槽以及连接阵列内不同水平面的可选择的槽的通道。
发明内容
本发明涉及一种带有微槽和微通道的陶瓷器件及其形成的方法。
本发明的一个特点是通过层叠多个生片(green sheet)而在陶瓷结构中制造一系列微槽和微通道。
本发明的一方面,开放槽和通道由各层分别形成。
另一方面,槽和通道的多层阵列结构包括一组填充有烧结后形成通道的材料的结构。
本发明的另一特点是使用材料移除技术形成槽、通道和这种孔。
本发明的再一特点是使用烧结过程中从陶瓷结构选出的损失材料。
本发明的再一特点是使用烧结后不留残留物的损失材料。
本发明的再一特点是使用烧结后留有多孔结构残留物的损失材料,该多孔结构的微孔相互连接。
本发明的再一特点是使用在可压实基体中形成通道的非可压实材料(无机物或金属或复合物)。
本发明的再一特点是在烧结过程中控制通道体积。
本发明的再一特点是在通道中使用由化学分解或气态沉淀而留有敷层的材料。
附图说明
图1示出第一过程后所完成的结构。
图2-5示出第一过程中的步骤。
图6示出第二过程后所完成的结构。
图7-10示出第二过程中的步骤。
具体实施方式
图1示出根据本发明所完成的结构简化后的一部分,该结构具有形成在板10-2中的单一水平通道25,该通道25连接形成在板10-1、10-2和10-3中的第一垂直孔22以及形成在板10-3中的第二孔24。板10-1到10-3最初是分离的陶瓷生片,该生片以传统方法层叠并烧结以形成陶瓷板10。在操作中,物质可在压力下通过板10-1而向上运动,在板10-3中的两个位置扩散并离开。同样,也可在相反方向流动,两种物质从板10-3中的两个孔进入、结合并从板10-1中的单一开口离开。
为了简化说明,图1示出使用三个生片和一个连接两垂直槽的水平通道形成的结构。该结构由单个板通过层叠而组装。该组装过程就是带有数千个孔阵列的陶瓷结构与选择地连接以连接垂直孔的数千个水平通道的组装。该陶瓷材料可包括氧化铝、玻璃陶瓷、氮化铝、硼硅玻璃和玻璃。垂直槽的直径可以是20微米或以上,通道宽度可以是20微米或以上且长度可以最小是20微米。与物质接触的槽的形状可以是圆形、矩形、光滑或粗糙的。板10的总厚度可以是任何期望的值,但优选地是小于1mm。生片的厚度取决于应用场合,但优选地是从约3密耳到约30密耳的范围。
层叠过程包括加热、加压和所需时间。优选的层叠压力小于800磅/平方英寸,温度低于90摄氏度并且所需时间小于5分钟。烧结过程包括所选择的材料和用于形成生片的粘合系统。
图2A到2C示出层叠以形成图1结构的分离的生片10-1、10-2和10-3。示例性地,水平通道25的长度大于孔22或24直径的两倍。示例性地,孔22的直径约为20微米或以上。制造中用的直径将取决于特定的应用场合和技术变量,例如,所通过物质的粘度、表面的表面张力/活性、流体期望的流动力、毛细的或强制流动、期望的流量和流速等等。
根据本发明,生片由例如氧化铝、玻璃、陶瓷和玻璃陶瓷的物质形成。用于形成垂直孔和水平通道的技术是通过例如钻孔将材料钻出的技术(包括分段冲裁、激光打孔、电子束钻孔、喷砂和高压液体喷射)的材料移除。
通过将材料压向侧面并使生片变形的微模压不包括在优选实施例中,并一般将其称为材料位移技术。这种技术是不期望的,这是因为期望的槽和通道相对位置精度非常小(即,几个微米),而由材料位移技术引入的变形对于提供期望的精度是一个显著的障碍。
用于第一实施例的易消失材料可以是任何相容的有机材料,例如,对苯二酸、碳或其它有机物质。
用于形成第二实施例中多孔结构的材料可以是陶瓷(例如,氧化铝、玻璃陶瓷、氮化铝和硼硅玻璃),该陶瓷的粒度示例性地小于40微米。
如果不担心处理或其它操作期间压力将使它们变形,水平和垂直孔可以保持开放(状态),或者它们可填充有易消失材料。
在本发明的第一实施例中,易消失材料是一种当其离开后不留有任何残留物的材料。移除该易消失材料的过程可包括将它加热至超过沸腾或升华温度,以使该材料以蒸汽形式消散到周围环境中;或者该技术可包括将易消失材料的分子和反应物的分子结合以形成气体(状态)的物质并进入到周围环境中的燃烧或其它化学反应。易消失材料的形式优选地是一种易于施加到生片内的孔中的形式,例如浆料的形式。
在第二实施例中,易消失材料与烧结时将形成多孔结构的第二材料结合;例如颗粒形式的易消失材料的混合物,颗粒大小足够大以使颗粒在未燃烧状态相互接触。因此,烧结后连续的开放结构将保持在开口微孔(open-pore)基体内以允许测试材料通过这些微孔从板10的一侧到另一侧。这也是显然的:通道中未烧结的多微孔体将使得形成受控的开放体积和通道尺寸。此外,通道中未烧结的多微孔体帮助防止烧结过程中通道倒塌。
图6与图1相似,示出所完成的结构,该结构中垂直孔是开放的,在烧结前填充有易消失材料并且水平通道具有多孔基体。水平通道225在烧结前用填充材料充满,该填充材料是易消失材料和基体材料的混合物,该混合物烧结以形成具有开口微孔的多孔基体,这些开口微孔允许流体通过它从垂直孔22流到垂直孔24。
图7A和7C示出填充有与用在前一示例中相同的易消失材料222的生片20-1和20-2。图7B示出带有空孔的生片20-2。
图8示出板20-1和20-2的亚叠板(sublaminate)。图9示出填充有填充材料225的水平孔。示例性地,材料225是易消失材料与上述将烧结以形成开口微孔结构的颗粒的混合。依照设计者的选择,垂直通路也可以用多孔材料填充以实现设计目标。图10示出烧结前的最终结构。
本发明可选择的形式包括使用可压实的材料作生片,并用非可压实的材料填充开口以保持通路的尺寸。例如,基体材料可以是像氧化铝的无机物与用于压实的玻璃粉相混合,而通道(和/或孔)中的非可压实物可以是较大的陶瓷颗粒,例如氧化铝。
此外,通路中的材料可以是一种烧结时形成非多孔鞘层(sheath)的材料,从而通道容纳衬套(liner),例如,该鞘层与板10的基体材料/体相比具有交错的表面能/活性。用于该鞘层的材料可以是无机物、金属或复合物。该鞘层可以由叠层中的第一材料和填充物中的第二材料或周围气体之间的化学分解形成,和/或该鞘层由气态沉淀形成。或者,该衬套可以由填充材料发出的蒸汽在壁上沉淀或与包含在叠层中的材料相反应而产生。
虽然已结合几个优选实施例对本发明进行了描述,但是本领域的技术人员将意识到,本发明可以在附加权利要求的精神和范围内以各种方式实施。
Claims (17)
1.一种形成板(10)的方法,所述板(10)用于使至少一种物质通过一组孔从第一侧到第二侧,所述方法包括如下步骤:
在第一陶瓷生片中形成多个垂直孔(22)(24);
在第二陶瓷生片中形成多个水平孔(25);
在第三陶瓷生片中形成多个垂直孔(22)(24),其中所述第二生片中的至少一些所述水平孔(25)将所述第一生片中的孔与所述第三生片中的孔相连接;
用包括易消失材料(222)的填充材料填充至少一些所述孔;
将所述第一、第二和第三陶瓷生片层叠在一起;并烧结所述第一、第二和第三陶瓷生片,从而形成所述板并释放所述易消失材料。
2.根据权利要求1的方法,其中:
形成所述第一、第二和第三陶瓷生片中至少一个的所述步骤受材料移除技术影响。
3.根据权利要求1的方法,其中:
在用所述易消失材料(222)填充所述孔的另一步骤之前,所述第二生片与所述第一和第三生片中的一个层叠在一起以形成亚叠板。
4.根据权利要求1的方法,其中:
在与另一所述生片层叠的步骤之前,每个所述第一、第二和第三生片中的孔都填充有所述易消失材料(222)。
5.根据权利要求1的方法,其中:
在所述第一、第二和第三生片中至少一个中的孔不填充有所述易消失材料(222)。
6.根据权利要求2的方法,其中:
所述易消失材料(222)在烧结过程中逸出而不留有残留物。
7.根据权利要求3的方法,其中:
所述易消失材料(222)在烧结过程中逸出而不留有残留物。
8.根据权利要求4的方法,其中:
所述易消失材料(222)在烧结过程中逸出而不留有残留物。
9.根据权利要求2的方法,其中:
填充所述孔的所述填充材料(225)是在烧结过程中逸出而不留有残留物的易消失材料和在所述烧结过程后留有多孔基体的基体材料的混合物。
10.根据权利要求3的方法,其中:
填充所述孔的所述填充材料(225)是在烧结过程中逸出而不留有残留物的易消失材料和在所述烧结过程后留有多孔基体的基体材料的混合物。
11.根据权利要求4的方法,其中:
填充所述孔的所述填充材料(225)是在烧结过程中逸出而不留有残留物的易消失材料和在所述烧结过程后留有多孔基体的基体材料的混合物。
12.根据权利要求1的方法,其中:
所述易消失材料(222)由下述组中选择,该组包括:
对苯二酸和碳。
13.根据权利要求9的方法,其中:
所述易消失材料(222)由下述组中选择,该组包括:
对苯二酸和碳;和
所述基体材料由下述组中选择,该组包括:
陶瓷,例如氧化铝、玻璃陶瓷、氮化铝和硼硅玻璃。
14.一种形成板的方法,所述板用于使至少一种物质通过一组孔从第一侧到第二侧,所述方法包括如下步骤:
在第一陶瓷生片中形成多个垂直孔(22)(24);
在第二陶瓷生片中形成多个水平孔(25);
在第三陶瓷生片中形成多个垂直孔(22)(24),其中所述第二生片中的至少一些所述水平孔(25)将所述第一生片中的孔与所述第三生片中的孔相连接;
将所述第一、第二和第三陶瓷生片层叠在一起;
烧结所述第一、第二和第三陶瓷生片。
15.根据权利要求14的形成板的方法,其中:
形成所述第一、第二和第三陶瓷生片中至少一个的所述步骤受材料移除技术影响。
16.根据权利要求14的方法,其中:
所述第二生片与所述第一和第三生片中的一个层叠在一起以形成亚叠板。
17.根据权利要求15的方法,其中:
所述第二生片与所述第一和第三生片中的一个层叠在一起以形成亚叠板。
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CN110304935A (zh) * | 2019-08-08 | 2019-10-08 | 贵州大学 | 一种陶瓷微通道的封装方法 |
CN113023666A (zh) * | 2021-02-23 | 2021-06-25 | 太原理工大学 | 一种用于硅基平板微热管的灌封方法 |
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CN102016599A (zh) * | 2008-04-25 | 2011-04-13 | 普乐喜金生物技术股份有限公司 | 生物芯片及相关自动分析器和方法 |
CN110304935A (zh) * | 2019-08-08 | 2019-10-08 | 贵州大学 | 一种陶瓷微通道的封装方法 |
CN110304935B (zh) * | 2019-08-08 | 2021-11-26 | 贵州大学 | 一种陶瓷微通道的封装方法 |
CN113023666A (zh) * | 2021-02-23 | 2021-06-25 | 太原理工大学 | 一种用于硅基平板微热管的灌封方法 |
CN113023666B (zh) * | 2021-02-23 | 2023-12-12 | 太原理工大学 | 一种用于硅基平板微热管的灌封方法 |
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JP4553193B2 (ja) | 2010-09-29 |
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