CN1722944A - Radiating structure having micro-structure layer and manufacturing method thereof - Google Patents
Radiating structure having micro-structure layer and manufacturing method thereof Download PDFInfo
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- CN1722944A CN1722944A CN 200410069738 CN200410069738A CN1722944A CN 1722944 A CN1722944 A CN 1722944A CN 200410069738 CN200410069738 CN 200410069738 CN 200410069738 A CN200410069738 A CN 200410069738A CN 1722944 A CN1722944 A CN 1722944A
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Abstract
This invention relates to a thermal device with microstructure layer, in addition to a making method, which comprises the following steps: a) making two heat conducting material backings with the same structure pattern; b) injecting high heat conducting material to the structure pattern, forming microstructure layer; c) preparing the thermal device with microstructure layer combined with two heat conducting material backings. The thermal device comprises the backing body and the spacing inside the backing body, wherein the inner wall of the spacing has the microstructure layer; meanwhile, the spacing has working fluid inside, by which it can realize material heat conduction with high microstructure layer precision.
Description
Technical field
The invention relates to a kind of heat abstractor and method for making thereof, particularly about a kind of heat abstractor and method for making thereof of utilizing the tool microstructured layers of liquid gas shift dissipation heat with microstructured layers.
Background technology
Along with development of economic globalization, people have improved greatly for the speed of work step and the requirement of convenience, how to finish the life requirement of maximum functionalization in the time of tool efficient, followed when the consumer chooses all kinds of life products on market today just chooses criterion.With electronic product, how to break through research and development bottleneck have small size to develop, multi-functional and high efficiency new product, that caters to consumer demand just in recent years must research and develop trend.By the research and development angle, though successfully making electronic building brick finish size, the manufacture of semiconductor of fast development in nearly ten years and IC designing technique dwindle and integrated target, simultaneously have the effect of multi-functional integration again concurrently, but other insoluble new problem also occurred, cause the assembly reliability to reduce.
The main cause that causes the said modules reliability to reduce, be because electronic building brick needs these assemblies of electricity driving to do work, be difficult to reach under the hundred-percent present situation in its efficient, a part of power transfer that it consumed becomes heat, makes the operating temperature of total system significantly rise.If operating temperature surpasses the scope of allowing, system promptly may produce run-time error, even may cross the situation that relative superiority or inferiority causes the system failure or burns in temperature.For the high density electronic product, the arithmetic speed of its internal electrical components and frequency of operation all are higher than traditional product far away, need the heat of dissipation also very big naturally in the use, the situation of operating temperature greater than permissible range very easily occur; Simultaneously, for cooperating the undersized development trend of electronic building brick, relevant heat abstractor also needs characteristic little with body, light weight, but so just one disposes and brings into play its effect, and this becomes a major challenge that this research and development field faces.
For improving the problems referred to above, prior art is to utilize the passive cooling mechanism of fluid, gas shift, as shown in Figure 3, utilize capillarity (Capillary) principle in liquid gas shift and the heat pipe (Heat Pipe), the heat of heat absorbing end (thermal source) 50 by evaporation of liquid, is conducted to heat extraction end 51, utilize the condensation of gas and the capillary pulling power of capillary structure (Wick) 52 again, form shuttling movement, the heat that electronic building brick produces is treated in dissipation continuously.For example No. 528151 case of Taiwan patent announcement and No. 501722 case have all disclosed this type of heat pipe-type heat abstractor.
The quality of this type of device radiation efficient obviously depends on the formation of this capillary structure, if the dimensional accuracy and the distributing position of this capillary structure do not reach design requirement, then this evaporative fluid obviously will be reduced greatly by the efficient that heat absorbing end moves to the heat extraction end, return this efficiency of movement for the treatment of that radiating end circulates after the heat dissipation again and also will have a greatly reduced quality.Yet because the purpose of this class heat abstractor is to be applied on the electronic building brick that size dwindles day by day, so the size of these capillary structures also all is the micro-structural of micron (μ m) grade, this forms the difficult problem that processing procedure is controlled with precision more.
United States Patent (USP) the 4th, 046 is that gold mining belongs to the powder sintering processing and makes these capillary structures in No. 190 cases, and its method for making is to spread for example metallic of the contour heat-transfer metal of copper earlier, carries out sintering and forms required capillary structure with high temperature again.Yet, in the actual production, can find that this method for making has great shortcoming, because sintering processing can't accurately be controlled the physical dimension after the shaping, so for the capillary structure that dimensional accuracy reaches the micrometer structure grade, finished product behind the sintering often is difficult to reach the accuracy requirement of design in advance, and then significantly influences its radiating efficiency.
For solving this type of problem, prior art is used injection molding mode instead, carries out injection moulding with the copper powder behind the sintering, and utilize injection molding characteristic, form required capillary structure or runner, reach high-precision physical dimension demand, to meet the accuracy requirement of capillary structure.But this method for making commonly used only solves the problem that capillary structure is shaped, and but still has the obstacle on other radiating efficiency.Because of injection molding extreme temperatures, so the density of cooling back copper greatly reduces, and then also makes its coefficient of heat conduction far away from monoblock copper billet material height, so though can bring into play the effect of liquid gas shift, but the usefulness of whole conduction heat is still not good, is difficult to satisfy the demand of electronic building brick heat radiation.
Therefore, how to develop a kind of new preparation method,, promote its radiating efficiency, also take into account its quick volume production and the easy demand of processing procedure simultaneously, really become association area problem urgently to be separated for this reason to make the heat abstractor that this class has the capillary microstructured layers.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of heat abstractor with microstructured layers and method for making thereof that promotes radiating efficiency.
A further object of the present invention is to provide a kind of heat abstractor with microstructured layers and method for making thereof of accurately control structure geometry designs.
Another object of the present invention is to provide a kind of processing procedure simple and easy and heat abstractor with microstructured layers and method for making thereof volume production fast.
The heat abstractor and the method for making thereof that provide a kind of small size to have microstructured layers is provided another purpose of the present invention.
For reaching above-mentioned and other purpose, the step of the radiating device manufacturing method of tool microstructured layers proposed by the invention comprises: two high heat conducting material base materials are provided, have structure plan on its surface; Structure plan on this high heat conducting material base material carries out injection moulding, forms microstructured layers on this structure plan, and this microstructured layers is high heat conducting material; And, make its formation accommodation space that is interconnected, and in this accommodation space, be packed into working fluid in conjunction with above two high heat conducting material base materials.
The radiating device manufacturing method of tool microstructured layers of the present invention also can may further comprise the steps: two high heat conducting material base materials are provided, have structure plan on its surface; Structure plan at this high heat conducting material base material forms high heat conducting material layer; Impress this high heat conducting material layer, make it form microstructured layers; And, make its formation accommodation space that is interconnected, and in this accommodation space, be packed into working fluid in conjunction with above two high heat conducting material base materials.
The heat abstractor of tool microstructured layers proposed by the invention comprises: high heat conducting material base material, have accommodation space in this high heat conducting material base material, and the surface of this accommodation space has structure plan; Microstructured layers is formed on this structure plan, and this microstructured layers is to make with high heat conducting material; And working fluid, be filled in this accommodation space.
Above-mentioned microstructured layers is capillary structure (Wick), to being attached on this capillary structure and the working fluid that is in contact with it produces capillary pulling power, and then make this working fluid move along the wall edge of this capillary structure, this capillary structure can be a plurality of grooves that are arranged in parallel or network structure, but it is arranged and be without particular limitation.
Simultaneously, above-mentioned high heat conducting material can be metal materials such as copper, silver, aluminium, and the high heat conducting material that forms this microstructured layers is a same material with the high heat conducting material that forms this first base material and this second base material; This first base material and second base material are highdensity bulk, and have heat absorption surface and heat extraction surface respectively on this first base material with on this second base material.
Heat abstractor body of the present invention is made by the metal base of high density and high heat-conduction coefficient, has high radiating efficiency; Simultaneously, injection molding capillary microstructured layers can accurately be controlled the size and the geometry of this microstructured layers, also has the easy advantage of quick volume production and processing procedure simultaneously, can take into account the small size trend for the treatment of the radiating electronic assembly again, bring into play the advantage of small size design of the present invention; By the liquid gas shift principle in this base material quick conductive and this accommodation space, this device is dissipation heat, lifting radiating efficiency fast, has fully solved two difficult problems on the existing method for making.
Description of drawings
Figure 1A to Fig. 1 C figure is the preparation flow chart of heat abstractor of the present invention;
Fig. 2 is the vertical view of microstructured layers of the present invention;
Fig. 3, Fig. 4 are other embodiment cutaway views of heat abstractor of the present invention; And
Fig. 5 is existing liquid gas shift formula heat abstractor schematic diagram.
Embodiment
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention.
The radiating device manufacturing method of the tool micro-structural that the present invention proposes has the flow chart shown in Figure 1A to Fig. 1 C.At first, as Figure 1A, first base material 10 and second base material 20 that prepare equidimension respectively, these two base materials 10,20 are the high-density metal bulk, and this metal block material is the contour heat-transfer metal material of copper, silver or aluminium for example, wherein, has first fluting 11 on this first base material 10, and be formed with a plurality of geometry patterns 12 on the inwall of this first fluting 11, make the inwall of this first fluting 11 have different apparent heights respectively, simultaneously, on this first base material 10 with respect to this first fluting 11 to outer surface 13, then be defined as heat absorption surface 13; In addition, also has the design of this first base material 10 relatively on this second base material 20, it has second fluting 21, the inwall of this second fluting 21 also is formed with a plurality of geometry patterns 22, and its position is corresponding with the structure plan 12 in this first fluting 11, on this second base material 20 relatively this second fluting 21 to outer surface 23, then be defined as a heat extraction surface 23.
Then, as Figure 1B, carry out the metal injection molded step of MIM, select the high heat conducting material identical with second base material 20 (copper for example for use with this first base material 10, silver or aluminium), and be made into metal powder grain and carry out injection moulding with high temperature, inject this first fluting, 11 and second fluting 21 respectively, on the inwall of this first fluting, 11 and second fluting 21, form microstructured layers 30 respectively with these inwall fluid-tight engagement, this microstructured layers 30 will be as being formed uniformly as Figure 1B at slot whole inwalls of 21 of this first fluting 11 and second, and with this structure plan 12,22 and have different height, simultaneously, also be formed with this microstructured layers 30 on the inwall perpendicular to its heat absorption surface 13 and heat extraction surface 23 respectively on this first fluting, 11 and second fluting 21.
This microstructured layers 30 is capillary structure (Wick), produce capillary pulling power to being attached to the fluid that is in contact with it on this capillary structure, and then make this fluid move along the wall edge of this capillary structure, this capillary structure can be a plurality of grooves that are arranged in parallel or network structure, but it is arranged and is without particular limitation, only need be to get final product with the high-termal conductivity capillary microstructured layers that injection molding forms; The capillary structure vertical view of Fig. 2 is preferred embodiment of the present invention, it is made up of a plurality of grooves that are arranged in parallel, wherein, oblique line part 30 is utilizes the formed capillary structure of injection molding, and all the other non-oblique line parts then are the inwalls of this first fluting, 11 or second fluting 21.
After finishing injection moulding and forming capillary structure, promptly shown in Fig. 1 C, comply with its arrow aspect in conjunction with encapsulation this first base material 10 and this second base material 20, it is to make this first fluting, 11 and second fluting 21 mode in opposite directions carry out capping, make this first fluting, 11 and second fluting 21 be connected to form accommodation space 35, in this accommodation space 35, be packed into working fluid 40; At this moment, the inwall of this first fluting, 11 and second fluting 21 will become the inwall of this accommodation space 35, thereby will be evenly distributed with this capillary structure 30 on all inwalls of this accommodation space 35, and this working fluid 40 will be filled and be attached on the capillary structure 30 of bottom or both sides, and this promptly finishes the making of the heat abstractor of tool radiator structure of the present invention.Its Vertical Centre Line 2-2 is the visual angle of Fig. 2, and the hatching line 1C-1C among Fig. 2 is the visual angle of Fig. 1 C.
Above-mentioned working fluid 40 is to transmit design for the heat that cooperates this heat abstractor, so its selection can be decided according to the demand of this heat dissipation environment, to select fluid for use, generally can select for example fluids such as aqueous water, acetone, liquid nitrogen or alcohol with suitable boiling point or condensation point.
Therefore, method for making proposed by the invention, obviously can solve the problem of existing radiating device manufacturing method, because of heat abstractor body of the present invention is a metal base 10,20 to have high density and high heat-conduction coefficient, so its device body has high radiating efficiency; Simultaneously, also has injection molding capillary microstructured layers 30 on this base material 10,20, can bring into play the advantage of injection moulding method for making, accurately control the size and the geometry of this microstructured layers 30, giving full play to the capillary effect transmits to carry out heat, both do not had the sinter molding method can't form the shortcoming of accurate capillary structure 30,, fully solved yet not with the low heat conduction shortcoming of injection moulding manufacturing installation body
Two difficult problems of prior art.
In addition, because method for making of the present invention only is to inject required microstructured layers 30 on metal block material 10,20, so also can bring into play the easy advantage of quick volume production and processing procedure, and also can take into account the small size trend for the treatment of the radiating electronic assembly, bring into play the advantage of small size design of the present invention.
In addition, the present invention is except that utilizing injection moulding to make this microstructured layers 30, also can utilize the mode of impression, it is to form high heat conducting material layer earlier on the structure plan 12,22 of this first, second base material 10,20, impress this high heat conducting material layer again, make it form microstructured layers 30, can bring into play effect of the present invention equally.
The present invention also can be as shown in Figure 3, prepare the identical ring-type framework 45 of first, second base material of profile and this 10,20 in advance, this ring-type framework 45 is placed between these two base materials 10,20 again, and then connect this first, second base material 10,20, to improve integrally-built height and to increase the size of this accommodation space 35.
Moreover, first base material 10 of the present invention also not necessarily need be identical and corresponding with the structure plan 12,22 on second base material 20, embodiment that also can be as shown in Figure 4, make this first, second base material 10,20 have different structure plan 12,22 respectively, can be connected to form accommodation space 35 after only need making it mutually combine to get final product.
Promptly can be made into the heat abstractor of tool microstructured layers as shown in Figure 5 by above-mentioned method for making, this device comprises: with the base material that high heat conducting material is made, have accommodation space 35 in this base material; Microstructured layers 30 is formed on the inwall of this accommodation space 35 with injection molding, and this microstructured layers 30 is to make with high heat conducting material; And be filled in working fluid 40 in this accommodation space 35.
So, by the made heat abstractor of method for making of the present invention, the radiating requirements that can meet the small size electronic building brick fully, only need during operation this heat abstractor is placed on the thermal source to be dispelled the heat (as electronic building brick), and make the heat absorption surface 13 of this base material contact with thermal source, at this moment, can absorb heat because of the temperature difference in this heat absorption surface 13, make the heat of this thermal source enter in this accommodation space 35 from this heat absorption surface 13, and because this first base material 10 is to make with high heat conducting material, have high density, thus heat import the efficient of this accommodation space 35 can be very high; Then, after heat enters this accommodation space 35, working fluid 40 attached to these accommodation space 35 below capillary structure of inner wall 30 will absorb this heat, and after being subjected to thermal evaporation, move to this accommodation space 35 tops, at this moment, the heat of this working fluid 40 will be released into the external world through this heat extraction surface 23 from this second base material 20, and this heat extraction process also can have high cooling efficiency because of the high thermal conductivity of this heat extraction base material 20.
After heat release is to this heat extraction surface 23, these working fluid 40 meeting condensations, be transformed into liquid, and then, be drawn back into this accommodation space 35 bottoms, and continue the circulation start because of the capillary pulling power of its gravity and this capillary structure 30, evaporation heat transfer once more absorbs heat, the radiating principle and mechanism of Here it is the heat abstractor with microstructured layers proposed by the invention obviously have high radiating efficiency, and meet the demand of electronic building brick on cooling mechanism.
Claims (23)
1. the radiating device manufacturing method of a tool microstructured layers is characterized in that, this method for making may further comprise the steps:
Two high heat conducting material base materials are provided, have structure plan on its surface;
Structure plan on this high heat conducting material base material carries out injection moulding, forms microstructured layers on this structure plan, and this microstructured layers is high heat conducting material; And
In conjunction with above two high heat conducting material base materials, make its formation accommodation space that is interconnected, and in this accommodation space, be packed into working fluid.
2. the radiating device manufacturing method of tool microstructured layers as claimed in claim 1, it is characterized in that, during in conjunction with above two high heat conducting material base materials, can connect these two high heat conducting material base materials by the identical ring-type framework of the high heat conducting material of profile and this, to control the size of this accommodation space.
3. the radiating device manufacturing method of tool microstructured layers as claimed in claim 1 is characterized in that, this microstructured layers is a capillary structure layer.
4. the radiating device manufacturing method of tool microstructured layers as claimed in claim 3 is characterized in that, this capillary structure layer is a kind of in groove and the network structure of being arranged in parallel.
5. the radiating device manufacturing method of tool microstructured layers as claimed in claim 1 is characterized in that, the high heat conducting material that forms this microstructured layers be copper, silver and aluminium in a kind of.
6. the radiating device manufacturing method of tool microstructured layers as claimed in claim 1 is characterized in that, high heat conducting material base material is a kind of in copper, silver or the aluminum metal bulk.
7. the radiating device manufacturing method of tool microstructured layers as claimed in claim 1 is characterized in that, this working fluid is that aqueous water, acetone, liquid nitrogen and alcohol are formed a kind of in the cohort.
8. the radiating device manufacturing method of a tool microstructured layers is characterized in that, this method for making may further comprise the steps:
Two high heat conducting material base materials are provided, have structure plan on its surface;
Structure plan at this high heat conducting material base material forms high heat conducting material layer;
Impress this high heat conducting material layer, make it form microstructured layers; And
In conjunction with above two high heat conducting material base materials, make its formation accommodation space that is interconnected, and in this accommodation space, be packed into working fluid.
9. the radiating device manufacturing method of tool microstructured layers as claimed in claim 8, it is characterized in that, during in conjunction with above two high heat conducting material base materials, can connect this two tall persons heat conducting material base material by the identical ring-type framework of the high heat conducting material of profile and this, to control the size of this accommodation space.
10. the radiating device manufacturing method of tool microstructured layers as claimed in claim 8 is characterized in that, this microstructured layers is a capillary structure layer.
11. the radiating device manufacturing method of tool microstructured layers as claimed in claim 10 is characterized in that, this capillary structure layer is a kind of in groove and the network structure of being arranged in parallel.
12. the radiating device manufacturing method of tool microstructured layers as claimed in claim 8 is characterized in that, the high heat conducting material layer that forms this microstructured layers be copper, silver and aluminium in a kind of.
13. the radiating device manufacturing method of tool microstructured layers as claimed in claim 8 is characterized in that, high heat conducting material base material is a kind of in copper, silver or the aluminum metal bulk.
14. the radiating device manufacturing method of tool microstructured layers as claimed in claim 8 is characterized in that, this working fluid is that aqueous water, acetone, liquid nitrogen and alcohol are formed a kind of in the cohort.
15. the heat abstractor of a tool microstructured layers is characterized in that, this device comprises:
High heat conducting material base material has accommodation space in this high heat conducting material base material, and the surface of this accommodation space has structure plan;
Microstructured layers is formed on this structure plan, and this microstructured layers is to make with high heat conducting material; And
Working fluid is filled in this accommodation space.
16. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, this microstructured layers is made with injection molding.
17. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, this microstructured layers is to make in the impression mode.
18. the heat abstractor of tool microstructured layers as claimed in claim 15, it is characterized in that, during in conjunction with above two high heat conducting material base materials, can connect these two high heat conducting material base materials by the identical ring-type framework of the high heat conducting material of profile and this, to control the size of this accommodation space.
19. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, this microstructured layers is a capillary structure layer.
20. the heat abstractor of tool microstructured layers as claimed in claim 19 is characterized in that, this capillary structure layer is a kind of in groove and the network structure of being arranged in parallel.
21. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, the high heat conducting material that forms this microstructured layers be copper, silver and aluminium in a kind of.
22. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, high heat conducting material base material is a kind of in copper, silver or the aluminum metal bulk.
23. the heat abstractor of tool microstructured layers as claimed in claim 15 is characterized in that, this working fluid is that aqueous water, acetone, liquid nitrogen and alcohol are formed a kind of in the cohort.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200410069738XA CN100401864C (en) | 2004-07-14 | 2004-07-14 | Radiating structure having micro-structure layer and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200410069738XA CN100401864C (en) | 2004-07-14 | 2004-07-14 | Radiating structure having micro-structure layer and manufacturing method thereof |
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| CN1722944A true CN1722944A (en) | 2006-01-18 |
| CN100401864C CN100401864C (en) | 2008-07-09 |
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| CNB200410069738XA Expired - Fee Related CN100401864C (en) | 2004-07-14 | 2004-07-14 | Radiating structure having micro-structure layer and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137846A (en) * | 2011-11-25 | 2013-06-05 | 财团法人工业技术研究院 | Soaking structure, manufacturing method thereof and heat dissipation module with soaking structure |
| CN110769654A (en) * | 2019-10-30 | 2020-02-07 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
| CN111128759A (en) * | 2019-12-18 | 2020-05-08 | 中国科学院微电子研究所 | Integrated circuit chip heat dissipation structure, preparation method thereof and three-dimensional device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
| US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
| CN2494036Y (en) * | 2001-07-27 | 2002-05-29 | 王文瑞 | Heat sink assembly |
| US6533029B1 (en) * | 2001-09-04 | 2003-03-18 | Thermal Corp. | Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| JP2004028406A (en) * | 2002-06-24 | 2004-01-29 | Namiki Precision Jewel Co Ltd | Heat pipe and heat spreader |
| CN2591775Y (en) * | 2002-12-06 | 2003-12-10 | 威盛电子股份有限公司 | Thin flat heat pipe radiator |
| CN2596415Y (en) * | 2002-12-30 | 2003-12-31 | 新渠热传导技术应用开发(大连)有限公司 | Heat pipe type microprocessor radiator |
-
2004
- 2004-07-14 CN CNB200410069738XA patent/CN100401864C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137846A (en) * | 2011-11-25 | 2013-06-05 | 财团法人工业技术研究院 | Soaking structure, manufacturing method thereof and heat dissipation module with soaking structure |
| CN110769654A (en) * | 2019-10-30 | 2020-02-07 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
| CN110769654B (en) * | 2019-10-30 | 2020-09-22 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
| CN111128759A (en) * | 2019-12-18 | 2020-05-08 | 中国科学院微电子研究所 | Integrated circuit chip heat dissipation structure, preparation method thereof and three-dimensional device |
| CN111128759B (en) * | 2019-12-18 | 2022-02-22 | 中国科学院微电子研究所 | Integrated circuit chip heat dissipation structure, preparation method thereof and three-dimensional device |
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| CN100401864C (en) | 2008-07-09 |
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