TW201420986A - Method for manufacturing ultra-thin vapor chamber and ultra-thin vapor chamber manufactured therefrom - Google Patents

Abstract

The present invention discloses a method for manufacturing an ultra-thin vapor chamber, comprising the following steps: providing a first plate, a second plate, an adhesive member, a filling tube and a working fluid, wherein the surface of the adhesive member is provided with a first metal layer; subjecting the first plate to a treatment for forming a first flow path inwardly recessed; overlapping the first plate, the adhesive member and the second plate in sequence; then melting the first metal layer to adhere the first plate, the adhesive member and the second plate integrally; forming a receiving space inside; and finally, filling the receiving space with the working fluid and sealing it thereafter. Because a micro-structure is employed to design the first flow path, and the adhesive member is used to adhere the first plate and the second plate, the present invention can significantly reduce the thickness of the finished product, and can take into account the cooling effect.

Description

Ultra-thin isothermal plate manufacturing method and ultra-thin isothermal plate made thereof

The present invention belongs to the technical field of a heat sink manufacturing method, and particularly relates to an ultra-thin isothermal plate manufacturing method which is structurally innovative and can effectively reduce the thickness and an ultra-thin isothermal plate produced therefrom.

According to the technology of the semiconductor industry, the size of electronic components such as Central Processing Unit (CPU), Graphics Processing Units (GPU) and high-power LED chips is getting smaller and smaller. However, the heat generation in use is getting higher and higher, and the heat flux per unit area is getting larger and larger. In order to maintain the operation of these electronic components under the permissible temperature, the most common method is to combine these electronic components. A variety of different types of heat sinks for heat dissipation.

A uniform type of heat sink has the advantages of high thermal conductivity, high heat transfer capability, simple structure, light weight and no power consumption. It is in line with the heat dissipation requirements of these electronic components, and in recent years, electronic products have gradually With the trend of thinness and lightness, the application range of the uniform temperature plate is also more extensive and popular. Please refer to Figure 1 for a schematic diagram of the structure of a conventional temperature equalizing plate. As shown in the figure, the structure of the temperature equalizing plate 1 mainly comprises a casing 11, a capillary structure 12 and a working fluid 13, wherein the casing 11 comprises an upper plate 111 and a lower plate 112, the upper plate 111 and the periphery of the lower plate 112 are integrally joined by punching, and the capillary structure 12 is disposed in the casing. The inner surface of 11 (i.e., the surface opposite the upper plate 111 and the lower plate 112) is filled with the working fluid 13 in the casing 11. In use, the heat-generating portion of the casing 11 in contact with the electronic components is an evaporation zone, and the non-contacting of the electronic components is a condensation zone, and the working fluid 13 located in the evaporation zone absorbs heat and evaporates into a gaseous state. The condensing zone cools and releases latent heat to return to a liquid state, and the working fluid 13 is directed back to the evaporation zone through the capillary structure 12 and gravity. In addition, in order to improve the heat dissipation efficiency and the strength during use, the temperature equalizing plate 1 is also provided with a plurality of heat conducting columns 113 between the upper plate 111 and the lower plate 112, which not only increases the heat conduction of the lower plate 112. The efficiency can also effectively improve the assembly strength of the housing 11.

However, the capillary structure 12 is protruded from the metal powder by the high-temperature sintering process on the inner surface of the casing 11, and since the shape is complicated and the height is different, and the space required for the working fluid 13 to flow is required, When the upper plate 111 and the lower plate 112 of the casing 11 are joined, a thicker plate material is required to achieve a stable fixing effect; further, the heat dissipation cylinders 113 must be fixed in an appropriate manner. Inside the housing 11. In summary, therefore, the thickness of the conventional uniform temperature plate 1 after molding is more than 2.8 mm, and the weight thereof is also greatly increased, resulting in a limited range of subsequent applications.

In view of this, one of the purposes of this creation is to provide a super A thin uniform temperature plate manufacturing method for producing the ultra-thin isothermal plate having a thickness of 0.5 mm to 2.8 mm for use in conjunction with a heating element to rapidly dissipate heat generated by the heating element, the ultra-thin The tempering plate manufacturing process includes the following steps: providing a first plate, a second plate, a bonding member, a filling tube and a working fluid, wherein the surface of the bonding member is provided with a first metal layer; One side of the first plate is processed to be provided with a first flow path, and the first flow path is staggered; the first plate, the adhesive member, the filling tube and the second plate are sequentially laminated; melting the first The metal layer is formed by bonding the first plate, the adhesive member, the filling tube and the second plate together, and forming an accommodating space therein; and filling the working fluid in the accommodating space, and filling the space Set the space to close it.

In one embodiment, the method for fabricating the ultra-thin isothermal plate of the present invention is to face one of the second plates before the step of “stacking the first plate, the bonding member and the second plate in sequence” A second flow path is provided for processing, and the second flow path is also staggered, and the first flow path and the second flow path are oppositely disposed.

In one embodiment, the method for fabricating the ultra-thin isothermal plate of the present invention provides a plurality of thermally conductive columns before the step of “stacking the first plate, the bonding member and the second plate in sequence”. And a second metal layer is disposed on the outer surface of the heat conducting column, and the heat conducting columns are disposed between the first plate and the second plate.

In an embodiment, the ultra-thin isothermal plate of the creation is made. In the process of "filling the working fluid in the accommodating space and closing the accommodating space", vacuuming is performed simultaneously.

The second objective of the present invention is to provide an ultra-thin isothermal plate obtained by the above-mentioned manufacturing method, which adopts a thinned plate material and an adhesive structure having a metal layer for bonding on the surface, and the inside of the plate The surface is provided with an inwardly concave flow path structure, which effectively reduces the thickness of the assembled body and ensures the flow space when the working fluid is used.

A further object of the present invention is to provide an ultra-thin isothermal plate, which further utilizes a plurality of thermally conductive columns having a metal layer for bonding on the surface, thereby improving the thermal conductivity and assembly strength.

Another object of the present invention is to provide an ultra-thin temperature-averaging plate which is provided with a guide groove structure adjacent to the heat-conducting column and the bonding portions of the bonding members to avoid the molten state. When the metal layer flows into the flow path and affects the heat dissipation effect, the yield during assembly can be effectively improved.

In order to achieve the above object, the ultra-thin isothermal plate of the present invention comprises: a first plate having a first flow path on one side and a heat-fitting element on the other side, the first flow path being staggered a second plate disposed on the first plate having one side of the first flow path; an adhesive member disposed between the first plate and the second plate, the adhesive member corresponding to the first plate and a frame-shaped structure formed by the second plate, the surface of the bonding member is provided with a a first metal layer, the first metal layer is melted and adhered to the first plate and the second plate, respectively, such that an inner space is formed in the first plate, the second plate and the adhesive member; a filling tube is disposed between the first plate and the second plate, and the filling pipe is in communication with the accommodating space; and a working fluid is filled in the accommodating space through the filling pipe, The filling tube closes the outer opening after filling, so that the working fluid can flow in the first flow path.

Wherein the first metal layer is electroplated, coated or chemically disposed on the surface of the bonding member, and the material of the first metal layer is selected from one of nickel, tin or copper, and is melted and used as The bonding application is used to bond the first plate, the bonding member and the second plate together.

In an embodiment, the ultra-thin isothermal plate of the present invention further has a second flow path disposed on one side of the second plate so that the first flow path is opposite to the second flow path to enhance Cooling efficiency.

In an embodiment, the ultra-thin isothermal plate of the present invention further has a plurality of heat conducting columns, and the surface of the heat conducting columns is provided with a second metal layer which is melted to be capable of the two ends of the heat conducting columns. Adhesively bonded to the inner surfaces of the first plate and the second plate, respectively.

In addition, the first flow channel and the second flow channel of the present invention are corresponding to the adhesive member and the heat conducting columns, and a plurality of first guiding channels and a plurality of second guiding grooves are respectively provided for filling The first metal layer and the second metal layer in a molten state.

In order for your review board to have a clear understanding of the content of this creation, please refer to the following description only.

Please refer to Figures 2, 3-9 and 10 for a flow chart of the steps of the preferred embodiment of the present invention and a schematic diagram of the state of the corresponding steps, and a cross-sectional view thereof after assembly. As shown in the figure, the author creates an ultra-thin isothermal plate 2 according to the operation steps of the ultra-thin isothermal plate making method, and the operation steps are as follows:

S1: A first plate 21, a second plate 22, an adhesive member 23, a filling tube 24 and a working fluid 25 are provided. The surface of the bonding member 23 is provided with a first metal layer 231. It should be noted that the first metal layer 231 is plated, coated or chemically disposed on the surface of the adhesive member 23, and the material of the first metal layer 231 is selected from one of nickel, tin or copper. ,

S2: etching a surface of the first plate member 21 to form a first flow path 211, and the first flow path 211 is staggered. The shape of the first flow path 211 is such that a plurality of rays 2111 are radiated outwardly at the most concentrated heat, and a plurality of side lines 2112 are connected between the two adjacent rays 2111, so that the first flow path 211 is connected. The system is in a state of mutual circulation, but its shape is not limited to this.

S3: etching a surface of the second plate 22 to form a second flow path 221, wherein the second flow path 221 is staggered, and the first flow path 211 and the second flow path 221 are oppositely disposed. The shape design of the second flow path 221 is the same as that of the first flow path 211, and thus no further details are provided herein. It should be noted that the first flow channel 211 and the second flow channel 221 of the preferred embodiment of the present invention are formed by physical etching or chemical etching, and may be processed by other mechanical processes such as laser engraving. It is made, so it should not be limited to this.

S4: A plurality of heat conducting columns 26 are provided, and a surface of the heat conducting columns 26 is provided with a second metal layer 261. The second metal layer 261 is formed on the surface of the heat conducting columns 26 by electroplating, coating or chemically, and is also selected from nickel, tin or copper. One.

S5: The first plate 21, the adhesive member 23, the filling tube 24 and the second plate 22 are sequentially stacked, and the heat conducting columns 26 are disposed between the first plate and the second plate. Wherein, the first plate 21 has one of the first flow channels 211 facing upward, and the adhesive member 23, the filling tube 24 and the heat conducting columns 26 are sequentially laminated, and finally the second plate 22 is covered. In the uppermost portion, the adhesive member 23, the filling tube 24 and the heat conducting columns 26 are interposed between the first plate member 21 and the second plate member 22.

S6: melting the first metal layer 231 and the second metal layer 261 to integrate the first plate 21, the bonding member 23, the filling tube 24, the heat conducting columns 26 and the second plate 22, and Form an accommodation space inside. Since the melting points of the first metal layer 231 and the second metal layer 261 are lower than the first plate 21, the After the bonding member 23 and the second plate 22 are heated or applied with high energy, the first metal layer 231 and the second metal layer 261 may be melted and present in a molten state for filling the first plate 21 . The gap between the second plate 22, the adhesive member 23, and the thermally conductive columns 26 and the like can be stabilized after returning to normal temperature to achieve the effect of bonding. It should be noted that, in order to prevent the first metal layer 231 and the second metal layer 261 from flowing into the first flow channel 211 and the second flow channel 221 when the first metal layer 231 and the second metal layer 261 are in a molten state, the first flow channel is blocked. 211 and the second flow channel 221 are respectively disposed at positions corresponding to the heat conducting columns, and a plurality of first guiding channels 2113 and a plurality of second guiding grooves 2211 are respectively disposed to fill the first metal layer in a molten state. 231 and the second metal layer 261.

S7: filling the working fluid 25 in the accommodating space, and closing the accommodating space. The working fluid 25 is injected into the accommodating space through the filling tube 24, and finally the nozzle of the filling tube 24 is closed.

S7-1: Vacuuming is performed simultaneously. While filling the working fluid 25, the accommodating space is evacuated through the filling tube 24, so that the boiling point of the working fluid 25 is lowered, and the heat dissipation efficiency can be further improved.

As shown in FIG. 10, the ultra-thin isothermal plate 2 of the present invention includes the first plate 21, the second plate 22, the adhesive member 23, the filling tube 24, the working fluid 25, and the heat-conducting columns. 26, after the steps of the above production method are completed.

The first plate 21 is made of copper metal. One of the first plates 21 is provided with a first flow path 211, and the other surface is attached to the heating element 3. The first flow path 211 is staggered. .

The second plate 22 is also made of copper metal, and the second plate 22 is opposite to the first plate 21 and has one side of the first flow path 211.

The adhesive member 23 is disposed between the first plate member 21 and the second plate member 22. The adhesive member 23 is a frame-shaped structure corresponding to the outer contour of the first plate member 21 and the second plate member 22. The surface of the adhesive member 23 is provided with a first metal layer 231 (the material of the first metal layer 231 is not copper), and the first metal layer 231 is heated to form a molten state for bonding to the first metal layer 231. On one side of the first plate 21 and the second plate 22, an accommodating space (not shown) is formed in the interior of the first plate 21, the second plate 22, and the bonding member 23.

The filling tube 24 is disposed together with the adhesive member 23 between the first plate member 21 and the second plate member 22, and is fixed together by the fixing effect of the bonding member 23; the filling tube 24 is coupled thereto. The accommodation space is connected.

The working fluid 25 is filled in the accommodating space through the filling tube 24, and the filling tube 24 closes the outer opening after the filling is completed, so that the working fluid 25 can be performed in the accommodating space and the first flow path 211. flow.

The heat transfer columns 26 are cylindrical bodies made of a metal material having a good thermal conductivity, and the shape thereof is not limited to a cylindrical shape, and may be a columnar body or a tube body of other shapes, and the heat transfer columns 26 may be used. The surface of the heat-conducting column 26 is provided with a second metal layer 261 which is melted to bond the two ends thereof to the first plate 21 and the second plate 22, respectively. surface.

However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, it is common knowledge in the technical field or equivalent or easy to be familiar with the technology. The changes and modifications made by the changer without departing from the spirit and scope of this creation shall be covered by the scope of this creation.

[Practical]

1‧‧‧Wall plate

11‧‧‧Shell

111‧‧‧Upper board

112‧‧‧ Lower board

113‧‧‧thermal column

12‧‧‧Muscle tissue

13‧‧‧Working fluid

[This creation]

S1~S7-1‧‧‧Steps

2‧‧‧Ultra-thin isothermal plate

21‧‧‧ first plate

211‧‧‧First runner

2111‧‧‧ray

2112‧‧‧ Sideline

2113‧‧‧First guide channel

22‧‧‧Second plate

221‧‧‧Second runner

2211‧‧‧Second guide channel

23‧‧‧Adhesive parts

231‧‧‧First metal layer

24‧‧‧fill tube

25‧‧‧Working fluid

26‧‧‧thermal column

261‧‧‧Second metal layer

3‧‧‧heating components

Figure 1 is a schematic view showing the structure of a conventional temperature equalizing plate.

Figure 2 is a flow chart showing the steps of the preferred embodiment of the present invention.

Fig. 3 is a schematic diagram showing the state corresponding to step S1.

Fig. 4 is a schematic view showing the state corresponding to step S2.

Fig. 5 is a schematic view showing the state corresponding to step S3.

Fig. 6 is a schematic diagram showing the state corresponding to step S4.

Fig. 7 is a schematic diagram showing the state corresponding to step S5.

Fig. 8 is a schematic view showing the state corresponding to step S6.

Figure 9 is a schematic diagram showing the states corresponding to steps S7 and S7-1.

Figure 10 is a cross-sectional view of the preferred embodiment of the present invention assembled.

S1~S7-1‧‧‧Steps

Claims (10)

The invention relates to a method for manufacturing an ultra-thin isothermal plate, wherein the ultra-thin isothermal plate has a thickness of 0.5 mm to 2.8 mm, and is used for laminating with a heating element to quickly dissipate heat generated by the device, including Providing a first plate, a second plate, an adhesive member, a filling tube and a working fluid, wherein a surface of the adhesive member is provided with a first metal layer; and a surface of the first plate is processed to provide a a first flow path, wherein the first flow path is staggered and recessed on the surface of the first plate; the first plate, the adhesive member, the filling tube and the second plate are sequentially laminated; and the first metal is melted The layer is formed by integrating the first plate, the bonding member, the filling tube and the second plate, and forming an accommodating space therein; and filling the working fluid in the accommodating space, and accommodating the accommodating space Closed. The method for manufacturing an ultra-thin isothermal plate according to claim 1, wherein one of the second plates is before the step of "stacking the first plate, the bonding member and the second plate in sequence" The processing is performed to provide a second flow path, and the second flow path is staggered, and the first flow path and the second flow path are disposed opposite to each other. The method for manufacturing an ultra-thin isothermal plate according to claim 1, wherein a plurality of thermally conductive columns are provided before the step of "stacking the first plate, the bonding member and the second plate in sequence". And a second metal layer is disposed on the outer surface of the heat conducting column, and the heat conducting columns are disposed between the first plate and the second plate. The method for manufacturing an ultra-thin type uniform temperature plate according to the first aspect of the patent application, in the process of "filling the working fluid in the accommodating space and closing the accommodating space", simultaneously performing vacuuming . An ultra-thin isothermal plate produced by the method for manufacturing an ultra-thin isothermal plate according to claim 1, comprising: a first plate having a first flow path on one side and the other side on the other side Attaching to the heating element, the first flow channel is staggered; a second plate is disposed on the first plate having one side of the first flow path; an adhesive member is disposed on the first plate and the Between the second plates, the adhesive member is a frame-shaped structure formed corresponding to the first plate and the second plate, and the surface of the adhesive member is provided with a first metal layer to melt the first metal layer. And respectively, the first plate and the second plate are respectively formed with an accommodating space; a filling tube is disposed on the first plate and the first plate Two plates And the filling pipe is connected to the accommodating space; and a working fluid is filled in the accommodating space through the filling pipe, and the filling pipe closes the outer opening after filling, so that the working fluid Flow can be performed in the first flow path. The ultra-thin temperature equalizing plate according to claim 5, wherein the first metal layer is electroplated, coated or chemically disposed on the surface of the bonding member. The ultra-thin isothermal plate according to claim 5 or 6, wherein the first metal layer is one selected from the group consisting of nickel, tin or copper. The ultra-thin isothermal plate according to claim 5, further comprising a second flow path disposed on one side of the second plate such that the first flow path is opposite to the second flow path. The ultra-thin isothermal plate according to claim 5 or 8, further comprising a plurality of heat conducting columns, wherein the surface of the heat conducting columns is provided with a second metal layer, and the two ends of the heat conducting columns are respectively connected And an inner surface of the first plate and the second plate. The ultra-thin type temperature equalizing plate according to claim 9, wherein the first flow channel and the second flow channel are corresponding to the adhesive member and the heat conducting columns, and the plurality of first diversion flows are respectively provided. The groove and the plurality of second flow guiding grooves are filled with the first metal layer and the second metal layer in a molten state.