CN1722394A - Processing method for forming electrode on plate-shape article - Google Patents
Processing method for forming electrode on plate-shape article Download PDFInfo
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- CN1722394A CN1722394A CN 200510074350 CN200510074350A CN1722394A CN 1722394 A CN1722394 A CN 1722394A CN 200510074350 CN200510074350 CN 200510074350 CN 200510074350 A CN200510074350 A CN 200510074350A CN 1722394 A CN1722394 A CN 1722394A
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- 238000003672 processing method Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 79
- 229920005989 resin Polymers 0.000 claims abstract description 79
- 238000005520 cutting process Methods 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 238000004090 dissolution Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 64
- 230000007246 mechanism Effects 0.000 description 23
- 241000196324 Embryophyta Species 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
To provide the working method of an electrode formed so as to be a plate type object capable of preventing the generation of burs and the stagnation of cutting waste between electrodes. The working method of a plurality of electrodes formed so as to be projected from the surface of the plate type object comprises a resin layer coating process for applying a resin layer on the surface of the plate type object by a resin soluble by a solvent, a cutting process for cutting a plurality of electrodes formed so as to be projected from the surface of the plate type object coated by a resin layer together with the resin layer to align the heights of the electrodes, and a resin layer removing process for resolving and removing the resin layer applied on the surface of the plate type object after finishing the cutting process, by a solvent.
Description
Technical field
The present invention relates to make the processing method of the height unanimity of the outstanding a plurality of electrodes that form on the surface of plate objects such as semiconductor chip.
Prior art
The semiconductor wafer that will be formed with a plurality of chips by cutter sweep is divided into semiconductor chip one by one, and these semiconductor chips that are split to form are widely used in the electronic equipments such as portable phone and personal computer.
In recent years, realize lightweight, miniaturization in order to make electronic equipment, developed the projected electrode that on the electrode of semiconductor chip, forms the overshooting shape of 50～100 μ m, and this projected electrode directly has been engaged to semiconductor chip electrode, that be called flip-chip and the input application that forms on the installation base plate.In addition, be called as keyset (イ Application one Port one ザ one) thus substrate on be set up in parallel the technology that semiconductor chip carries out stacked realization miniaturization and also be developed and drop into application.
However, above-mentioned every technology forms the projected electrode of a plurality of overshooting shapes at the substrate surface of semiconductor chip etc., is bonded with each other together for the electrode by this overshooting shape makes substrate, must make the height unanimity of the projected electrode of overshooting shape.Be the height unanimity of the projected electrode that makes this overshooting shape, though can use general grinding, its service behaviour is relatively poor and need for a long time.
In addition, as the technology that on the substrate surface of semiconductor chip etc., forms a plurality of overshooting shape projected electrodes, has column ball (ス Star De バ Application プ) forming method, this forming method is, after the tip of silk threads such as heating and melting gold forms soldered ball, this soldered ball is applied ultrasonic wave and uses hot press on the electrode of semiconductor chip, make the head fracture of soldered ball.Because the projected electrode that is formed by the spherical established law of this column can produce the silk that touches of needle-like making the fracture of soldered ball head through hot press when, so grinding ratio difficulty, the plate after heating by being pressed on the projected electrode, can be made the height unanimity of projected electrode.(for example with reference to patent documentation 1)
Patent documentation 1: Japanese Patent Application Laid-Open 2001-53097 communique
However, with the plate after the heating by being pressed on the projected electrode so that the height of projected electrode when consistent, in the head fragmentation of projected electrode, can occur and the such problem of adjacent projected electrode short circuit.In order to eliminate this problem, in the invention of in above-mentioned communique, putting down in writing, be provided with the extra operation of the point of removing projected electrode.
In order to eliminate the problems referred to above, the applicant has proposed the processing unit (plant) that the point by cutting outstanding a plurality of electrodes that form on the plate object surface is removed in Japanese patent application 2003-110536.
In addition, when the cutting projected electrode, at projected electrode is to be had under the formed situation of metal of stickiness by gold etc., produce burr (バ リ), this burr makes between the projected electrode and is short-circuited, cutting swarf accumulates in and also makes the projected electrode short circuit between the projected electrode, and produces cutting swarf and come off cause the new problem that electrical characteristic worsens on installation base plate.
Summary of the invention
The present invention makes in view of the above fact, and the major technology problem that it will solve provides a kind of processing method of the electrode that forms on plate object, and it can not produce burr, and can prevent that cutting swarf from accumulating between the electrode.
In order to solve above-mentioned major technology problem, provide in the present invention carrying out method for processing, it is characterized in that comprising: used resin bed lining operation by resin coated with resin layer on the surface of this plate object of dissolution with solvents at the outstanding a plurality of electrodes that form in plate object surface; The outstanding a plurality of electrodes that form on this plate object surface of this resin bed that has been covered are cut and make its highly consistent cutting process together with this resin bed; After this cutting process finishes, remove the resin bed that is overlayed on lip-deep this resin bed of this plate object and remove operation by dissolution with solvents.
In above-mentioned resin bed lining operation, on the plate object surface, apply liquid resin, elapsed time and after hardening, form resin bed.In addition, above-mentioned resin bed is formed by water-soluble resin, above-mentioned resin bed remove operation preferably water dissolving remove resin bed.
According to the present invention, in the cutting process that the outstanding a plurality of electrodes that form cut on to the plate object surface, owing to cut together with in resin bed lining operation, overlaying on the lip-deep resin bed of plate object, therefore can not generate burr, and owing to be formed with resin bed between electrode, so cutting swarf can not accumulate between the electrode.In addition, overlayed on the lip-deep resin bed of plate object owing to remove in the operation to have removed by dissolution with solvents at resin bed, though therefore in cutting process cutting swarf also can be removed attached on the resin layer surface together with resin bed.
Description of drawings
Fig. 1 is the plane graph as the semiconductor wafer of the machined object that is made of plate object.
Fig. 2 is the key diagram that forms the spherical established law of column of projected electrode on a plurality of semiconductor chips that are arranged on the semiconductor wafer shown in Figure 1.
Fig. 3 is the oblique view that expression makes the state on the annular frame that remains on as the semiconductor chip of the machined object that is made of plate object.
Fig. 4 is the oblique view that expression makes the state on the support substrate that is supported in as the semiconductor chip of the machined object that is made of plate object.
Fig. 5 is the key diagram that the electrode that forms is carried out resin bed lining operation in the method for processing on plate object according to the present invention.
Fig. 6 is the amplification sectional view of major part of semiconductor wafer that is formed with the tabular machined object of conduct of resin bed by resin bed shown in Figure 5 lining operation.
Fig. 7 is an embodiment of the processing unit (plant) of enforcement cutting process in the method for processing is carried out in expression to the electrode that forms on plate object according to the present invention a oblique view.
Fig. 8 is the oblique view that is illustrated in an embodiment of the cutting unit that has in the processing unit (plant) shown in Figure 7.
Fig. 9 is the oblique view that is illustrated in another embodiment of the cutting unit that has in the processing unit (plant) shown in Figure 7.
Figure 10 is illustrated in the chuck table mechanism that has in the processing unit (plant) shown in Figure 7 and the oblique view of chuck table travel mechanism.
Figure 11 is to use the key diagram of the cutting process of cutting unit enforcement shown in Figure 8.
Figure 12 is to use the key diagram of the cutting process of cutting unit enforcement shown in Figure 9.
Figure 13 has carried out implementing in the method for processing behind the cutting process amplification sectional view as the major part of the semiconductor wafer of machined object according to the present invention to the electrode that forms on plate object.
Figure 14 has carried out implementing in the method for processing resin bed according to the present invention to the electrode that forms to remove after the operation amplification sectional view as the major part of the semiconductor wafer of machined object on plate object.
Embodiment
Following with reference to the preferred embodiment of accompanying drawing detailed description according to the processing method of the electrode that on plate object, forms of the present invention.
Fig. 1 shows according to the present invention as the semiconductor wafer 10 of the tabular machined object after the processing.Semiconductor wafer 10 shown in Figure 1 is formed with a plurality of semiconductor chips 110 with matrix shape in its surface.On the surface of a plurality of semiconductor chips 110 that form on this semiconductor wafer 10, form a plurality of columnar protrusions electrodes 120 respectively.This columnar protrusions electrode 120 forms by the spherical established law of for example column.Promptly, shown in Fig. 2 (a), after the point heating and melting that makes the spun gold 121 that inserts capillary 15 with electric torch by discharge forms soldered ball 122, on the battery lead plate 111 that is made of for example aluminium etc. that uses ultrasonic wave and this soldered ball 122 is bonded in form on the semiconductor chip 110 as Fig. 2 (b) shown in hot pressing, the head of soldered ball 122 ruptures.A plurality of columnar protrusions electrodes 120 of Xing Chenging are in the residual state that has needle-like to touch silk shown in Fig. 2 (c) thus, and it is highly uneven simultaneously.
Then, with reference to Fig. 3 and Fig. 4 other embodiment of machined object is described.
In Fig. 3 and embodiment shown in Figure 4; machined object is the semiconductor chip 110 that above-mentioned semiconductor wafer 10 is divided into one by one; in Fig. 3; be equipped with protective tapes 17 on the ring-shaped frame 16; on this protective tapes 17, be pasted with a plurality of semiconductor chips 110; in Fig. 4, on support substrate 18, a plurality of semiconductor chips 110 have been pasted by for example two-sided tape.In addition, on the surface of semiconductor chip 110, be formed with a plurality of columnar protrusions electrodes 120.
Below, the method for processing of the outstanding a plurality of electrodes that form on the surface of above-mentioned tabular machined object is described.In addition, with as above-mentioned semiconductor wafer illustrated in figures 1 and 2 10 describe as machined object.
At first, be implemented in resin bed lining operation as coated with resin layer on the surface of the semiconductor wafer 10 of plate object.In illustrated embodiment, this resin bed lining operation is to implement by spinner 1 as shown in Figure 5.Spinner 1 has chuck table 1a and jet pipe 1b, and chuck table 1a has the attraction holding device, and jet pipe 1b is configured in the top of this chuck table 1a central part.On the chuck table 1a of this spinner 1, carry semiconductor wafer 10,, make semiconductor wafer 10 attract to remain on the chuck table 1a by the effect of not shown attraction holding device.At this moment, semiconductor wafer 10 surfaces upwards are carried on rear side.Then, on one side rotating chuck platform 1a liquid resin is dripped to the central portion on semiconductor wafer 10 surfaces from jet pipe 1b, thus, liquid resin is owing to centrifugal force flows to outer peripheral portion.On the surface of semiconductor wafer 10, flow to the resin of peripheral part like this, elapsed time and hardening, form the resin bed 130 on lining semiconductor wafer 10 surfaces as shown in Figure 6.In addition, as the resin of lining semiconductor wafer surface, the resin that its use can be removed by dissolution with solvents it is desirable to the water-soluble resins such as polyethylene glycol that can remove by water especially.
If implemented resin bed lining operation as described above, just can implement the outstanding a plurality of electrodes that form on the plate object surface of resin bed that has been covered are cut together with resin bed so that the cutting process of electrode height unanimity.This cutting process is to implement by processing unit (plant) shown in Figure 7.Processing unit (plant) in the illustrated embodiment has the device case by Reference numeral 2 whole expressions.Device case 2 has main part 21 and upstanding wall 22, and main part 21 is rectangular shapes of elongated extension, and upstanding wall 22 is arranged on the rearward end (upper right side among Fig. 7) of this main part 21 and substantially perpendicularly extends upward.The leading flank of this upstanding wall 22 is provided with the pair of guide rails 221,221 of direction extension up and down.On this a pair of guide rail 221,221 cutting unit 3 is installed, this cutting unit 3 can move up at upper and lower.
Topping machanism 3 has mobile base station 31 and axle unit 32, and axle unit 32 is installed in this and moves on the base station 31.The both sides of mobile base station 31 its back are provided with a pair of foot section 311,311 that direction is up and down extended, and are formed with the guide-track groove 312,312 that can be slidingly fastened with above-mentioned pair of guide rails 221,221 on this a pair of support 311,311.Mobile like this base station 32 is slidably mounted on the upstanding wall 22 on the pair of guide rails 221,221 that is provided with, and on this moves the front face side of base station 32 holding components 313 is housed, and axle unit 32 is installed on this holding components 313.
Axle unit 32 has axle housing 321, mandrel 322 and servo motor 323, its central shaft housing 321 is assemblied on the holding components 313, mandrel 322 is provided on this axle housing 321 free to rotately, and servo motor 323 is as driving the drive source that mandrel 322 rotates.Give prominence to the lower ends downward side that axle housing 321 is crossed in the bottom of mandrel 322, is provided with the instrument installing component 324 of circular plate shape in its lower end, and the cutter tip 33 as cutting tools releasably is installed on this instrument installing component 324.
At this, cutter tip 33 is described to the structure that instrument installing component 324 loads and unloads with reference to Fig. 8.
Then, with reference to Fig. 9 other embodiment of instrument installing component that above-mentioned cutter tip 33 is installed is described.
Return Fig. 7 and continue to describe, the processing unit (plant) in the illustrated embodiment has makes above-mentioned cutting unit 3 at the mobile cutting unit connecting gear 4 of above-below direction (with the perpendicular direction of the stationary plane of chuck table described later) along above-mentioned pair of guide rails 221,221.This cutting unit connecting gear 4 has the external thread rod 41 that perpendicular is extended on the front side that is arranged on upstanding wall 22.These external thread rod 41 its upper ends and bottom are by be installed in the parts of bearings 42 and 43 and supported on the upstanding wall 22 free to rotately.Be equipped with in the above-mentioned parts of bearings 42 as the impulse motor 44 that is used to drive the drive source that external thread rod 41 rotates, the output shaft of this impulse motor 44 is in transmission connection to external thread rod 41.On the back of mobile base station 31, also form from the rearwardly projecting link (not shown) of the middle body of its Width, be formed with on this connecting portion and extend the internal thread hole that connects in vertical direction, above-mentioned external thread rod 41 can be screwed in this perforation internal thread hole.Thus, when impulse motor 44 was just changeing, mobile base station 31 was that cutting unit 3 descends, and promptly advanced, and when impulse motor 44 reversings, mobile base station 31 is that cutting unit 3 rises, and promptly retreats.
Continue to describe with reference to Fig. 7 and Figure 10, on the main part 21 of housing 2 latter half of, be formed with the processing operation part 211 that is roughly rectangle, on this processing operation part 211, be equipped with chuck table mechanism 5.This chuck table mechanism 5 has the chuck table 52 of supporting base station 5 and circular plate shape, and the center of rotation axis that this chuck table 52 is extended with perpendicular is that the center is provided on this support base station 51 free to rotately.Support that base station 51 can be carried on pair of guide rails 23 with being free to slide, on 23, and this is to guide rail 23,23 extend on the arrow 23a of fore-and-aft direction (perpendicular to the direction of upstanding wall 22 leading flanks) on the above-mentioned processing operation part 211 and the direction shown in the 23b, the chuck table travel mechanism 56 that this support base station 51 can will be described by the back sends to send between zone 24 (among Figure 10 with the shown position of solid line) and the machining area 25 relative with the cutting tools 33 that constitutes above-mentioned axle unit 32 (among Fig. 9 with the shown position of double dot dash line) at machined object shown in Figure 7 and moves.
Above-mentioned chuck table 52 has the loading end 52a of carrying machined object in the above, and free to rotate being supported on the above-mentioned support base station 51.This chuck table 52 can be rotated by servo motor 53, and this servo motor 53 is connected on the rotation axis (not shown) that chuck table 52 installs below.In addition, chuck table 52 is made of the suitable like this porous material of the pottery of porous, and is connected to not shown suction device.Thus, by chuck table 52 selectively is communicated to not shown suction device, can attract fixedly to be carried on the machined object on the loading end 52.In addition, illustrated chuck table mechanism 5 has that be adapted to can be with the cover 54 (referring to Fig. 1) of supporting that base station 51 moves, and this cover 54 has the hole of inserting chuck table 52, and covers above-mentioned support base station 51 etc.
Continue to describe with reference to Figure 10, the processing unit (plant) in the illustrated embodiment have can make above-mentioned chuck table mechanism on the direction shown in arrow 23a and the 23b along chuck table travel mechanism 56 that pair of guide rails 23,23 moves.Chuck table travel mechanism 56 has external thread rod 561 and servo motor 562, and external thread rod 561 is provided between the pair of guide rails 23,23, and parallels extension with guide rail 23,23, and servo motor 562 drives this external thread rod 561 and rotates.External thread rod 561 and the screwed hole 511 that is provided with on above-mentioned support base station 51 are screwed, and its point is supported to the parts of bearings 563 of pair of guide rails 23,23 by connection free to rotately.The cardinal extremity of the driving shaft of servo motor 562 and external thread rod 561 is in transmission connection.Correspondingly, when servo motor 562 is just changeing, support that base station 51 is that chuck table mechanism 5 moves on the direction shown in the arrow 23a, when servo motor 562 reversings, support that base station 51 is that chuck table 5 mechanisms move on the direction shown in the arrow 23b.The chuck table mechanism 5 that moves on the direction shown in arrow 23a and the 23b selectively is positioned at the machined object of representing with realization among Fig. 4 and sends in the machining area of sending the zone and representing with double dot dash line.In addition, chuck table mechanism 5 can be in machining area in preset range along the direction shown in arrow 23a and the 23b, promptly with direction that stationary plane 52a parallels on reciprocating motion.
Returning Fig. 7 continues to describe; both sides at the moving direction of the support base station 51 that constitutes above-mentioned chuck table mechanism 5; as shown in Figure 7, be provided with the fold protective cover 57 and 58 that its shape of cross section is down channel shaped and covers above-mentioned pair of guide rails 23,23 and external thread rod 561 and servo motor 562 etc.Fold protective cover 57 and 58 can be formed by the so suitable material of canvas.The front end of fold protective cover 57 is fixed on the front side wall of processing operation part 211, and the rear end is fixed on the front end face of cover 54 of chuck table mechanism 5.The front end of fold protective cover 58 is fixed on the rear end face of cover 54 of chuck table mechanism 5, and the rear end is fixed on the leading flank of upstanding wall 22 of housing 2.When the direction shown in the arrow 23a moved, fold protective cover 57 stretched and opens in chuck table mechanism 5, and fold protective cover 58 shrinks, and when the direction shown in the arrow 23b moved, fold protective cover 57 shrank in chuck table mechanism 5, and fold protective cover 58 can stretch and open.
On the first half in the main part 21 of said apparatus housing 2, be provided with first case load bearing component 6a, second case load bearing component 7a, the interim placing component 8a of machined object, clean parts 9a.On first case load bearing component 6a, carry first case of holding before the processing 6 of machined object, on second case load bearing component 7a, carry second case 7 of machined object after holding processing.The interim placing component 8a of above-mentioned machined object is provided with the interim apparatus for placing 8 of machined object, is used for the interim machined object of placing before the processing that sends out for first case 6 that carries at first case load bearing component 6a.In addition, the machined object after the processing being cleaned the decontaminating apparatus of handling 9 is configured on the clean parts 9a.
Between above-mentioned first case load bearing component 6a and second case load bearing component 7a, be provided with machined object conveyer 11, machined object before the processing of holding in first case 6 that this machined object conveyer 11 will carry on first case load bearing component 6a spreads out of to the interim apparatus for placing 8 of machined object, and the machined object after the processing that will clean by decontaminating apparatus 9 is sent in second the case 7 that carries on second case load bearing component 7a.Send to send between the zone 24 at the interim placing component 8a of above-mentioned machined object and machined object and be provided with machined object feeder 12, the machined object of this machined object feeder 12 before with the processing of carrying on the interim apparatus for placing 8 of machined object is sent to and is positioned at machined object and sends on the chuck table 52 of sending the chuck table mechanism 5 of zone on 24.Send to send between zone 24 and the clean parts 9a and be provided with machined object carrying device 13 sending the machined object of sending above-mentioned machined object to, this machined object carrying device 13 will be positioned at machined object and send machined object after the processing of being carried on the chuck table 52 of sending the chuck table mechanism 5 of zone on 24 to and be sent to and clean parts 9.
The processing unit (plant) shown in Figure 7 that constitutes more than using is implemented in the process of cutting process of the present invention, by implementing above-mentioned resin bed lining operation, there is the semiconductor wafer 10 of resin bed 130 to be contained in first the case 6 with surface-coated, is carried on for this first the case 6 on first case load bearing component 6a of device case 2.On the other hand, in second case load bearing component 7a of device case 2, carry free second the case 7.
The semiconductor wafer 10 as machined object that is contained in first case 6 is transmitted by the knee-action of machined object conveyer 11 and the action of advancing and retreat, and is carried on the interim apparatus for placing 8 of machined object.Be carried in semiconductor wafer 10 spinning movement by machined object feeder 12 this carries out center-aligned after of carrying on the interim apparatus for placing 8 of machined object and be arranged in machined object and send on the chuck table 52 of sending regional 24 chuck table mechanism 5.Semiconductor wafer 10 in carrying on the chuck table 52 attracts to be fixed on the chuck table 52 by not shown suction device.
If semiconductor wafer 10 is attracted to be fixed on the chuck table 52, make chuck table travel mechanism 56 (referring to Figure 10) action so, and chuck table mechanism 5 moves on direction shown in the arrow 23a, and making fixedly, the chuck table 52 of semiconductor wafer 10 is positioned in the machining area 25.If having fixed the chuck table 52 of semiconductor wafer 10 like this is positioned in the machining area 25, so implement a plurality of columnar protrusions electrodes 120 that will on semiconductor chip 110 surfaces that are arranged on the semiconductor wafer 10, form, the cutting process that the resin bed 130 that is covered cuts on the surface.
At first, with reference to Figure 11 the cutting process that the cutting unit 3 by above-mentioned Fig. 7 and embodiment shown in Figure 8 carries out is described.
Under the situation of the cutting unit 3 of Fig. 7 and embodiment shown in Figure 8, drive mandrel 322 and rotate, make the instrument installing component 324 that cutter tip 33 is installed in Figure 11 on the direction shown in the arrow, with the rotary speed rotation of for example 6000rpm.So cutting unit 3 descends, and cutter tip 33 is positioned at the predetermined carry of cutting puts.Then, chuck table 52 position shown in the solid line from Figure 11 of having fixed semiconductor wafer 10 is moved to the right with predetermined transfer rate.Here, transfer rate is under the situation of twenties μ m in the cutting width of the cutting blade 332 of cutter tip 33 for example, can be 2mm/ about second.So shown in double dot dash line among Figure 11, after the center that is fixed on the semiconductor wafer 10 on the chuck table 52 moved to the center of instrument installing component 324, cutting unit 3 rose.The result is, the cutting blade 332 of the cutting tools 33 that rotates by the rotation that is accompanied by mandrel 322, be arranged on the upper end that formed a plurality of columnar protrusions electrodes 120 are gone up on semiconductor chip 110 surfaces on the semiconductor wafer 10, cut with resin bed 130, make it highly consistent as shown in figure 13.Thus, because columnar protrusions electrode 120 and resin bed 130 be cut together so can not produce burr, and, owing between columnar protrusions electrode 120, form resin bed 130, so cutting swarf can not accumulate between the columnar protrusions electrode 120.In addition, above-mentioned cutting process is to implement by the DRY CUTTING method that cutting fluid is not provided when cutting.
Then, with reference to Figure 12 the cutting process that is undertaken by cutting unit embodiment illustrated in fig. 93 is described.
Under the situation of the cutting unit 3 of embodiment shown in Figure 9, at first, the mobile base station 31 that constitutes cutting unit 3 is descended, make the topping machanism of being installed on the instrument installing component 325 that is installed on the mobile base station 31 33 be positioned to the predetermined carry of cutting and put.Then, one side make be fixed with semiconductor wafer 10 chuck table 52 in Figure 12 shown in the arrow on the direction with the rotation of the rotary speed of for example 2000rpm, one side moves chuck table 52 position shown in the solid line from Figure 12 to the right with predetermined transfer rate.Transfer rate is under the situation of twenties μ m in the cutting width of the cutting blade 332 of cutter tip 33 for example, can be 0.6mm/ about second.In addition, shown in double dot dash line among Figure 12, the center of chuck table 52 moves to after the position that arrives cutter tip 33, and cutting unit 33 is risen.The result is, the cutting blade 332 by cutting tools 33 will be arranged on semiconductor chip 110 surfaces on the semiconductor wafer 10 and go up the upper ends of formed a plurality of columnar protrusions electrodes 120 and downcut with resin bed 130, make it highly consistent as shown in figure 13.In this embodiment, because columnar protrusions electrode 120 also is that all are cut so can not produce burr with resin bed 130, and, owing between columnar protrusions electrode 120, form resin bed 130, so cutting swarf can not accumulate between the columnar protrusions electrode 120.
As mentioned above, be arranged on semiconductor chip 110 surface on the semiconductor wafer 10 and go up after the cutting process of a plurality of columnar protrusions electrodes 120 that form and resin bed 130 finishes, cutting unit 3 is risen, the rotation of chuck table 52 stops.Then, chuck table 52 is moved in Fig. 7 on the direction shown in the arrow 23b, and be positioned at machined object and send to and send in the zone 24, remove the attraction of the semiconductor wafer after the cut on the chuck table 52 10 is fixed.Attract the semiconductor wafer 10 after fixed solution removes to be sent out, be sent to decontaminating apparatus 9 by machined object carrying device 13.
In illustrated embodiment, implement to deliver to the resin bed that resin bed 130 dissolvings that are covered on the surface of semiconductor wafer 10 of decontaminating apparatus 9 remove and remove operation by solvent.
That is the clean water that the semiconductor wafer 10 of delivering to decontaminating apparatus 9 is sprayed as solvent.In illustrated embodiment because the resin bed 130 that is covered is formed by water-soluble resin on semiconductor wafer 10 surfaces, therefore can by clean water-soluble separate and clean flow away.The result is that as shown in figure 14, the resin bed 130 that is covered on semiconductor wafer 10 surfaces is removed, and becomes the state that exposes projected electrode 120.Like this because the resin beds 130 that lining is gone up on semiconductor wafer 10 surface are removed behind the above-mentioned cutting process having implemented, even the cutting swarf therefore in the above-mentioned cutting process attached on the resin bed 130, also can be along with resin bed 130 is removed together.
Implementing after above-mentioned resin bed removes operation, the semiconductor wafer 10 that can will remove resin bed is contained in by machined object conveyer 11 on second case 7 the precalculated position.
Claims (3)
1. the processing method of an electrode that on the plate object surface, forms, it is processed outstanding a plurality of electrodes that form on the plate object surface, it is characterized in that this method comprises:
Resin bed lining operation is utilized the resin coated with resin layer on the surface of this plate object that dissolves by solvent;
Cutting process will be given prominence to a plurality of electrodes that form and cut together with this resin bed so that the electrode height unanimity on this plate object surface of this resin bed that has been covered;
Resin bed is removed operation, after this cutting process finishes, removes by dissolution with solvents and to be overlayed on lip-deep this resin bed of this plate object.
2. the processing method of the electrode that forms on the plate object surface as claimed in claim 1 is characterized in that: in this resin bed lining operation, apply liquid resin on this plate object surface, elapsed time and the back of hardening forms resin bed.
3. the processing method of the electrode that forms on the plate object surface as claimed in claim 1 or 2 is characterized in that: this resin bed is formed by water-soluble resin, and it is to remove this resin bed by water-soluble separating that this resin bed is removed operation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP159016/2004 | 2004-05-28 | ||
| JP2004159016A JP4373851B2 (en) | 2004-05-28 | 2004-05-28 | Method for processing electrode formed on plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1722394A true CN1722394A (en) | 2006-01-18 |
| CN100419981C CN100419981C (en) | 2008-09-17 |
Family
ID=35493797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100743503A Active CN100419981C (en) | 2004-05-28 | 2005-05-27 | Processing method for forming electrode on plate-shape article |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4373851B2 (en) |
| CN (1) | CN100419981C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522326A (en) * | 2011-12-14 | 2012-06-27 | 杭州立昂微电子股份有限公司 | Production method of semiconductor discrete device back side metal suitable for screen printing |
| CN108538824A (en) * | 2017-03-03 | 2018-09-14 | Tdk株式会社 | The manufacturing method of semiconductor chip |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008182015A (en) * | 2007-01-24 | 2008-08-07 | Disco Abrasive Syst Ltd | Method for grinding wafer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3007497B2 (en) * | 1992-11-11 | 2000-02-07 | 三菱電機株式会社 | Semiconductor integrated circuit device, its manufacturing method, and its mounting method |
| JP2003124240A (en) * | 2001-10-12 | 2003-04-25 | Matsushita Electric Ind Co Ltd | Method for manufacturing semiconductor device |
-
2004
- 2004-05-28 JP JP2004159016A patent/JP4373851B2/en not_active Expired - Lifetime
-
2005
- 2005-05-27 CN CNB2005100743503A patent/CN100419981C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522326A (en) * | 2011-12-14 | 2012-06-27 | 杭州立昂微电子股份有限公司 | Production method of semiconductor discrete device back side metal suitable for screen printing |
| CN102522326B (en) * | 2011-12-14 | 2014-09-24 | 杭州立昂微电子股份有限公司 | Production method of semiconductor discrete device back side metal suitable for screen printing |
| CN108538824A (en) * | 2017-03-03 | 2018-09-14 | Tdk株式会社 | The manufacturing method of semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005340593A (en) | 2005-12-08 |
| JP4373851B2 (en) | 2009-11-25 |
| CN100419981C (en) | 2008-09-17 |
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