CN1714976A - Thermostatic type thermo-compression bonding device and thermal pressure welding method - Google Patents
Thermostatic type thermo-compression bonding device and thermal pressure welding method Download PDFInfo
- Publication number
- CN1714976A CN1714976A CN 200410027937 CN200410027937A CN1714976A CN 1714976 A CN1714976 A CN 1714976A CN 200410027937 CN200410027937 CN 200410027937 CN 200410027937 A CN200410027937 A CN 200410027937A CN 1714976 A CN1714976 A CN 1714976A
- Authority
- CN
- China
- Prior art keywords
- press
- thermostatic type
- fit component
- compression bonding
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The present invention discloses a kind of usefulness so that two thermostatic type thermo-compression bonding devices for the treatment of the overlapping part joint of press-fit component, it comprises thermal head with a heating tool, can drive elevating mechanism that this thermal head moves up and down and the mechanism that pushes down with a press section, but this press section heat conduction and be arranged on this heating tool and above-mentioned two overlapping parts for the treatment of press-fit component between, and the overlapping part for the treatment of press-fit component is exerted pressure.The present invention also provides a kind of thermostatic type thermal pressure welding method.
Description
[technical field]
The invention relates to a kind of thermo-compression bonding device and thermal pressure welding method, particularly a kind of thermostatic type thermo-compression bonding device and thermostatic type thermal pressure welding method.
[background technology]
The assembling of liquid crystal display module comprises elements such as display panels, drive integrated circult, flexible circuit board, printed circuit board (PCB) joint, makes it to form the processing procedure of electrical connection.
Above-mentioned processing procedure makes two interelement pressings and forms with thermo-compression bonding device usually and is electrically connected.Thermo-compression bonding device can be divided into the impulse heat-pressing tipping and put and two kinds of thermostatic type thermo-compression bonding devices.Wherein, it is under the situation to two element pressurizations that the impulse heat-pressing tipping is put, the heating of switching on is melted two interelement scolders, and outage makes solder cools and connects two elements then, and this kind thermo-compressed mode can prevent that connecting portion from producing defectives such as projection, rosin joint.The thermostatic type thermo-compression bonding device is because the temperature of its thermal head keeps constant, it is after heating is melted two interelement scolders, the element that needs the heat of dissociation pressure head and be crimped, so that solder cools, but, carry out thermo-compressed with the thermostatic type thermo-compression bonding device, it is compared the impulse heat-pressing tipping and puts some problems of existence, describes below in conjunction with Fig. 1.
Shown in Fig. 1 (a) and (b), be respectively that the time-temperature curve figure that carries out thermo-compressed with the thermostatic type thermo-compression bonding device is put in the impulse heat-pressing tipping.Among the figure, t1 is preheating time, and t2 is the working time, and t3 is cool time, and Tm is the fusing point of scolder, and curve A, B are the time-temperature curve figure of scolder.When putting with impulse heat-pressing tipping when carrying out thermo-compressed, shown in Fig. 1 (a), scolder reaches fusing point Tm through the preheating of t1 time, carry out the thermo-compressed of t2 time, through after the cooling of t3 time, the thermal head that the impulse heat-pressing tipping is put at the pairing A1 time point of t3 leaves the element that is crimped thereupon, at this moment, because of scolder solidifies, the combination of elements that is crimped is firm, can form and be electrically connected effect preferably.When carrying out thermo-compressed with the thermostatic type thermo-compression bonding device, shown in Fig. 1 (b), scolder reaches fusing point Tm through the preheating of t1 time, carry out the thermo-compressed of t2 time thereupon, and make the thermal head of thermostatic type thermo-compression bonding device leave the element that is crimped at the pairing B1 time point of t2, at this moment, the temperature of scolder is still on fusing point, it is still uncolled to solidify, and owing to the strength instantaneous reduction that is applied on the element that is crimped, two elements are separated, cause the gap, thereby can't form complete electrical connection effect.
Though there is above-mentioned shortcoming in the thermostatic type thermo-compression bonding device, but, because of its board simple structure, cost is low, consuming electric power is few, for many factories that the thermostatic type thermo-compression bonding device has been installed, more wishing to have a kind of technology, improve existing thermostatic type thermo-compression bonding device, make it possess the advantage that the impulse heat-pressing tipping is put.
[summary of the invention]
Problem for the bad of the thermostatic type thermo-compression bonding device thermo-compressed that overcomes prior art the invention provides a kind of thermostatic type thermo-compression bonding device that improves the thermo-compressed quality.
The present invention also provides a kind of thermostatic type thermal pressure welding method that improves the thermo-compressed quality.
Thermostatic type thermo-compression bonding device of the present invention is used so that two overlapping parts for the treatment of press-fit component engage, it comprises the mechanism that pushes down of thermal head with a heating tool and the press section with a heat conduction, this thermal head can this treat that press-fit component moves up and down relatively, this press section is arranged between this heating tool and above-mentioned two overlapping parts for the treatment of press-fit component, and the overlapping part for the treatment of press-fit component is exerted pressure.
Thermostatic type thermal pressure welding method of the present invention may further comprise the steps: a heat conducting element is provided; This heat conducting element is arranged on the overlapping part top for the treatment of press-fit component, and this overlapping part for the treatment of press-fit component is applied certain pressure by this heat conducting element; Be pressed on this heat conducting element by heating tool, this treated the overlapping part heating of press-fit component by this heat conducting element; Be lifted away from this heating tool, keep this heat conducting element that this is treated the pressure of the overlapping part of press-fit component, treat the press-fit component cooling until this.
Compared to prior art, because thermostatic type thermo-compression bonding device of the present invention is at heating tool and treat to be provided with a press section between the overlapping part of press-fit component, this press section is after carrying out thermo-compressed, the overlapping part that can treat press-fit component is exerted pressure and is dispelled the heat, solidify until solder cools, avoid two possibilities that element is separated from each other, thereby formed complete electrical connection effect, can improve the thermo-compressed quality.Thermal pressure welding method of the present invention can avoid treating the possibility that the element of crimping is separated from each other equally, can improve the quality of thermo-compressed.
[description of drawings]
Fig. 1 is that the time-temperature curve figure that carries out thermo-compressed with the thermostatic type thermo-compression bonding device is put in the tipping of prior art impulse heat-pressing.
Fig. 2 is the front elevation of thermostatic type thermo-compression bonding device first embodiment of the present invention, and it is in not duty.
Fig. 3 is the side view of thermostatic type thermo-compression bonding device first embodiment of the present invention, and it is in not duty.
Fig. 4 is the front elevation of thermostatic type thermo-compression bonding device first embodiment of the present invention when in running order.
Fig. 5 is the front elevation of thermostatic type thermo-compression bonding device second embodiment of the present invention.
[specific embodiment]
As shown in Figure 2, be the front elevation of thermostatic type thermo-compression bonding device first embodiment of the present invention.This thermo-compression bonding device 1 usefulness is so that two elements for the treatment of crimping 31,32 engage by scolder 33, and it comprises that a thermal head 11, an objective table 12, an elevating mechanism 13, a movable table 14, a horizontal frame 15, an X-Y board 16 and push down mechanism 17.
This thermal head 11 comprises a heating tool 111, a fixing piece 112 and is separately positioned on two carriages 113 of these fixing piece 112 both sides.This heating tool 111 is by these fixing piece 112 fixings, and element 31,32 and scolder 33 that this heating tool 111 is used to treat crimping heat.These two carriages, 113 each tool one through holes 114.
This elevating mechanism 13 links to each other with this thermal head 11, moves up and down to drive this thermal head 11.This elevating mechanism 13 can be that cylinder or other can drive the mechanism that this thermal head 11 moves up and down.
This movable table 14 is connected with this elevating mechanism 13, and this movable table 14 is arranged on this horizontal frame 15, and this movable table 14 can be along these horizontal frame 15 move left and right, and then drive elevating mechanism 13 and thermal head 11 move left and right.
This objective table 12 is treated press- fit component 31,32 in order to carrying, and when heating tool 111 was treated press- fit component 31,32 and heated, this objective table 12 played a supportive role.This X-Y board 16 can move along orthogonal directions X and Y direction in horizontal plane, to drive objective table 12 and to treat that press- fit component 31,32 moves to correct position.
This is pushed down mechanism 17 and comprises a press section 171 and two pressurization part 172.This press section 171 has the heat conduction function, these two pressurization part 172 are for having the T shape cylinder of constant weight, this pressurization part 172 is enclosed within the through hole 114 of above-mentioned carriage 113, and these pressurization part 172 diameters are less than through hole 114 internal diameters, so that this pressurization part 172 can be free to slide in this through hole 114.Certainly, the upper end of this pressurization part 172 be in order to this carriage 113 form against mobile certain limit arranged so that this pushes down mechanism 17.
In conjunction with Fig. 3 as can be seen, this press section 171 of pushing down mechanism 17 is arranged between this heating tool 111 and above-mentioned two overlapping parts for the treatment of press- fit component 31,32, why this press section 171 is arranged on above-mentioned position, is elaborated below with reference to Fig. 4.
Fig. 4 is thermostatic type thermo-compression bonding device of the present invention 1 front elevation when in running order.The work of this thermostatic type thermo-compression bonding device 1 promptly is by heating tool 111 contact press sections 171 and treats press- fit component 31,32 and heat, and the scolder 33 that is arranged in the overlapping part for the treatment of press- fit component 31,32 is melted.The present invention adopts press section 171 to be arranged under the heating tool 111, and it makes this heating tool 111 need to rely on press section 171 that heat is conducted to this and treats press- fit component 31,32.
After this scolder 33 is heated thawing, heating tool 111 is lifted away to certain altitude (figure does not show), at this moment, because pushing down mechanism 17 has the gravity effect, it still can be treated press- fit component 31,32 by press section 171 and apply certain pressure and dispel the heat, and until scolder 33 cooled and solidified, has avoided two possibilities that element 31,32 is separated from each other, thereby form complete electrical connection effect 31,32 of two elements, can improve the thermo-compressed quality.
In the above embodiment, these two elements 31,32 for the treatment of crimping are respectively a flexible circuit board and a printed circuit board (PCB), and this scolder 33 is a leypewter.This press section 171 is the fast and on-deformable sheet metal of heat conduction, as iron plate.Certainly, this press-fit component 31 also can be the material of other flexibility; This scolder 33 also can be ACF heat-fusible materials such as (Anisotropic ConductiveFilm, aeolotropic conductive films).
Again as shown in Figure 5, be the front elevation of thermostatic type thermo-compression bonding device second embodiment of the present invention.The difference of this thermostatic type thermo-compression bonding device 2 and above-mentioned thermostatic type thermo-compression bonding device 1 is: this thermostatic type thermo-compression bonding device 2 adopts one " ﹁ " shape iron plate 27 as pushing down mechanism, this iron plate 27 comprises a straight press section 271 and a kink 272, this kink 272 is vertically set on this iron plate 27 1 ends, during use, this kink 272 is directed upwardly, and plays the convenient effect that picks and places iron plate 27 with hand; The objective table 22 of this thermostatic type thermo-compression bonding device 2 is a magnetic devices, this objective table 22 by the magnetic attraction gravitational attraction, fix this iron plate 27, thereby make 27 pairs two of this iron plates treat that the element 31,32 of crimping produces pressure.
Certainly, the objective table 22 in this thermostatic type thermo-compression bonding device 2 also can be a nonmagnetic substance, at this moment, need utilize this magnetic devices to attract this iron plate 27 treating below the press- fit component 31,32 magnetic devices (figure does not show) to be set.In addition, the mode of fixed press portion 271, except the magnetic attraction mode, other so long as do not hinder pressure head apply downward strength fixed form can, for example: can impose downward strength with a spring clip.
Adopt the thermal pressure welding method of above-mentioned thermostatic type thermo-compression bonding device 1 or 2, may further comprise the steps: a heat conducting element is provided, and this heat conducting element can be press section 171 or 271; This heat conducting element is arranged on the overlapping part top for the treatment of press- fit component 31,32, and this overlapping part for the treatment of press- fit component 31,32 is applied certain pressure by this heat conducting element; Be pressed on this heat conducting element by heating tool 111, this treated the overlapping part heating of press- fit component 31,32 by this heat conducting element; Be lifted away from this heating tool 111, keep this heat conducting element that this is treated the pressure of the overlapping part of press- fit component 31,32, treat press- fit component 31,32 and scolder 33 coolings until this; After treating the press-fit component cooling, this is lifted away from this heat conducting element.
Claims (13)
1. thermostatic type thermo-compression bonding device, with so that two overlapping parts for the treatment of press-fit component engage, it comprises that one has the thermal head of a heating tool, this thermal head can this treat that press-fit component moves up and down relatively, it is characterized in that: further comprise and push down mechanism, this pushes down the press section that mechanism has a heat conduction, and this press section is arranged between this heating tool and above-mentioned two overlapping parts for the treatment of press-fit component, and the overlapping part for the treatment of press-fit component is exerted pressure.
2. thermostatic type thermo-compression bonding device as claimed in claim 1 is characterized in that: further comprise an objective table, press-fit component is treated in this objective table carrying.
3. thermostatic type thermo-compression bonding device as claimed in claim 2 is characterized in that: this press section and objective table of pushing down mechanism attracts each other.
4. thermostatic type thermo-compression bonding device as claimed in claim 1 is characterized in that: this press section of pushing down mechanism is an iron plate, is treating to be provided with a magnetic devices below the press-fit component, and this magnetic devices attracts this iron plate.
5. thermostatic type thermo-compression bonding device as claimed in claim 4 is characterized in that: this is pushed down mechanism and further comprises a kink, and this kink is vertically set on this iron plate one end.
6. thermostatic type thermo-compression bonding device as claimed in claim 1 is characterized in that: this is pushed down mechanism and further comprises two pressurization part, and these two pressurization part are vertically set on the two ends of this press section.
7. thermostatic type thermo-compression bonding device as claimed in claim 6 is characterized in that: two carriages further are set on this thermal head, and these two carriages and these two pressurization part cooperate one by one, make these two pressurization part relatively these two carriages be free to slide.
8. thermostatic type thermo-compression bonding device as claimed in claim 7 is characterized in that: this carriage has through hole, and this pressurization part is inserted in this through hole and can be free to slide in this through hole.
9. thermostatic type thermo-compression bonding device as claimed in claim 1 is characterized in that: this thermal head is to drive by an elevating mechanism to move up and down.
10. a thermostatic type thermal pressure welding method may further comprise the steps: a heat conducting element is provided; This heat conducting element is arranged on the overlapping part top for the treatment of press-fit component, and this overlapping part for the treatment of press-fit component is applied certain pressure by this heat conducting element; Be pressed on this heat conducting element by heating tool, this treated the overlapping part heating of press-fit component by this heat conducting element; Be lifted away from this heating tool, keep this heat conducting element that this is treated the pressure of the overlapping part of press-fit component, treat the press-fit component cooling until this.
11. thermostatic type thermal pressure welding method as claimed in claim 10 is characterized in that: this heat conducting element treats that to this overlapping part applied pressure of press-fit component is to realize by magnetic attracting force.
12. thermostatic type thermal pressure welding method as claimed in claim 10 is characterized in that: this heat conducting element treats that to this overlapping part applied pressure of press-fit component is the gravity effect realization by this heat conducting element.
13. thermostatic type thermal pressure welding method as claimed in claim 10 is characterized in that: after this treats the press-fit component cooling, further comprise the step that is lifted away from this heat conducting element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279374A CN100515643C (en) | 2004-06-28 | 2004-06-28 | Constant temperature type hot-press jointing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279374A CN100515643C (en) | 2004-06-28 | 2004-06-28 | Constant temperature type hot-press jointing device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1714976A true CN1714976A (en) | 2006-01-04 |
| CN100515643C CN100515643C (en) | 2009-07-22 |
Family
ID=35821294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100279374A Expired - Fee Related CN100515643C (en) | 2004-06-28 | 2004-06-28 | Constant temperature type hot-press jointing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100515643C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102601998A (en) * | 2012-03-09 | 2012-07-25 | 太仓市皓荣化工科技有限公司 | Hot melting device and hot melting method thereof |
| CN109094040A (en) * | 2018-07-27 | 2018-12-28 | 潘雲生 | A kind of sheet material attachment device with suction unit |
| CN112935457A (en) * | 2021-01-21 | 2021-06-11 | 江苏诺森特电子科技有限公司 | Hot-press welding head slow-pressure tin soldering device and tin soldering process |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233576A (en) * | 1997-02-19 | 1998-09-02 | Alps Electric Co Ltd | Apparatus and method for peeling electric component |
| CN2369808Y (en) * | 1999-04-09 | 2000-03-22 | 王岳平 | Soldering machine |
| JP2002164646A (en) * | 2000-11-27 | 2002-06-07 | Kiyoshi Matsumoto | Soldering and removing apparatus |
| CN2727778Y (en) * | 2004-08-07 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Thermostatic hot crimping device |
-
2004
- 2004-06-28 CN CNB2004100279374A patent/CN100515643C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102601998A (en) * | 2012-03-09 | 2012-07-25 | 太仓市皓荣化工科技有限公司 | Hot melting device and hot melting method thereof |
| CN109094040A (en) * | 2018-07-27 | 2018-12-28 | 潘雲生 | A kind of sheet material attachment device with suction unit |
| CN112935457A (en) * | 2021-01-21 | 2021-06-11 | 江苏诺森特电子科技有限公司 | Hot-press welding head slow-pressure tin soldering device and tin soldering process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100515643C (en) | 2009-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101963338B1 (en) | Heater chip, bonding apparatus, bonding method and junction structure of conductive thin line and terminal | |
| EP1090706B1 (en) | Apparatus and method for bonding conductors | |
| US20050284567A1 (en) | Bonding device and method | |
| CN2727778Y (en) | Thermostatic hot crimping device | |
| US10512172B2 (en) | System for pressing pre-tin shaping | |
| CN1714976A (en) | Thermostatic type thermo-compression bonding device and thermal pressure welding method | |
| US7900808B2 (en) | Soldering method and system thereof | |
| US7465173B2 (en) | De-soldering tool | |
| CN111702364B (en) | TO-CAN ceramic plate welding method | |
| JP3795269B2 (en) | Thermocompression bonding equipment | |
| CN103712181B (en) | A kind of LED erecting device and installation method and prepared display device thereof | |
| JP3754185B2 (en) | Thermocompression bonding apparatus and heater tool used therefor | |
| JP2000021930A (en) | Thermocompression bonding device | |
| CN112247307A (en) | Hot-press welding device and hot-press welding process | |
| CN101017935A (en) | Interconnection device for a double-sided printed circuit board | |
| JP2869051B2 (en) | Thermocompression bonding equipment | |
| JP2007220727A (en) | Pressurized connecting device and pressurized connecting method of electronic component | |
| JP3816144B2 (en) | Crimping head and display panel manufacturing method using the same | |
| CN2814703Y (en) | Coupling structure for electric connector terminal and circuit board | |
| JP2001196422A (en) | Thermocompression bonding device | |
| CN220574952U (en) | Reflow soldering tooling | |
| CN2802758Y (en) | Plate-to-plate electric connector | |
| JP2840873B2 (en) | High frequency heating equipment | |
| JP3127407B2 (en) | Thermocompression bonding method | |
| US20140353360A1 (en) | Temperature Triggering Ejector Mechanism for Lock Pin Soldering Type Component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090722 Termination date: 20160628 |