CN1707782A - Radiating substrate and producing method thereof - Google Patents
Radiating substrate and producing method thereof Download PDFInfo
- Publication number
- CN1707782A CN1707782A CN 200410047814 CN200410047814A CN1707782A CN 1707782 A CN1707782 A CN 1707782A CN 200410047814 CN200410047814 CN 200410047814 CN 200410047814 A CN200410047814 A CN 200410047814A CN 1707782 A CN1707782 A CN 1707782A
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- heat
- radiating substrate
- base material
- coating
- thermal conductivity
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Abstract
The heat sink base plate includes base body of plastic non-metal material and conducting layer. The base body has many small through holes, and the conducting layer of heat conducting metal paint is painted onto the surface of the base body and filled into the through holes to form heat conducting passage. In this way, heat may be conducted from one side of the base body via the through holes to the other side and the base body possesses excellent heat dissipating effect.
Description
Technical field
Relevant a kind of heat-radiating substrate of the present invention and method for making thereof, especially finger is a kind of is provided with conducting shell in base material, make heat energy can conduct to the heat-radiating substrate and the method for making thereof of another side from the one side of this base material, it is simple in structure, easy to manufacture, with low cost, and can effectively conduct the long-pending heat of dissipation after the assembling, be applicable to the covered shell of heating modules such as personal computer, laptop computer, PDA or mobile phone.
Background technology
In the epoch of the very fast progress of science and technology at present, various electronic products such as personal computer, mobile computer, mobile phone, personal digital assistant etc. have become role indispensable among the human lives.No matter be, or in family life, let us use the time of electronic product that the trend that increases is day by day arranged in work position.
Because electronic product constantly moves towards compact, relatedly influence all kinds of first assembly of its use and the precision and the size of process equipment also requires harsh day by day.In various electronic product, its design of shell purpose is except the desire of protection product structure itself and attraction handsome in appearance consumer purchase, and its another purpose just has been the effect of dispelling the heat.
With the laptop computer is example, and mostly now many consumers is factors such as CPU frequency, hard-disk capacity, display screen size if considering when choosing laptop computer, but do not notice the importance of notebook enclosure material.Because laptop computer is inner compact, the CPU of the inside, hard disk, mainboard all are the heat production rich anies influential family, if the heat of inner accumulation can not distribute in time, computer will crash, and the serious intraware that also can cause damages.Can portable computer external dispel the heat apace, also is the important factor of decision material.
The enclosure material of laptop computer adopts magnadure mostly now, magnadure is not very firm wear-resisting in fact, simultaneously expensive, matter is heavy and radiating effect is limited, after using for a long time, original silvery white can grind off, and exposes its dimmed true colours, if what careless scuffing the, that road cut also can be very is showy.In order to solve the problem that magnadure runs into, manufacturer has introduced sheathing material to the space Titanium again, but because of the cost problem, so on making, generally do not use.
Because existing utilize metal alloy in make, inconvenience in the use and radiating effect is not good and cost is high, raw material is obtained and reclaim shortcomings such as difficult, the research and development that constantly progress greatly, thus the present invention in response to and give birth to.
Summary of the invention
Main purpose of the present invention is providing a kind of simple in structure, easy to manufacture, with low cost, and can effectively conduct the heat-radiating substrate and the method for making thereof of the long-pending heat of dissipation after the assembling.
In order to achieve the above object, heat-radiating substrate that the present invention is set and method for making thereof, it comprises the base material of plastic non-metallic material and is applied to the conducting shell of the whole outer surface of this base material, offer several small perforation on this base material, the metallic paint of this conduction series of strata thermal conductivity forms, this conducting shell is except that the whole outer surface of coating base material, also be filled in the perforation of aforementioned substrates, make it form the conducting shape, use making heat energy conduct to another side via the conducting shell in the perforation, thereby make this base material have excellent radiating effect from the one side of this base material.
This plastic non-metallic material can be glass fibre (FRP), or it is wherein a kind of to be selected from polyethylene (HDPE, LDPE, LLDPE), haloflex (CPV), polypropylene (PP), ethylene/vinyl acetate copolymer (EVA), polystyrene (PS), propylene/butadiene/styrene copolymers (ABS), styrene/maleic anhydride copolymers, high impact polystyrene (HIPS), poly terephthalic acid diethylester (PET) and polyvinyl chloride (PVC).
This conducting shell is the coating by the tool thermal conductivity, and preferable alloy coating is applied on the base material and forms, and the coating of this tool thermal conductivity can be directly commercial, also can be by well known to a person skilled in the art method oneself preparation.
The invention still further relates to by the heating electronic installation of described heat-radiating substrate, as personal computer, laptop computer, PDA (personal digital assistant device, Personal Digital Assistant) or mobile phone etc. for its shell.
For ease of more deep understanding being arranged, after mat one embodiment is specified in now to the present invention.
Description of drawings
Fig. 1 is the local appearance cut-away view of the described base material of the embodiment of the invention;
Fig. 2 is the local appearance cut-away view after the embodiment of the invention heat-radiating substrate coating;
Fig. 3 is the outward appearance cut-away view after the moulding of embodiment of the invention heat-radiating substrate;
Fig. 4 is the flow chart of heat-radiating substrate method for making of the present invention;
Fig. 5 is the user mode schematic diagram of embodiment of the invention heat-radiating substrate;
Fig. 6 is covered on user mode schematic diagram on the appliance and electronic for embodiment of the invention heat-radiating substrate.
Reference numerals explanation: 1 heat-radiating substrate; 11 base materials; 111 perforation; 12 conducting shells; 121 metallic paint; 2 heating electronic installations.
Embodiment
See also Fig. 1, Fig. 2, diagramatic content is an embodiment of heat-radiating substrate of the present invention and method for making thereof, wherein this heat-radiating substrate 1 is as being overlying on the heating electronic installation outward, shell as personal computer, laptop computer, PDA (Personal Digital Assistant) or mobile phone uses, and its base material 11 and conducting shell 12 by plastic non-metallic material is formed.
Metallic paint is coated on the whole outer surface of above-mentioned base material 11, and the mode of its coating can be coating or is modes (as Fig. 2, shown in Figure 3) such as immersion, and this conducting shell 12 is filled in the above-mentioned perforation 111.
And as shown in Figure 4, the method for making of heat-radiating substrate 1 of the present invention can comprise following step:
A, get the base material 11 that a plastic non-metallic material is a structure;
B, on this base material 11, establish several small perforation 111; And
C, coating has a thermal conductivity on this base material 11 metallic paint 121 to be forming conducting shell 12, and make it to be filled in the perforation 111 of above-mentioned base material 11.
Please consult Fig. 1～Fig. 4 again, during enforcement, at first get the base material 11 that a plastic non-metallic material is a structure, this plastic non-metallic material can be glass fibre (FRP), or be selected from polyethylene (HDPE, LDPE, LLDPE), haloflex, polypropylene (PP), ethylene/vinyl acetate copolymer (EVA), polystyrene (PS), propylene/butadiene/styrene copolymers (ABS), styrene/maleic anhydride copolymers, high impact polystyrene (HIPS), poly terephthalic acid diethylester (PET) and polyvinyl chloride (PVC) are wherein a kind of, and in fact most area is established several small perforation 111 on this base material 11, the last metallic paint 121 that coating has a thermal conductivity on this base material 11 to be forming conducting shell 12, and makes it to be filled in the perforation 111 of base material 11.By this, when the set heat-radiating substrate 1 of the present invention is used as the shell of heating electronic installation 2 (as Fig. 5, shown in Figure 6), the heat energy that this heating electronic installation 2 is produced, the conducting shell 12 that can be coated with from the one side of this base material 11 is via the perforation 111 of filling up metallic paint 121, and conduct to the conducting shell 12 of base material 11 another sides, and reach the purpose of dispelling the heat fast and effectively.
Therefore, heat-radiating substrate of the present invention and method for making thereof have following advantage:
1, the present invention utilizes plastic non-metallic material to be base material, and its cost is low, and weight is also more commonly used Metalwork is light, thus no matter all very convenient in manufacturing, recovery or consumer's use, can reduce again simultaneously The waste of metals resources.
2, the present invention is provided with several small perforation in base material, make heat energy can from the one side of this base material via Fill up the perforation of metallic paint, and conduct to the base material another side, so have quick and good radiating effect.
3, the present invention is coated with the metallic paint of deposite device thermal conductivity in base material, not only can be fully with thermal energy conduction dissipation, And be installed in heating electronic installation such as personal computer, laptop computer, PDA (Personal Digital Assistant) Or behind the mobile phone, have metallic luster on its external form, can increase desire of choosing with the raising consumer attractive in appearance.
Claims (12)
1, a kind of heat-radiating substrate comprises:
The base material of plastic non-metallic material offers several small perforation on this base material; And
Conducting shell is coated by the coating of tool thermal conductivity on the whole outer surface of above-mentioned base material, and is filled in the perforation of aforementioned substrates, makes the conducting shell of the whole outer surface of base material form the mutual conduction shape.
2, heat-radiating substrate as claimed in claim 1, wherein the coating of this tool thermal conductivity is metallic paint.
3, heat-radiating substrate as claimed in claim 1, wherein the coating of this tool thermal conductivity is to be coated on the substrate surface with coating method.
4, heat-radiating substrate as claimed in claim 1, it is wherein a kind of that wherein this plastic non-metallic material is selected from polyethylene (HDPE, LDPE, LLDPE), haloflex, polypropylene, ethylene/vinyl acetate copolymer, polystyrene, propylene/butadiene/styrene copolymers, styrene/maleic anhydride copolymers, high impact polystyrene, poly terephthalic acid diethylester and polyvinyl chloride.
5, heat-radiating substrate as claimed in claim 1, wherein this plastic non-metallic material is a glass fibre.
6, a kind of method for making of heat-radiating substrate is characterized in that comprising the following steps:
A, get the base material of plastic non-metallic material as structure;
B, on this base material, establish several small perforation; And
C, coating has a thermal conductivity on the whole outer surface of this base material coating to be forming conducting shell, and make it to be filled in the perforation of above-mentioned base material.
7, the method for making of heat-radiating substrate as claimed in claim 6, wherein the coating of this tool thermal conductivity is to be coated on the substrate surface with coating method.
8, the method for making of heat-radiating substrate as claimed in claim 6, wherein this conducting shell is for forming in the coating that this base material is soaked in aforementioned tool thermal conductivity.
9, the method for making of heat-radiating substrate as claimed in claim 6, wherein this plastic non-metallic material be selected from polyethylene (HDPE, LDPE, LLDPE), haloflex, polypropylene (PP), ethylene/vinyl acetate copolymer (EVA), polystyrene (PS), propylene/butadiene/styrene copolymers (ABS), styrene/maleic anhydride copolymers, high impact polystyrene (HIPS), poly terephthalic acid diethylester (PET) and polyvinyl chloride (PVC) wherein one or more.
10, the method for making of heat-radiating substrate as claimed in claim 6, wherein the coating of this tool thermal conductivity is metallic paint.
11, a kind of heating electronic installation is to be its shell with heat-radiating substrate as claimed in claim 1.
12, heating electronic installation as claimed in claim 11, it is personal computer, laptop computer, PDA or mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410047814 CN1707782A (en) | 2004-06-10 | 2004-06-10 | Radiating substrate and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410047814 CN1707782A (en) | 2004-06-10 | 2004-06-10 | Radiating substrate and producing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1707782A true CN1707782A (en) | 2005-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410047814 Pending CN1707782A (en) | 2004-06-10 | 2004-06-10 | Radiating substrate and producing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1707782A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412361A (en) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | Laminated heat dissipation substrate and electronic assembly structure using same |
| CN102510699A (en) * | 2011-09-22 | 2012-06-20 | 华为终端有限公司 | Mobile terminal |
| CN102566723A (en) * | 2012-02-20 | 2012-07-11 | 童师颖 | Uniform-temperature quick-radiation casing of notebook computer |
| CN103732041A (en) * | 2013-12-12 | 2014-04-16 | 苏州环明电子科技有限公司 | Manufacturing method of composite material heat dissipation film |
| CN105047790A (en) * | 2015-08-14 | 2015-11-11 | 何蓓 | Practical high-power LED encapsulation structure |
| CN107318236A (en) * | 2016-04-27 | 2017-11-03 | 佳邦科技股份有限公司 | Portable electronic product and the heat dissipation type shell mechanism for portable electronic product |
| CN107864599A (en) * | 2017-12-11 | 2018-03-30 | 广东欧珀移动通信有限公司 | Glass shell and mobile terminal |
| CN116230398A (en) * | 2022-12-29 | 2023-06-06 | 丰宾电子科技股份有限公司 | Super radiating aluminium electrolytic capacitor |
-
2004
- 2004-06-10 CN CN 200410047814 patent/CN1707782A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412361A (en) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | Laminated heat dissipation substrate and electronic assembly structure using same |
| CN102412361B (en) * | 2010-09-21 | 2016-06-08 | 佳胜科技股份有限公司 | Laminated heat dissipation substrate and electronic assembly structure using same |
| CN102510699A (en) * | 2011-09-22 | 2012-06-20 | 华为终端有限公司 | Mobile terminal |
| CN102566723A (en) * | 2012-02-20 | 2012-07-11 | 童师颖 | Uniform-temperature quick-radiation casing of notebook computer |
| CN103732041A (en) * | 2013-12-12 | 2014-04-16 | 苏州环明电子科技有限公司 | Manufacturing method of composite material heat dissipation film |
| CN105047790A (en) * | 2015-08-14 | 2015-11-11 | 何蓓 | Practical high-power LED encapsulation structure |
| CN105047790B (en) * | 2015-08-14 | 2018-01-12 | 南陵旺科知识产权运营有限公司 | A kind of practical high-power LED encapsulation structure |
| CN107318236A (en) * | 2016-04-27 | 2017-11-03 | 佳邦科技股份有限公司 | Portable electronic product and the heat dissipation type shell mechanism for portable electronic product |
| CN107318236B (en) * | 2016-04-27 | 2019-12-17 | 佳邦科技股份有限公司 | portable electronic product and heat dissipation type shell structure for same |
| CN107864599A (en) * | 2017-12-11 | 2018-03-30 | 广东欧珀移动通信有限公司 | Glass shell and mobile terminal |
| CN116230398A (en) * | 2022-12-29 | 2023-06-06 | 丰宾电子科技股份有限公司 | Super radiating aluminium electrolytic capacitor |
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