CN102566723A - Uniform-temperature quick-radiation casing of notebook computer - Google Patents
Uniform-temperature quick-radiation casing of notebook computer Download PDFInfo
- Publication number
- CN102566723A CN102566723A CN2012100376580A CN201210037658A CN102566723A CN 102566723 A CN102566723 A CN 102566723A CN 2012100376580 A CN2012100376580 A CN 2012100376580A CN 201210037658 A CN201210037658 A CN 201210037658A CN 102566723 A CN102566723 A CN 102566723A
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- casing
- chassis
- plate
- cover
- heating elements
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Abstract
The invention relates to a uniform-temperature quick-radiation casing of a notebook computer, which belongs to the technical field of electronics and comprises an upper casing cover 1, a casing bottom 2, upper radiation plates 3, lower radiation plates 4, enclosure structural strips 5, supporting columns 6, porous media 7 and hinges 8. The upper casing cover 1 and the casing bottom 2 are equal in size and comprise hollow sandwich flat boxes consisting of the upper radiation plates 3, lower radiation plates 4 and enclosure structural strips 5, the porous media 7 and heat tube working media are mounted in the boxes to form superconductive planar heat tubes. Heating elements 9 are mounted on the upper casing cover 1 and the casing bottom 2, heat generated in operation of the heating elements 9 can be quickly dispersed by the upper casing cover 1 and the casing bottom 2 and transmitted to the whole casing to be dispersed to the surrounding environment, and accordingly the temperature of the heating elements 9 can be controlled within a permitted safety range.
Description
Technical field:
Title of the present invention is a notebook computer samming quick heat radiating casing, belongs to electronic technology field.It consists of a housing cover, housing bottom 2, the cooling plate 3, a lower cooling plate 4, Article 5 envelope structure, support columns 6, 7 porous media, hinges 8 components.Other dimensions of the chassis and the chassis cover a bottom two as a single entity by the hinge 8, the cooling plate 3, a lower cooling plate 4, Article 5 envelope made of hollow laminated flat box, inside the box 7 and porous media heat pipe working fluid, constitutes a superconducting heat pipe thermal characteristics of the plane.Casing upper cover 1 with heater element 9 is housed on 2 at the bottom of the casing; The heat that when heater element 9 work, produces can by casing upper cover 1 with 2 disperse rapidly and be sent on the whole casing and be dispersed into and go in the surrounding environment at the bottom of the casing, thereby the temperature of heater element 9 is controlled in the safe range that is allowed.
Background technology:
The thermal value of electronic component is pressed geometric growth with the increase of collection depth; Present electronic technology can have been made the notebook computer of superelevation collection depth; But reliable and effective radiating mode is not found in its heating as yet, particularly difficult more for the notebook computer of compact conformation, finite volume.Such as notebook computer's CPU and power supply are used with fan forced air cooling fins on the printed circuit board has a miniature heat pipe cooling precedent.Cloud computing rack and this computer chassis of pen meter to high density operation do not find effectively as yet, cooling measure easily.
Summary of the invention:
For remedying the deficiency of existing above-mentioned technology; The present invention can provide a kind of notebook computer samming quick heat radiating casing; The heat that when heating element works, produces can be disperseed rapidly and be sent on the whole casing and be dispersed into to go in the surrounding environment by enclosure wall, thereby the temperature of heater element is controlled in the safe range that element allows.For this purpose, it may cover the chassis 1, the chassis base 2, the heat radiating plate 3, a lower heat plate 4, the structure of the envelope 5, the support column 6, the porous medium 7, 8 comprise a hinge.Chassis cover a bottom 2 and the chassis by a hinge 8 links as one; chassis and the chassis cover an area of the bottom two the same, they are on the other dimensions of the heat radiating plate 3 and the lower plate 4 composite made This two cooling plates embedded sandwiched between two support columns 4-80 6, in the upper laminated together under heat radiating plate 3 and the upper plate 4 is four surrounding envelope of five consolidation, surrounded and sealed, mezzanine flat forming a hollow box, box 7 and porous media with heat pipe working fluid; chassis cover 1, chassis mounted on the bottom two heating elements 9.
Description of drawings:
Fig. 1. be notebook computer samming quick heat radiating casing structure figure,
Fig. 2. be notebook computer samming quick heat radiating casing A_A cut-open view.
Which :1 - Chassis cover China; - housing bottom; 3 - Top cooling plate; 4 - Why cooling plate; 5 - envelope structure of a; 6 - supporting columns; 7 - porous media; 8 - hinges; 9 - heating element.
Chassis cover (1) and the casing bottom (2) by a hinge (8) bound together; housing cover (1) and the casing bottom (2) of the same size, they are on the other dimensions of the cooling plate (3) and the lower heat dissipation plate (4) superposed together, these two heat radiating plate is sandwiched between the embedded 4-80 a support column (6), laminated together in the thermal plate (3) and the lower heat dissipation plate ( 4) the periphery of the envelope by four (5) consolidation, surrounded and sealed together to form a hollow sandwich flat box, box with a porous medium (7) and the heat pipe working fluid; housing cover (1) , chassis base (2) is provided with heating elements (9).The heat that when heater element 9 work, produces can by casing upper cover 1 with 2 disperse rapidly and be sent on the whole casing and be dispersed into and go in the surrounding environment at the bottom of the casing, thereby the temperature of heater element 9 is controlled in the safe range that is allowed.
Case study on implementation:
Fig. 1 also is 17 " notebook samming quick heat radiating casing figure.Chassis cover (1) and the casing bottom (2) by a hinge (8) bound together; housing cover (1) and the casing bottom (2) size: 350 × 260 × 50mm, they are and other dimensions of the radiating plate (3) and the lower heat dissipation plate (4) superposed together, these two heat radiating plate 42 is sandwiched between the embedded support column (6) of the upper cooling plate (3) and the lower heat dissipation plate (4 ) together, laminated together in the thermal plate (3) and the lower heat dissipation plate (4) on the periphery by four envelope (5) to surround the consolidation and sealed together to form a hollow sandwich flat boxes, boxes with porous medium (7) and the heat pipe working fluid; housing cover (1), housing bottom (2) is equipped with a power supply and CPU heating element (9), the total calorific value of 30w.The heat that when heater element (9) is worked, produces is through disperseing rapidly with (2) at the bottom of the casing as the casing upper cover (1) of superconduction hot body and being sent on the whole casing; Go in the surrounding environment and be dispersed into, thereby the temperature at heater element (9) center is controlled in 60 ℃ the safe range.
Claims (1)
1 A laptops average temperature rapid cooling cabinet, which consists of a chassis cover, chassis bottom two, the cooling plate 3, a lower cooling plate 4, Article 5 envelope structure, support columns 6, 7 porous media, hinge 8 components.Chassis cover a bottom 2 and the chassis by a hinge 8 links as one; chassis and the chassis cover an area of the bottom two the same, they are on the other dimensions of the heat radiating plate 3 and the lower plate 4 composite made This two cooling plates embedded sandwiched between two support columns 4-80 6, in the upper laminated together under heat radiating plate 3 and the upper plate 4 is four surrounding envelope of five consolidation, surrounded and sealed, mezzanine flat forming a hollow box, inside the box porous media 7; chassis cover 1, Chassis mounted on the bottom two heating elements 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100376580A CN102566723A (en) | 2012-02-20 | 2012-02-20 | Uniform-temperature quick-radiation casing of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100376580A CN102566723A (en) | 2012-02-20 | 2012-02-20 | Uniform-temperature quick-radiation casing of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102566723A true CN102566723A (en) | 2012-07-11 |
Family
ID=46412318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100376580A Pending CN102566723A (en) | 2012-02-20 | 2012-02-20 | Uniform-temperature quick-radiation casing of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102566723A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454801A (en) * | 2017-08-09 | 2017-12-08 | 长沙广义变流技术有限公司 | A kind of cooling heat source structure under closed environment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197367A (en) * | 1997-04-14 | 1998-10-28 | 株式会社日立制作所 | Electronic equipment |
| CN1707782A (en) * | 2004-06-10 | 2005-12-14 | 佶鸿电子股份有限公司 | Radiating substrate and producing method thereof |
| CN101598377A (en) * | 2009-05-15 | 2009-12-09 | 重庆大学 | Capillary wick type radiation heat exchange plate |
-
2012
- 2012-02-20 CN CN2012100376580A patent/CN102566723A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197367A (en) * | 1997-04-14 | 1998-10-28 | 株式会社日立制作所 | Electronic equipment |
| CN1707782A (en) * | 2004-06-10 | 2005-12-14 | 佶鸿电子股份有限公司 | Radiating substrate and producing method thereof |
| CN101598377A (en) * | 2009-05-15 | 2009-12-09 | 重庆大学 | Capillary wick type radiation heat exchange plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454801A (en) * | 2017-08-09 | 2017-12-08 | 长沙广义变流技术有限公司 | A kind of cooling heat source structure under closed environment |
| CN107454801B (en) * | 2017-08-09 | 2023-04-07 | 长沙广义变流技术有限公司 | Heat source heat radiation structure under closed environment |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |