CN216354171U - Heat control heat dissipation device and equipment thereof - Google Patents

Abstract

A thermal control heat dissipation device and equipment thereof relate to the technical field of heat dissipation. The thermal control heat dissipation device comprises a shell, a heat conduction assembly, a heat dissipation framework and a heat storage piece; the top surface of the shell is used for connecting a heat source; the shell is provided with a closed shell inner cavity, and the heat conduction assembly and the heat dissipation framework are arranged in the shell inner cavity; the heat conducting assembly is fixedly connected with the inner wall of the top of the shell, and the heat dissipation framework is fixedly connected with the heat conducting assembly; the heat storage piece is made of a phase-change material, and the heat storage piece is filled in the cavity in the shell. The thermal control heat dissipation device comprises a thermal control heat dissipation device. The utility model aims to provide a thermal control heat dissipation device and equipment thereof, which solve the technical problem of heat dissipation of equipment in an instantaneous high-power intermittent working mode in the prior art to a certain extent.

Description

Heat control heat dissipation device and equipment thereof

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a thermal control heat dissipation device and equipment thereof.

Background

For equipment in an instantaneous high-power intermittent working mode, if the heat dissipation capability of a configured heat dissipation device is too low, the short-time temperature of equipment devices is too high, and the equipment devices are easily damaged; if the heat dissipation capability of the configured heat dissipation device is too large, the cost is higher, and the cooling efficiency is lower.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a thermal control heat dissipation device and equipment thereof, which solve the technical problem of heat dissipation of equipment in an instantaneous high-power intermittent working mode in the prior art to a certain extent.

In order to achieve the purpose, the utility model provides the following technical scheme:

a thermal control heat dissipation device comprises a shell, a heat conduction assembly, a heat dissipation framework and a heat storage piece; the top surface of the shell is used for connecting a heat source;

the shell is provided with a closed shell inner cavity, and the heat conduction assembly and the heat dissipation framework are arranged in the shell inner cavity;

the heat conducting assembly is fixedly connected with the inner wall of the top of the shell, and the heat dissipation framework is fixedly connected with the heat conducting assembly;

the heat storage piece is made of a phase-change material, and the heat storage piece is filled in the cavity in the shell.

In any of the above technical solutions, optionally, the heat conducting assembly includes a temperature equalizing plate; the temperature equalizing plate is arranged between the inner wall of the top of the shell and the heat dissipation framework.

In any of the above technical solutions, optionally, the heat conducting assembly further includes a plurality of heat pipes; one end of the heat pipe is fixedly connected with the temperature equalizing plate, and the other end of the heat pipe penetrates through the heat dissipation framework and is connected with the bottom of the shell or arranged at intervals.

In any of the above technical solutions, optionally, the temperature-uniforming plate includes a temperature-uniforming plate shell, a temperature-uniforming plate evaporation structure layer, and an evaporation cavity; the vapor-distributing plate evaporation structure layer and the evaporation cavity are respectively arranged inside the vapor-distributing plate shell, and the vapor-distributing plate evaporation structure layer is arranged on one side, close to the top of the shell, of the vapor-distributing plate shell;

the heat pipe is fixedly connected with the temperature-equalizing plate shell.

In any of the above technical solutions, optionally, the heat pipe is cylindrical, U-shaped, L-shaped, or W-shaped;

and/or, a plurality of the heat pipes form at least one column of heat pipe sets; the heat pipes of each column of the heat pipe group are sequentially arranged at intervals along the direction vertical to the thickness direction of the shell.

In any of the above technical solutions, optionally, the thickness of the uniform temperature plate is less than or equal to 4 mm;

the phase change material comprises paraffin;

the melting point of the phase-change material is 70-90 ℃.

In any of the above technical solutions, optionally, the heat dissipation framework is a foam heat dissipation member or a heat dissipation fin;

the foam heat dissipation piece is made of foam copper, foam aluminum or foam carbon.

In any of the above technical solutions, optionally, the housing includes a housing body and a bottom cover; the shell body is fixedly connected with the bottom cover, and the shell body and the bottom cover form the shell inner cavity;

the shell body comprises a top cover corresponding to the bottom cover; the top surface of the top cover is used for connecting a heat source;

the bottom cover is provided with a filling opening for filling the heat storage piece;

the outer surfaces of the shell body and the bottom cover are both provided with a conductive oxide layer;

the shell body and the bottom cover are both made of hard aluminum alloy;

the top cover and/or the bottom cover are provided with a plurality of mounting holes.

A thermal control heat dissipation device comprises a heat source and a thermal control heat dissipation device;

the heat source is connected to the top surface of the shell of the thermal control heat dissipation device.

In any of the above technical solutions, optionally, the number of the heat sources is multiple; a plurality of heat sources are arranged on the top surface of the shell at intervals;

a heat conducting gasket is arranged between the heat source and the shell;

the heat conduction coefficient of the heat conduction gasket is 5w/m.k-15 w/m.k.

The utility model has the following beneficial effects:

the utility model provides a thermal control heat dissipation device and equipment thereof, which comprise a shell, a heat conduction assembly, a heat dissipation framework and a heat storage piece, wherein the top surface of the shell is used for connecting a heat source; the heat control heat dissipation device rapidly transfers the heat of the heat source to the heat storage part through the heat conduction assembly and the heat dissipation framework, the heat storage part absorbs a large amount of heat in a short time through self phase change, the temperature of the heat source can be reduced at a higher speed, the heat control heat dissipation device can be particularly used for heat dissipation of the heat source in an instantaneous high-power intermittent working mode, and the heat control heat dissipation device is lower in cost and higher in cooling efficiency.

In order to make the aforementioned and other objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic view of a first angular structure of a thermal control heat dissipation apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded view of the thermal management heat sink of FIG. 1;

fig. 3 is a second angle structural schematic diagram of the thermal control heat dissipation device according to the embodiment of the utility model;

FIG. 4 is a cross-sectional view taken along line A-A of the thermally controlled heat sink shown in FIG. 3;

FIG. 5 is a partially enlarged view of a vapor chamber and a heat pipe according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a heat dissipation fin according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a plurality of heat pipes according to an embodiment of the present invention;

fig. 8 is a schematic simulation diagram of a thermal control heat dissipation apparatus according to an embodiment of the present invention;

fig. 9 is another simulation diagram of the thermal control heat dissipation device according to the embodiment of the present invention.

Icon: 100-a housing; 110-a shell body; 120-a bottom cover; 200-a thermally conductive assembly; 210-a temperature-uniforming plate; 211-a vapor chamber shell; 212-vapor-forming the structural layer by the vapor-forming plate; 213-an evaporation chamber; 220-a heat pipe; 300-a heat dissipation framework; 500-a heat source; 600-heat conducting gasket.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the utility model are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Examples

The embodiment provides a thermal control heat dissipation device and equipment thereof; referring to fig. 1 to 9, fig. 1 is a perspective view of a thermal control heat dissipation device according to the present embodiment, and fig. 2 is an exploded view of the thermal control heat dissipation device shown in fig. 1; fig. 3 is a front view of the thermal control heat sink according to the present embodiment, and fig. 4 is a sectional view of the thermal control heat sink shown in fig. 3 along the direction a-a; FIG. 5 is a partial enlarged sectional view of the vapor chamber and the heat pipe provided in this embodiment; fig. 6 is a perspective view of a heat dissipation fin provided in this embodiment, and fig. 7 is a perspective view of a plurality of heat pipes provided in this embodiment. Fig. 8 and fig. 9 are two simulation schematic diagrams of the thermal control heat dissipation apparatus provided in this embodiment, where fig. 8 uses the thermal conductivity of the thermal pad to be 6w/m.k for simulation test, and fig. 9 uses the thermal conductivity of the thermal pad to be 12w/m.k for simulation test.

Referring to fig. 1 to 7, the present embodiment provides a thermal control heat dissipation device for heat dissipation of a heat source, especially for heat dissipation of a heat source in an instantaneous high-power intermittent operation mode. For example, the heat source of the instantaneous high-power intermittent operation mode has the operation time of 200s-300s and then has rest.

The thermal control heat dissipation device comprises a shell 100, a heat conduction assembly 200, a heat dissipation framework 300 and a heat storage piece; the top surface of the housing 100 is used for connecting a heat source 500. The heat source 500 is, for example, a chip.

The case 100 is provided with a closed case inner cavity, and the heat conducting assembly 200 and the heat dissipation frame 300 are both disposed in the case inner cavity.

The heat conducting assembly 200 is fixedly connected with the inner wall of the top of the housing 100, and the heat dissipating frame 300 is fixedly connected with the heat conducting assembly 200.

The heat storage member is made of a phase-change material, and the heat storage member is filled in the cavity in the housing, that is, the heat storage member is filled in the gap between the heat conduction assembly 200, the heat dissipation frame 300 and the housing 100.

Phase change materials have the ability to absorb and store large amounts of latent heat when changing their physical state over a range of temperatures. Taking solid-liquid phase change as an example, when the material is heated to a melting temperature, the material generates phase change from a solid state to a liquid state, and in the melting process, the phase change material absorbs and stores a large amount of latent heat; when the phase change material is cooled, the stored heat is dissipated to the environment within a certain temperature range, and reverse phase change from liquid to solid is carried out. In both phase change processes, the stored or released energy is called latent heat of phase change. When the physical state changes, the temperature of the phase change material is almost kept unchanged before the phase change is completed, a wide temperature platform is formed, and although the temperature is unchanged, the latent heat absorbed or released is quite large. The thermal control heat dissipation device in this embodiment adopts the characteristics of the phase-change material to meet the heat dissipation requirement of the heat source 500 in the instantaneous high-power intermittent operation mode. Because the heat conductivity coefficient of the phase-change material is very low, for example, only about 0.12w/m.k, the heat dissipation framework 300 is adopted to quickly transfer heat to each position of the heat storage element, and quickly diffuse the heat in the shell 100, so that the heat storage element absorbs heat and heats up; when the melting point of the heat storage part is reached, the solid state is liquefied into liquid, and a large amount of heat is absorbed, so that the temperature of the heat source 500 is controlled within a safe range. When the heat source 500 stops working, heat is dissipated through the shell 100, the temperature of the heat storage part is reduced to be lower than the melting point temperature, and the liquid state is solidified into the solid state.

The thermal control heat dissipation device in this embodiment includes a housing 100, a heat conduction assembly 200, a heat dissipation framework 300, and a heat storage member, wherein the top surface of the housing 100 is used for connecting a heat source 500, the heat source 500 transfers heat to the heat conduction assembly 200 through the top surface of the housing 100, and the heat conduction assembly 200 transfers heat to the heat dissipation framework 300 and the heat storage member; the heat control heat dissipation device rapidly transfers the heat of the heat source 500 to the heat storage part through the heat conduction assembly 200 and the heat dissipation framework 300, the heat storage part absorbs a large amount of heat in a short time through self phase change, the temperature of the heat source 500 can be reduced at a higher speed, the heat control heat dissipation device can be particularly used for heat dissipation of the heat source 500 in an instantaneous high-power intermittent working mode, and the heat control heat dissipation device is lower in cost and higher in cooling efficiency.

For example, when the heat source 500 operates, a part of electric power of the heat source 500 is converted into thermal power, and the thermal power is transferred to the housing 100 of the thermal control heat dissipation device in contact with the heat source 500, then transferred to the heat conduction assembly 200 through the housing 100, transferred to the heat dissipation framework 300 through the heat conduction assembly 200, and then transferred to the heat storage member; when the temperature of the heat storage member reaches the melting point, the solid state is liquefied into a liquid state, and a large amount of heat is absorbed, so that the heat source 500 can be cooled.

Referring to fig. 2-5, in an alternative of the present embodiment, the heat conducting assembly 200 includes a temperature equalization plate 210; the temperature equalization plate 210 is disposed between the top inner wall of the housing 100 and the heat dissipation frame 300. Through the vapor chamber 210, heat can be better transferred to the heat dissipation frame 300.

Referring to fig. 2-5, in an alternative of the present embodiment, the heat conducting assembly 200 further includes a plurality of heat pipes 220; one end of the heat pipe 220 is fixedly connected to the temperature equalizing plate 210, and the other end of the heat pipe 220 passes through the heat dissipation frame 300 and is connected to or spaced from the bottom of the housing 100. Through the heat pipe 220, with the better heat transfer with the temperature-uniforming plate 210 for heat dissipation skeleton 300, so that the heat of heat source 500 more fast transfers to the heat dissipation skeleton 300 that is close to the middle part of casing 100, bottom, and then makes the heat of heat source 500 more fast transfer to the heat-retaining piece that is close to the middle part of casing 100, bottom, improved the heat-retaining speed that absorbs the heat to a certain extent, accelerated the heat dissipation of heat source 500.

Referring to fig. 2 and 5, in an alternative of the present embodiment, the vapor chamber 210 includes a vapor chamber shell 211, a vapor structure layer 212 of the vapor chamber, and a vapor chamber 213; the vapor-permeable plate evaporation structure layer 212 and the evaporation cavity 213 are respectively disposed inside the vapor-permeable plate shell 211, and the vapor-permeable plate evaporation structure layer 212 is disposed on a side of the vapor-permeable plate shell 211 close to the top of the housing 100.

Optionally, the heat pipe 220 is fixedly connected to the vapor chamber 211.

Optionally, the vapor-deposited structure layer 212 comprises a sintered powder layer or a mesh.

For example, when the heat source 500 operates, a part of electric power of the heat source 500 is converted into thermal power, the heat is conducted to the housing 100 in contact with the heat source 500, then is conducted to the temperature equalizing plate 210 through the housing 100, and is conducted to the heat pipe 220 through the temperature equalizing plate 210, the heat pipe 220 belongs to a superconductor, the heat is rapidly diffused to the heat dissipation framework 300 in contact with the heat pipe 220 along the axis of the heat pipe 220, and is then conducted to the heat storage element through the heat dissipation framework 300; when the temperature of the heat storage member reaches the melting point, the solid state is liquefied into a liquid state, and a large amount of heat is absorbed, so that the heat source 500 can be cooled.

In an alternative of this embodiment, the heat pipe 220 is cylindrical, U-shaped, L-shaped or W-shaped; or other shapes. As shown in fig. 7, the heat pipe 220 has a U-shape.

Referring to FIG. 7, in an alternative of the present embodiment, a plurality of heat pipes 220 form at least one column of heat pipe sets; the heat pipes 220 of each heat pipe set are sequentially arranged at intervals in the thickness direction of the vertical casing 100. By providing a heat pipe set, the heat conduction capability of the heat conduction assembly 200 is improved.

In the alternative of this embodiment, the thickness of the vapor chamber 210 is less than or equal to 4 mm; for example, the thickness of the vapor chamber 210 is 1.5mm, 2mm, 3.6mm, or 4mm, or other dimensions.

In an alternative of this embodiment, the phase change material comprises paraffin; the phase change material may also include other phase change materials.

In the alternative of this embodiment, the melting point of the phase change material is 70 ℃ to 90 ℃; for example, the melting point of the phase change material is 70 ℃, 75 ℃, 80 ℃, 88 ℃, or 90 ℃, or other temperatures.

In the alternative of this embodiment, the heat dissipation frame 300 is a foam heat dissipation member or a heat dissipation fin, or other structure for dissipating heat quickly.

Optionally, the foamed heat sink is copper foam, aluminum foam, or carbon foam, or other foam structure.

Referring to fig. 2, in an alternative of the present embodiment, the case 100 includes a case body 110 and a bottom cover 120; the case body 110 and the bottom cover 120 are fixedly connected, and the case body 110 and the bottom cover 120 form a case inner cavity.

The case body 110 includes a top cover corresponding to the bottom cover 120; the top surface of the top cover is used for connecting a heat source 500.

Optionally, a filling opening for filling the heat storage element is provided on the bottom cover 120; optionally, the filling opening does not protrude from the surface of the bottom cover 120.

Optionally, the outer surfaces of the case body 110 and the bottom cover 120 are both provided with a conductive oxide layer; through the conductive oxide layer, electromagnetism is shielded better, reduces the interference of electromagnetism to the chip. Optionally, the surface of the conductive oxide layer is a golden yellow conductive oxidation treatment layer.

Optionally, the shell body 110 and the bottom cover 120 are made of hard aluminum alloy;

optionally, the top cover and/or the bottom cover 120 are provided with a plurality of mounting holes, i.e. the top cover is provided with a plurality of mounting holes, or the bottom cover 120 is provided with a plurality of mounting holes, or both the top cover and the bottom cover 120 are provided with a plurality of mounting holes. Through the mounting hole to thermal control heat abstractor is connected with other structures.

Optionally, the mounting holes are threaded holes.

The present embodiment further provides a thermal control heat dissipation apparatus, which includes a heat source 500 and the thermal control heat dissipation device according to any of the above embodiments;

the heat source 500 is attached to the top surface of the case 100 of the thermal control heat sink.

The thermal control heat dissipation apparatus provided in this embodiment includes the above thermal control heat dissipation device, and the technical features of the above disclosed thermal control heat dissipation device are also applicable to the thermal control heat dissipation apparatus, and the technical features of the above disclosed thermal control heat dissipation device are not described repeatedly. The thermal control heat dissipation device in the embodiment has the advantages of the thermal control heat dissipation device, and the advantages of the thermal control heat dissipation device disclosed above are not described repeatedly herein.

Referring to fig. 1 and 2, in an alternative of the present embodiment, the number of the heat sources 500 is plural; a plurality of heat sources 500 are spaced apart on the top surface of the housing 100.

Optionally, a heat conducting gasket 600 is disposed between the heat source 500 and the housing 100; the heat source 500 is facilitated to better transfer heat to the case 100 by the heat conductive gasket 600.

Optionally, the thermal conductivity of the thermal pad is 5w/m.k-15 w/m.k. For example, the thermal conductivity of the thermal pad is 5w/m.k, 6w/m.k, 10w/m.k, 12w/m.k, or 15 w/m.k.

The thermal control heat dissipation device of the embodiment needs to meet vacuum thermal tests and thermal performance tests.

The vacuum heat test is included at 10^-6And in the Pa environment, heating the thermal control heat dissipation device to a temperature higher than the melting point of the heat storage part to ensure that the phase change material is fully melted, keeping for 30min, and checking whether the heat storage part leaks or not. For example, when the heat storage member is paraffin, the heat control heat dissipation device is heated to about 100 ℃ to ensure that the paraffin is sufficiently melted.

The thermal performance test adopts a heat source simulation chip with corresponding power, the chip keeps heating for 250s in a low-pressure environment at 70 ℃, and the temperature rise curve of the thermal control heat dissipation device is monitored and recorded.

For a clearer understanding of the thermal control heat dissipation apparatus and the device thereof in the present embodiment, the following examples are given: heat source 500 includes 3 models, chip a, chip B, and chip C, respectively, with specific power, volume, and operating time as shown in table 1. Wherein, the number of the chips A is 1; the number of the chips B is 2, namely a chip B1 and a chip B2; the number of chips C is 2, chip C1 and chip C2. Two sets of simulation tests were performed with 5 heat sources 500 using thermal conductivity pads with thermal conductivity of 6w/m.k and 12 w/m.k.

TABLE 1 chip Power

Chip and method for manufacturing the same	Power of	Volume (mm)	Number of	Working time
					Chip A	115W	30×30×2	1	250s
Chip B	55W	20×20×2	2	250s
					Chip C	28W	15×15×1.3	2	250s

Inputting simulation analysis conditions:

1. the heat consumption is 115+55+55+28+28 ═ 281 w;

2. size of the thermal control heat dissipation device: d145 × H65 mm;

3. ambient temperature: 70 ℃;

the thickness of the thermal pad 600 between the 4.5 chips and the case 100 is 1mm (about 0.85mm after compression);

5. the working time is 250 s;

6. the phase-change material adopts paraffin with a melting point of 75-85 ℃, and the latent heat is more than or equal to 200J/g.

The first set of simulation tests were simulated using a thermal pad with a thermal conductivity of 6w/m.k, and the simulated temperature cloud was shown in fig. 8, with specific data in the set 1 of data in table 2.

The second set of simulation tests were simulated using a thermal pad with a thermal conductivity of 12w/m.k, and the simulated temperature cloud was shown in fig. 9, with specific data in the set of data 2 in table 2.

Table 2 simulation summary

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A thermal control heat dissipation device is characterized by comprising a shell, a heat conduction assembly, a heat dissipation framework and a heat storage piece; the top surface of the shell is used for connecting a heat source;

the shell is provided with a closed shell inner cavity, and the heat conduction assembly and the heat dissipation framework are arranged in the shell inner cavity;

the heat conducting assembly is fixedly connected with the inner wall of the top of the shell, and the heat dissipation framework is fixedly connected with the heat conducting assembly;

the heat storage piece is made of a phase-change material, and the heat storage piece is filled in the cavity in the shell.

2. The thermally controlled heat sink of claim 1, wherein the thermally conductive assembly comprises a vapor chamber; the temperature equalizing plate is arranged between the inner wall of the top of the shell and the heat dissipation framework.

3. The thermally controlled heat sink of claim 2, wherein the thermally conductive assembly further comprises a plurality of heat pipes; one end of the heat pipe is fixedly connected with the temperature equalizing plate, and the other end of the heat pipe penetrates through the heat dissipation framework and is connected with the bottom of the shell or arranged at intervals.

4. The thermally controlled heat sink according to claim 3, wherein the vapor chamber comprises a vapor chamber shell, a vapor structure layer of the vapor chamber, and an evaporation cavity; the vapor-distributing plate evaporation structure layer and the evaporation cavity are respectively arranged inside the vapor-distributing plate shell, and the vapor-distributing plate evaporation structure layer is arranged on one side, close to the top of the shell, of the vapor-distributing plate shell;

the heat pipe is fixedly connected with the temperature-equalizing plate shell.

5. The thermally controlled heat dissipating device according to claim 3, wherein the heat pipe is cylindrical, U-shaped, L-shaped or W-shaped;

and/or, a plurality of the heat pipes form at least one column of heat pipe sets; the heat pipes of each column of the heat pipe group are sequentially arranged at intervals along the direction vertical to the thickness direction of the shell.

6. The thermally controlled heat dissipating device according to claim 2, wherein the thickness of the uniform temperature plate is not more than 4 mm;

the phase change material comprises paraffin;

the melting point of the phase-change material is 70-90 ℃.

7. The thermally controlled heat dissipating device according to claim 1, wherein the heat dissipating skeleton is a foam heat dissipating member or a heat dissipating fin;

the foam heat dissipation piece is made of foam copper, foam aluminum or foam carbon.

8. The thermally controlled heat sink of claim 1, wherein the housing comprises a shell body and a bottom cover; the shell body is fixedly connected with the bottom cover, and the shell body and the bottom cover form the shell inner cavity;

the shell body comprises a top cover corresponding to the bottom cover; the top surface of the top cover is used for connecting a heat source;

the bottom cover is provided with a filling opening for filling the heat storage piece;

the outer surfaces of the shell body and the bottom cover are both provided with a conductive oxide layer;

the shell body and the bottom cover are both made of hard aluminum alloy;

the top cover and/or the bottom cover are provided with a plurality of mounting holes.

9. A thermal control heat sink apparatus comprising a heat source and the thermal control heat sink device of any one of claims 1-8;

the heat source is connected to the top surface of the shell of the thermal control heat dissipation device.

10. The thermally controlled heat dissipating device according to claim 9, wherein the number of the heat sources is plural; a plurality of heat sources are arranged on the top surface of the shell at intervals;

a heat conducting gasket is arranged between the heat source and the shell;

the heat conduction coefficient of the heat conduction gasket is 5w/m.k-15 w/m.k.

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