CN1681967A - 用于锌和锌合金的非氰化物铜电镀方法 - Google Patents
用于锌和锌合金的非氰化物铜电镀方法 Download PDFInfo
- Publication number
- CN1681967A CN1681967A CNA038057441A CN03805744A CN1681967A CN 1681967 A CN1681967 A CN 1681967A CN A038057441 A CNA038057441 A CN A038057441A CN 03805744 A CN03805744 A CN 03805744A CN 1681967 A CN1681967 A CN 1681967A
- Authority
- CN
- China
- Prior art keywords
- zinc
- copper
- nickel
- solution
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 50
- 239000010949 copper Substances 0.000 title claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 239000011701 zinc Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 42
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052725 zinc Inorganic materials 0.000 title claims abstract description 22
- 238000007747 plating Methods 0.000 title claims description 47
- 239000011248 coating agent Substances 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 34
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 18
- -1 nickel pyrophosphate Chemical compound 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 65
- 229910052759 nickel Inorganic materials 0.000 claims description 33
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 18
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 8
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- 239000011734 sodium Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 7
- 150000002815 nickel Chemical class 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 5
- 229940024464 emollients and protectives zinc product Drugs 0.000 claims description 4
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical group [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical group [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- VKFFEYLSKIYTSJ-UHFFFAOYSA-N tetraazanium;phosphonato phosphate Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[O-]P([O-])(=O)OP([O-])([O-])=O VKFFEYLSKIYTSJ-UHFFFAOYSA-N 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 3
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 230000001464 adherent effect Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 29
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical class [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 9
- 150000003751 zinc Chemical class 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 235000011180 diphosphates Nutrition 0.000 description 6
- 238000007654 immersion Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 206010027146 Melanoderma Diseases 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/096,411 | 2002-03-12 | ||
| US10/096,411 US6827834B2 (en) | 2002-03-12 | 2002-03-12 | Non-cyanide copper plating process for zinc and zinc alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1681967A true CN1681967A (zh) | 2005-10-12 |
Family
ID=28039015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA038057441A Pending CN1681967A (zh) | 2002-03-12 | 2003-01-30 | 用于锌和锌合金的非氰化物铜电镀方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6827834B2 (enExample) |
| EP (1) | EP1483430B1 (enExample) |
| JP (1) | JP4027320B2 (enExample) |
| CN (1) | CN1681967A (enExample) |
| AU (1) | AU2003217279A1 (enExample) |
| ES (1) | ES2477589T3 (enExample) |
| WO (1) | WO2003078686A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724870B (zh) * | 2008-10-22 | 2011-04-27 | 中国科学院宁波材料技术与工程研究所 | 锌合金无氰电沉积镀镍溶液及镀镍方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4815120B2 (ja) * | 2004-10-20 | 2011-11-16 | 株式会社オーディオテクニカ | コンデンサマイクロホン |
| US20100084278A1 (en) * | 2008-10-02 | 2010-04-08 | Rowan Anthony J | Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components |
| US9783901B2 (en) | 2014-03-11 | 2017-10-10 | Macdermid Acumen, Inc. | Electroplating of metals on conductive oxide substrates |
| CN110760904A (zh) * | 2019-10-31 | 2020-02-07 | 武汉奥邦表面技术有限公司 | 一种无氰碱性亚铜镀铜添加剂 |
| CN113430595A (zh) * | 2021-06-24 | 2021-09-24 | 惠州市安泰普表面处理科技有限公司 | 一种在黄铜铸件表面镀铜的方法 |
| CN116536541B (zh) * | 2023-04-10 | 2025-05-06 | 南京工程学院 | 一种适用于电弧喷涂的锌基合金丝材及其制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4273837A (en) * | 1975-04-18 | 1981-06-16 | Stauffer Chemical Company | Plated metal article |
| US4599279A (en) * | 1984-10-01 | 1986-07-08 | Ball Corporation | Zinc alloy for reducing copper-zinc diffusion |
| JP2673829B2 (ja) * | 1989-05-26 | 1997-11-05 | 日新製鋼株式会社 | 銅被覆鉄粉の製造法 |
| JP2832224B2 (ja) * | 1990-04-03 | 1998-12-09 | 三井金属鉱業株式会社 | ニッケル被覆亜鉛基合金金型の製造方法 |
| JPH10241697A (ja) * | 1997-02-21 | 1998-09-11 | Matsushita Electric Ind Co Ltd | アルカリ蓄電池用電極及びその製造法 |
| JP3715743B2 (ja) * | 1997-04-15 | 2005-11-16 | 株式会社神戸製鋼所 | Ｍｇ合金部材の製造方法 |
| JPH11181593A (ja) * | 1997-12-16 | 1999-07-06 | Totoku Electric Co Ltd | 銅被覆アルミニウム線の製造方法 |
| US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
| US6054037A (en) * | 1998-11-11 | 2000-04-25 | Enthone-Omi, Inc. | Halogen additives for alkaline copper use for plating zinc die castings |
| US6656606B1 (en) * | 2000-08-17 | 2003-12-02 | The Westaim Corporation | Electroplated aluminum parts and process of production |
-
2002
- 2002-03-12 US US10/096,411 patent/US6827834B2/en not_active Expired - Lifetime
-
2003
- 2003-01-30 JP JP2003576675A patent/JP4027320B2/ja not_active Expired - Lifetime
- 2003-01-30 WO PCT/US2003/002773 patent/WO2003078686A1/en not_active Ceased
- 2003-01-30 ES ES03713321.2T patent/ES2477589T3/es not_active Expired - Lifetime
- 2003-01-30 AU AU2003217279A patent/AU2003217279A1/en not_active Abandoned
- 2003-01-30 CN CNA038057441A patent/CN1681967A/zh active Pending
- 2003-01-30 EP EP03713321.2A patent/EP1483430B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724870B (zh) * | 2008-10-22 | 2011-04-27 | 中国科学院宁波材料技术与工程研究所 | 锌合金无氰电沉积镀镍溶液及镀镍方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2477589T3 (es) | 2014-07-17 |
| JP2005520048A (ja) | 2005-07-07 |
| JP4027320B2 (ja) | 2007-12-26 |
| US20030183532A1 (en) | 2003-10-02 |
| EP1483430A1 (en) | 2004-12-08 |
| US6827834B2 (en) | 2004-12-07 |
| EP1483430A4 (en) | 2007-12-19 |
| AU2003217279A1 (en) | 2003-09-29 |
| EP1483430B1 (en) | 2014-06-18 |
| WO2003078686A1 (en) | 2003-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20051012 |