CN1674244A - Method for detecting defect of semiconductor elements - Google Patents
Method for detecting defect of semiconductor elements Download PDFInfo
- Publication number
- CN1674244A CN1674244A CN 200410031241 CN200410031241A CN1674244A CN 1674244 A CN1674244 A CN 1674244A CN 200410031241 CN200410031241 CN 200410031241 CN 200410031241 A CN200410031241 A CN 200410031241A CN 1674244 A CN1674244 A CN 1674244A
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- Prior art keywords
- semiconductor element
- defective
- grid
- detection method
- connector
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims description 34
- 230000007547 defect Effects 0.000 title abstract description 7
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 238000000227 grinding Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000002950 deficient Effects 0.000 claims description 66
- 230000004888 barrier function Effects 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 17
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
A detection method of semiconductor element defect includes providing a semiconductor element consisting of substrate, grid, plug, insulation layer and wire; having plug connected in electricity to source electrode / drain electrode area in substrate at two sides of grid and having it partially covered above grid as well as having defect done between plug and grid; grinding semiconductor element to position above grid uncovered by play; washing semiconductor element; moving off insulation layer between plug and grid to detect the defect there.
Description
Technical field
The invention relates to a kind of detection method of semiconductor element, and particularly relevant for a kind of detection method of semiconductor element defective.
Background technology
So-called integrated circuit, be exactly particular electrical circuit required various elements and circuit, dwindle and be produced on size only reaching a kind of electronic product on 2 centimeters or the littler area.Because integrated circuit is by ten hundreds of mostly, size needs just to watch the solid-state electronic element that obtains to be combined by microscope, therefore can be described as microelectronic element again.If there is defective (Defect), the electronic device failure of microelectronic element formation thus will be caused in the above-mentioned microelectronic element.And, when the semiconductor design specification is dwindled, improve and keep semiconductor technology yield difficulty more, and defective (Defect) is for influencing of paramount importance key in the technology yield.Therefore, the identification and analysis of defective and reduction have great relation for the lifting of integrated circuit fine ratio of product.
Existing in order to detect the defective in the semiconductor element, remove each layer on the semiconductor element and the method that in regular turn each layer is performed an analysis in regular turn and adopt in etched mode.That is, when carrying out the defects detection of semiconductor element, beginning from the upper strata successively down to carry out etch process according to its order, the lower floor that makes defectiveness place layering one by one exposes, and each layer carried out observation analysis, up to proceeding to orlop.
Yet, along with the increase of semiconductor integrated level, use above-mentioned method check and analysis semiconductor element defective, will be difficult further especially for analyzing the defective that FEOL the caused defective of grid and connector short circuit (as cause).This is because when using above-mentioned detection method, needs the etching of carrying out in layer, till defective is exposed, so will make the very long Production Time of test film needs that the defective of sening as an envoy to is exposed.And this kind method is in the process of carrying out Wet-type etching, and defective or particulate also can be because of etching be removed, and cause can't be certain the shortcoming that detects defective or particulate.
Summary of the invention
In view of this, a purpose of the present invention is to provide a kind of detection method of semiconductor element, can detect defective fast and accurately.
The present invention proposes a kind of detection method of semiconductor element defective, this semiconductor element is made of substrate, grid, connector, insulating barrier and lead, wherein above the source/drain regions and cover part grid in the substrate of connector electric connection grid both sides, and has a defective between connector and the grid, the method is carried out grinding steps earlier, and the grinding semiconductor element is to connector cover gate top not at least.Then carry out cleaning step, clean semiconductor components.Behind the insulating barrier that removes between grid and the connector, the defective between detecting connector and the grid.
In above-mentioned method, grinding steps more comprises and is ground to rough exposure grid.Cleaning step comprises with behind the washed with de-ionized water semiconductor element, the drying semiconductor element.The step that removes the insulating barrier between grid and the connector then comprises carries out wet etch process and carries out dry etch process.
The present invention adopts the mode of grinding, directly semiconductor element being ground to connector can the cover gate upper section, and then removes the insulating barrier between grid and the connector, not only can avoid defective to be removed because of wet etching, and can detect defective accurately, and can save time.
The present invention proposes a kind of detection method of semiconductor element defective, this semiconductor element comprises two adjacent conductor layer and insulating barriers at least, this insulating barrier fills up the gap between the adjacent conductive layers, wherein has a defective between the two adjacent conductor layers, the method is carried out grinding steps earlier, and the grinding semiconductor element is to rough exposure two conductor layers.Then, remove the insulating barrier between two conductor layers, and detect the defective between two conductor layers.
In said method, after grinding steps and remove and comprise before the step of the insulating barrier between two conductor layers and carry out cleaning step.This cleaning step is dried this semiconductor element then earlier with this semiconductor element of washed with de-ionized water.The method that removes the insulating barrier between two conductor layers can be Wet-type etching or dry-etching.
The present invention adopts the mode of grinding, directly semiconductor element is ground to rough exposure two conductor layers, and then removes the insulating barrier between two conductor layers, not only can avoid defective to be removed because of wet etching, and can detect defective accurately, and can save time.
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A to Fig. 1 C is the flow process profile that illustrates according to the detection method of a kind of semiconductor element defective of one embodiment of the present invention;
Fig. 2 A and Fig. 2 B are the sweep electron microscope photographic view of the semiconductor element of experimental example 1 of the present invention;
Fig. 3 A and Fig. 3 B are the sweep electron microscope photographic view of the semiconductor element of experimental example 2 of the present invention;
Fig. 4 A and Fig. 4 B are the sweep electron microscope photographic view of the semiconductor element of comparative example 1 of the present invention;
Fig. 5 A and Fig. 5 B are the sweep electron microscope photographic view of the semiconductor element of other experimental examples of the present invention.
Description of reference numerals
100: semiconductor element
102: substrate
104: grid
106: protective layer
108: connector
110: insulating barrier
112: the bit line
114: stack layer
116: source/drain regions
118: defective
Embodiment
Please refer to Figure 1A to Fig. 1 C, it illustrates the flow process profile according to the detection method of a kind of semiconductor element defective of one embodiment of the present invention.
Please refer to Figure 1A, semiconductor element 100 is provided, this semiconductor element comprises substrate 102, grid 104, protective layer 106, connector 108, insulating barrier 110, bit line 112 and stack layer 114.
Then, please refer to Figure 1B, carry out a grinding steps, grinding semiconductor element 100 is to connector 106 not till cover gate 104 tops.In this grinding steps, employed lapping device for example is the MODEL 656N pit grinder (Dimple Grinder) of JOELLTD corporate system.Certainly, in this step, but also the grinding semiconductor chip till exposing grid 104.Behind grinding steps, carry out cleaning step with clean semiconductor components.This cleaning step for example is with the washed with de-ionized water semiconductor element, carries out a baking step then.This cleaning step need spend the time about 5～10 seconds usually.
Then, please refer to Fig. 1 C, remove protective layer 106 and insulating barrier 110 between grid 104 and the connector 108.For example be to carry out wet etch step earlier in this step, use hydrofluoric acid (HF) solution, remove the TEOS silica as etchant.Carry out reactive ion etch process then and remove silicon nitride layer and TEOS silica.In this step, because therefore defective 118 conductor particulate normally can not be removed.And, after the protective layer 106 and insulating barrier 110 that remove between grid 104 and the connector 108, also can carry out a cleaning step.Afterwards, the defective 118 between detecting connector 108 and the grid 104.The instrument that uses for example is a sweep electron microscope.
In the above embodiment of the present invention, be to be that example is done explanation with the defective that detects between connector and the grid, certain method of the present invention also can be applied to detect the defective between the conductor layer (lead).For instance, detect the defective between the two adjacent conductor layers (as the bit line), can be ground to the surface of rough exposure two adjacent conductor layers earlier, remove the insulating barrier (method that removes insulating barrier can be used dry-etching or Wet-type etching) between conductor layer then, utilize sweep electron microscope again, with the defective of detecting adjacent conductor interlayer.
Then with comparative example 1 advantage of the present invention is described with experimental example 1, experimental example 2.In experimental example 1, experimental example 2 and comparative example 1, be that example is done explanation with the dynamic random access memory.
Experimental example 1
The semiconductor chip (dynamic random access memory) of 0.15 micron of live width is provided, and this semiconductor chip is carried out a grinding steps, the grinding semiconductor chip is to connector not till the cover gate top.In this grinding steps, milling time for example is about 12 minutes.After semiconductor chip is carried out cleaning step, remove the insulating barrier between grid and the connector.For example be to carry out wet etch step earlier in this step, use hydrofluoric acid (HF) solution, carried out etching 1 minute as etchant.Carried out reactive ion etch process then 1 minute.After the insulating barrier between grid and connector, also can carry out a cleaning step.Then, utilize sweep electron microscope, the detecting semiconductor chip.Its result is (graphic part is the memory cell areas of dynamic random access memory) shown in Fig. 2 A and Fig. 2 B.
Experimental example 2
The semiconductor chip (dynamic random access memory) of 0.13 micron of live width is provided, then this semiconductor chip is carried out the processing step identical with experimental example 1 after, utilize sweep electron microscope, detect this semiconductor chip.Its result is (graphic part is the memory cell areas of dynamic random access memory) shown in Fig. 3 A and Fig. 3 B.
Comparative example 1
The semiconductor element (dynamic random access memory) of 0.15 micron of live width is provided, and at first, hydrofluoric acid carried out Wet-type etching 3 minutes as etchant, to remove conductor layer, carried out cleaning step then.Then, sulfuric acid carried out Wet-type etching 10 minutes as etchant, to remove memory cell top electrode flaggy (Cell Platelayer).
Then, carry out removing of storage node layer (Storage Node layer), in this step, carried out reactive ion etching earlier 2 minutes, to remove nitrogenize silicon/oxidative silicon/silicon nitride capacitance dielectric layer.Then, as etchant, carried out etching 5 minutes with hydrofluoric acid, clean so that nitrogenize silicon/oxidative silicon/silicon nitride capacitance dielectric layer is removed, and remove insulating barrier.Then, be etchant with potassium hydroxide, carried out etching 15 seconds, removing lower electrode plate, and with hydrofluoric acid as etchant, the etching time of carrying out is 5 minutes, so that lower electrode plate is removed totally.
Afterwards, carry out removing of bit line and connector, carried out etching 10 minutes with sulfuric acid as etchant earlier, to remove metal level.Then, be that etchant carried out etching 20 seconds with potassium hydroxide, to remove polysilicon.Then, as etchant, carried out etching 5 minutes, to remove residual bit line and connector with hydrofluoric acid.After removing bit line and connector, utilize sweep electron microscope, detect this semiconductor chip.Its result is (graphic part is the memory cell areas of dynamic random access memory) shown in Fig. 4 A and Fig. 4 B.Wherein, removing after the technology of each layer, all can carry out cleaning step.
By experimental example 1 result with experimental example 2, shown in Fig. 2 B and Fig. 3 B, the defective of discovery between grid and connector that can be clearly.And method of the present invention also goes for the little element of live width.Yet,, shown in Fig. 4 B, and can't find defective between grid and connector by the result of comparative example 1.This is because the defective that causes grid and connector short circuit conductor particulate normally, and in the process that the mode with Wet-type etching removes whole connector, defective also can be removed simultaneously.Therefore, in Fig. 4 B, just defective can't have been detected.
In addition, by above-mentioned result as can be known, the 2 required times of experimental example 1 and experimental example are about 15 minutes, and the 1 needed time of comparative example needs about 30 minutes at least.Therefore, method of the present invention is compared with existing method, can save time really.
In addition, Fig. 5 A and Fig. 5 B are the sweep electron microscope photographic view of other experimental examples of the present invention.Shown in Fig. 5 A and Fig. 5 B, the defective between grid and the connector can clearly detect.
The above-mentioned experimental example 1 of the present invention, experimental example 2 and comparative example 1 are that the memory cell areas with dynamic random access memory is that example is done explanation.Certain method of the present invention also can be applied to the periphery circuit region of dynamic random access memory, perhaps detects the defective of the semiconductor element of other kinds.
Described according to the above embodiment of the present invention, the present invention adopts the mode of grinding, directly semiconductor element being ground to connector can the cover gate upper section, and then remove insulating barrier between grid and the connector, not only can avoid defective to be removed because of wet etching, and enough defectives that detects accurately.And, also can save time.
Though the present invention discloses as above with preferred embodiment; but it is not in order to limit the present invention; those skilled in the art are under the situation that does not break away from the spirit and scope of the present invention; should do a little change and retouching, so protection scope of the present invention should be with appended being as the criterion that claim was defined.
Claims (14)
1. the detection method of a semiconductor element defective, this semiconductor element comprises a substrate, a grid, a connector, an insulating barrier and a lead at least, wherein this connector electrically connects source and this grid top, cover part in this substrates of this grid both sides, and have a defective between this connector and this grid, this method comprises:
Carry out a grinding steps, grind this semiconductor element to this connector at least and do not cover this grid top;
Carry out a cleaning step, clean this semiconductor element;
Remove this insulating barrier between this grid and this connector; And
Detect this defective between this connector and this grid.
2. the detection method of semiconductor element defective as claimed in claim 1, wherein this grinding steps also comprises and is ground to this grid of rough exposure.
3. the detection method of semiconductor element defective as claimed in claim 1, wherein this cleaning step comprises:
With this semiconductor element of washed with de-ionized water; And
Dry this semiconductor element.
4. the detection method of semiconductor element defective as claimed in claim 1, the step that wherein removes this insulating barrier between this grid and this connector comprises:
Carry out a wet etch process; And
Carry out a dry etch process.
5. the detection method of semiconductor element defective as claimed in claim 4, wherein the material of this insulating barrier comprises silica, this wet etch process comprises uses hydrofluoric acid solution as etching solution.
6. the detection method of semiconductor element defective as claimed in claim 4, wherein this dry etch process comprises reactive ion etch process.
7. the detection method of semiconductor element defective as claimed in claim 4, the step of wherein detecting this defective between this connector and this grid comprises the use sweep electron microscope.
8. the detection method of a semiconductor element defective, this semiconductor element comprises two adjacent conductor layers and an insulating barrier at least, and this insulating barrier fills up the gap between this adjacent conductive layers, wherein has a defective between this two adjacent conductor layer, and this method comprises:
Carry out a grinding steps, grind this semiconductor element to this two conductor layer of rough exposure;
Remove this insulating barrier between this two conductor layer; And
Detect this defective between this two conductor layer.
9. the detection method of semiconductor element defective as claimed in claim 8 is wherein after this grinding steps and remove and comprise before the step of this insulating barrier between this two conductor layer and carry out a cleaning step.
10. the detection method of semiconductor element defective as claimed in claim 9, wherein this cleaning step comprises:
With this semiconductor element of washed with de-ionized water; And
Dry this semiconductor element.
11. the detection method of semiconductor element defective as claimed in claim 8, the method that wherein removes this insulating barrier between this two conductor layer comprises Wet-type etching.
12. the detection method of semiconductor element defective as claimed in claim 8, the method that wherein removes this insulating barrier between this two conductor layer comprises dry-etching.
13. the detection method of semiconductor element defective as claimed in claim 12, wherein this dry-etching comprises reactive ion etch process.
14. the detection method of semiconductor element defective as claimed in claim 8, the step of wherein detecting this defective between this two conductor layer comprises the use sweep electron microscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100312419A CN100361286C (en) | 2004-03-26 | 2004-03-26 | Method for detecting defect of semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100312419A CN100361286C (en) | 2004-03-26 | 2004-03-26 | Method for detecting defect of semiconductor elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1674244A true CN1674244A (en) | 2005-09-28 |
| CN100361286C CN100361286C (en) | 2008-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100312419A Expired - Fee Related CN100361286C (en) | 2004-03-26 | 2004-03-26 | Method for detecting defect of semiconductor elements |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254844A (en) * | 2010-05-21 | 2011-11-23 | 武汉新芯集成电路制造有限公司 | Memory chip bit line failure analysis method |
| CN101996911B (en) * | 2009-08-26 | 2012-06-20 | 中芯国际集成电路制造(上海)有限公司 | Failure analysis method of gate oxide |
| CN103325711A (en) * | 2013-06-27 | 2013-09-25 | 上海华力微电子有限公司 | Method for inspecting gap in filling technology |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6767750B2 (en) * | 2001-12-31 | 2004-07-27 | Texas Instruments Incorporated | Detection of AIOx ears for process control in FeRAM processing |
| US6709879B2 (en) * | 2002-01-02 | 2004-03-23 | United Microelectronics Corporation | Method for inspecting a pattern defect process |
-
2004
- 2004-03-26 CN CNB2004100312419A patent/CN100361286C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101996911B (en) * | 2009-08-26 | 2012-06-20 | 中芯国际集成电路制造(上海)有限公司 | Failure analysis method of gate oxide |
| CN102254844A (en) * | 2010-05-21 | 2011-11-23 | 武汉新芯集成电路制造有限公司 | Memory chip bit line failure analysis method |
| CN102254844B (en) * | 2010-05-21 | 2013-06-19 | 武汉新芯集成电路制造有限公司 | Memory chip bit line failure analysis method |
| CN103325711A (en) * | 2013-06-27 | 2013-09-25 | 上海华力微电子有限公司 | Method for inspecting gap in filling technology |
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| Publication number | Publication date |
|---|---|
| CN100361286C (en) | 2008-01-09 |
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Granted publication date: 20080109 Termination date: 20100326 |