CN1667892A - 具有受驱动的电子打火棒的金属丝接合设备 - Google Patents
具有受驱动的电子打火棒的金属丝接合设备 Download PDFInfo
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Abstract
本发明提供一种包括接合头的金属丝接合机器,该接合头包括适于向接点位置供应用于接合的金属丝的接合工具。金属丝接合机器还包括电子打火棒,该电子打火棒设置构成为用于加热延伸穿过接合工具的金属丝的端部以形成用于接合的露空球。电子打火棒相对于电子打火棒的支撑结构可垂直驱动。
Description
技术领域
本发明涉及金属丝的接合,尤其涉及具有形成露空球的电子打火棒的金属丝接合设备。
背景技术
在电子工业里,导电金属丝用于多种装置(例如,半导体装置)中,例如,提供一装置各部分之间的电接合。用于金属丝接合的最普通的材料是金和铝。也用到铜及银。通过在两个接点位置之间附着一段金属丝形成金属丝接合。为形成这种附着,使用各种装置切断金属丝末端并接合(例如焊接)到接点位置。现有的装置包括热压缩(T/C)、热声波(T/S)及超声波(U/S)装置。接合后的金属丝沿着其长度通常以抛物线或椭圆构形弯曲,因此,被称作为金属丝“环”。
两种将金属丝接合到接点位置的现有技术是球接合和楔接合。球接合通常是较佳的技术,尤其是在半导体工业。参看附图1,一种使用球接合的的现有设备包括承载称作为毛细管12的接合头10,通过该毛细管12供应一段金属丝。
球接合设备也包括电子打火(EFO)棒14,当点燃时,该EFO棒的末端使火花跳到自毛细管12延伸的金属丝的末端位置而使金属丝熔化。随着金属丝熔化的端部凝固,表面张力使该端部形成一个大体的球形。由EFO棒所形成的金属丝球形部被称作“露空球”。该金属丝环的露空球及金属丝环的另一相对尾端接合到各自的接点位置(例如,管芯、芯片、衬底、互连结构等上的接合垫)。例如,通过塑性变形及两个金属表面的界面间相互作用促成的金属丝与衬底接合垫之间的接合,所述两个金属表面的界面间相互作用是由压力及温度联合作用产生,如果该设备包括变频器装置,该联合作用还包括超声波能量。
为了将工件(例如接合的衬底)移动到接合操作所需适当位置,现有的金属丝接合机器主要与将衬底移入或移出接合点的材料处理系统联合使用以定位接合面16,该接合面16由衬底装置在接合点限定。附图所示的接合面16具有零(0.000英寸)垂直(例如Z轴)位置。使用一个夹具插入件18将衬底装置锁在接合点的位置以实现金属丝接合。当电子装置移到接合点及当该装置随后移开接合点时,夹具插入件18在“开”与“关”之间的位置抬升及下降,如附图1中的箭头A所示。如附图1所示,在一种现有的金属丝接合机器中,夹具插入件18在打开与关闭的位置之间垂直移动大约0.074英寸的距离。
现有接合设备的承载接合工具(例如毛细管12)的接合头10在接合点处被垂直驱动,如箭头B所示,以相对于接合面16抬升及降低毛细管12。然而,现有金属丝接合机器的EFO棒14是以固定的距离静态地位于接合面16的上方。因为它保持静止,EFO棒14必须位于接合面16上方足够的距离以避免当插入件18移到器打开位置时EFO棒与夹具插入件18之间的干涉。例如,如附图1所示,一个现有装置的EFO棒静态地位于接合面16上方0.270英寸的距离处。
如上所述,EFO棒燃烧以熔化金属丝的延伸端部并对于由金属丝接合设备所使用的每一个环形成一露空球。因此,为了将金属丝适当地定位接近EFO棒14以形成露空球,现有设备的接合头10需要将毛细管12抬升到EFO棒14上方足够的距离,EFO棒14静态地位于0.270英寸处。如附图2所示,对于为特定衬底装置所使用的每一个金属丝环,一个现有机器的接合头10必须垂直抬升到接合面16上方大约0.320英寸处。
发明内容
本发明的代表性具体实施方式提供一种金属丝接合机器。金属丝接合机器包括接合头,该接合头包括用于向接点位置供应接合用金属丝的金属丝接合工具。金属丝接合机器还包括电子打火棒,该电子打火棒用于加热延伸穿过接合工具的金属丝的端部以形成用于接合的露空球。电子打火棒相对于电子打火棒的支撑结构垂直可驱动。
本发明的另一种代表性的实施例提供一种设置为加热延伸穿过金属丝接合机器的接合工具的金属丝的端部,以形成用于接合的露空球的电子打火棒。该电子打火棒包括支撑结构、由所述支撑结构支撑的棒及致动器,该致动器设置为相对于支撑结构垂直调整棒的位置。
本发明的另一种代表性的实施例提供一种操作电子打火棒的方法,该电子打火棒设置为加热延伸穿过金属丝接合机器的接合工具的金属丝的端部以形成用于接合的露空球。该方法包括降低金属丝接合机器的夹具插入件以固持将要金属丝接合的装置。该方法还包括在夹具插入件固持将要金属丝接合的装置时,使用致动器朝向夹具插入件降低电子打火棒。
附图说明
为了举例说明本发明,附图示出较佳具体实施方式;然而,可以理解的是,本发明并不限于所示精确的装置及手段。
附图1为现有的金属丝接合设备的侧视图并示出位于打开位置的夹具插入件;
附图2为附图1中所示金属丝接合设备的侧视图,其示出位于关闭位置的夹具插入件及定位在金属丝环末端形成露空球的位置的设备的接合头;
附图3为本发明代表性具体实施方式的金属丝接合设备的侧视图,其示出位于打开位置的夹具插入件及位于抬升位置的设备的EFO棒;
附图4为附图3中所示金属丝接合设备,其示出位于关闭位置的夹具插入件、位于下降位置的EFO棒及定位在金属丝环末端形成露空球的位置的设备的接合头;
附图5为本发明代表性具体实施方式螺线管驱动的EFO棒装置的立体图;
附图6为本发明代表性具体实施方式具有复位弹簧的螺线管驱动的EFO棒装置的立体图;
附图7为本发明代表性具体实施方式的EFO棒及夹具插入件的部分立体图;
附图8为本发明代表性具体实施方式操作电子打火棒的方法的流程图。
具体实施方式
在此所用的关于电子打火棒的术语“支撑结构”指设计用于支撑电子打火棒的任何结构(例如图5中所示的外壳36)。例如,支撑结构可以通过棒支撑臂(例如绕着枢轴承)枢转支撑电子打火棒以对棒提供相对于支撑结构的垂直驱动。然而,支撑结构并不限于这样一个具体实施方式。例如,支撑结构可以通过棒支撑臂使用线性轴承支撑电子打火棒。同样地,支撑结构(及它与棒的互相连接,例如通过一个棒支撑臂)并不限于任何特定构造。
同样地,本发明的具体实施方式中包括棒支撑臂,所述的“棒支撑臂”并不限于附图所示及在此描述的具体的棒支撑臂。相反地,棒支撑臂可以包括支撑结构与电子打火棒之间的任何结构。
在此所用的术语“可驱动的”或者“受驱动的”指电子打火棒在接合操作过程中可以通过致动器垂直调整,以使棒可以相对于接合面抬升及下降。
根据本发明代表性的实施例,提供一用于在半导体元件(例如管芯、芯片、衬底等)上的接点位置之间接合一个金属丝的金属丝接合设备。该金属丝接合设备包括承载毛细管的接合头,所述毛细管用于接合一个金属丝到接点位置。金属丝接合设备是球接合设备并包括电子打火棒,该电子打火(EFO)棒用于熔化自毛细管延伸的金属丝的终端端部以使该端部形成一个露空球。
本发明的EFO棒相对于接合面在抬升的与下降的位置之间可垂直驱动。选择EFO棒抬升的位置以防止EFO棒与位于接合点的夹具插入件之间的干涉。夹具插入件在打开与关闭位置之间抬升及下降以允许在接合点接收电子装置及在金属丝环应用到该装置后其退出。
夹具插入件自其打开位置到关闭位置下降以提供EFO棒自其抬升位置下降的空间。选择EFO棒的下降位置以避免EFO棒与关闭的夹具插入件之间的干涉。由于EFO棒的垂直驱动,在每一个金属丝环应用到接合点的过程中,接合头抬升毛细管以形成露空球的距离相较于现有技术的具有静止支撑的EFO棒的金属丝接合机器减小了大约23%(例如从320密耳到246密耳)。接合头需要的行程距离的减小大大减少了金属丝环周期时间,因而提高了整个机器的生产能力,又降低了接合头驱动系统马达的发热量,从而改善整个机器的精确度。
在本发明的某些实施例中,由于EFO棒可以抬升,夹具可以在打开位置抬升以在退出过程中给已被金属丝接合的装置上的接合的金属丝环提供更多的空隙,而不增加循环中接合头的行程。
根据本发明的一实施例,棒装置包括可枢转支撑的棒支撑臂,该棒支撑臂在接近臂的一端承载EFO棒。臂装置还包括与棒支撑臂接合以在“上”与“下”的位置之间移动EFO棒的螺线管。棒装置还可以包括与棒支撑臂接合以迫使EFO棒朝向“上”的位置(例如停电情形)的复位弹簧。
参看附图,同一元件使用同一标号,附图3及4示出本发明代表性的具体实施例的金属丝接合设备20。该金属丝接合设备20包括承载接合工具24(例如毛细管24)的接合头22,该接合工具24供应金属丝以形成将要接合到接点位置如集成电路上的接触垫的金属丝环。金属丝接合设备20位于一个接合点,该接合点接受材料搬运系统(未示出)传送的衬底装置。接合头22设置为在接合点相对于由衬底装置所定义的至少一个接合面26抬升及下降,如箭头B所示。接合头22的抬升及下降将毛细管24所传送的金属丝末端接合到接合面26上。金属丝末端的接合形成环。
夹具插入件28位于接合点并设计为在打开与关闭位置之间抬升及下降,如箭头A所示,以将衬底装置锁在接合点的位置而将金属丝环接合到接合面26上。夹具插入件28的打开及关闭位置分别如附图3及4所示。
金属丝接合设备20是球接合设备并包括包括一个电子打火(EFO)棒30,该电子打火棒30燃烧以熔化自毛细管24延伸的金属丝的端部以形成一个露空球。与现有技术的金属丝接合机器(例如附图1-2)的EFO棒不同,该EFO棒静态地位于相对于接合面的固定Z轴距离处,本申请的EFO棒30是垂直驱动,如箭头C所示(附图3)。即,EFO棒可以相对于接合面26抬升和下降。附图3所示的EFO棒30位于接合面26上方Z轴距离大约为0.270英寸的抬升位置。EFO棒30在这个距离的位置,避免当夹具插入件28处于其打开位置时在接受一个电子装置进入接合点或从那里移出的过程中EFO棒30与夹具插入件28之间的干涉。
参看附图4,其示出EFO棒位于下降的位置。因为夹具插入件28已经下降到其关闭位置,EFO棒30可以下降到Z轴距离0.270英寸以下而不会导致EFO棒30与夹具插入件28之间的干涉。如图所示,位于下降位置的EFO棒30位于Z轴距离0.196英寸处。这样,本发明减小了为随后的接合形成球的接合面上方的高度。在使用附图3-4所示的本发明的代表性具体实施例形成露空球的过程中,为了允许EFO棒形成下一个球,金属丝接合设备20的接合头22仅仅将毛细管24从接合面26抬升到接合面26上Z轴距离大约为0.246英寸处,如附图4所示。
附图3-4示出本发明的代表性的实施例。由于本发明EFO棒30的垂直定位控制允许在相对于接合面较低高度形成球,在每一个金属丝环形成的过程中金属丝接合设备20的接合头22的行程距离相较于现有金属丝接合机器的运动减小了大约23%(例如,(0.320-0.246)/0.320)。这种在每一个环形成的过程中接合头行程距离的减小直接关系到周期时间的实质性减少。因而,使用本发明可提高产品产量。这对于接合头的Z轴运动是一个限制因素的比较短的金属丝环来说尤其明显。
本发明接合头行程距离的减小还可以减少用于接合头22驱动系统的Z轴马达发热量。金属丝接合设备有时与提供一定弯曲量的柔顺导引机构共同作用。本发明减小在每一个循环周期的过程中接合头所需要的行程距离,因此,还减小加在如柔顺导引机构联接上的疲劳,因而提高机器的总寿命。
通过减小形成露空球的每一个循环周期之间的接合头22的复位距离,由于由金属丝接合设备形成的环,本发明还有助于改善质量控制。EFO棒的下降减少了在从第二接合撕裂高度到EFO点火高度的过程中必须由金属丝张力系统抓取的金属丝量。在现有技术中,由于在高速运动中过度的变形及弯曲,金属丝有时可能损坏。
参看附图5,其示出本发明代表性实施例的螺线管驱动的EFO棒装置32。该棒装置32包括棒支撑臂34,该棒支撑臂34在接近臂34的一端支撑EFO棒30以在接合头(如附图3及4所示的接合头22)承载的金属丝的末端形成露空球。棒支撑臂34依次收容在臂外壳36所限定的腔内并最好通过一个枢轴承38(例如青铜枢轴承)枢转接合到外壳36。
棒支撑臂34接合到臂外壳36,在棒支撑臂34的上表面40与臂外壳36的顶壁42之间形成一个间隙。该间隙允许棒支撑臂34绕枢轴承38所定义的一个枢轴相对于臂外壳36枢转,以抬升或降低由棒支撑臂34所承载的EFO棒30。EFO棒30通过枢转支撑臂34在“上”与“下”位置之间移动,在“上”位置,EFO棒30相对于夹具插入件28抬升,在“下”位置,EFO棒30位于形成露空球的操作位置。
棒装置32还包括在前面接合到臂外壳36顶壁42的第一阻止元件44及在后面接合到枢轴承38的第二阻止元件46。阻止元件44、46以这种方式定位而与棒支撑臂34的上表面40接触以分别为EFO棒30建立“上”及“下”位置。阻止元件44、46中的每一个最好与臂外壳36的顶壁42螺纹啮合,以提供“上”及“下”限制位置的调整。
棒装置32还包括位于臂外壳36后端并与棒支撑臂34的一端接合的螺线管48,棒支撑臂34的该端与臂34承载EFO棒30的一端相对。如附图5的箭头D所示的通过螺线管48驱动棒支撑臂34的后端垂直运动导致棒支撑臂34的前端垂直运动,如附图5的箭头C所示。由螺线管48驱动的棒支撑臂34的运动是一个跷跷板运动,棒支撑臂34的后端向上运动导致相对的前端向下运动,反之亦然。
如附图6所示,棒装置32还可以包括一个在相对端处固定到柱52、54上的复位弹簧50,柱52、54分别由棒支撑臂34及臂外壳36承载。与附图5中螺线管既抬升又降低棒支撑臂34的后端的装置不同,附图6的复位弹簧50迫使棒支撑臂34的前端为了EFO棒30朝向“上”位置,因而,仅仅需要螺线管48驱动棒支撑臂34向“下”位置移动。
参看附图7中的部分立体图,夹具插入件28及EFO棒30最好适合在它们之间限制放电。夹具插入件28包括一个大体的矩形开口56,该开口56给接合头22(参看附图3及4)提供入口以将金属丝成环在由夹具插入件28在其关闭位置固定的工件(例如半导体元件如管芯、芯片、衬底、互连结构等)上。如附图7所示,开口56的侧壁58成角度以容纳EFO棒30,当EFO棒30位于其“下”位置时,EFO棒30最好由棒支撑臂34以一个大体相应的角度支撑。EFO棒30最好包括电绝缘60以限制与夹具插入件28之间的放电。如附图7所示,开口56的侧壁58还包括接近于夹具插入件28上表面64的成圆角的边62,以在EFO棒30位于其“下”位置时进一步限制夹具插入件28与EFO棒30之间可能的放电。
本发明不限于上面所述的由螺线管驱动的EFO棒30的垂直运动。垂直驱动EFO棒30的其它适合的装置的非限制清单包括气动的、液压的、声频线圈、直流马达、交流马达或者步进马达装置。本发明也不限于上面所述的在“上”与“下”的位置之间垂直移动EFO棒30的枢转臂34。
附图8示出利用电子打火棒加热延伸穿过金属丝接合机器接合工具的金属丝的端部以形成用于接合的露空球的操作方法流程图。如附图8所示,在步骤800,金属丝接合机器的夹具插入件(例如任何用于固持将要金属丝接合的装置的结构)下降以固持将要金属丝接合的装置。在步骤802,在夹具插入件固持将要金属丝接合的装置时使用致动器将电子打火棒朝向夹具插入件下降。在步骤804,电子打火棒抬升离开夹具插入件,使电子打火棒的抬升位置不干涉夹具插入件离开接合面的抬升。该方法可以包括上面所述关于本发明的其它具体实施方式的其它步骤。
上面所述的关于附图8的方法(有或没有上面所述的附加步骤)可以应用于许多其他媒体。例如,该方法可以作为软件安装在现有的计算机系统/服务器上(用于连接或集成一个金属丝接合机器的计算机系统)。此外,该方法可以从计算机可读载体(例如固体存储器、光盘、磁盘、射频载体媒体、音频载体媒体等)操作,该计算机可读载体包括与电子打火装置操作方法相关的计算机指令(例如计算机程序指令)。
前面是根据发明人所预见的可实施的实施例描述的发明,目前没有预见的关于本发明的一些非实质性的修改应与本发明等同。
Claims (20)
1、一种金属丝接合机器,包括:
包括金属丝接合工具的接合头,所述金属丝接合工具适于向接点位置供应接合用的金属丝;
电子打火棒,所述电子打火棒构成为用于加热自接合工具延伸的金属丝的端部以形成用于接合的露空球,所述电子打火棒相对于电子打火棒的支撑结构可垂直驱动。
2、如权利要求1中所述的金属丝接合机器,其特征在于,所述电子打火棒通过棒支撑臂可枢转地接合到所述的支撑结构。
3、如权利要求2中所述金属丝接合机器,其特征在于,还包括通过相对于支撑结构枢转棒支撑臂垂直调整电子打火棒的位置的致动器。
4、如权利要求3中所述的金属丝接合机器,其特征在于,所述致动器包括螺线管。
5、如权利要求3中所述的金属丝接合机器,其特征在于,所述致动器设定为在抬升与下降的位置之间调整电子打火棒的位置。
6、如权利要求5中所述金属丝接合机器,其特征在于,所述抬升位置预定为使电子打火棒位于抬升的位置时电子打火棒不干涉金属丝接合机器的夹具插入件在金属丝接合机器的接合面上面的抬升,所述下降位置预定为使电子打火棒位于下降的位置时电子打火棒不干涉夹具插入件固持将要金属丝接合的装置。
7、如权利要求3中所述金属丝接合机器,其特征在于,还包括当致动器未被驱动时迫使电子打火棒朝向抬升位置的弹簧,所述致动器设置为在被驱动时降低电子打火棒。
8、如权利要求1中所述的金属丝接合机器,其特征在于,还包括将将要金属丝接合的装置固持到金属丝接合机器的接合面的夹具插入件,所述的夹具插入件设置了一个小孔,通过所述小孔金属丝接合工具可以将金属丝接合到所述装置。
9、如权利要求8中所述的金属丝接合机器,其特征在于,接近所述小孔的夹具插入件的侧壁成角度,因而为电子打火棒操作提供额外空间。
10、如权利要求8中所述的金属丝接合机器,其特征在于,所述接近所述小孔的夹具插入件的边成圆角,因而为电子打火棒操作提供额外空间。
11、一种设置为加热自金属丝接合机器接合工具延伸的金属丝的端部以形成用于接合的露空球的电子打火棒,所述电子打火棒包括:
支撑结构;
由所述支撑结构支撑的棒;及
致动器,所述致动器设置为相对于支撑结构垂直调整棒的位置。
12、如权利要求11中所述的电子打火棒,其特征在于,所述棒通过棒支撑臂可枢转地接合到支撑结构。
13、如权利要求11中所述的电子打火棒,其特征在于,所述致动器包括螺线管。
14、如权利要求11中所述的电子打火棒,其特征在于,所述致动器设置为在抬升的与下降的位置之间调整所述棒的位置。
15、如权利要求14中所述的电子打火棒,其特征在于,所述抬升的位置预定为使所述棒位于抬升的位置时棒不干涉金属丝接合机器的夹具插入件在金属丝接合机器的接合面上面的抬升,且所述下降的位置预定为使所述棒位于下降的位置时棒不干涉夹具插入件固持将要金属丝接合的装置。
16、如权利要求11中所述的电子打火棒,其特征在于,还包括当致动器未被驱动时迫使电子打火棒朝向抬升位置的弹簧,所述致动器设置为其在被驱动时降低电子打火棒。
17、一种电子打火棒的操作方法,所述的电子打火棒设置为加热自金属丝接合机器接合工具延伸的金属丝的端部以形成用于接合的露空球,所述的方法包括以下步骤:
降低金属丝接合机器的夹具插入件以固持将要金属丝接合的装置;及
在夹具插入件固持将要金属丝接合的装置时,使用致动器朝向夹具插入件降低电子打火棒。
18、如权利要求17中所述的,其特征在于,还包括以下步骤:
抬升所述电子打火棒离开所述的夹具插入件,使电子打火棒的抬升的位置不干涉夹具插入件离开所述接合面的抬升。
19、如权利要求18中所述的方法,其特征在于,所述抬升的步骤包括使用所述致动器抬升电子打火棒。
20、如权利要求18中所述的方法,其特征在于,所述抬升的步骤包括通过关闭致动器以使弹簧迫使所述的电子打火棒朝向抬升的位置来抬升电子打火棒。
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US55173904P | 2004-03-09 | 2004-03-09 | |
US60/551,739 | 2004-03-09 |
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CN1667892A true CN1667892A (zh) | 2005-09-14 |
CN100429844C CN100429844C (zh) | 2008-10-29 |
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CNB2005100535727A Expired - Fee Related CN100429844C (zh) | 2004-03-09 | 2005-03-08 | 具有受驱动的电子打火棒的金属丝接合设备 |
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US (1) | US20050199677A1 (zh) |
CN (1) | CN100429844C (zh) |
SG (2) | SG114779A1 (zh) |
TW (1) | TW200534455A (zh) |
Cited By (3)
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CN100365882C (zh) * | 2005-10-24 | 2008-01-30 | 中国电子科技集团公司第四十五研究所 | 负高压电子打火成球装置 |
CN102569111A (zh) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | 用于引线键合的压板 |
CN110620054A (zh) * | 2019-08-19 | 2019-12-27 | 浙江锐群科技有限公司 | 全自动深腔球引线键合头装置 |
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US20060144899A1 (en) * | 2004-12-30 | 2006-07-06 | Hu Xiao P | Jam detection apparatus and method for indexing of substrates and lead frames |
US20080073408A1 (en) * | 2006-09-22 | 2008-03-27 | Ka Shing Kenny Kwan | Movable electronic flame-off device for a bonding apparatus |
US8357998B2 (en) * | 2009-02-09 | 2013-01-22 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
US9105552B2 (en) | 2011-10-31 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
US8823180B2 (en) | 2011-12-28 | 2014-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
US8618677B2 (en) | 2012-04-06 | 2013-12-31 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
US9171790B2 (en) | 2012-05-30 | 2015-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
US9165904B1 (en) * | 2014-06-17 | 2015-10-20 | Freescale Semiconductor, Inc. | Insulated wire bonding with EFO before second bond |
CN109935526B (zh) * | 2019-04-19 | 2024-07-23 | 广东阿达智能装备有限公司 | 移件机构及引线键合机 |
KR20220007247A (ko) | 2020-07-10 | 2022-01-18 | 삼성전자주식회사 | 와이어 본딩 장치 |
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- 2005-03-02 SG SG200705811-8A patent/SG135181A1/en unknown
- 2005-03-08 US US11/075,236 patent/US20050199677A1/en not_active Abandoned
- 2005-03-08 CN CNB2005100535727A patent/CN100429844C/zh not_active Expired - Fee Related
- 2005-03-09 TW TW94107173A patent/TW200534455A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100365882C (zh) * | 2005-10-24 | 2008-01-30 | 中国电子科技集团公司第四十五研究所 | 负高压电子打火成球装置 |
CN102569111A (zh) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | 用于引线键合的压板 |
CN110620054A (zh) * | 2019-08-19 | 2019-12-27 | 浙江锐群科技有限公司 | 全自动深腔球引线键合头装置 |
CN110620054B (zh) * | 2019-08-19 | 2021-03-23 | 浙江锐群科技有限公司 | 全自动深腔球引线键合头装置 |
Also Published As
Publication number | Publication date |
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US20050199677A1 (en) | 2005-09-15 |
SG114779A1 (en) | 2005-09-28 |
CN100429844C (zh) | 2008-10-29 |
SG135181A1 (en) | 2007-09-28 |
TW200534455A (en) | 2005-10-16 |
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