CN1641868A - 发热电子元件的热管散热器 - Google Patents
发热电子元件的热管散热器 Download PDFInfo
- Publication number
- CN1641868A CN1641868A CNA2004100001636A CN200410000163A CN1641868A CN 1641868 A CN1641868 A CN 1641868A CN A2004100001636 A CNA2004100001636 A CN A2004100001636A CN 200410000163 A CN200410000163 A CN 200410000163A CN 1641868 A CN1641868 A CN 1641868A
- Authority
- CN
- China
- Prior art keywords
- heat
- thin
- electronic elements
- fluid passage
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title description 12
- 239000007788 liquid Substances 0.000 claims abstract description 66
- 239000012530 fluid Substances 0.000 claims description 79
- 239000000126 substance Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 18
- 230000008016 vaporization Effects 0.000 claims description 15
- 238000009834 vaporization Methods 0.000 claims description 14
- 241000293001 Oxytropis besseyi Species 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 12
- 239000012809 cooling fluid Substances 0.000 claims description 12
- 239000007769 metal material Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 239000011162 core material Substances 0.000 claims description 8
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000003351 stiffener Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 230000000274 adsorptive effect Effects 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 238000004826 seaming Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 239000011148 porous material Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 210000002683 foot Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (21)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100001636A CN1314112C (zh) | 2004-01-08 | 2004-01-08 | 发热电子元件的热管散热器 |
PCT/CN2004/000356 WO2005071747A1 (en) | 2004-01-08 | 2004-04-15 | Heat pipe radiator of heat-generating electronic component |
EP04727496.4A EP1708261B1 (en) | 2004-01-08 | 2004-04-15 | Heat pipe radiator for a heat-generating component |
US10/831,582 US20050150636A1 (en) | 2004-01-08 | 2004-04-23 | Heat pipe radiator for eliminating heat of electric component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100001636A CN1314112C (zh) | 2004-01-08 | 2004-01-08 | 发热电子元件的热管散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1641868A true CN1641868A (zh) | 2005-07-20 |
CN1314112C CN1314112C (zh) | 2007-05-02 |
Family
ID=34716093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100001636A Expired - Fee Related CN1314112C (zh) | 2004-01-08 | 2004-01-08 | 发热电子元件的热管散热器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050150636A1 (zh) |
EP (1) | EP1708261B1 (zh) |
CN (1) | CN1314112C (zh) |
WO (1) | WO2005071747A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7699094B2 (en) | 2006-04-28 | 2010-04-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber heat sink |
CN101065001B (zh) * | 2006-04-28 | 2010-12-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101312227B (zh) * | 2007-05-25 | 2011-08-17 | 黄明智 | Led照明的散热方法及装置 |
CN115119467A (zh) * | 2021-03-22 | 2022-09-27 | 建准电机工业股份有限公司 | 散热模块 |
TWI797865B (zh) * | 2021-12-03 | 2023-04-01 | 艾姆勒科技股份有限公司 | 兩相浸沒式散熱結構 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1195196C (zh) * | 2002-01-10 | 2005-03-30 | 杨洪武 | 集成式热管及其换热方法 |
US20050274488A1 (en) * | 2004-05-28 | 2005-12-15 | A-Loops Thermal Solution Corporation | Heat-pipe engine structure |
DE102004035780A1 (de) * | 2004-07-23 | 2006-03-16 | Siemens Ag | Feuersperrmodul |
CN101754645B (zh) * | 2008-12-10 | 2013-06-26 | 深圳市超频三科技有限公司 | 热管式散热器及其制造方法 |
CN102646652B (zh) * | 2011-02-22 | 2014-11-05 | 和硕联合科技股份有限公司 | 散热器及其改良方法 |
US20130058042A1 (en) * | 2011-09-03 | 2013-03-07 | Todd Richard Salamon | Laminated heat sinks |
GB2507495B (en) * | 2012-10-30 | 2018-07-25 | Denso Marston Ltd | A heat exchanger assembly |
CN104456482B (zh) * | 2014-12-10 | 2017-11-14 | 上海康耐司信号设备有限公司 | 一种用于大功率led灯具的热管散热器 |
RU2636385C1 (ru) * | 2016-08-24 | 2017-11-23 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Устройство охлаждения одиночного мощного светодиода с интенсифицированной конденсационной системой |
CN106654929B (zh) * | 2017-01-10 | 2018-11-20 | 中科天工电气控股有限公司 | 一种配电箱散热机构 |
CN108811439A (zh) * | 2018-06-15 | 2018-11-13 | 江苏英杰铝业有限公司 | 一种铝型材水冷散热器 |
CN109282340A (zh) * | 2018-09-21 | 2019-01-29 | 禾臻电子科技(上海)有限公司 | 电暖器 |
CN112033714B (zh) * | 2020-08-12 | 2021-07-02 | 大连理工大学 | 一种用于评估水冷式散热器散热性能的测试平台及使用方法 |
CN114449729B (zh) * | 2020-11-06 | 2023-11-10 | 中移物联网有限公司 | 一种主板保护结构及其装配方法 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
DE2515753A1 (de) * | 1975-04-10 | 1976-10-14 | Siemens Ag | Waermerohr |
US4335781A (en) * | 1978-10-02 | 1982-06-22 | Motorola Inc. | High power cooler and method thereof |
US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
JPH04132446U (ja) * | 1991-05-29 | 1992-12-08 | 本田技研工業株式会社 | 自動車のガソリン冷却装置 |
JPH07112032B2 (ja) * | 1992-09-24 | 1995-11-29 | ダイヤモンド電機株式会社 | ヒートパイプ機能を備えた放熱体 |
US5647429A (en) * | 1994-06-16 | 1997-07-15 | Oktay; Sevgin | Coupled, flux transformer heat pipes |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
CN2216672Y (zh) * | 1994-11-01 | 1996-01-03 | 何立成 | 换热管散热器 |
JPH098190A (ja) * | 1995-06-22 | 1997-01-10 | Calsonic Corp | 電子部品用冷却装置 |
JP3164518B2 (ja) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
JPH10154781A (ja) * | 1996-07-19 | 1998-06-09 | Denso Corp | 沸騰冷却装置 |
JPH10185466A (ja) * | 1996-12-24 | 1998-07-14 | Showa Alum Corp | ヒートパイプ式放熱器 |
US6005772A (en) * | 1997-05-20 | 1999-12-21 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US6321831B1 (en) * | 1998-12-16 | 2001-11-27 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6410982B1 (en) * | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
JP2001183080A (ja) * | 1999-12-24 | 2001-07-06 | Furukawa Electric Co Ltd:The | 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ |
JP2001208489A (ja) * | 2000-01-28 | 2001-08-03 | Hitachi Cable Ltd | フラットヒートパイプおよびその製造方法 |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6648063B1 (en) * | 2000-04-12 | 2003-11-18 | Sandia Corporation | Heat pipe wick with structural enhancement |
US6315033B1 (en) * | 2000-05-22 | 2001-11-13 | Jia Hao Li | Heat dissipating conduit |
CN2483756Y (zh) * | 2001-03-23 | 2002-03-27 | 林清彬 | 中央处理单元双相导流散热器 |
US6439298B1 (en) * | 2001-04-17 | 2002-08-27 | Jia Hao Li | Cylindrical heat radiator |
US6666261B2 (en) * | 2001-06-15 | 2003-12-23 | Foxconn Precision Components Co., Ltd. | Liquid circulation cooler |
US6533029B1 (en) * | 2001-09-04 | 2003-03-18 | Thermal Corp. | Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator |
US6609561B2 (en) * | 2001-12-21 | 2003-08-26 | Intel Corporation | Tunnel-phase change heat exchanger |
CN2588441Y (zh) * | 2002-05-21 | 2003-11-26 | 邵再禹 | 一种热管散热器 |
US6702002B2 (en) * | 2002-06-03 | 2004-03-09 | Chin-Wen Wang | Hydronic pump type heat radiator |
US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
CN2566460Y (zh) * | 2002-07-29 | 2003-08-13 | 李建明 | 具有多级散热结构的热管散热器 |
US6845622B2 (en) * | 2003-03-27 | 2005-01-25 | Intel Corporation | Phase-change refrigeration apparatus with thermoelectric cooling element and methods |
TW574839B (en) * | 2003-06-09 | 2004-02-01 | Arro Superconducting Technolog | Temperature conduction heat exchange device of circular-flow channel type |
-
2004
- 2004-01-08 CN CNB2004100001636A patent/CN1314112C/zh not_active Expired - Fee Related
- 2004-04-15 WO PCT/CN2004/000356 patent/WO2005071747A1/zh active Application Filing
- 2004-04-15 EP EP04727496.4A patent/EP1708261B1/en not_active Expired - Lifetime
- 2004-04-23 US US10/831,582 patent/US20050150636A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7699094B2 (en) | 2006-04-28 | 2010-04-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber heat sink |
CN101065001B (zh) * | 2006-04-28 | 2010-12-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101312227B (zh) * | 2007-05-25 | 2011-08-17 | 黄明智 | Led照明的散热方法及装置 |
CN115119467A (zh) * | 2021-03-22 | 2022-09-27 | 建准电机工业股份有限公司 | 散热模块 |
TWI797865B (zh) * | 2021-12-03 | 2023-04-01 | 艾姆勒科技股份有限公司 | 兩相浸沒式散熱結構 |
Also Published As
Publication number | Publication date |
---|---|
CN1314112C (zh) | 2007-05-02 |
EP1708261A1 (en) | 2006-10-04 |
WO2005071747A1 (en) | 2005-08-04 |
EP1708261A4 (en) | 2011-05-04 |
EP1708261B1 (en) | 2014-12-17 |
US20050150636A1 (en) | 2005-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DALIAN GOLDEN 3D TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YANG HONGWU Effective date: 20100629 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 116023 NO.1-203, NO.25, HEISHIJIAOJINGBIN LANE, SHAHEKOU DISTRICT, DALIAN CITY, LIAONING PROVINCE TO: 116600 2ND FLOOR, BUILDING 2, NO.11, GUANGGU ROAD, DALIAN DEVELOPMENT AREA, DALIAN CITY, LIAONING PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100629 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Address before: Shahekou District of Dalian City, Liaoning Province, 116023 Lane 25, Jing bin Heishijiao No. 1-203 Patentee before: Yang Hongwu |
|
ASS | Succession or assignment of patent right |
Owner name: DALIAN TERMALWAY HEAT TRANSFER TECHNOLOGY CO., LTD Effective date: 20130416 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130416 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Patentee after: Dalian Sanwei Heat Transfer Technology Co., Ltd. Address before: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee before: Dalian Termalway Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070502 Termination date: 20170108 |
|
CF01 | Termination of patent right due to non-payment of annual fee |