CN1638919A - 用于双向抛光工件的改进的方法和设备 - Google Patents

用于双向抛光工件的改进的方法和设备 Download PDF

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Publication number
CN1638919A
CN1638919A CNA028153898A CN02815389A CN1638919A CN 1638919 A CN1638919 A CN 1638919A CN A028153898 A CNA028153898 A CN A028153898A CN 02815389 A CN02815389 A CN 02815389A CN 1638919 A CN1638919 A CN 1638919A
Authority
CN
China
Prior art keywords
polishing
backing plate
sand belt
area
bilinearity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028153898A
Other languages
English (en)
Chinese (zh)
Inventor
胡马云·塔利
康斯坦丁·弗洛达尔斯基
贾拉尔·阿施贾伊
道格拉斯·W·扬
武尔夫·佩尔洛夫
埃弗拉因·贝拉兹克斯
马克·亨德森
伯纳德·M·弗雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/880,730 external-priority patent/US6464571B2/en
Priority claimed from US10/126,464 external-priority patent/US6589105B2/en
Priority claimed from US10/126,469 external-priority patent/US6634935B2/en
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of CN1638919A publication Critical patent/CN1638919A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
CNA028153898A 2001-06-12 2002-06-12 用于双向抛光工件的改进的方法和设备 Pending CN1638919A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US09/880,730 2001-06-12
US09/880,730 US6464571B2 (en) 1998-12-01 2001-06-12 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US10/126,469 2002-04-18
US10/126,464 US6589105B2 (en) 1998-12-01 2002-04-18 Pad tensioning method and system in a bi-directional linear polisher
US10/126,469 US6634935B2 (en) 1998-12-01 2002-04-18 Single drive system for a bi-directional linear chemical mechanical polishing apparatus
US10/126,464 2002-04-18

Publications (1)

Publication Number Publication Date
CN1638919A true CN1638919A (zh) 2005-07-13

Family

ID=27383427

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028153898A Pending CN1638919A (zh) 2001-06-12 2002-06-12 用于双向抛光工件的改进的方法和设备

Country Status (7)

Country Link
EP (1) EP1395392A1 (fr)
JP (1) JP2004528998A (fr)
KR (1) KR100665748B1 (fr)
CN (1) CN1638919A (fr)
AU (1) AU2002316240A1 (fr)
TW (1) TW552177B (fr)
WO (1) WO2002100594A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102490111A (zh) * 2011-11-24 2012-06-13 上海华力微电子有限公司 一种固定磨料化学机械研磨装置
CN103722470A (zh) * 2014-01-26 2014-04-16 福建长江工业有限公司 一种保证产品抛光性能一致的方法及磨抛设备
CN109015306A (zh) * 2018-09-10 2018-12-18 安徽鑫艺达抛光机械有限公司 一种抛光设备进给装置
CN111941201A (zh) * 2020-08-21 2020-11-17 许昌学院 一种用于法布里-珀罗干涉仪镜板的高精度制造装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5596030B2 (ja) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法
KR101011220B1 (ko) * 2010-07-02 2011-01-26 연세대학교 산학협력단 내하성능 및 사용성능이 개선된 강거더
CN102699796B (zh) * 2012-05-14 2014-12-03 宁波霍思特精密机械有限公司 一种高温合金铸件浇口磨削装置
TWI574778B (zh) * 2015-02-11 2017-03-21 國立勤益科技大學 硏磨拋光機
CN115284140B (zh) * 2022-08-17 2023-11-17 昆山新莱洁净应用材料股份有限公司 一种bpe卫生管件批量抛光装置及抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3844249C2 (de) * 1988-09-19 1994-02-24 Marunaga & Co Ltd Bandschleifmaschine
DE69206685T2 (de) * 1991-06-06 1996-07-04 Commissariat Energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
DE60019352T2 (de) * 1999-02-04 2006-05-11 Applied Materials, Inc., Santa Clara Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102490111A (zh) * 2011-11-24 2012-06-13 上海华力微电子有限公司 一种固定磨料化学机械研磨装置
CN102490111B (zh) * 2011-11-24 2014-06-11 上海华力微电子有限公司 一种固定磨料化学机械研磨装置
CN103722470A (zh) * 2014-01-26 2014-04-16 福建长江工业有限公司 一种保证产品抛光性能一致的方法及磨抛设备
CN109015306A (zh) * 2018-09-10 2018-12-18 安徽鑫艺达抛光机械有限公司 一种抛光设备进给装置
CN109015306B (zh) * 2018-09-10 2020-05-22 安徽鑫艺达抛光机械有限公司 一种抛光设备进给装置
CN111941201A (zh) * 2020-08-21 2020-11-17 许昌学院 一种用于法布里-珀罗干涉仪镜板的高精度制造装置

Also Published As

Publication number Publication date
JP2004528998A (ja) 2004-09-24
KR100665748B1 (ko) 2007-01-09
TW552177B (en) 2003-09-11
AU2002316240A1 (en) 2002-12-23
KR20040025689A (ko) 2004-03-24
EP1395392A1 (fr) 2004-03-10
WO2002100594A8 (fr) 2003-02-20
WO2002100594A1 (fr) 2002-12-19

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: ASM NUTOOL INC.

Free format text: FORMER OWNER: NUTOOL INC.

Effective date: 20050722

C10 Entry into substantive examination
C41 Transfer of patent application or patent right or utility model
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20050722

Address after: American California

Applicant after: ASM Nutool Inc.

Address before: American California

Applicant before: Nutool, Inc.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication