CN1627881A - 以不同高度构成的印刷电路板的结构 - Google Patents

以不同高度构成的印刷电路板的结构 Download PDF

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Publication number
CN1627881A
CN1627881A CNA2004100638678A CN200410063867A CN1627881A CN 1627881 A CN1627881 A CN 1627881A CN A2004100638678 A CNA2004100638678 A CN A2004100638678A CN 200410063867 A CN200410063867 A CN 200410063867A CN 1627881 A CN1627881 A CN 1627881A
Authority
CN
China
Prior art keywords
pcb
circuit board
printed circuit
design
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100638678A
Other languages
English (en)
Chinese (zh)
Inventor
何塞·路易斯·科尔多瓦·马蒂利亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitelcom Mobile Technology S A
Original Assignee
Vitelcom Mobile Technology S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitelcom Mobile Technology S A filed Critical Vitelcom Mobile Technology S A
Publication of CN1627881A publication Critical patent/CN1627881A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CNA2004100638678A 2003-12-11 2004-07-13 以不同高度构成的印刷电路板的结构 Pending CN1627881A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES200302933A ES2234430B1 (es) 2003-12-11 2003-12-11 Estructura de placa de circuito impreso (pcb) configurada con distintos niveles.
ESP200302933 2003-12-11

Publications (1)

Publication Number Publication Date
CN1627881A true CN1627881A (zh) 2005-06-15

Family

ID=34673798

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004100638678A Pending CN1627881A (zh) 2003-12-11 2004-07-13 以不同高度构成的印刷电路板的结构

Country Status (7)

Country Link
CN (1) CN1627881A (es)
AR (1) AR044454A1 (es)
AU (1) AU2003294986A1 (es)
ES (1) ES2234430B1 (es)
PE (1) PE20050551A1 (es)
TW (1) TW200520642A (es)
WO (1) WO2005057887A1 (es)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100388668C (zh) * 2005-10-21 2008-05-14 华为技术有限公司 一种线路接口板及配备该线路接口板的接入设备
CN110300488A (zh) * 2018-03-23 2019-10-01 法雷奥汽车内部控制（深圳）有限公司 硬质电路板及包括该硬质电路板的汽车车灯
CN111947800A (zh) * 2019-05-17 2020-11-17 博格华纳路德维希堡有限公司 温度传感器
CN112867227A (zh) * 2019-11-28 2021-05-28 上海华为技术有限公司 一种印制电路板pcb、室内小型基站及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
US5008496A (en) * 1988-09-15 1991-04-16 Siemens Aktiengesellschaft Three-dimensional printed circuit board
JP2821262B2 (ja) * 1990-11-26 1998-11-05 株式会社日立製作所 電子装置
DE4131934A1 (de) * 1991-09-25 1993-04-08 Degussa Verfahren zur herstellung von starren, in teilbereichen biegbaren gedruckten schaltungen
DE4412278A1 (de) * 1994-04-09 1995-10-12 Bosch Gmbh Robert Starre und flexible Bereiche aufweisende Leiterplatte
ES2187285B1 (es) * 2001-08-24 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100388668C (zh) * 2005-10-21 2008-05-14 华为技术有限公司 一种线路接口板及配备该线路接口板的接入设备
CN110300488A (zh) * 2018-03-23 2019-10-01 法雷奥汽车内部控制（深圳）有限公司 硬质电路板及包括该硬质电路板的汽车车灯
CN111947800A (zh) * 2019-05-17 2020-11-17 博格华纳路德维希堡有限公司 温度传感器
CN112867227A (zh) * 2019-11-28 2021-05-28 上海华为技术有限公司 一种印制电路板pcb、室内小型基站及其制造方法

Also Published As

Publication number Publication date
ES2234430B1 (es) 2006-11-01
WO2005057887A1 (es) 2005-06-23
AU2003294986A1 (en) 2005-06-29
ES2234430A1 (es) 2005-06-16
PE20050551A1 (es) 2005-08-02
TW200520642A (en) 2005-06-16
AR044454A1 (es) 2005-09-14

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication