AR044454A1 - Estructura de placa de circuito impreso (pcb) configurada con distintos niveles - Google Patents

Estructura de placa de circuito impreso (pcb) configurada con distintos niveles

Info

Publication number
AR044454A1
AR044454A1 ARP040101850A ARP040101850A AR044454A1 AR 044454 A1 AR044454 A1 AR 044454A1 AR P040101850 A ARP040101850 A AR P040101850A AR P040101850 A ARP040101850 A AR P040101850A AR 044454 A1 AR044454 A1 AR 044454A1
Authority
AR
Argentina
Prior art keywords
different levels
pcb
printed circuit
plate structure
circuit plate
Prior art date
Application number
ARP040101850A
Other languages
English (en)
Inventor
Matilla Jose Luis Cordoba
Original Assignee
Vitelcom Mobile Technology S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitelcom Mobile Technology S A filed Critical Vitelcom Mobile Technology S A
Publication of AR044454A1 publication Critical patent/AR044454A1/es

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Se describe una estructura de placa de circuito impreso (PBC) que permite la posibilidad de un diseño a distintos niveles con la utilización de una PCB de tipo estándar tan solo eligiendo la geometría adecuada. La PCB del presente está construida a partir de un soporte estándar de naturaleza rígida, en el que se practican cortes o hendiduras pasantes para la formación de franjas estrechas extendidas según la dirección longitudinal y que están capacitadas para inflexionar ligeramente y permitir que las porciones de placa entre las que se extienden queden situadas en planos a distinto nivel con orientaciones previamente seleccionadas. La provisión de aberturas permite en su caso la superposición de componentes con el consiguiente ahorro de espesor y de la longitud total de la placa.
ARP040101850A 2003-12-11 2004-05-28 Estructura de placa de circuito impreso (pcb) configurada con distintos niveles AR044454A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200302933A ES2234430B1 (es) 2003-12-11 2003-12-11 Estructura de placa de circuito impreso (pcb) configurada con distintos niveles.

Publications (1)

Publication Number Publication Date
AR044454A1 true AR044454A1 (es) 2005-09-14

Family

ID=34673798

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP040101850A AR044454A1 (es) 2003-12-11 2004-05-28 Estructura de placa de circuito impreso (pcb) configurada con distintos niveles

Country Status (7)

Country Link
CN (1) CN1627881A (es)
AR (1) AR044454A1 (es)
AU (1) AU2003294986A1 (es)
ES (1) ES2234430B1 (es)
PE (1) PE20050551A1 (es)
TW (1) TW200520642A (es)
WO (1) WO2005057887A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100388668C (zh) * 2005-10-21 2008-05-14 华为技术有限公司 一种线路接口板及配备该线路接口板的接入设备
CN110300488A (zh) * 2018-03-23 2019-10-01 法雷奥汽车内部控制（深圳）有限公司 硬质电路板及包括该硬质电路板的汽车车灯
DE102019113046B4 (de) * 2019-05-17 2024-09-26 Borgwarner Ludwigsburg Gmbh Temperatursensor
CN112867227A (zh) * 2019-11-28 2021-05-28 上海华为技术有限公司 一种印制电路板pcb、室内小型基站及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
US5008496A (en) * 1988-09-15 1991-04-16 Siemens Aktiengesellschaft Three-dimensional printed circuit board
JP2821262B2 (ja) * 1990-11-26 1998-11-05 株式会社日立製作所 電子装置
DE4131934A1 (de) * 1991-09-25 1993-04-08 Degussa Verfahren zur herstellung von starren, in teilbereichen biegbaren gedruckten schaltungen
DE4412278A1 (de) * 1994-04-09 1995-10-12 Bosch Gmbh Robert Starre und flexible Bereiche aufweisende Leiterplatte
ES2187285B1 (es) * 2001-08-24 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.

Also Published As

Publication number Publication date
ES2234430B1 (es) 2006-11-01
WO2005057887A1 (es) 2005-06-23
CN1627881A (zh) 2005-06-15
AU2003294986A1 (en) 2005-06-29
ES2234430A1 (es) 2005-06-16
PE20050551A1 (es) 2005-08-02
TW200520642A (en) 2005-06-16

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