CN1603679A - 发光二极管灯散热结构 - Google Patents

发光二极管灯散热结构 Download PDF

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Publication number
CN1603679A
CN1603679A CNA2004100521147A CN200410052114A CN1603679A CN 1603679 A CN1603679 A CN 1603679A CN A2004100521147 A CNA2004100521147 A CN A2004100521147A CN 200410052114 A CN200410052114 A CN 200410052114A CN 1603679 A CN1603679 A CN 1603679A
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radiation
line
light emitter
heat radiation
emitter diode
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CN100483024C (zh
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李学霖
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Priority to EP05802018A priority patent/EP1813863A4/en
Priority to US11/666,634 priority patent/US20090052171A1/en
Priority to PCT/CN2005/001794 priority patent/WO2006050656A1/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Road Signs Or Road Markings (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

本发明涉及发光二极管灯，具体涉及一种发光二极管灯散热结构。它包括线路驱动发光板和线路控制板，线路驱动发光板上集成发光二极管阵列；所述线路驱动发光板上面设置一散热反光铝板，其下面接合一导散热胶层，导散热胶层另一面接合一散热铝板。上述线路控制板可用导散热胶包裹，以进一步导散线路控制板工作时产生的热量。本发明由于采用上述的夹层结构，使发光二极管工作时发出的热量得以经不同的散热层面迅速有效地导散出去，可使发光二极管的工作温度始终保持在65℃以下，有效解决了发光二极管灯的散热问题。

Description

发光二极管灯散热结构
技术领域
本发明涉及发光二极管灯，具体涉及一种发光二极管灯散热结构。
背景技术
发光二极管作为一种发光光源，具有能耗低、发热量较低、使用寿命长等诸多优点，已经越来越广泛地应用于照明和装饰灯具中。但由于单一发光二极管管体的发光亮度不足，因此在生产发光二极管灯具时需要采用发光二极管阵列的结构形式来提供灯具的总体发光亮度。然而，发光二极管的发热量虽然较低，但由于数量较多的发光二极管是装置在相对密封的灯具内腔中，其工作时产生的热量因难以导散而形成积聚，因此仍不可避免地要考虑其整体发热而造成的影响。按照目前的发光二极管技术，若其工作温度一旦超过80℃，则会造成发光二极管发光体的整体烧死报废，进而影响到灯具的使用效果和质量。目前，尚没有行之有效的方法来解决发光二极管灯的散热问题。
发明内容
本发明的目的在于针对上述问题，提供一种结构简单的发光二极管灯散热结构，其可有效解决发光二极管灯工作时产生热量的散热问题。
为达到上述目的，本发明的技术方案如下：发光二极管灯散热结构，包括线路驱动发光板和线路控制板，线路驱动发光板上集成发光二极管阵列；所述线路驱动发光板上面设置一散热反光铝板，其下面接合一导散热胶层，导散热胶层另一面接合一散热铝板。
上述线路控制板可用导散热胶包裹，以进一步导散线路控制板工作时产生的热量。
上述导散热胶层由橡硅胶和云母粉混合搅拌而成，橡硅胶与云母粉的重量配比为1∶0.05～1。
本发明由于采用上述的夹层结构，使发光二极管工作时发出的热量得以经不同的散热层面迅速有效地导散出去，可使发光二极管的工作温度始终保持在65℃以下，有效解决了发光二极管灯的散热问题。
附图说明
图1是本发明的结构示意图；
图2是本发明的结构分解示意图。
现结合附图和实施例对本发明作进一步说明：
具体实施方式
如图1、图2所示，本发明包括线路驱动发光板1和线路控制板2，线路驱动发光板1上集成发光二极管阵列11。线路驱动发光板1上面贴合一散热反光铝板3，散热反光铝板上具有与发光二极管数量相应的容置孔31，发光二极管管体部分自容置孔31突出。线路驱动发光板2下面接合一导散热胶层4，导散热胶层4另一面接合一散热铝板5。线路控制板2用导散热胶6包裹。
上述导散热胶由橡硅胶和云母粉混合搅拌而成。根据不同的要求，橡硅胶与云母粉的重量配比为1∶0.05～1。
上述导散热胶层的厚度在2毫米～20毫米之间，能达到最佳的导散热效果。
本发明工作时，发光二极管自管体部分发出的热量经由散热反光铝板导散，而自管脚部分发出的热量则经由导散热胶层4导散到散热铝板5后再导散出去。因此，发光二极管整体发出的热量得以迅速有效地导散出去，保证了发光二极管的工作温度在65℃以下。线路控制板2用一导散热胶6包裹，可进一步导散线路控制板2工作时产生的热量。

Claims (5)

1、发光二极管灯散热结构，包括线路驱动发光板和线路控制板，线路驱动发光板上集成发光二极管阵列，其特征是：所述线路驱动发光板上面设置一散热反光铝板，其下面接合一导散热胶层，导散热胶层另一面接合一散热铝板。
2、根据权利要求1所述的发光二极管灯散热结构，其特征是：所述线路控制板用导散热胶包裹。
3、根据权利要求1或2所述的发光二极灯散热结构，其特征是：所述导散热胶层由橡硅胶和云母粉混合搅拌而成。
4、根据权利要求3所述的发光二极管灯散热结构，其特征是：所述橡硅胶与云母粉的重量配比为1∶0.05～1。
5、根据权利要求1所述的发光二极管灯散热结构，其特征是：所述导散热胶层的厚度在2毫米～20毫米之间。
CNB2004100521147A 2004-11-09 2004-11-09 发光二极管灯散热结构 Expired - Fee Related CN100483024C (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CNB2004100521147A CN100483024C (zh) 2004-11-09 2004-11-09 发光二极管灯散热结构
EP05802018A EP1813863A4 (en) 2004-11-09 2005-10-28 HEAT DISPERSION STRUCTURE FOR AN LED DIODE LAMP
US11/666,634 US20090052171A1 (en) 2004-11-09 2005-10-28 Heat-dispensing structure for the led's lamp
PCT/CN2005/001794 WO2006050656A1 (fr) 2004-11-09 2005-10-28 Structure de dispersion de chaleur pour une lampe a diodes led

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CNB2004100521147A CN100483024C (zh) 2004-11-09 2004-11-09 发光二极管灯散热结构

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US (1) US20090052171A1 (zh)
EP (1) EP1813863A4 (zh)
CN (1) CN100483024C (zh)
WO (1) WO2006050656A1 (zh)

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WO2008070983A1 (en) * 2006-12-11 2008-06-19 Magna International Inc. Thermal management system and method for semiconductor lighting systems
WO2008138231A1 (en) * 2007-05-16 2008-11-20 Jie She Led lamp of highly efficient heat dissipation
CN101421556A (zh) * 2006-04-19 2009-04-29 夏普株式会社 照明装置和具备该照明装置的液晶显示装置

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CN101421556A (zh) * 2006-04-19 2009-04-29 夏普株式会社 照明装置和具备该照明装置的液晶显示装置
WO2008070983A1 (en) * 2006-12-11 2008-06-19 Magna International Inc. Thermal management system and method for semiconductor lighting systems
WO2008138231A1 (en) * 2007-05-16 2008-11-20 Jie She Led lamp of highly efficient heat dissipation

Also Published As

Publication number Publication date
US20090052171A1 (en) 2009-02-26
WO2006050656A1 (fr) 2006-05-18
EP1813863A1 (en) 2007-08-01
EP1813863A4 (en) 2008-01-23
CN100483024C (zh) 2009-04-29

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