CN1602652A - Substrate cleaner - Google Patents
Substrate cleaner Download PDFInfo
- Publication number
- CN1602652A CN1602652A CN02824823.6A CN02824823A CN1602652A CN 1602652 A CN1602652 A CN 1602652A CN 02824823 A CN02824823 A CN 02824823A CN 1602652 A CN1602652 A CN 1602652A
- Authority
- CN
- China
- Prior art keywords
- substrate
- adsorption roller
- aforementioned
- base plate
- conveyer belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 207
- 238000004140 cleaning Methods 0.000 claims abstract description 63
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 238000001179 sorption measurement Methods 0.000 claims description 92
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract 4
- 238000009736 wetting Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 18
- 230000003068 static effect Effects 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000007639 printing Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning In General (AREA)
Abstract
A substrate cleaner incorporated in the manufacture line for a printed wiring board to remove foreign particles deposited on the surface of the substrate. A carrier belt carries the substrate by loading its edge section. A suction roller utilizes wetting property to suck foreign particles on the substrate surface. The foreign particles sucked by the suction roller are transferred to an adhesive substrate surface. The foreign particles sucked by the suction roller are transferred to an adhesive roller. The suction roller maintains a cleaning effect fora long time. Since the edge section of the substrate is mounted on the carrier belt, the surface of the substrate is cleaned even loaded with an electronic component in the rear.
Description
Technical field
The present invention relates to be used for as the preceding operation of making printed circuit substrate, the clean base plate cleaning device is carried out on the surface of printed circuit substrate.
Background technology
In the past, in the printed circuit substrate in being loaded into electronic equipment etc., carry the chip part (electronic unit) on this printed circuit substrate the size minimum 1.6mm (length) * 0.8mm (wide) also arranged, do not include too little.Therefore, in the last stage of making printed circuit substrate or stage midway,, do not have too big problem even be attached with foreign matters such as dust and dust on the substrate yet.
Thereby, when being installed in electronic unit on the printed circuit substrate, under originally state when printed circuit substrate manufacturer buys, printed circuit substrate is supplied with the production line of the employing surface mounting technology (SMT) that constitutes by substrate feedway, printing machine, apparatus for mounting component, conveyer, reflow ovens, substrate storing apparatus.
But, recently, the electronic unit that is installed on the printed circuit substrate is the chip part of 1.0mm (length) * 0.5mm (wide) or 0.6mm (length) * 0.3mm very small dimensions such as (wide) mostly, and it is numerous to be installed in the number of components on the printed circuit substrate, has realized the densification that parts are installed.Therefore, the fault pilosity by causing attached to the foreign matters such as dust on the printed circuit substrate becomes problem.
As the solution of the fault that causes by dust etc., adopt clearer etc., with staff clean substrate singly.Printed circuit substrate after this cleaning is supplied with the substrate feedway of above-mentioned production line.But this method is very bothersome.And finishing from cleaning will be through after a while to the solder printing of next operation, and probably dust etc. can be once again attached on the printed circuit substrate.
Can form onlineization and solve this problem by cleaning device is added in the production line.But, in the production line of printed circuit substrate for example, the time and supply with the printed circuit substrate that any electronic unit also is not installed, the time and supply with the printed circuit substrate that electronic unit is installed on one side.And then, supply with the substrate that there is no need to handle to cleaning device, or supply with the substrate that can not handle.Therefore, for online use cleaning device, must make the cleaning device can be easily and positively corresponding to supplying to the various forms in the production line or the printed circuit substrate of state.
Summary of the invention
The object of the present invention is to provide the apparatus for cleaning substrate in a kind of production line that adds printed circuit substrate, it can be corresponding to various printed circuit substrates, without staff can automated cleaning printed circuit substrate surface foreign matter.
The present invention makes for achieving the above object.Apparatus for cleaning substrate of the present invention have rotate on one side at the conveyer belt of carrying printed circuit substrate under the state of the marginal portion of bearing substrate, on the aforesaid base plate of being carried by aforementioned conveyer belt the adsorption roller that adds press contacts, while rotate the adhesive roll that adds the aforementioned adsorption roller of press contacts, make aforementioned adsorption roller from the position that contacts aforesaid base plate to away from the mechanism that moves of position.
In the apparatus for cleaning substrate of the present invention, add press contacts by the surface and the adsorption roller of conveyer belt substrate conveying.Adsorption roller is formed by silicone rubber or other resin, rubber resin, utilizes the foreign matters such as dust, dust of wettability absorption substrate surface, clean substrate.Owing to do not have adhesives etc. on the surface of adsorption roller, therefore can avoid adhesives etc. to be attached to fault on the substrate from roller.
Further add press contacts by adsorption roller, be adsorbed on dust on the adsorption roller etc. and shift to adhesive roll from adsorption roller with adhesive roll.Thereby adsorption roller is through the effect that still can keep clean after long-time.
In the cleaning device of the present invention, the marginal portion of substrate remains on the conveyer belt, can only clean the opposite one side of conveyer belt.Thereby, even when the inside of the substrate that is equipped with electronic unit cleaned, be downside with the lift-launch face of electronic unit, with the inside be upside be placed on the conveyer belt, can carry out clean to its inside.And cleaning device is not handled, or when having supplied with the substrate that can not handle, adsorption roller is moved to the position of leaving from the position of contact substrate.
Because therefore apparatus for cleaning substrate of the present invention can add in the SMT production line of printed circuit substrate corresponding to various forms of substrates.By with so onlineization of apparatus for cleaning substrate, owing to can enter printing process immediately behind the clean substrate, therefore can prevent to adhere to dust etc. on the substrate once again, further improve cleaning effect.
As a kind of form of the present invention, adsorption roller can have conductivity.In the apparatus for cleaning substrate, adsorption roller and substrate contacts move together while rubbing.Therefore, can newly produce static, thereby may the electronic unit that carry on substrate be damaged.By making adsorption roller have conductivity, can prevent this problem.
In another form of the present invention, near on the position of adsorption roller, conveyer belt is maintained on the position away from adsorption roller.This is in order to prevent adsorption roller contact conveyer belt, and causes stained.And, when the preceding end in contact adsorption roller of the substrate that is transferred, below the front end of substrate and between the conveyer belt, form the space.Thus, by adsorption roller feed drive substrate really.Replace this space, even do not support conveyer belt in the adsorption roller bottom, also conveying substrate really.
Adopt other form of the present invention, when adsorption roller pressure contact substrate, in order to suppress substrate warp, can support, perhaps at adsorption roller lower support conveyer belt in the inside of substrate side.
Description of drawings
The present invention is described with reference to the accompanying drawings.
Fig. 1 is the figure that the integral body of the production line of the expression printed circuit substrate that added apparatus for cleaning substrate of the present invention constitutes.
Fig. 2 A and Fig. 2 B are the figure of formation that schematically represents to be suitable for the apparatus for cleaning substrate of example of the present invention.
Fig. 3 is the figure that amplifies the part of adsorption roller shown in presentation graphs 2A and Fig. 2 B and substrate contacts.
Fig. 4 A to Fig. 4 C is the figure of formation that schematically represents to be suitable for the apparatus for cleaning substrate of another example of the present invention.
Fig. 5 schematically represents to be suitable for the figure of the formation of the apparatus for cleaning substrate of an example more of the present invention.
Fig. 6 A and Fig. 6 B schematically represent to be suitable for the figure of the formation of the apparatus for cleaning substrate of an example more of the present invention.
Embodiment
The example of the cleaning device of printed circuit substrate of the present invention is described with reference to the accompanying drawings.
At first, the production line of the printed circuit substrate that has added apparatus for cleaning substrate is described with reference to Fig. 1.
Substrate feedway 11 is supplied with printed circuit substrate singly automatically to apparatus for cleaning substrate 1.After this substrate that cleaning device 1 cleaning is supplied with top, this substrate is supplied with printing machine 12.Printing machine 12 carries out solder printing on this substrate of supplying with, be re-supplied in the erector 13.Erector 13 on this substrate, supplies to component mounting in the reflow ovens 15 by conveyer 14.This substrate after 15 pairs of solder printings of reflow ovens and boarded parts are finished is heat-treated.This substrate after processing finishes is accommodated in the substrate storing apparatus 16.
As shown in Figure 1, by making cleaning device 1 onlineization, can supply with printed circuit substrate automatically, the people needn't get involved clean.And, foreign matters such as dust, dust have therefore been reduced attached to the chance on the substrate after cleaning because this substrate that cleaned is infeeded in the printing machine 12 immediately.
Formation below with reference to Fig. 2 A and Fig. 2 B explanation apparatus for cleaning substrate.Fig. 2 A shows the front elevation of apparatus for cleaning substrate, and Fig. 2 B shows its side view.
Shown in Fig. 2 A, conveyer belt 3 is set, so that substrate 2 is transported to outlet side from entrance side.Shown in Fig. 2 B, conveyer belt 3 is made of 2 conveyer belts that are set up in parallel 3, the edge part at each conveyer belt bearing substrate 2 two ends.Conveyer belt 3 is carried substrate 2 by not shown motor driven to the illustrated direction of arrow.Thus, by the edge part with two ends be placed on 2 conveyer belts 3, conveying substrate 2, even the following parts that have been equipped with of substrate 2, also conveying substrate 2 insusceptibly can clean its surface.
On the transport path of substrate 2, set gradually substrate detecting sensor 8, static remover 6, adsorption roller 4, adsorption roller 4, static remover 6 to outlet side from entrance side.Substrate 2 by static remover 6 below during, the static that the surface has has been removed.Static remover 6 can adopt contact-type or non-contact type.
The rear side of 2 adsorption rollers 4 and adhesive roll 5 add press contacts.Adhesive roll 5 is driven by not shown motor rotation, and owing to adsorption roller 4 contacts with adhesive roll 5, so adsorption roller 4 rotates along with the rotation of adhesive roll 5.In addition, can be only adsorption roller 4 or only adhesive roll 5 also can be that adsorption roller 4 and adhesive roll 5 boths are by motor driven by motor driven.In case substrate detecting sensor 8 senses conveyer belt 3 conveying substrates 2, starter then, adsorption roller 4 and adhesive roll 5 begin rotation.
When substrate 2 was thin, chucking substrate 2 was carried smoothly as mentioned above, and cleans its surface.But if the thickness of substrate 2 increases, when then substrate 2 was transported to adsorption roller 4 places, substrate 2 was in the state that withstands on the adsorption roller 4, and the phenomenon between adsorption roller 4 and the conveyer belt 3 can take place not to be clipped in.
Shown in Fig. 2 A, in the apparatus for cleaning substrate of this example, the place that enters the cleaning area at the leading section of substrate 2 is provided with the space that forms the gap between adsorption roller 4 and conveyer belt 3.In the example shown in Fig. 2 A, this space is at roller 7 by conveyer belt 3
1To 7
5In roller 7
2With 7
4Circuitous everywhere and form.Because have this space, when the substrate 2 that is transferred withstood on the adsorption roller 4, the revolving force of adsorption roller 4 acted on the leading section of substrate 2, the leading section of substrate 2 is kept out of the way in this space.Thus, substrate 2 is sandwiched between adsorption roller 4 and the conveyer belt 3 and carries.
As shown in Figure 3, during the leading section of the substrate 2 that is transferred contact adsorption roller 4, there is the space at the downside of the leading section of substrate 2.Thereby the leading section of the substrate 2 of contact adsorption roller 4 is pressed towards below, the rearward end perk of substrate 2.In order to limit the perk of this rearward end, substrate feedway 11 sides of conveyer belt 3 slightly above block 9 is set.Even this block 9 is set, the leading section of substrate 2 also can enter in the space of below, and the leading section of substrate 2 is adsorbed roller 4 and conveyer belt 3 is introduced, and the conveying of substrate 2 can not stop.Substrate 2 can be carried in apparatus for cleaning substrate reposefully.
As mentioned above, the cleaning device of this example can clean various substrates, and can make needn't clean base plate and can not clean base plate pass through, and therefore can add in the production line of printed circuit substrate.
Because adsorption roller 4 has conductivity, can prevent to produce static.Though utilize static remover 6 to remove the static of substrate 2, adsorption roller 4 contacts, rubs with substrate 2, can produce static on the surface of substrate 2 again.When substrate 2 has been equipped with electronic unit because electronic unit, particularly IC wherein etc., static very a little less than, the therefore new static that produces probably can destroy to some extent.This example has conductivity by making adsorption roller 4, prevents to produce new static, can prevent the destruction to electronic unit.In addition, the resistance value of adsorption roller 4 is preferably 10
3～10
7Ω.
By roller 7
2And 7
4, in substrate 2 and part that adsorption roller 4 contacts, conveyer belt 3 remains on the position away from adsorption roller 4.Thus, even substrate 2 not on conveyer belt 3 time, adsorption roller 4 can not contact conveyer belt 3 yet.Thereby, adsorption roller 4 can not be transmitted be with 3 stained.
More than in the apparatus for cleaning substrate of Shuo Ming this example, by the space is being set under the adsorption roller and between the conveyer belt, the substrate that is transferred can enter smoothly, and the formation of the apparatus for cleaning substrate of other example that smoothly enters of this substrate of employing realization is shown in Fig. 4 A.
The formation of the cleaning part of the apparatus for cleaning substrate shown in the apparatus for cleaning substrate shown in Fig. 4 A and Fig. 2 A is basic identical, so the part identical with Fig. 2 A among Fig. 4 A, with identical symbolic representation.
In the apparatus for cleaning substrate of Fig. 4 A, the upper-lower position by correct control maintenance adsorption roller 4 is provided with some spaces between adsorption roller 4 and conveyer belt 3.Remove the roller 7 in the apparatus for cleaning substrate that is located at Fig. 2 A
2, 7
3, 7
4, when conveying substrate 2 not, between adsorption roller 4 and conveyer belt 3, have some spaces, be discontiguous.
Adopt such formation, when substrate 2 entered adsorption roller 4, the leading section of substrate 2 was depressed conveyer belt 3, conveyer belt 3 bendings.Thereby the press contacts that adds of adsorption roller 4 is to realize by the elastic force of substrate 2 self and conveyer belt 3 during clean substrate 2 surperficial.Like this, also can not stop even the substrate that is transferred 2 withstands on the adsorption roller, conveying substrate 2 smoothly.
But substrate 2 is transmitted when being with 3 to be transported to adsorption roller 4 belows, for example, when substrate 2 elastic force thin or substrate self is more weak, substrate 2 is warpage downwards, cause substrate 2 and adsorption roller 4 to add press contacts insufficient, can not remove dust on the substrate 2, dust etc.
At this moment, shown in Fig. 4 B and Fig. 4 C, adsorption roller 4 central portions just below near supporter 17 is set.Fig. 4 B is the figure that sees from entrance side, and Fig. 4 C is the figure that sees from the side.Below these supporter 17 maintenance substrates 2, the warpage of substrate 2 is corrected, can improve cleaning effect.
But when the downside ground of supporter 17 contact substrates 2 rotation, the inside of contact substrate 2, its elastic force that has can not influence the parts of lift-launch.It is to prevent that by process the resin of charged processing or metal from forming discoid brush etc.During conveying substrate 2, supporter 17 cooperates the conveying ground rotation of substrate 2.And, if in the support of supporter 17, adopt spring mechanism, also can cooperate the motion of above-below direction.Thus, though substrate 2 below when being equipped with parts, parts are during by supporter 17 tops because supporter 17 moves up and down, supporter 17 can not exerted pressure to parts.In addition, supporter 17 also can be by motor driven.
With the size of the substrate 2 that is transferred, the shape that thickness is consistently selected supporter 17, can be the disc-shape of discoid brush or resin or metal.And, can cooperate the width of substrate 2, by manually or automatically supporter 17 being adjusted to optimal fixed position.And then supporter 17 can be kept out of the way out from the height face of conveyer belt 3 when unnecessary.Thus, contact substrate can not use yet.
And then, shown in Fig. 4 B and Fig. 4 C, in the apparatus for cleaning substrate shown in Fig. 4 A, if prevent the guide 18 that substrate 2 crawls in the centre of 2 adsorption rollers 4, the arranged outside of conveyer belt 3, conveying substrate 2 smoothly then.
In the apparatus for cleaning substrate shown in Fig. 4 A, conveyer belt 3 is by roller 7
1, 7
5Deng support, during with conveyer belt 3 conveying substrates 2, relative with 2 adsorption rollers in front and back 4 to the not support of downside of conveyer belt 3.Thus, can play with the apparatus for cleaning substrate shown in Fig. 2 A in the identical effect in space that forms., as shown in Figure 5, the roller that tabular conveyer belt supporter 19 replaces supporting conveyer belt 3 can be set also herein, thus conveying substrate 2 stably.
If conveying substrate 2 between this adsorption roller 4 and conveyer belt 3 when the thinner thickness of this substrate 2, can produce delicate deflection in conveyer belt 3, this delicate deflection makes substrate 2 closely contact with adsorption roller 4, thereby can remove dust, dust really.
But when the thickness of substrate 2 during greater than 1mm, if adopt above-mentioned formation, when cleaning, the leading section of substrate 2 and rearward end can be upturned.In order to prevent the end perk of substrate 2, what substrate 2 was set on conveyer belt 3 prevents substrate perk plate 20, thus conveying substrate 2 smoothly.
As Fig. 4 A or shown in Figure 5, in the bottom of adsorption roller 4, adopt when not supporting the formation of conveyer belt 3, during conveying substrate 2, because the pressure contact force that adds of adsorption roller 4 weakens, in order to adjust the size that this adds pressure contact force, shown in Fig. 6 A and Fig. 6 B, the downside of conveyer belt 3 also can be provided with the metallurgical part 21 of support of sliding support conveyer belt 3 in the bottom of adsorption roller 4.
Consistently from spring-like or tabular metallurgical part, select the metallurgical part 21 that is provided with the thickness of substrate 2.Near the outside of 2 conveyer belts of advancing side by side 3, the guide 18 that prevents to crawl is set respectively near the pars intermedia of 2 adsorption rollers 4 promptly.Thus, can stably carry undersized substrate.
In addition, in the apparatus for cleaning substrate shown in Fig. 5 and Fig. 6 A, though static remover 6, substrate detecting sensor 8, and travel mechanism 10 not shown, this is for convenience of description, diagram has been omitted, in their apparatus for cleaning substrate with similarly also have them shown in Fig. 2 A and Fig. 4 A.
As mentioned above, the cleaning device that constitutes according to apparatus for cleaning substrate of the present invention can be corresponding to various substrates, thereby can add in the production line of printed circuit substrate, without staff, can clean the surface of the printed circuit substrate of automatic supply really.
Claims (6)
1. apparatus for cleaning substrate, it is the cleaning device of removing attached to the foreign matter on the substrate surface that is transferred, it comprises the marginal portion of bearing substrate and carries the conveyer belt of this substrate, on the aforesaid base plate that is transferred while rotating the adsorption roller that adds press contacts, at the opposition side of aforesaid base plate while rotating the adhesive roll that adds the aforementioned adsorption roller of press contacts, make aforementioned adsorption roller from the position on contact aforesaid base plate surface to away from the mechanism that moves of position, it is characterized in that, aforementioned adsorption roller is from aforementioned substrate surface absorption aforementioned foreign matter, and aforementioned adhesive roll adheres to the aforementioned foreign matter that is adsorbed.
2. a cleaning device as claimed in claim 1 is characterized in that, aforementioned adsorption roller is non-conductive or conductivity.
3. a cleaning device as claimed in claim 1 or 2 is characterized in that, keeps aforementioned adsorption roller to add the aforementioned conveyer belt of the vicinity on press contacts aforesaid base plate surface, and the aforementioned marginal portion of itself and aforesaid base plate is left.
4. a cleaning device as claimed in claim 1 or 2 is characterized in that, when carrying aforesaid base plate, because aforementioned adsorption roller adds press contacts to aforesaid base plate, aforementioned adsorption roller adds the aforementioned conveyer belt deflection of the vicinity on press contacts aforesaid base plate surface.
5. a cleaning device as claimed in claim 4 is characterized in that, a side opposite with aforementioned adsorption roller of aforementioned conveyer belt is provided with and is used to adjust the metallurgical part that adds the deflection that press contacts produces by aforementioned.
6. one kind as any one described cleaning device in the claim 1～5, it is characterized in that, when aforementioned adsorption roller added press contacts aforesaid base plate surface, a side opposite with aforementioned adsorption roller of aforesaid base plate was provided with the supporter that supports aforesaid base plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2002/010612 WO2004034757A1 (en) | 2002-10-11 | 2002-10-11 | Substrate cleaner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1602652A true CN1602652A (en) | 2005-03-30 |
| CN1602652B CN1602652B (en) | 2010-06-09 |
Family
ID=32089056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02824823.6A Expired - Lifetime CN1602652B (en) | 2002-10-11 | 2002-10-11 | Substrate cleaner |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4326472B2 (en) |
| CN (1) | CN1602652B (en) |
| AU (1) | AU2002338178A1 (en) |
| WO (1) | WO2004034757A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101312322B (en) * | 2007-05-22 | 2011-03-16 | 株式会社松荣工机 | Conveying appliance |
| US8079105B2 (en) | 2005-11-10 | 2011-12-20 | Datacard Corporation | Card cleaning mechanism |
| CN101470357B (en) * | 2007-12-27 | 2013-03-13 | 株式会社Orc制作所 | Exposure apparatus |
| CN105307786A (en) * | 2013-06-18 | 2016-02-03 | 苹果公司 | Pressure-sensing rollers for lamination systems |
| CN110813930A (en) * | 2019-11-23 | 2020-02-21 | 湖南东神自动化设备有限公司 | Circuit board surface cleaning device |
| CN112140633A (en) * | 2020-09-21 | 2020-12-29 | 昆山市天丰印刷包装有限公司 | Full-automatic aqueous printing slotting die-cutting machine |
| CN114364153A (en) * | 2021-12-15 | 2022-04-15 | 上海羽默电子科技有限公司 | Circuit board printing process |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100542700C (en) * | 2004-12-24 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Clamp in use for cleaning base plate of glass |
| KR20080051961A (en) | 2006-12-07 | 2008-06-11 | 한국전자통신연구원 | Method for cleaning flexible substrate |
| JP5253481B2 (en) * | 2010-11-04 | 2013-07-31 | ユニテク株式会社 | Substrate cleaning device |
| JP6382622B2 (en) * | 2014-02-25 | 2018-08-29 | バンドー化学株式会社 | Cleaning device, adhesive roller unit and adhesive roller |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614860Y2 (en) * | 1990-04-04 | 1994-04-20 | 住友金属工業株式会社 | Foreign material removal device for belt-shaped ultra-low tension sheet |
| JPH0763685B2 (en) * | 1991-09-10 | 1995-07-12 | 都ローラー工業株式会社 | Dust removal roller and dust removal device using the same |
| CN1344131A (en) * | 2000-09-18 | 2002-04-10 | 华通电脑股份有限公司 | Laser perforation method for PCB and substrate |
| JP2002153825A (en) * | 2000-11-17 | 2002-05-28 | Taiyo Kogyo Kk | Tacky adhesive roller for removing dust |
| JP3078286U (en) * | 2000-12-12 | 2001-06-29 | 榮華 葉 | Circuit board cleaning machine |
-
2002
- 2002-10-11 WO PCT/JP2002/010612 patent/WO2004034757A1/en active Application Filing
- 2002-10-11 CN CN02824823.6A patent/CN1602652B/en not_active Expired - Lifetime
- 2002-10-11 AU AU2002338178A patent/AU2002338178A1/en not_active Abandoned
- 2002-10-11 JP JP2004542798A patent/JP4326472B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8079105B2 (en) | 2005-11-10 | 2011-12-20 | Datacard Corporation | Card cleaning mechanism |
| CN101304817B (en) * | 2005-11-10 | 2012-11-14 | 咨询卡有限公司 | Card cleaning mechanism |
| CN101312322B (en) * | 2007-05-22 | 2011-03-16 | 株式会社松荣工机 | Conveying appliance |
| CN101470357B (en) * | 2007-12-27 | 2013-03-13 | 株式会社Orc制作所 | Exposure apparatus |
| CN105307786A (en) * | 2013-06-18 | 2016-02-03 | 苹果公司 | Pressure-sensing rollers for lamination systems |
| CN105307786B (en) * | 2013-06-18 | 2019-09-17 | 苹果公司 | Pressure-sensing roller for laminating system |
| CN110813930A (en) * | 2019-11-23 | 2020-02-21 | 湖南东神自动化设备有限公司 | Circuit board surface cleaning device |
| CN112140633A (en) * | 2020-09-21 | 2020-12-29 | 昆山市天丰印刷包装有限公司 | Full-automatic aqueous printing slotting die-cutting machine |
| CN114364153A (en) * | 2021-12-15 | 2022-04-15 | 上海羽默电子科技有限公司 | Circuit board printing process |
| CN114364153B (en) * | 2021-12-15 | 2023-12-08 | 上海羽默电子科技有限公司 | Circuit board printing process |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002338178A1 (en) | 2004-05-04 |
| WO2004034757A1 (en) | 2004-04-22 |
| JP4326472B2 (en) | 2009-09-09 |
| JPWO2004034757A1 (en) | 2006-02-16 |
| CN1602652B (en) | 2010-06-09 |
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