JP3101485U - Printed circuit board cleaning device - Google Patents

Abstract

Provided is a cleaning device that can clean various substrates and that can be incorporated into a printed wiring board manufacturing line.
A cleaning device transports a substrate with two transport belts (3) mounted on an edge portion of the substrate. The suction roller 4 suctions dust and the like on the substrate surface due to the wettability of the surface. The dust and the like adsorbed by the suction roller are transferred to the adhesive roller 5. Therefore, the suction roller maintains the cleaning effect for a long time. Since the edge of the substrate is mounted on the transport belt, the back surface of the substrate can be cleaned even when the electronic component is already mounted thereon. Further, by holding the suction roller at a position away from the substrate by the retreat mechanism 10, in-line can be achieved.
[Selection] Figure 2

Description

  The present invention relates to a substrate cleaning device for cleaning a surface of a printed wiring board as a pre-process of manufacturing the printed wiring board.

  2. Description of the Related Art Conventionally, in a printed wiring board incorporated in an electronic device or the like, a dimension of a chip component (electronic component) mounted on the printed wiring board is as small as 1.6 mm (long) × 0.8 mm (width) at a minimum. It was not small. For this reason, even if foreign substances such as dust and dirt adhere to the substrate before or during the manufacturing of the printed wiring board, no particular problem occurs.

  Therefore, when electronic components are mounted on a printed wiring board, the printed wiring board is supplied from a printed wiring board manufacturer, and the printed wiring board is supplied to the board supply device, printing machine, component mounting device, conveyor, reflow It has been supplied to a production line by surface mounting technology (SMT) comprising a furnace and a substrate storage device.

  However, recently, most of electronic components mounted on a printed wiring board have a very small size of 1.0 mm (length) × 0.5 mm (width) or 0.6 mm (length) × 0.3 mm (width). The number of components mounted on one printed wiring board, which are chip components, is increasing, and the density of component mounting is being increased. For this reason, defects caused by foreign matters such as dust adhering to the printed wiring board frequently occur, and are regarded as problems.

  As a solution to a defect caused by dust or the like, a method of manually cleaning substrates one by one using a cleaning roller or the like is performed. The printed wiring board after this cleaning is supplied to the substrate supply device of the above-mentioned production line. However, such a method is troublesome. Then, it takes time from the end of the cleaning to the next step of solder printing, and there is a possibility that dust or the like may adhere to the printed wiring board again.

  Therefore, various types of substrate cleaning devices have been developed that remove foreign substances such as dust adhering to the substrate by contacting a rotating brush or a rotating adhesive roller while transporting the substrate such as an electronic component or a printed wiring board. (See, for example, Patent Documents 1 to 5). It has also been developed to remove dust adhering to the surface of the object to be cleaned with a suction roller that does not use an adhesive (for example, see Patent Document 6).

Japanese Utility Model Publication No. 61-71433 JP-A-1-289295 JP-A-62-49984 Japanese Utility Model Publication No. 6-14860 JP 2000-334406 A JP-A-6-91236

  Since such an already-developed cleaning device can be incorporated into a production line of a printed wiring board, the above-mentioned problem is solved by incorporating a conventionally developed cleaning device into a production line and inlining the same. You. However, for example, a printed wiring board on which no electronic components are mounted is supplied to a printed wiring board manufacturing line, or a printed wiring board on which electronic components are already mounted on one side is supplied. Further, the cleaning device may be supplied with a substrate that does not need to be processed or cannot be processed. Therefore, in order to use the cleaning device in-line, the cleaning device must be able to easily and reliably cope with various types or states of the printed wiring board supplied to the production line.

  The present invention is applicable to various printed wiring boards, and can be incorporated into a printed wiring board manufacturing line so that foreign substances on the surface of the printed wiring board can be automatically cleaned without manual operation. The purpose is to provide.

  In order to solve the above problems, the present invention provides a substrate cleaning apparatus for removing foreign substances adhering to a surface of a printed wiring board to be transported, wherein the edge portion of the printed wiring board is placed and the substrate is transported. A conveying belt of the book, a suction roller that is in pressure contact with the one surface of the printed wiring board being conveyed while rotating, and an adhesive roller that is in pressure contact with the suction roller and is rotated on the side opposite to the printed wiring board. Means for moving the suction roller to a position away from a position in contact with the surface of the printed wiring board, wherein the suction roller sucks the foreign matter from the surface of the printed wiring board, and the foreign matter is The image was transferred to an adhesive roller.

  At least an upstream side of the suction roller in the transport direction of the printed wiring board is provided with an electrostatic removing device that removes electricity from a surface of the printed wiring board, and the suction roller is non-conductive, or It was assumed to be conductive.

  Two or more suction rollers arranged in parallel and pressed in contact with the surface of the printed wiring board and rotating in the same direction; and pressure contact with the suction roller on the opposite side of the suction roller from the printed wiring board. And the adhesive roller to be used.

  A height adjusting jig for the suction roller is provided, and the height adjusting jig is inserted between a bearing portion of the suction roller and a support base of the bearing portion, and the suction roller and the transport belt Is set to a predetermined height corresponding to the thickness of the printed wiring board to be conveyed, and when the printed wiring boards of different thicknesses are conveyed, to a predetermined height corresponding to the thickness. The interval is adjusted by exchanging the height adjusting jig that can be set.

  Further, the transport belt in the vicinity where the suction roller comes into pressure contact with the surface of the printed circuit board is bent by the pressure contact of the suction roller to the printed circuit board when the printed circuit board is carried. The conveyor belt is held by a plurality of belt holding rollers, the belt holding roller is disposed on the upstream side and the downstream side with respect to the suction roller, and the conveyor belt is provided on the upstream side and the downstream side. Between the belt holding rollers on the side, the suction roller is bent by pressure contact with the printed wiring board.

  A lifting prevention plate that prevents the rear part of the printed wiring board from being lifted when the printed wiring board is sandwiched between the suction roller and the transport belt, above the transport belt on the upstream side of the suction roller. Was decided.

  Further, when the suction rollers arranged in parallel are in pressure contact with the printed wiring board, a holding jig for holding the conveyance belt at a center between the suction rollers is provided on a side of the conveyance belt opposite to the suction roller. It has been arranged in.

  Further, when the suction roller comes into pressure contact with the surface of the printed wiring board, a support for supporting the printed wiring board is arranged on a side of the printed wiring board opposite to the suction roller, The support is a disc-shaped elastic body which rotates in accordance with the conveyance of the printed wiring board, and is formed of a brush which has been subjected to an antistatic treatment.

  The support is configured to move up and down in accordance with the height of a component mounted on the printed wiring board by a spring mechanism, and further, the support is moved in a direction orthogonal to a transport direction of the printed wiring board. The position was decided to be adjusted.

  As described above, if configured as the substrate cleaning apparatus according to the present invention, it is possible to cope with various substrates, thereby making it possible to incorporate it into the production line of the printed wiring board, and to automatically print the printed wiring board. The substrate cleaning device can surely clean the surface without manual operation.

  Hereinafter, an embodiment of a printed wiring board cleaning apparatus according to the present invention will be described with reference to the drawings, divided into Examples 1 to 5.

  First, with reference to FIG. 1, a description will be given of a production line for a printed wiring board (hereinafter, simply referred to as a board) incorporating a board cleaning device.

  The substrate supply device 11 automatically supplies substrates to the substrate cleaning device 1 one by one. After cleaning the upper surface of the supplied substrate, the cleaning device 1 supplies the substrate to the printing machine 12. The printing machine 12 performs solder printing on the supplied substrate and supplies the substrate to the mounter 13. The mounter 13 mounts components on the substrate and supplies the components to the reflow furnace 15 via the conveyor 14. The reflow furnace 15 heat-treats the substrate on which the solder printing and component mounting have been completed. The processed substrate is stored in the substrate storage device 16.

  By inlining the cleaning device 1 as shown in FIG. 1, the substrate is automatically supplied, and it is not necessary for a person to be involved in the cleaning process. In addition, since the cleaned substrate is immediately supplied to the printing press 12, the chance of foreign matter such as dust and dirt adhering to the cleaned substrate is reduced.

  Next, FIG. 2 shows a first embodiment according to the substrate cleaning apparatus of the present invention. With reference to FIGS. 2A and 2B, a description will be given of a configuration of the substrate cleaning apparatus according to the first embodiment, centering on a cleaning unit. FIG. 2A shows a side view of the substrate cleaning apparatus, and FIG. 2B shows a front view as viewed from the entrance side.

As shown in FIG. 2A, two transport belts are provided so that the substrate 2 is transported from the entrance side to the exit side. Conveyor belt, as shown in FIG. 2 (b), is composed of two parallel disposed a belt 3 ₁ and 3 _2, each belt is adapted to place the edge portions at both ends of the substrate 2 ing. Conveyor belt 3 ₁ and 3 ₂ are driven by a motor, not shown, to convey the substrate 2 in the direction of the arrow shown. Thus, by placing the edge portions at both ends on the two belts 3 ₁ and 3 _2, by conveying the substrate 2, as components on the lower surface of the substrate 2 it was already present, its components, will pass through between the belt 3 ₁ and the belt 3 _2, without being affected by the components thereof, can transport the substrate 2, it is possible to clean the surface of the opposite side.

The transport path of the substrate 2, toward the inlet side of the cleaning portion to the outlet side, the substrate detection sensor 8, an electrostatic remover 6 _1, suction rollers 4 _1, adsorbed roller 4 _2, an electrostatic remover 6 ₂ in order Be placed. Substrate 2, while passing under the electrostatic remover 6 ₁ and 6 _2, static electricity is removed to the surface. The electrostatic remover 6 ₁ and 6 _2, contact type, can also be used in any of the non-contact ones. Suction roller 4 electrostatic remover 6 ₁ arranged upstream of the ₁ is important to eliminate the influence of the static electricity charged on a substrate for the adsorption of dust in the adsorption roller 4 _1.

2 present behind the side of the suction roller 4 ₁ and 4 ₂ are the adhesive roller 5 is placed in contact pressure. Adhesive roller 5 is rotationally driven by a motor (not shown), the suction rollers 4 ₁ and 4 _2, since it is in contact with the adhesive roller 5 is rotated with the rotation of the adhesive roller 5. Incidentally, the adsorption roller 4 ₁ and 4 _2, or by driving only the adhesive roller 5 by a motor, or it is also possible to drive both the suction rollers 4 ₁ and 4 ₂ and the adhesive roller 5 by a motor. That the substrate 2 is conveyed by the conveyor belt 3 ₁ and 3 _2, the substrate detecting sensor 8 senses the adsorption roller 4 ₁ and 4 ₂ and the adhesive roller 5 motor is activated starts to rotate.

Suction rollers 4 ₁ and 4 ₂ may be formed in non-conductive silicone rubber resin, or may be those formed by silicone rubber resin having conductivity. Suction rollers 4 ₁ and 4 ₂ adsorbs foreign matter such as dust, dust on the surface of the substrate 2 by the wettability of the silicon rubber, to clean the substrate 2. Suction rollers 4 ₁ and 4 _2, so does not have an adhesive material or the like on the surface, can be adhesive or the like from the adsorption roller 4 ₁ and 4 ₂ can be prevented an accident that adheres to the substrate 2.

By adhesive roller 5 is pressure contact with the suction roller 4 ₁ and 4 _2, dust and the like from the substrate 2 is sucked by the suction roller 4 ₁ and 4 ₂ are transferred to the adhesive roller 5. Therefore, the suction roller 4 ₁ and 4 ₂ of the surface, constantly keeping a clean state, so that the cleaning effect is sustained. In FIG. 2, two suction rollers 4 ₁ and 4 ₂ are to be perpendicular to the flow direction board 2 conveyed have been parallel spaced, the surface of the substrate 2 In order to increase the cleaning efficiency, the number may be further increased and three or more may be arranged in parallel. In this case, one adhesive roller 5 may be arranged so as to be in pressure contact with both adjacent suction rollers, or the same number of adhesive rollers 5 as the suction rollers may be individually applied to each of the suction rollers. Pressure contact may be used.

Suction rollers 4 ₁ and 4 ₂ and the adhesive roller 5, the moving mechanism 9, and is movable to a position away from a position in contact with the substrate 2. Substrate do not need to be cleaned from the substrate feeding device 11, or when the substrate can not be cleaned is supplied, the suction rollers 4 ₁ and 4 ₂ are moved away from the conveyor belt 3, in contact with the substrate 2 which is conveyed do not do. This allows the substrate 2 passes through the cleaning device 1 without touching the suction roller 4 ₁ and 4 _2.

Suction rollers 4 ₁ and 4 ₂ are some elasticity to have a pressurized contact from above the substrate 2 taking advantage of this elasticity. Therefore, the lower end portion of the suction roller 4 ₁ and 4 ₂ at the time when the substrate 2 is not conveyed, positioned below the upper surface of the substrate 2 being conveyed. In such a state, when the substrate 2 is conveyed, the leading end portion of the substrate 2, first strikes the suction roller 4 ₁ on the inlet side. Then, the substrate 2 is, by the friction force between the suction roller 4 ₁ and the conveyor belt 3, sandwiched between the suction roller 4 ₁ and the conveyor belt 3, further it will be conveyed to the suction roller 4 _2. In the course this conveyance, the upper surface of the substrate 2 is cleaned by the suction roller 4 ₁ and 4 _2.

When the substrate 2 is thin, the substrate 2 is smoothly sandwiched and conveyed in this manner, and the surface thereof is cleaned. However, when the thickness of the substrate 2 is increased, when the substrate 2 is conveyed to the suction roller 4 _1, the substrate 2 will become remains hits the suction roller 4 _1, adsorbed roller 4 ₁ and the conveyor belt A phenomenon occurs in which the sheet is not sandwiched between the _first and _second electrodes 31 and 32.

Therefore, in the substrate cleaning apparatus according to the first embodiment, as shown in FIG. 2A, there is play between the suction roller 4 and the transport belt 3 where the leading end of the substrate 2 enters the cleaning area. A gap was provided. This gap is set smaller than the thickness of the substrate 2 in the example shown in FIG. Furthermore, to move the conveyor belt 3 in the flow direction of the substrate 2, in order and held, but the belt holding rollers 7 ₁ to 7 ₃ are provided, the holding roller 7 ₂ and 7 _3, suction rollers 4 ₁ and 4 ₂ are arranged offset on the upstream side and downstream side of a position to pressure contact with the substrate 2 carried, the conveyor belt 3 in the vicinity of the suction rollers 4 ₁ and 4 ₂ is pressure contact with the substrate 2, Not retained.

Therefore, the transport belt 3 can be held and bent by the tension applied to the belt itself. By this deflection is present, the substrate 2 carried, when hits the suction roller 4 _1, adsorbed roller 4 ₁ of rotational force to the tip portion of the substrate 2 is applied, the tip portion of the substrate 2 the conveyor belt 3 will bend and the gap will be further widened. Therefore, the substrate 2 is sandwiched smoothly between the suction roller 4 ₁ and the conveyor belt 3 is conveyed to the cleaning section. Incidentally, even when the substrate 2 does not come conveyed by this gap exists, since the suction roller 4 ₁ and 4 ₂ are not in contact with the conveyor belt 3, it is possible to prevent the suction rollers 4 ₁ and 4 ₂ are dirty.

  As described above, the cleaning device according to the first embodiment can reliably clean the substrate even if the electronic component is mounted on one side, and further, the substrate that does not need to be cleaned or the substrate that cannot be cleaned. Can be easily incorporated into a printed wiring board manufacturing line.

Further, the suction rollers 4 ₁ and 4 ₂ by having conductivity, generation of static electricity can be prevented. Although static electricity charged on the substrate 2 by an electrostatic remover ₆₁ is removed, by the suction roller 4 ₁ and 4 ₂ are frictionally in contact with the substrate 2, static electricity is newly on the surface of the substrate 2 Can occur. If the substrate 2 already has electronic components mounted thereon, the electronic components, especially ICs among them, are very sensitive to static electricity and may be destroyed by newly generated static electricity. As in this embodiment, by providing conductivity to the suction rollers 4 ₁ and 4 _2, it is possible to prevent the occurrence of a new static, to prevent destruction of the electronic components. It is preferable that the electric resistance value of the suction roller is set to 10 ³ Ω to 10 ⁷ Ω.

The substrate cleaning apparatus of the first embodiment described above, immediately below the suction roller 4 ₁ and 4 _2, a gap is provided between the conveyor belt 3 ₁ and 3 _2, further transport belt 3 ₁ and 3 ₂ are lower By holding the substrate 2 so as to bend, the transported substrate 2 is smoothly rushed in, and the substrate 2 is transported to the cleaning unit without stopping. However, when the substrate 2 is conveyed below the suction roller 4 ₁ and 4 ₂ by the conveyor belt 3, for example, or the substrate 2 is thin, or when the elasticity of the substrate itself is weak, the substrate 2 is warped downward If it would, in some cases the pressure contact between the substrate 2 and the suction roller 4 ₁ and 4 ₂ is not performed sufficiently, can not be removed dirt, dust or the like on the substrate 2.

Therefore, a second embodiment capable of coping with this case is shown in FIGS. 3 (a) and 3 (b). The substrate cleaning apparatus of the second embodiment, the configuration of the substrate cleaning apparatus shown in Example 1 as a base, in the vicinity of directly below the center portion of the suction roller 4 ₁ and 4 _2, established the backup member 17 ₁ and 17 ₂ ing. FIG. 3A is a view as viewed from the entrance side, and FIG. 3B is a view as viewed from the side. By this backup member 17 ₁ and 17 ₂ holds the lower surface of the substrate 2, and correcting the warping of the substrate 2, it is possible to enhance the cleaning effect.

Backup member 17 ₁ and 17 ₂ is configured to be rotated in contact with the lower surface of the substrate 2, when in contact with the back surface of the substrate 2, so as not to affect the components mounted, thereby inelastic . It is a disk-shaped elastic body made of a resin or metal subjected to antistatic treatment, and is, for example, a brush or the like. Backup member 17 ₁ and 17 ₂ when the substrate 2 is conveyed to rotate fit for transporting the substrate 2. Further, when employing a spring mechanism for supporting the back-up member 17 ₁ and 17 _2, it is possible to match vertical movement. Thus, when the components on the lower surface of the substrate 2 has been mounted even if the top of the backup member 17 ₁ and 17 ₂ parts passes, since the backup member 17 ₁ and 17 ₂ are moved up and down, the backup member parts No stress on you. It is also possible to drive the back-up member 17 ₁ and 17 ₂ in the motor.

The shape of the backup member 17 ₁ and 17 _2, according to the size-thickness of the substrate 2 conveyed, disc-shaped brush or, as a disk-shaped resin systems or metal system is selected. The backup member 17 ₁ and 17 _2, to the width of the substrate 2, or in accordance with the mounting position of the electronic component on the rear surface of the substrate 2, so as to adjust the fixing position of optimum lateral manually or automatically Good to keep. Further, the backup members 17 ₁ and 17 ₂ can, if unnecessary, may be retracted from the height plane of the conveyor belt _{3 1} and _{3 2.} Thereby, it is also possible to use without contacting the substrate.

Further, in the substrate cleaning apparatus according to the second embodiment, as shown in FIG. 3 (a) and (b), a two intermediate suction roller _{4 1} and _{4 2,} the outer conveyor belt _{3 1} and _{3 2} , when installing a meandering preventive guide 18 ₁ and 18 ₂ with respect to the substrate 2, without the substrate 2 popping can be performed smoothly conveyed.

In the substrate cleaning apparatus shown in FIG. 2 (a), the conveyor belt _{3 1} and _{3 2} are supported by the belt holding rollers _{7 1} to _{7 3,} respectively, the substrate 2 by the conveyor belt _{3 1} and _{3 2} when transporting, eliminating the support of the conveyor belt 3 ₁ and 3 ₂ of the lower side opposite the two suction rollers 4 ₁ and 4 ₂ which are juxtaposed. Thus, to form a deflection of the conveyance belt 3 ₁ and 3 ₂ during rush substrate 2, and creates the effect of smooth entrapment.

Here, instead of holding rollers for supporting the conveyor belt 3 ₁ and 3 _2, Example 3 of arranging the conveyor belt support 19 ₁ and 19 ₂ of the plate under the husband of the conveyor belt 3 ₁ and 3 ₂ s FIG. 4 shows a substrate cleaning apparatus. As shown, the conveyor belt support 19 ₁ and 19 _2, because not provided on the lower suction rollers 4 ₁ and 4 _2, as in the case of the cleaning apparatus of the first embodiment, when the rush substrate 2 conveyor belt 3 ₁ and 3 ₂ flexure is formed, can create the effect of smoothly entrapment, the substrate 2 can be stably transported at.

Between the suction roller 4 ₁ and 4 ₂ and the conveyor belt 3 ₁ and 3 _2, the substrate 2 is conveyed, when the thickness of the substrate 2 is thin, delicate to the conveyor belt 3 ₁ and 3 ₂ deflection occurs Do, this subtle deflection by close contact board 2 and the suction roller 4 ₁ and 4 ₂ are, it is possible to remove reliably Nigomi dust.

However, in the case where the thickness of the substrate 2 is 1 mm or more and the above configuration, the front end and the rear end of the substrate 2 may be lifted upward during cleaning. For prevention raised edge of the substrate 2, on the conveyor belt 3 ₁ and 3 _2, when disposed preventing plate 20 ₁ and 20 ₂ lifting board substrate 2, so enabling smooth transfer of substrates 2.

The substrate cleaning apparatus shown in Examples 1 to 3, only the conveyor belt 3 ₁ and 3 ₂ are supported by the suction roller 4 ₁ and 4 ₂ of the upstream and downstream holding roller, suction rollers 4 ₁ and 4 in the _second lower conveyor belt _{3 1} and _{3 2} are not supported. This configuration is when the substrate 2 is conveyed, by deflecting the conveyor belt 3 ₁ and 3 ₂ downwardly, to perform smoothly the transfer of the substrate 2.

However, by having a configuration to flex the conveyor belt 3 ₁ and 3 _2, when the substrate 2 is conveyed, depending on the thickness of the substrate 2, the pressure contact force of the suction roller 4 ₁ and 4 ₂ is weakened There are cases. Therefore, in the substrate cleaning apparatus of the fifth embodiment shown in FIG. 5, the magnitude of the pressure contact force can be adjusted so that the pressure contact force does not weaken. As shown in FIG. 5 (a) and (b), the conveyor belt _{3 1} and _{3 2} of the respective lower in the lower portion of the suction roller _{4 1} and _{4 2,} and the suction roller _{4 1} and the suction roller _{4 2} an intermediate position, placing the supporting jig 21 ₁ and 21 ₂ which slides supporting the conveyor belt _{3 1} and _{3 2.}

Support jigs 21 ₁ and 21 ₂ are arranged, according to the thickness of the substrate 2 is selected from a spring-like or plate-shaped jig. Smooth by the supporting jig 21 ₁ and 21 ₂ are disposed, at the time of conveyance of the substrate 2, the deflection in the conveyor belt 3 ₁ and 3 ₂ are only the lower portion of the suction roller 4 ₁ and the suction roller 4 _2, the transfer of the substrate 2 while performing the, it can be secured pressure contact force by the suction roller 4 ₁ and 4 ₂ in the cleaning section. Together with the arrangement of the support jig 21 ₁ and 21 _2, a conveyor belt 3 ₁ and 3 ₂ in the vicinity of the outer running two parallel, two intermediate portions in the adsorption roller 4 ₁ and 4 ₂ of each near, when installing a meandering preventive guide 18 ₁ and 18 _2, in the substrate of small size can be stably conveyed.

Figure 2 As described in the substrate cleaning apparatus of Example 1, (a), the in the substrate cleaning apparatus of the present invention is, at the tip portion of the substrate 2 enters the cleaning unit, the suction rollers 4 ₁ and 4 ₂ and provided with a gap which becomes play between the conveyor belt 3 ₁ and 3 _2, the gap is set smaller than the conveyed thickness of the substrate 2, further, when carrying the substrate 2, the suction rollers 4 ₁ and by deflecting the conveyor belt 31 and 32 in the lower part of the 4 _2, and to perform smoothly conveying the substrate 2. Therefore, when the substrates 2 having different thicknesses are conveyed, in order to smoothly convey the substrates 2, it is necessary to adjust the gap according to the thickness of the conveyed substrates 2.

Therefore, the substrate cleaning apparatus of Example 5 so as to position the height adjustment jig which can adjust the installation height of the suction roller 4 ₁ and 4 _2, shown in FIG. 6 (a) and (b). 6 (a) is a front view seen from the inlet side of the cleaning unit, FIG. 6 (b) is an enlarged diagram for height adjustment jig that adjusts the installation height of the suction roller 4 _1.

As shown in FIG. 6 (a), the opposite ends of the suction roller _{4 1,} bearing portions 22 ₁ and 22 ₂ are provided. Bearing portions 22 ₁ and 22 ₂ are supported by respective bearing portions support 23 ₁ and 23 _2. Between the bearings ₂₂ 1, 22 ₂ and the bearings support ₂₃ 1, 23 _2, respectively, adjusting jig ₂₄ 1, 24 ₂ are inserted height. The height adjustment jig 24 ₁ and 24 _2, the interval of the suction roller _{4 1} and the conveyor belt _{3 1} and _{3 2} are adjusted. Similarly, with regard suction roller 4 _2, between the bearing portion and the bearing portion supporting base at its both ends, the height adjustment jig 24 ₁ and 24 ₂ and the same height adjustment jig is inserted. Although not shown, a mechanism for holding the position of each bearing portion in the transport direction is provided.

The details of the height adjusting jig shown in FIG. 6A are shown in FIG. 6B. In FIG. 6 (b), typically, when the height adjustment jig 24 ₁ is shown. The bearing portion support 23 _1, the height position setting member 25 can be finely adjusted vertically is provided. When the substrate cleaning device is shipped as a product, the height position setting member 25 is for adjusting the height position of the suction roller and setting the interval between the suction roller and the conveyor belt as a standard. When the substrate is cleaned, it is fixed.

The height adjustment jig 24 _1, the engaging recess 26 is provided, the engaging recess 26 is fitted to the height position setting member 25. The thickness H of the jig top and the engaging recess 26 in the height adjustment jig 24 _1, corresponding to the thickness of the substrate conveyed 2, optimal spacing between the conveyor belt and the suction roller It is set to have a large size.

  When substrates 2 having different thicknesses are transported, a plurality of types of height adjustment jigs set to a thickness H adjusted to an optimum interval are prepared according to the thickness of the substrate 2 to be transported. In advance, a corresponding height adjusting jig is inserted between the bearing portion and the bearing portion support base in accordance with the thickness of the substrate 2 to be transported. By providing such a height adjusting jig, even when substrates of different thicknesses are conveyed, the height of the suction roller is finely adjusted each time according to the type of the substrate. There is no necessity, and the predetermined height can be set simply by inserting the corresponding height adjustment jig. Even when a substrate having a different thickness is carried into the cleaning unit, the substrate can always be smoothly transported, optimal pressure contact can be realized, and foreign substances on the substrate can be reliably removed.

In the substrate cleaning apparatus according to Embodiment 2 to 5 shown in FIGS. 3 to 6 described above, an electrostatic remover 6 ₁ and 6 _2, substrate detecting sensor 8 and the moving mechanism 9, have been shown by Although not shown, these are omitted from the drawing for the sake of explanation, and these substrate cleaning apparatuses are provided with respective devices similarly to the substrate cleaning apparatus shown in FIG.

It is a figure showing the whole line composition concerning the manufacturing line of the printed wiring board in which the substrate cleaning device was incorporated. 1 is a diagram conceptually illustrating a configuration of a substrate cleaning apparatus according to a first embodiment of the present invention. FIG. 4 is a diagram conceptually illustrating a configuration of a substrate cleaning apparatus according to a second embodiment of the present invention. FIG. 5 is a diagram conceptually illustrating a configuration of a substrate cleaning apparatus according to a third embodiment of the present invention. FIG. 8 is a diagram conceptually illustrating a configuration of a substrate cleaning apparatus according to a fourth embodiment of the present invention. FIG. 8 is a diagram conceptually illustrating a configuration of a substrate cleaning apparatus according to a fifth embodiment of the present invention.

Explanation of reference numerals

1 ... substrate cleaning apparatus 2 ... printed circuit board _{3 1,} 3 2 _... conveyor belt _{4 1,} 4 2 _... suction roller 5 ... adhesive roller _{6 1,} 6 2 _... electrostatic remover ₇ 1-7 3 _... belt holding rollers 8 ... substrate detection sensor 9 ... moving mechanism ₁₇ 1, 17 2 _... backup member ₁₈ 1, 18 2 _... meandering preventive guide ₁₉ 1, 19 2 _... conveyor belt support ₂₀ 1, 20 2 _... substrate lift preventing plate ₂₁ 1, 21 ₂ ... Supporting jigs 22 ₁ and 22 ₂ ... Bearing parts 23 ₁ and 23 ₂ ... Bearing part support bases 24 ₁ and 24 ₂ ... Height adjusting jig 25 ... Height position setting member 26 ... Engaging recess

Claims (16)

A board cleaning device for removing foreign matter attached to a surface of a printed wiring board to be conveyed,
Two conveyor belts for mounting an edge portion of the printed wiring board and conveying the board;
A suction roller that makes pressure contact while rotating on one surface of the printed wiring board being conveyed,
An adhesive roller that is pressed into contact with the suction roller and is rotated on a side opposite to the printed wiring board,
Means for moving the suction roller to a position away from a position in contact with the surface of the printed wiring board,
The substrate cleaning apparatus, wherein the suction roller sucks the foreign matter from a surface of the printed wiring board, and the foreign matter is transferred to the adhesive roller.   The substrate cleaning apparatus according to claim 1, further comprising an electrostatic removal device configured to remove a charge on a surface of the printed wiring board, at least on an upstream side of the suction roller in a transport direction of the printed wiring board.   The substrate cleaning device according to claim 1, wherein the suction roller is non-conductive.   The substrate cleaning device according to claim 1, wherein the suction roller is conductive.   Two or more suction rollers arranged in parallel and pressed in contact with the surface of the printed wiring board and rotating in the same direction; and pressure contact with the suction roller on the opposite side of the suction roller from the printed wiring board. The substrate cleaning apparatus according to claim 3, further comprising the adhesive roller to be used. A height adjusting jig according to the suction roller is provided,
The height adjustment jig is inserted between a bearing portion of the suction roller and a support base of the bearing portion, and the thickness of the printed wiring board to be transported at a distance between the suction roller and the transport belt. Set to a predetermined height corresponding to
When the printed wiring boards having different thicknesses are conveyed, the printed wiring boards are exchanged for the height adjusting jig which can be set to a predetermined height corresponding to the thickness, and the interval is adjusted. The substrate cleaning device according to claim 3.   The conveyance belt in the vicinity where the suction roller comes into pressure contact with the surface of the printed wiring board, wherein when the printed wiring board is conveyed, the conveyance roller bends due to the pressure contact of the suction roller to the printed wiring board. The substrate cleaning device according to any one of claims 3 to 5, wherein The transport belt is held by a plurality of belt holding rollers,
The belt holding roller is disposed upstream and downstream with respect to the suction roller,
The substrate cleaning apparatus according to claim 7, wherein the transport belt bends between the belt holding roller on the upstream side and the belt holding roller on the downstream side by pressure contact of the suction roller with the printed wiring board.   Above the conveyor belt on the upstream side of the suction roller, a lifting prevention plate is provided to prevent the rear part of the printed circuit board from being lifted when the printed circuit board is sandwiched between the suction roller and the conveyor belt. The substrate cleaning apparatus according to claim 8, wherein:   When the suction rollers arranged in parallel are in pressure contact with the printed wiring board, a holding jig for holding the conveyance belt at the center between the suction rollers is disposed on the opposite side of the conveyance belt from the suction roller. The substrate cleaning device according to claim 8, wherein the substrate is cleaned.   When the suction roller comes into pressure contact with the surface of the printed wiring board, a support for supporting the printed wiring board is disposed on a side of the printed wiring board opposite to the suction roller. Item 8. A substrate cleaning apparatus according to item 7.   The substrate cleaning apparatus according to claim 11, wherein the support is a disc-shaped elastic body that rotates in accordance with the conveyance of the printed wiring board.   13. The substrate cleaning apparatus according to claim 12, wherein the support is formed of a brush which has been subjected to an antistatic treatment.   14. The substrate cleaning apparatus according to claim 12, wherein the support moves up and down in accordance with a height of a component mounted on the printed wiring board by a spring mechanism.   The substrate cleaning apparatus according to any one of claims 12 to 14, wherein the position of the support is adjusted in a direction orthogonal to a direction in which the printed wiring board is transported.   The height adjusting jig is placed on a height position setting member of the suction roller provided on the support when inserted between the bearing of the suction roller and the support of the bearing. The substrate cleaning apparatus according to claim 6, wherein the cleaning is performed.

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