CN1576006A - 流体喷射结构 - Google Patents
流体喷射结构 Download PDFInfo
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- CN1576006A CN1576006A CNA2004100342749A CN200410034274A CN1576006A CN 1576006 A CN1576006 A CN 1576006A CN A2004100342749 A CNA2004100342749 A CN A2004100342749A CN 200410034274 A CN200410034274 A CN 200410034274A CN 1576006 A CN1576006 A CN 1576006A
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Abstract
本发明公开一种流体喷射结构,其位于一基板上,以缩小芯片尺寸以及降低制造成本。该流体喷射结构在该基板上包含一歧管、一气泡产生器、一导线以及至少与该歧管相毗邻且流通的两列流体室。该导线位于该基板顶端的表面且部分位于该歧管上的两列流体室之间,以驱动该气泡产生器。
Description
技术领域
本发明提供一种流体喷射结构以及一种组装流体喷射结构的方法,尤指一种在两列气泡产生器之间,装置配有电源线的流体喷射结构,以及一种组装流体喷射结构的方法。
背景技术
以目前来说,流体喷射装置广泛地应用于喷墨打印机上。任何流体喷射装置的改进都会使喷墨打印机的品质提升以及降低价格。流体喷射装置也可应用于其它领域,如燃料注入系统、细胞分类、药物导入系统、平板印刷以及微喷射推进系统。
在市面的产品中,仅有一些可在制式外型中喷出个别的滴液。最成功的设计之一是运用热量压迫气泡而喷出滴液。此项设计因为易于制造以及成本低廉而广为使用。
在美国专利公告第5,774,148号的“Print head with field oxide as thermalbarrier in chip”详细说明了一种在流体喷射结构的中心进行流体输导的方法。为了要组装喷嘴构造,必须要进行喷砂(sand blasting)、激光钻孔或者化学蚀刻步骤,以在芯片中央产生孔洞,让墨水可以通过。
然而,因为芯片中被移除的区域会浪费掉,而造成生产效率降低的情况,因此此项方法需要较大的芯片尺寸。
发明内容
本发明的主要目的是提供一种加强排列集合的流体喷射结构,以缩小芯片尺寸以及降低制造成本。
在本发明的优选实施例中,流体喷射结构包含一基板、排列在基板中的歧管、至少两列排列在该歧管两侧且连接于该歧管的流体室、至少一个气泡产生器,以及置于基板顶端表面的导线。除此之外,部分的导线位于两列流体室之间,而导线用来驱动气泡产生器。
本发明的优点为本发明的流体喷射结构并不需要完全蚀刻芯片,所以能获得较多空间使得墨水可顺利地通过。在歧管之上的区域可用来作电路布局。这不仅可强化在歧管之上的布局结构的强度,也可缩小芯片尺寸。另外,缩小芯片尺寸同时,相同区域内喷射结构的数目也会增加,因此打印速度也可加快。
附图说明
图1是本发明的第一实施例的打印头结构的横剖面图;
图2是本发明的打印头结构的横剖面图;
图3是本发明的打印头结构的顶端;
图4是图3的打印头结构的局部放大图;
图5是本发明的打印头结构内的矩阵驱动电路的方块图;
图6至图8是组成本发明的打印头结构的方块图;
图9是本发明的第二实施例的打印头结构的横剖面图;
图10是本发明的第三实施例的打印头结构的横剖面图。
附图标记说明
10 打印头结构 100 打印头结构
11 歧管 12、12a 喷孔
13 金属层 14、14a 气泡产生器
14b、114a 气泡产生器 15 MOS晶体管
16、116 流体室 18、74 低温氧化层
19 电源线 20 接地端
22 金属线 23 多晶硅线
24 接触层 32 微处理器
34 电源驱动器 35 地址驱动器
60 硅基板 62 场氧化层
64 栅极 66 源极
68 漏极 72 低应力结构层
74、76 低温氧化层 200 打印头结构
112、212 喷孔 114a、214 气泡产生器
117a、217a 第一气泡 130、230 液滴
214a、214b 气泡产生器 216 流体室
217b 第二气泡
具体实施方式
请参阅图1,图1是本发明的第一实施例的打印头结构10的横剖面图。本发明的第一实施例的打印头结构10是具有活阀的流体喷射结构。如图1所示,气泡产生器14包含两个气泡产生装置,即第一加热器14a以及第二加热器14b,该两个加热器与喷孔12相毗邻。因为两加热器14a以及14b之间电阻值的不同,所以当两加热器14a、14b加热流体室16内的流体时(图未示),会轮流产生两个气泡。第一加热器14a会产生第一气泡(图未示),而且第一加热器14a的位置相较于第二加热器14b更接近于歧管11。第一气泡会将歧管11与喷孔12互相隔离,该第一气泡可视作一活阀以降低流体室16以及邻近的流体室16间的交互干扰效应(cross talk effect)。第二加热器14b则用来产生第二气泡(图未示)。第二气泡会挤压流体室16内的流体(例如墨水),让流体喷出喷孔12之外。最后第二气泡与第一气泡会相结合,以降低附随滴液的产生。此外,打印头最好能包含足够的流体室,使得打印头在每次扫描过媒介的时候,每一英时之中能打印大约或者超过300喷墨点。
本发明的流体喷射结构能让墨水在不用完全蚀刻芯片的情况下就可以顺利通过。以此构造为基础,电源线可排列歧管11之上以便于强化在歧管11之上的构造层强度。
请参阅图2,图2是本发明的流体喷射结构的横剖面图。一低温氧化层18沉淀在第一加热器14a以及第二加热器14b之上,用来作为保护层。在此之后,一通过层会在预设区域中形成,且一金属层13会经由通过层(via layer)沉淀在加热器14a以及14b顶端表面上。因此金属层13会与加热器14a、14b作电连接。
同样地,MOS晶体管15的漏极68以及源极66会通过金属层13与加热器14a、14b以及接地端20作电连接。因此,当MOS晶体管15的栅极开启时,一外部电压信号会从金属层13所构成的接触点(pad)送到打印头。此时,一电流会从接触点经金属层13传送到第一加热器14a以及第二加热器14b。然后,电流会经过MOS晶体管15的漏极68以及源极66,流到接地端20以便于完成此加热过程。当加热流体室16内的墨水时,会产生两个气泡,将墨水滴液挤出喷孔12之外。在打印过程中,会依据要打印的数据来控制哪个喷孔12喷出墨水滴液。金属层13的材质可以是铝、金、铜、钨、铝硅铜合金或者铝铜合金。
请参阅图3、图4以及图5,图3是本发明的流体喷射结构的顶端。在优选实施例中,打印头的喷孔12分隔成十六个P群,即P1到P16,而每个P群包含二十二个地址,即A1到A22。如图5所示,一逻辑电路或微处理器32依据要打印的数据产生一选取信号。之后选取信号会传送到电源驱动器34以及地址驱动器35以决定要开启A1-A22其中的一个地址,并提供电源予P1-P16其中之一。举例来说,当控制开启A22以及提供电源到P1群时,P1-A22对应的MOS晶体管15上的加热器14a以及14b会在预设时间完成加热操作以及喷出墨水。
图4是图3区域B的局部详述图。如图4所示,两列喷孔12、12a位于芯片的中央。如图3所示以线A-A’将该通道分隔成两部分,会有八群即P1到P8在右侧,另外八群即P9到P16在左侧。在两列喷孔12、12a之间的歧管11之上的区域会被用作电源线排列。八个对应于P1到P8的金属电源线排列在线A-A’右侧并且电连接于右侧I/O接触点。八个对应于P9到P16(未显示)的金属电源线排列在线A-A’左侧并且电连接于左侧I/O接触点。
在每个对应P接触点以及G接触点间的驱动电路呈U型电路排列布局。在接触点P1以及接触点G1之间的驱动电路在图4中以虚线方块表示。每一个驱动电路之间并没有交互连接。另外,仅有金属层13会被用来组成加热器14a以及14b之间的电源线19以及接地接触点G。在一MOS晶体管15的群组上面有十一个金属线22,而且十一个金属线22在图4中排列于该MOS晶体管群组的下面。金属线22电连接于接触点A以便于发送地址驱动器35到对应MOS晶体管15的群组,以控制墨水的喷射。在MOS晶体管15群组左侧有十一个多晶硅线23,MOS晶体管15右侧也有十一个多晶硅线。之后接触层24的形成可使得金属线22以及多晶硅线23电连接,以完成驱动电路的连接。多晶硅线23会用来与MOS晶体管群组上面以及下面的金属线22连接(即图4所示的金属线22上半部以及下半部)。举例来说,假如一信号要从接触点A1输入以开启P16的加热器,该信号必须从多晶硅线23穿过金属线22传送到P16的加热器。
在上述所举的例子中使用了二十二个A接触点、十六个P接触点以及八个G接触点。A接触点与P接触点次数相乘可得出流体室16的总数量,这可用打印头控制。因为每个流体室有两个气泡产生器14,所以可能气泡产生器的总数为22×16×2=704。对于总数为46个I/O接触点(22+16+8=46)来说,因为704/12=58.67而且48<58.67,所以I/O接触点总数会少于气泡产生器总数的十二分之一。
请参阅图6到图8,图6至图8是组成本发明的流体喷射的方块图。首先,执行局部氧化步骤,在硅基板60上形成大片场氧化层62。然后,执行全面硼掺杂步骤,以调整驱动电路的临界电压。一多硅栅极64会在大片场氧化层62中形成。同时,沿着芯片的两边会形成二十二个多晶硅线23。之后执行砷掺杂步骤,在栅极64两侧形成源极66以及漏极68。之后,如图6所示,一低应力结构层72(如氮硅化合物)会形成流体室16的上层。
请参阅图7,一蚀刻溶液(KOH)会用来蚀刻基板60的后侧,以形成歧管11来供应流体。之后利用一蚀刻溶液(HF)来局部侵蚀大片场氧化层62而形成流体室16。接下来,执行使用KOH来进行蚀刻步骤以增加流体室16的深度。流体室16以及歧管11会相互连接并注满流体,然而,此蚀刻步骤需要特别小心,因为流体室16内的凸面角落也会被侵蚀。
接下来,执行组合加热器步骤。此步骤为现有技术所没有的。在优选实施例之中,利用钽与铝合金作为第一加热器14a以及第二加热器14b材质是优选的选择,其它材质如铂或者HfB也是不错的选择。一低温氧化层74沉积会在整个基板60上。低温氧化层74除了保护第一加热器14a、第二加热器14b以及隔离MOS晶体管15之外,也可作为覆盖栅极64、源极66、漏极68以及大片场氧化层62的保护层。
接下来,在第一加热器14a以及第二加热器14b上形成传导层13,以用来与第一加热器14a、第二加热器14b以及驱动电路的MOS晶体管15作电连接。因为驱动电路会传送一信号到各别加热器以及驱动多个成对的加热器,所以仅需要少数电路装置以及连接电路。铝硅铜合金、铝、铜、金或者钨可作为传导层13优选的材质。低温氧化层76则沉积作为传导层13上的保护层。
请参阅图8,第一加热器14a以及第二加热器14b之间会形成喷孔12。到目前为止,已详细说明了驱动电路与流体注入阵列(array)组合成一体的过程。驱动电路以及加热器皆已形成于同一个基板上,而且本实施例的喷射结构亦不需要另外的喷嘴板(nozzle plate)。
以下将详述本发明的操作过程。请参阅图4以及图5。当开始打印时,逻辑电路以及微处理器32会依据欲打印的数据决定哪个喷孔12喷出墨水并且产生一选取信号。该选取信号会传送到电源驱动器34以及地址驱动器35以开启适当的A群(A1到A22)以及将电源导入适当的P群(P1到P16)。因此会产生一电流并传送到加热器14a以及14b,以加热流体并产生气泡,而喷出滴液。举例来说,假定要将一滴液从A1-P1的喷孔12喷出,首先从A1的I/O接触点输入电压信号并且传送到MOS晶体管15的栅极64以开启栅极64。接下来,从A1的I/O接触点输入另一个电压信号以产生一电流。该电流透过加热器14a以及14b通过漏极68、源极66以及接地端20以便于加热流体以及产生气泡,而气泡会将墨水滴液从A1-P1的喷孔12a喷出。
请参阅图9,图9是本发明的第二实施例的打印头结构100的横剖面构造图。不同于图1所示的第一实施例的打印头结构10,第二实施例的打印头结构100包含一个气泡产生器114以及一个与通道112相毗邻的第一加热器114a。当第一加热器114a加热流体时,会形成第一气泡117a并将已喷出流体液滴130挤压出通道112。第一加热器114a与通道112相毗邻,并位于对应流体室116的外上方。
请参阅图10,图10是本发明的第三实施例的打印头结构200的横剖面构造图。如图1所示的第一实施例的打印头结构10,第三实施例的打印头构造200包含两个气泡产生器214、一第一加热器214a以及一第二加热器214b,而第一加热器214a以及第二加热器214b与通道212相毗邻。然而,第三实施例的打印头结构200中的第一加热器214a以及第二加热器214b有相同的电阻值。在优选的情况中,第一加热器214a以及第二加热器214b的面积会相同,但是只要第一加热器214a以及第二加热器214b的电阻大致相同的情况下,则长度-面积以及电阻系数都可以适度地作调整。第一加热器214a以及第二加热器214b大体上在同一时间分别加热流体,以产生第一气泡217a以及第二气泡217b。因为电阻值大约相同的缘故,所以第一加热器214a所产生的气泡217a与第二加热器214b所产生的气泡217b的体积相同。气泡217a以及217b会从通道212挤压已喷出流体液滴230。因为气泡217a以及217b的体积相同而且大体上在同一时间产生,所以被喷出流体液滴230大约会从对应流体室216垂直喷出。
尽管上述仅说明单色打印机,但是本发明可应用在彩色打印机或多色打印机。除此之外,本发明也可应用于领域,如燃料注入系统、细胞分类、药物导入系统、平板印刷以及微喷射推进系统以及其它类似的装置等。
依据本发明的设计,歧管上以及两列流体室间的空间可用于导线的排列。因为制造打印头时不需要蚀刻整个芯片,所以可在歧管之上做电路布局,因而可缩小芯片尺寸以及增加每片晶片可切割出的芯片数。而且位于歧管上方的结构层之上的电路排列的配置可强固结构层。使用此种增加电路排列的密度的方法可使电路排列所需的面积减少,而且可在同一芯片上配置更多喷孔以增加打印速度。
以上所述仅为本发明的优选实施例,凡依本发明权利要求所做的均等变化与修饰,皆应属本发明专利的涵盖范围。
Claims (17)
1.一种流体喷射结构,其包括:
一基板;
一歧管,形成于该基板中;
至少两列流体室,与该歧管相流通,并位于该歧管的两侧,其中流体可经过该歧管流入该流体室中;
多个喷孔,与对应的该流体室相流通;
多个气泡产生器,位于该基板上,其中在一流体室中仅设有单一该气泡产生器,而且每一个气泡产生器约与一对应该喷孔相毗邻,并位于该对应喷孔之外;
一驱动电路,包含多个设置于该基板上的功能元件,用来传送驱动信号以驱动该多个气泡产生器;以及
一导线,位于该基板上,用来驱动该气泡产生器,其中该部分导线位于该歧管之上以及该两列流体室之间。
2.如权利要求1所述的流体喷射结构,其中每一个气泡产生器位于该对应流体室之上。
3.如权利要求1所述的流体喷射结构,其中该流体室内的单一气泡产生器位于该歧管以及该对应喷孔之间。
4.一种装置,用来喷出流体,其包括:
一流体室;
一歧管,与该流体室相流通,用来供应流体流至该流体室;
一喷孔,与该流体室相流通;
一第一气泡产生装置,当该流体室注满流体时,可在该流体室内产生一第一气泡,而该第一气泡产生装置约与该喷孔相毗邻并位于该流体室之外;
一第二气泡产生装置,当该流体室注满流体时,可在该流体室产生一第二气泡,而该第二气泡产生装置约与该喷孔相毗邻并位于该流体室之外,
其中该喷孔位于该第一气泡产生装置以及该第二气泡产生装置之间,且该第一气泡以及该第二气泡大约在同时间产生,而且该第一气泡以及该第二气泡的形成会造成该流体室内的流体穿过该喷孔而大致垂直的角度喷出该流体室之外。
5.如权利要求4所述的装置,其中该第一气泡产生装置以及该第二气泡产生装置分别为第一电阻器以及第二电阻器。
6.如权利要求5所述的装置,其中该第一电阻器以及该第二电阻器的电阻值大致相同。
7.如权利要求5所述的装置,其中该第一电阻器以及该第二电阻器位于该流体室之上。
8.一种打印头,用来喷出墨水,其包括:
一基板;
一歧管(manifold),形成于该基板中;
多个流体室(chamber),该流体室与该歧管相流通,其中墨水可穿过该歧管流至该流体室;
多个喷孔(orifice),与一对应的该流体室相流通;
一第一气泡产生装置及一第二气泡产生装置,当该对应的流体室内注满墨水时,可在该对应流体室中产生一第一气泡以及一第二气泡,而该第一气泡产生装置与该第二气泡产生装置约与一对应的该喷孔相毗邻且位于该对应流体室之外,其中该喷孔位于该第一气泡产生装置以及该第二气泡产生装置之间;以及
一地址电路装置(addressing circuit means),其包含多个接触点(pad)以及多路解调器(demultiplexing means),该地址电路装置位于该基板上,而且与该第一气泡产生装置、该第二气泡产生装置以及该接触点间相连结,其中该接触点的数量少于该流体室的数量。
9.如权利要求8所述的打印头,其中该第一气泡以及该第二气泡大约在同时间产生,而且该第一气泡以及该第二气泡的形成会造成该流体室内的墨水穿过该喷孔而大约垂直喷出该流体室之外。
10.如权利要求9所述的打印头,其中该第一气泡产生装置以及该第二气泡产生装置分别为第一电阻器以及第二电阻器。
11.如权利要求10所述的打印头,其中该第一电阻器以及该第二电阻器的电阻值大致相同。
12.如权利要求10所述的打印头,其中该第一电阻器以及该第二电阻器位于该流体室之上。
13.一种打印系统,具有一打印头用来喷出墨水,其包括:
一墨水储存槽以供应墨水;
一打印头的基板;
一歧管,位于该基板中;
多个流体室,与该歧管相流通,其中墨水可穿过该歧管流至该流体室,该流体室彼此间互相隔离一预设距离,以便于在每次该打印头扫描过一打印媒介时,提供等于或者大于每英时300点的打印;
一第一气泡产生装置及一第二气泡产生装置,当一对应流体室充满墨水时,该第一气泡产生装置及该第二气泡产生装置分别会在对应的该流体室中产生一第一气泡以及一第二气泡,该第一气泡产生装置以及该第二气泡产生装置与一对应喷孔相毗邻,并位于该对应流体室之外,其中该喷孔位于该第一气泡产生装置以及该第二气泡产生装置之间;以及
一第一电路系统,其包含多个接触点以及多路解调器,该第一电路系统位于该基板上,并且与该第一气泡产生装置、该第二气泡产生装置以及该接触点间相连结,其中该接触点总数约少于或等于位于该基板上的第一产生装置以及第二气泡产生装置总数的十二分之一。
14.如权利要求13所述的打印系统,其中该第一气泡以及该第二气泡约于同时间产生,并且该第一气泡以及该第二气泡的形成会造成该流体室内的墨水穿过该喷孔而大约垂直喷出该流体室之外。
15.如权利要求14所述的打印系统,其中该第一气泡产生装置以及该第二气泡产生装置分别为第一电阻器以及第二电阻器。
16.如权利要求15所述的打印系统,其中该第一电阻器以及该第二电阻器的电阻值大致相同。
17.如权利要求15所述的打印系统,其中该第一电阻器以及该第二电阻器位于该流体室之上。
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CNB2004100342749A Expired - Fee Related CN1322980C (zh) | 2003-07-01 | 2004-04-05 | 流体喷射结构 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6938993B2 (zh) |
CN (1) | CN1322980C (zh) |
DE (1) | DE102004022497A1 (zh) |
TW (1) | TWI231270B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102941737A (zh) * | 2007-10-12 | 2013-02-27 | 录象射流技术公司 | 喷墨模组 |
CN105058985A (zh) * | 2010-10-01 | 2015-11-18 | 马姆杰特科技有限公司 | 通过可独立致动的腔顶桨状物控制墨滴方向性的喷墨喷嘴组件 |
CN106068186A (zh) * | 2014-06-30 | 2016-11-02 | 惠普发展公司,有限责任合伙企业 | 流体喷射结构 |
JP2019181846A (ja) * | 2018-04-12 | 2019-10-24 | キヤノン株式会社 | 液体吐出ヘッド基板、液体吐出ヘッド、液体吐出装置、および、液体吐出ヘッド基板の製造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US6207392B1 (en) | 1997-11-25 | 2001-03-27 | The Regents Of The University Of California | Semiconductor nanocrystal probes for biological applications and process for making and using such probes |
US7922276B2 (en) * | 2004-04-08 | 2011-04-12 | International United Technology Co., Ltd. | Ink jet printhead module and ink jet printer |
TWI232801B (en) * | 2004-04-08 | 2005-05-21 | Int United Technology Co Ltd | Printhead controller and ink jen printer |
US7964474B2 (en) * | 2008-12-31 | 2011-06-21 | Stmicroelectronics, Inc. | Use of field oxidation to simplify chamber fabrication in microfluidic devices |
EP2621728B1 (en) * | 2010-10-01 | 2019-02-13 | Memjet Technology Limited | Inkjet printhead having common conductive track on nozzle plate |
AU2014262188B2 (en) * | 2010-10-01 | 2016-01-07 | Memjet Technology Limited | Inkjet nozzle assembly with drop directionality control via independently actuable roof paddles |
PL3717254T3 (pl) * | 2019-02-06 | 2024-03-18 | Hewlett-Packard Development Company, L.P. | Układ scalony ze sterownikami adresowymi do płynowej struktury półprzewodnikowej |
PL3892471T3 (pl) | 2019-02-06 | 2024-02-26 | Hewlett-Packard Development Company, L.P. | Komponent drukujący z układem pamięciowym wykorzystujący przerywany sygnał zegarowy |
MX2021008997A (es) | 2019-02-06 | 2021-08-18 | Hewlett Packard Development Co | Paquetes de datos que comprende numeros aleatorios para controlar dispositivos dispensadores de fluido. |
CN113412466B (zh) | 2019-02-06 | 2024-05-07 | 惠普发展公司,有限责任合伙企业 | 流体喷射控制器接口、流体喷射控制方法和流体喷射装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US107616A (en) * | 1870-09-20 | Improvement in door-springs | ||
JPS55132259A (en) | 1979-04-02 | 1980-10-14 | Canon Inc | Liquid jet recording method |
JPS62240558A (ja) | 1986-04-14 | 1987-10-21 | Canon Inc | 液体噴射記録ヘツド |
US5122812A (en) | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
US5774148A (en) * | 1995-10-19 | 1998-06-30 | Lexmark International, Inc. | Printhead with field oxide as thermal barrier in chip |
US5824204A (en) * | 1996-06-27 | 1998-10-20 | Ic Sensors, Inc. | Micromachined capillary electrophoresis device |
US6039438A (en) * | 1997-10-21 | 2000-03-21 | Hewlett-Packard Company | Limiting propagation of thin film failures in an inkjet printhead |
US6273553B1 (en) * | 1998-01-23 | 2001-08-14 | Chang-Jin Kim | Apparatus for using bubbles as virtual valve in microinjector to eject fluid |
DE69911742T2 (de) * | 1998-01-23 | 2004-08-05 | Benq Corp., Kweishan | Vorrichtung und verfahren zur anwendung von blasen al virtuelles ventil in einem mikroeinspritzgerät zum ausstossen von flüssigkeit |
TWI232807B (en) * | 2001-01-19 | 2005-05-21 | Benq Corp | Microinject head with driving circuitry and the manufacturing method thereof |
TW552201B (en) | 2001-11-08 | 2003-09-11 | Benq Corp | Fluid injection head structure and method thereof |
-
2003
- 2003-07-01 US US10/604,223 patent/US6938993B2/en not_active Expired - Lifetime
-
2004
- 2004-04-05 CN CNB2004100342749A patent/CN1322980C/zh not_active Expired - Fee Related
- 2004-04-06 TW TW093109491A patent/TWI231270B/zh not_active IP Right Cessation
- 2004-05-07 DE DE102004022497A patent/DE102004022497A1/de not_active Ceased
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102941737A (zh) * | 2007-10-12 | 2013-02-27 | 录象射流技术公司 | 喷墨模组 |
CN102941737B (zh) * | 2007-10-12 | 2014-12-10 | 录象射流技术公司 | 喷墨模组 |
CN105058985A (zh) * | 2010-10-01 | 2015-11-18 | 马姆杰特科技有限公司 | 通过可独立致动的腔顶桨状物控制墨滴方向性的喷墨喷嘴组件 |
CN106068186A (zh) * | 2014-06-30 | 2016-11-02 | 惠普发展公司,有限责任合伙企业 | 流体喷射结构 |
US9815282B2 (en) | 2014-06-30 | 2017-11-14 | Hewlett-Packard Development Company, L.P. | Fluid ejection structure |
JP2019181846A (ja) * | 2018-04-12 | 2019-10-24 | キヤノン株式会社 | 液体吐出ヘッド基板、液体吐出ヘッド、液体吐出装置、および、液体吐出ヘッド基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US6938993B2 (en) | 2005-09-06 |
DE102004022497A1 (de) | 2005-01-27 |
CN1322980C (zh) | 2007-06-27 |
TWI231270B (en) | 2005-04-21 |
TW200502100A (en) | 2005-01-16 |
US20040104973A1 (en) | 2004-06-03 |
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