CN1551327A - Base board holding appliance,base board processing device, base board checking device and use method - Google Patents
Base board holding appliance,base board processing device, base board checking device and use method Download PDFInfo
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- CN1551327A CN1551327A CNA2004100382055A CN200410038205A CN1551327A CN 1551327 A CN1551327 A CN 1551327A CN A2004100382055 A CNA2004100382055 A CN A2004100382055A CN 200410038205 A CN200410038205 A CN 200410038205A CN 1551327 A CN1551327 A CN 1551327A
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- substrate
- described substrate
- butt
- fluid layer
- platen surface
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B9/00—Undergarments
- A41B9/001—Underpants or briefs
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B2400/00—Functions or special features of shirts, underwear, baby linen or handkerchiefs not provided for in other groups of this subclass
- A41B2400/38—Shaping the contour of the body or adjusting the figure
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B2400/00—Functions or special features of shirts, underwear, baby linen or handkerchiefs not provided for in other groups of this subclass
- A41B2400/44—Donning facilities
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B2400/00—Functions or special features of shirts, underwear, baby linen or handkerchiefs not provided for in other groups of this subclass
- A41B2400/60—Moisture handling or wicking function
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B2500/00—Materials for shirts, underwear, baby linen or handkerchiefs not provided for in other groups of this subclass
Abstract
A substrate holder, a substrate processing apparatus and a substrate inspection device capable of holding the substrate in a state of keeping the flatness possessed by the substrate itself, and performing measurement, process, and inspection with high precision, as well as the method of using the same, are provided. A substrate holder which holds the substrate above the face of a plate, comprises fluid layer forming means 11b, 11d between substrate S and the face of the plate 11a for forming the fluid layer for floating substrate S and positioning means 13 holding substrate S stably by the fluid layer and abutting at least the under surface or the lateral surface of substrate S floated by the fluid layer for positioning the substrate at a predetermined position at the face of the plate 11a.
Description
Technical field
The present invention relates to the substrate that substrate stably remains on the platen surface is kept apparatus, substrate board treatment, base board checking device and their using method.
Background technology
For example in field of semiconductor manufacture, generally keep under the state on the apparatus substrate being remained on substrate, to substrate measure, handle, inspection etc.
And, in this field of semiconductor manufacture, the figure that forms on the surface to for example substrate of photomask, graticle (レ チ Network Le) etc. is critically measured, is handled, during inspection etc., it is smooth and do not have crooked requiring to be kept substrate that apparatus kept by described substrate.
But, keep in the apparatus in the method for marginal portion that utilizes supporting substrate or lateral parts or with the surface of supported at three point substrate, the substrate in the past that the method at the back side realizes, it is crooked to exist substrate to produce because of deadweight waits, and the problem that is difficult to carry out micrometric measurement.
Therefore, proposed in the past various can be by suppressing substrate this bending or bending proofreaied and correct the technical scheme of measuring as far as possible accurately etc. (for example, with reference to patent documentation 1,2).
In the technical scheme that patent documentation 1 is put down in writing, have the frame shape XY objective table that is used to place substrate, to being placed on the substrate on this XY objective table, utilize the detection system that constitutes by the optical detection system to detect the figure that forms on the substrate surface.In this case, because when being placed on substrate on the frame shape XY objective table, the middle body of substrate is absorbed in the middle body of XY objective table and forms bending, so described detection system is configured in the below of XY objective table, the picture surface that makes graticle is towards the below, graticle be placed on exposure device on state when identical, measure the figure coordinate of graticle, eliminate crooked influence.
In the technical scheme that patent documentation 2 is put down in writing, in order to eliminate particularly the influence of the curved substrate that causes because of the temperature distributing disproportionation in the substrate to measurement result, temperature to substrate is measured, thermal coefficient of expansion according to this measurement result and substrate is proofreaied and correct, and eliminates the influence that is caused because of described temperature inequality.
But the technical scheme that these patent documentations are put down in writing is a precondition with the curved substrate all, so have the problem that precision that restriction measures etc. improves.
Therefore, not crooked in order to make substrate, also considered on flat board, to place substrate with high rigidity and high-precision tabular surface, and utilize vacuum cup etc. substrate by the method for measuring on the described tabular surface that is pressed in this flat board etc.
But, according to this method, because the flatness of substrate is closely related with the flatness of the tabular surface of the described flat board of placing substrate, so when the tabular surface of plate bending or flat board has slight curves, these all are reflected in the flatness of substrate, have the problem that is difficult to carry out micrometric measurement etc.
In addition, when utilizing vacuum cup to be adsorbed on substrate on the flat board,,, produce crookedly on the substrate, have the problem that is difficult to carry out micrometric measurement etc. then in this part if produce particulate or airtrapping between dull and stereotyped tabular surface and the substrate.
If produce this problem, also produce the problem of the reproducibility that can not obtain to measure.That is, be placed on the substrate on the flat board owing to be not the shape that had originally of substrate self but produced distortion, so can produce following problem.
For example, when same substrate repeatedly being carried out the measuring shape of flatness etc. of substrate, because substrate deformation degree difference when being placed on dull and stereotyped going up at every turn, thus can not realize measuring reproducibility, and cause measuring precision and reduce.
In addition, as photomask etc., when having figure etc. on substrate, if the substrate that is placed on the flat board deforms, then distortion also correspondingly appears in dimension of picture and graphics shape.As a result, linear measure longimetry precision and the coordinate measuring precision of figure etc. have been reduced.
And except above-mentioned base plate deformation, reproducibility in the inspection/mensuration of substrate and precision are also owing to moving of substrate reduced.
And, in recent years, substrate with photomask of liquid crystal glass base and liquid-crystal apparatus manufacturing usefulness etc. is representative, substrate size occurring (for example maximizes, on one side more than or equal to the square substrate of 300mm) trend, correspondingly the deformation extent (amount of bow etc.) that causes because of the deadweight of substrate self becomes big, and because the surface area of substrate becomes big, causes the problems referred to above more remarkable.
Summary of the invention
The present invention proposes in order to address the above problem, its objective is provides a kind of substrate to keep apparatus, substrate board treatment, base board checking device and their using method, can keep substrate (particularly large substrate), it can and can not moved under positioning states from the original shape generation distortion of substrate self (bending), can improve reproducibility and precision, can measure accurately, handle, inspection etc.
In order to achieve the above object, substrate of the present invention keeps apparatus that substrate is stably remained on assigned position on the platen surface, its structure is, has: fluid layer forms the unit, and it forms the fluid layer that being used between described substrate and described platen surface makes described substrate float from the one side side; And positioning unit, it stably keeps described substrate by described fluid layer, and the described substrate that floats by described fluid layer of butt (when connecing the The Ru) at least below or the side, with the assigned position of described substrate orientation on described platen surface.
According to this structure, fluid layer utilizes identical power to make substrate floating and becomes and the discontiguous state of platen surface, so can eliminate the curved substrate that causes because of deadweight.In addition owing to have a positioning unit, can restricting substrate move.And, by from platen surface side butt substrate, the assigned position on the substrate that positioning unit is positioned to float by fluid layer, the influence that causes so can make positioning unit butt substrate is for minimum.
In addition, though also can be liquid,, has the advantage that operation does not in the back need to remove the operation of fluid by utilizing gases such as air or nitrogen as the fluid that forms described fluid layer.In addition, as substrate for example also can be the glass substrate of photomask blank or photomask or their uses.As the material of glass substrate, for example can list the quartz of synthetic quartz or doped with fluorine etc.
Above-mentioned positioning unit can adopt as lower unit: by the elastomer on the platen surface as described in being located at be installed in that the butt parts of substrate constitute as described in the butt on this elastomer, by limit moving of described substrate below the described substrate of described butt parts butt float state.
According to this structure, can remain the butt state of substrate and positioning unit.That is, when substrate floated by fluid layer, correspondingly by elastomeric bounce (playing development power), the butt parts rose with the state of butt substrate.The height and position and the elastomeric bounce of floating by fluid layer by suitable adjustment substrate can be to measuring in the scope that waits the minimum that exerts an influence, and carry out the location of substrate and fixing.
As described positioning unit, also can adopt as lower unit: the butt parts that moved freely by the advance and retreat of substrate side surfaces as described in the peripheral direction butt of substrate as described in float state constitute, and limit moving of described substrate by a plurality of positions around the described substrate that makes described butt parts butt float state.
According to this structure, can come moving of restricting substrate by the substrate side surfaces of the butt parts butt float state of positioning unit, position and fix.The butt parts are as long as come butt substrate gently with the degree that can restricting substrate moves, so can substantially eliminate the bending of the substrate that is caused by positioning unit.
In addition, the advance and retreat of butt parts both moved and can be undertaken by driving bodies such as motor and actuators, also can be by manually realizing.
The substrate of said structure keeps apparatus can be applied to all must keep substrate under the state of keeping flatness accurately device.
For example, can keep the substrate of said structure appliance application in the substrate board treatment with illumination unit, this illumination unit be to processing light such as the surface irradiation electron beam of the described substrate that is kept apparatus to locate and keep by substrate or laser beams.
As this substrate board treatment, for example, can list use coated for example the photomask blank etc. of photoresist substrate and form the describing device or the exposure device of figure to its illuminating laser beam.
In the operation that forms figure, the precision of the figure of formation depends on the hold mode of the substrate that is used to form figure widely.For example, in the operation that forms figure, deform if be used to form the substrate (for example photomask blank, semiconductor substrate) of figure, then the figure of Xing Chenging also forms according to the substrate deformation degree.
And, being moved in the operation that forms figure if be used to form the substrate of figure, the positional precision that then forms figure reduces.Particularly when making photomask, the operation of using describing device or exposure device to form figure is most important operation, and quality that we can say photomask is basically by this operation decision.Equally, the graph transfer printing with photomask is very important operation in the semiconductor manufacturing in the operation on the semiconductor substrate.
Therefore, can keeping substrate and make its not crooked (indeformable) and do not move the substrate maintenance apparatus of the present invention of (location), being applied to illuminating laser beam, to form the describing device of figure or exposure device etc. effective especially.
As other substrate board treatment, can list the annealing in process device, on semiconductor substrate, carry out the CVD processing unit of selectivity film forming, wherein the annealing in process device uses laser beam, utilizes the activate of the irradiation damage that injects ion, implanted dopant and by making polysilicon crystallization SOI (the Silicon on Insulator) technology etc. of making single crystal silicon again.
In addition, the substrate of said structure keeps apparatus also can be applied to have the base board checking device of illumination unit and optical detecting unit, this illumination unit is checked light to the surface irradiation of the described substrate that is kept apparatus to locate and keep by described substrate, and this optical detecting unit detects the light based on the described substrate surface of described inspection light.
As this base board checking device, the coordinate measuring apparatus that for example can list the testing fixture of the flatness of measuring substrate, the figure that is formed on the substrate surface is measured.
Use substrate of the present invention to keep apparatus, when mensuration is retained not crooked (indeformable) and do not move the flatness of substrate of (location), can measure the flatness that substrate self has, can carry out reproducibility, the good flatness mensuration of precision.
In addition, when carrying out the coordinate measuring of the figure on such substrate such as photomask, by the state that substrate is held in not crooked (indeformable) and under positioning states, does not move, can be under the state of original dimension of picture and graphics shape, be linear measure longimetry and the coordinate measuring that carries out figure under the indeformable state, therefore can carry out reproducibility, the good flatness mensuration of precision.
Purpose of the present invention also can realize by claim 7 or 8 described substrate keeping methods.
That is, substrate keeping method of the present invention is used for substrate is stably remained on assigned position on the platen surface, and it has: fluid layer forms operation: form fluid layer between described substrate and described platen surface, described substrate is floated from the one side side; And positioning process: make the following or side of the described substrate that butt parts butt floats by described fluid layer, with the plane of described platen surface almost parallel in position.
Substrate keeping method of the present invention can be applied to all methods that must keep substrate under the state of keeping flatness accurately, for example, can be applied to be provided with to the surface irradiation electron beam of the described substrate that uses described substrate keeping method to locate and keep or laser beam etc. and handle the substrate processing method using same of the irradiation process of light, or be provided with substrate inspecting method to the inspection rayed operation of the surface irradiation inspection light of the described substrate that uses described substrate keeping method to locate and keep.
Description of drawings
Fig. 1 is the perspective cutaway view, that the substrate that relates to of explanation the 1st execution mode of the present invention keeps the structure of apparatus.
Fig. 2 is the profile that is illustrated in the substrate maintenance apparatus of the state that has formed fluid layer between platen surface and the substrate.
Fig. 3 is the structure of the positioning unit in explanation the 1st execution mode and the enlarged drawing of effect.
Fig. 4 is the plane graph of the collocation form of explanation positioning unit.
Fig. 5 is the key diagram that the substrate that utilized the 2nd execution mode of the present invention of other positioning units to relate to keeps apparatus, is its plane graph.
Fig. 6 is the key diagram that substrate that explanation has utilized the 2nd execution mode of the present invention of other positioning units to relate to keeps apparatus, is the profile that the explanation substrate keeps step.
Fig. 7 is the skeleton diagram of an example of expression base board checking device.
Symbol description
1,2: substrate keeps apparatus; 11,21: objective table; 11a, 21a: platen surface; 11b, 21b: air blows out the hole; 11c: recess; 11d, 21d: air chamber; 12,22: guide frame; 13,23: positioning unit; 14: the butt parts; 15: leaf spring (elastomer); 24: driving body; 25: the butt parts.
Embodiment
Below, with reference to accompanying drawing, describe preferred forms of the present invention in detail.
In addition; in the following description; as substrate; be to describe as example with the glass substrate that photomask or graticle etc. uses; but the invention is not restricted to this glass substrate, also can be applied to have the Cr film, the substrate of all kinds such as glass substrate of transmitance controlling diaphragm, ITO film etc. such as MoSi film, resin substrate, metal substrate.And the material as the glass substrate of following explanation for example can list the quartz of synthetic quartz or doped with fluorine etc.
[substrate keeps the explanation of apparatus]
Fig. 1 is the perspective cutaway view, that the substrate that relates to of explanation the 1st execution mode of the present invention keeps the structure of apparatus, and Fig. 2 is the profile that the substrate that is illustrated in the state that has formed fluid layer between platen surface and the substrate keeps apparatus.
The substrate of the 1st execution mode keeps apparatus 1 to have objective table 11 and guide frame 12: this objective table 11 has flat condition surface (hereinafter referred to as platen surface) 11a in horizontal plane; This guide frame 12 is formed and is placed on the glass substrate S similar shapes on the platen surface 11a of this objective table, and is located on the objective table 11 round glass substrate S.
Be formed for the air chamber 11d of storing compressed air in the inside of objective table 11.Air chamber 11d is connecting not shown air feed units such as air blast, and the air of supplying with from this air feed unit keeps certain pressure.In addition, form a large amount of air that penetrates into air chamber 11d and blow out hole 11b on platen surface 11a, the air in the air chamber 11d blows out hole 11b from each air and is blown with the flow velocity that essence equates.In addition, in the substrate maintenance apparatus 1 of Fig. 1, to illustrate 6 row, 4 row air in order illustrating convenient and to blow out hole 11b, be not limited thereto but air blows out collocation form and the number of hole 11b.
In this embodiment, blowing out hole 11b by described air feed unit and air chamber 11d and air is formed in the fluid layer that forms fluid layer and glass substrate S is floated between glass substrate S and the platen surface 11a and forms the unit.
As shown in Figure 2, if under the state of having placed glass substrate S on the platen surface 11a, drive the air feed unit, air supply in air chamber 11d, then the air in the air chamber 11d blows out hole 11b from air and blows out below glass substrate S.The air that blows out below glass substrate S flows to the edge of glass substrate S, and the interstitial row between the edge of guide frame 12 and glass substrate S is put into the atmosphere.Thus, between glass substrate S and platen surface 11a, form fluid layer (air layer).
When glass substrate S floats height and position to regulation, form the pressure of air of fluid layer and the deadweight of glass substrate S and balance each other, glass substrate S is maintained at this height and position.
Form recess 11c at a plurality of positions of platen surface 11a (being three places in the present embodiment).Be used for the positioning unit 13 that the glass substrate S to float state positions and be located at this recess 11c (with reference to Fig. 1).
Below, the structure and the effect of the positioning unit 13 in the present embodiment are described with reference to Fig. 3.
Fig. 3 is the structure of the positioning unit in this execution mode of explanation and the part amplification profile of effect.
Fig. 3 (a) expression offers substrate with glass substrate S and keeps apparatus 1 state before.Shown in Fig. 3 (a), positioning unit 13 is made of the leaf spring 15 and the butt parts 14 of chevron, and the leaf spring 15 of this chevron is installed on the bottom of recess 11c with the state that a terminal part list supports; These butt parts 14 be installed in the top of this leaf spring 15 and butt glass substrate S below.The 14 preferred uses of butt parts can not damage the following of glass substrate S and and glass substrate S between the material of be difficult for to produce sliding form, for example, can use urethane resin, rubber to wait and form.In addition, can select the bounce material enough little of leaf spring 15 with respect to the deadweight of substrate S.Preferably,, suitably select the bounce of leaf spring 15 in that substrate S is produced in the minimum zone of distortion according to the levitation height position of the substrate S that passes through fluid layer.
State when Fig. 3 (b) expression offers substrate maintenance apparatus 1 with glass substrate S.Shown in Fig. 3 (b), do not blowing out under the state of hole 11b (seeing figures.1.and.2) blow out air from air, when on platen surface 11a, placing glass substrate S, resist the bounce of leaf spring 15 by the deadweight of glass substrate S butt parts 14 are returned to recess 11c side pressure, become the state that is stored among the recess 11c.
Fig. 3 (c) expression blows out hole 11b blow out air and state that glass substrate S is floated from air.
Shown in Fig. 3 (c), blow out hole 11b blow out air from air and when glass substrate S is floated, follow this to float, butt parts 14 rise under the state of butt glass substrate S.
At this moment,, and can limit moving of glass substrate S, so utilize the bounce of leaf spring 15 can avoid glass substrate S the crooked rough sledding of part to occur owing to the elasticity of leaf spring 15 can not pushed butt parts 14 excessively to glass substrate S.
In addition, under the situation of the positioning unit 13 that has used the such leaf spring 15 of this execution mode, the direction that moves that can suppress glass substrate S is limited in rectilinear direction.Promptly, shown in Fig. 3 (a), though butt parts 14 do not move to Y direction (direction vertical with the paper of Fig. 3), follow the distortion of leaf spring 15 and mobile a little, so utilize a positioning unit 13 to be difficult to carry out the location of X-direction and the Y direction of substrate S to X-axis.
Therefore, as shown in Figure 4, be configured to 3 positioning units (below, in Fig. 4, represent 3 positioning units with symbol 13A, 13B, 13C respectively) vertical with the moving direction of butt parts 14.That is, make the direction of the leaf spring 15 of 2 positioning unit 13A, 13B point to X-direction, make the direction of the leaf spring 15 of remaining positioning unit 13C point to Y direction.Like this, leaf spring 15 moves towards the Y direction of 2 positioning unit 13A, 13B of X-direction restriction glass substrates, and leaf spring 15 moves towards the X-direction of the positioning unit 13C of Y direction restriction glass substrate.Thus, can be positioned at glass substrate S in the X-Y plane.
And, coming the decompression adsorbing mechanism of fixing glass substrate S gently by on butt parts 14, being provided with the absorption affinity of the degree of destabilizing factors such as floating not make glass substrate S produce bending, can position more accurately.
In addition, positioning unit is not limited to said structure, and only otherwise make glass substrate S produce bending etc., and X-direction and the moving of Y direction that can limit the glass substrate S of float state position, and also can use other structures.And, in the above description, under the state that does not blow out hole 11b blow out air, glass substrate S is placed on the platen surface 11a from air, blow out hole 11b blow out air and glass substrate S is floated from air then, but also can glass substrate S be provided on the platen surface 11a blowing out from air under the state of hole 11b blow out air.
Fig. 5 and Fig. 6 are the key diagrams that the substrate that utilizes the 2nd execution mode of the present invention of the positioning unit of other structures to relate to keeps apparatus, and Fig. 5 is its plane graph, and Fig. 6 is the profile that substrate that the positioning unit of explanation the 2nd execution mode carries out keeps step.
In this embodiment, positioning unit 23 is installed on the guide frame of being located on the objective table 21 22.
Positioning unit 23 is moved butt parts 25 freely and these butt parts 25 is constituted with respect to the driving bodies such as solenoid 24 that glass substrate S advance and retreat move by the advance and retreat from the side of the peripheral direction butt glass substrate S of the substrate S of float state.
A plurality of butt parts 25 (establish two for each minor face in Fig. 5 example, each long limit is established four) have been disposed respectively on each limit of rectangular-shaped guide frame 22, so that can be from the side of butt glass substrate S around the rectangular-shaped glass substrate S.Be provided with driving body 24 accordingly with each butt parts 25.
In addition, also can adopt following structure: driving body of configuration on each limit of guide frame 22, utilize this driving body to make a plurality of butt parts 25 that are configured on the same edge advance and retreat mobile simultaneously.
The control of driving body 24 is to carry out according to the driving command of not shown control device.Driving body 24 is driven so that the timing that butt parts 25 advance and retreat move, for example both can be to drive through making driving body 24 after the stipulated time from the beginning blow out air, also can be that photoelectric sensor etc. is set, detect at described photoelectric sensor and make driving body 24 drivings when substrate S floats to the specified altitude position.
Shown in Fig. 6 (a), under the state that driving body 24 is stopped, that is, butt parts 25 are retreated under the state of the position of not interfering glass substrate S, glass substrate S is offered substrate keep apparatus 2.
Shown in Fig. 6 (b), blow out hole 21b at air from air and blow out air chamber 21d, when glass substrate S floats to the height and position of regulation, shown in Fig. 6 (c), driving body 24 is driven.
Like this, butt parts 25 limit the X-direction of glass substrate S and moving of Y direction from the side of butt glass substrate S on every side of glass substrate S.
In addition, the local buckling of the glass substrate S that forms for the butt that dwindles as much as possible owing to butt parts 25 preferably is adjusted into the stroke of butt parts 25 in advance: the front end of butt parts 25 side of butt glass substrate S gently when driving body 24 is driven.
[explanation of substrate board treatment]
The substrate board treatment that the substrate of said structure uses when keeping apparatus 1,2 can be used to make photomask blank, photomask etc.
In this case, substrate board treatment has to keeping the surface irradiation electron beam of 1,2 described substrates of locating and keeping of apparatus or the illumination unit of laser beam by substrate, by from this illumination unit irradiating electron beam or laser beam, be implemented in and draw the regulations such as figure that figure or correction be formed on the substrate on the substrate and handle.
As this substrate board treatment, for example, can list the substrate of the photomask blank that uses photoresist coated etc. and form the describing device or the exposure device of figure to its illuminating laser beam.
[explanation of base board checking device]
Below, the base board checking device of checking substrate is described.
In the following description, the testing fixture with the flatness of checking substrate is that example describes.In addition, as this testing fixture, known have oblique incidence interference mode and vertical incidence interference mode, but be that example describes with the oblique incidence interference mode in the following description.
In the oblique incidence interference mode, as shown in Figure 7, for example, use He-Ne laser as the light source of checking light, the light and shade striped (interference fringe) that the optical path difference of the collimated light beam by reading this laser occurs when becoming the integer multiple that uses wavelength is measured flatness.
The base board checking device 5 of oblique incidence interference mode is shown in Fig. 7 (a), haply by constituting with the lower part: the power supply unit 51 of laser; Produce the laser tube 52 of He-Ne laser beam; Only be used for seeing through the filter 53 of the laser beam of provision wavelengths; Make the object lens 54 and the diffuser plate 55 of laser beam diffusion; Drive the motor 56 of this diffuser plate 55; Make the laser beam that is spread become the calibration lens 57 of collimated light beam; Prism prototype standard 58; Fresnel plate 60; Screen 61; Adjust a plurality of mirror M 1～M5 of the light path of laser beam.
Fig. 7 (b) is the figure of the relation of expression collimated light beam and optical path difference, is the sample (glass substrate S) of Fig. 7 (a) and the enlarged drawing of prism prototype standard 58 parts.
From Fig. 7 (b) as can be seen, be made as n in refractive index air
o, prism refractive index when being made as n, optical path difference δ can use following formulate.
δ＝n
o(P1P2-P2P3)-nTP3
In addition, the distance between the each point in P1P2, P2P3 and the TP3 presentation graphs 7 (b).
Wherein, because
P1P2＝2n
o/cosθ’
TP3=P1P3sin θ=2d
oTan θ ' sin θ, therefore
δ＝2n
o/cosθ’-2d
otanθ’·sinθ
Because n
oSin θ '=n sin θ, therefore
δ＝2n
od
o?cosθ’+λ·β/2π
Because the phase change β=π at the P3 place,
So δ=2n
od
oCos θ '+λ/2
Owing to when this optical path difference becomes the integer multiple that uses wavelength, produce interference fringe, produce the apparent height d of the substrate S of striped
oFor
d
o=λ/2 n
oCos θ ' is m (m-1/2): integer
That is, the interference fringe that occurs when utilizing the optical path difference of the collimated light beam of laser to become the integer multiple that uses wavelength owing to the mensuration of flatness is so need to keep substrate not move in mensuration.And the mensuration of flatness need be measured according to the shape that substrate self had originally.Therefore, by do not move being held under positioning states and substrate not crooked be that indeformable substrate of the present invention keeps appliance application in the mensuration of flatness, can effectively improve reproducibility and precision that flatness is measured.
Although understand preferred forms of the present invention, but the present invention is not subjected to any qualification of above-mentioned execution mode.
For example, the situation that positioning unit 13 is located at three positions has been described in the 1st execution mode, but also can be located at four positions or multi-section position more.In addition, used leaf spring 15 as elastomer, as long as but can restricting substrate S the moving of prescribed direction, also can use other forms of springs such as wind spring.
In addition, in the 2nd execution mode, positioning unit 23 moves butt parts advance and retreat by solenoid, as long as but butt parts advance and retreat are moved, driving body is not limited to solenoid, also can use cylinder or motor etc.And, in the 2nd execution mode, utilize driving body that butt parts advance and retreat are moved, but also can butt parts advance and retreat be moved by manual operation.
In addition, in the above description, use air that glass substrate S is floated, but, also can use other inert gases such as nitrogen according to the kind of device or substrate, purposes etc.And, as the fluid that glass substrate S is floated, be that example is illustrated with gases such as air, but be not limited to gas, also can make liquid such as water.During this situation,,, glass substrate S is produced buoyancy, glass substrate S is floated by selecting the liquid of proportion greater than glass substrate S as employed liquid.But,, have the advantage that operation does not in the back need to remove the operation of fluid etc. if use gas such as air.
In addition, the invention is not restricted to untreated glass substrate, for example, also can be applied to have the glass substrate of transmitance controlling diaphragms such as Cr film, MoSi film, ITO film etc.
According to the present invention, fluids such as use air make substrate float from platen surface, and make the butt parts below substrate or the side carry out butt and position, so can be suppressed to minimum to the bending of substrate, can under the state of keeping the flatness that substrate self has, measure accurately, handle, inspection etc.Particularly, the present invention is when being applied to be easy to generate crooked large substrate because of deadweight, and its effect is bigger.
Claims (10)
1. a substrate keeps apparatus, and substrate is stably remained on assigned position on the platen surface, it is characterized in that having:
Fluid layer forms the unit, and it forms the fluid layer that being used to below described substrate and between the described platen surface makes described substrate floating;
Positioning unit, it stably keeps described substrate by described fluid layer, and the described substrate that floats by described fluid layer of butt at least below or the side, with the assigned position of described substrate orientation on described platen surface.
2. the described substrate of claim 1 keeps apparatus, it is characterized in that,
Using gases is as the fluid that forms described fluid layer.
3. claim 1 or 2 described substrates keep apparatus, it is characterized in that,
Described positioning unit is made of the butt parts that are located at the elastomer on the described platen surface and be installed in the described substrate of butt on this elastomer, limits moving of described substrate below the described substrate by making described butt parts butt float state.
4. claim 1 or 2 described substrates keep apparatus, it is characterized in that,
Described positioning unit has from the advance and retreat of the described substrate side surfaces of peripheral direction butt of the described substrate of float state and moves freely butt parts, limits moving of described substrate by a plurality of positions around the described substrate that makes described butt parts butt float state.
5. a substrate board treatment has the described substrate of claim 1 and keeps apparatus, it is characterized in that,
Have to the surface irradiation electron beam of the described substrate that keeps apparatus to locate and keep by described substrate or the illumination unit of laser beam.
6. a base board checking device has the described substrate of claim 1 and keeps apparatus, it is characterized in that having:
Check the inspection light irradiation unit of light to the surface irradiation of the described substrate that keeps apparatus to locate and keep by described substrate;
Detection is based on the optical detecting unit of the light of the described substrate surface of described inspection light.
7. substrate keeping method is used for substrate is stably remained on assigned position on the platen surface, it is characterized in that having:
Fluid layer forms operation: form fluid layer between described substrate and described platen surface, described substrate is floated from the one side side;
Positioning process: make described substrate that butt parts butt floats by described fluid layer at least below or the side, with the plane of described platen surface almost parallel in position.
8. the described substrate keeping method of claim 7 is characterized in that,
Described substrate is the substrate of photomask blank or photomask or their uses.
9. a substrate processing method using same has utilized claim 7 or 8 described substrate keeping methods, it is characterized in that,
Be provided with irradiation process from light to the surface irradiation of the described substrate that utilizes described substrate keeping method to locate and keep that handle.
10. a substrate inspecting method has utilized claim 7 or 8 described substrate keeping methods, it is characterized in that,
Be provided with inspection rayed operation from light to the surface irradiation of the described substrate that utilizes described substrate keeping method to locate and keep that check.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP136427/2003 | 2003-05-14 | ||
| JP2003136427A JP4268447B2 (en) | 2003-05-14 | 2003-05-14 | Substrate holder, substrate processing apparatus, substrate inspection apparatus, and methods of use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1551327A true CN1551327A (en) | 2004-12-01 |
| CN100378944C CN100378944C (en) | 2008-04-02 |
Family
ID=33526396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100382055A Expired - Fee Related CN100378944C (en) | 2003-05-14 | 2004-05-13 | Base board holding appliance,base board processing device, base board checking device and use method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4268447B2 (en) |
| KR (1) | KR100809648B1 (en) |
| CN (1) | CN100378944C (en) |
| TW (1) | TWI242634B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013037139A1 (en) * | 2011-09-13 | 2013-03-21 | 深圳市华星光电技术有限公司 | Lcd exposure platform device and exposure system |
| CN107430998A (en) * | 2015-02-27 | 2017-12-01 | 株式会社日本制钢所 | Atmosphere forming apparatus and floating method for carrying |
| CN108766901A (en) * | 2018-06-26 | 2018-11-06 | 上海华力微电子有限公司 | The method for detecting wafer work platform flatness |
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| KR100830053B1 (en) * | 2007-03-29 | 2008-05-16 | 주식회사 피앤드엠 | Chuck for carrying substrate of non-contact type |
| KR100849084B1 (en) * | 2007-05-22 | 2008-07-30 | 위아무역주식회사 | Glass board align unit |
| JP2010040788A (en) * | 2008-08-05 | 2010-02-18 | Olympus Corp | Lift device and substrate inspection device |
| CN102014361B (en) | 2009-09-07 | 2014-02-19 | 华为技术有限公司 | Authentication authorization accounting (AAA) session updating method, device and system |
| KR101190967B1 (en) | 2009-12-22 | 2012-10-12 | 크루셜엠스 주식회사 | Supply and an adhesion system consecutive both tape automation for a cellular phone case |
| KR101412114B1 (en) | 2012-11-20 | 2014-06-26 | 리노정밀(주) | Apparatus for testing |
| KR101716803B1 (en) | 2014-12-18 | 2017-03-15 | 이채갑 | Probe device |
| JP6874314B2 (en) * | 2016-09-30 | 2021-05-19 | 株式会社ニコン | Object holding device, exposure device, flat panel display manufacturing method, and device manufacturing method |
| KR20210040684A (en) * | 2019-10-04 | 2021-04-14 | (주)포인트엔지니어링 | Micro led display manufacturing device and method of manufacturing micro led display |
| KR102378017B1 (en) | 2020-06-19 | 2022-03-25 | 리노정밀(주) | Connector Jig and Conducting Wire Connecting Device and Connection Method of Such Connector Jig |
| KR20220086749A (en) | 2020-12-16 | 2022-06-24 | 리노정밀(주) | Substrate Inspection Apparatus for Easy Inspection |
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- 2004-05-12 TW TW093113262A patent/TWI242634B/en active
- 2004-05-13 KR KR1020040034012A patent/KR100809648B1/en not_active IP Right Cessation
- 2004-05-13 CN CNB2004100382055A patent/CN100378944C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013037139A1 (en) * | 2011-09-13 | 2013-03-21 | 深圳市华星光电技术有限公司 | Lcd exposure platform device and exposure system |
| CN107430998A (en) * | 2015-02-27 | 2017-12-01 | 株式会社日本制钢所 | Atmosphere forming apparatus and floating method for carrying |
| CN108766901A (en) * | 2018-06-26 | 2018-11-06 | 上海华力微电子有限公司 | The method for detecting wafer work platform flatness |
| CN108766901B (en) * | 2018-06-26 | 2020-07-31 | 上海华力微电子有限公司 | Method for detecting flatness of wafer worktable |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200506315A (en) | 2005-02-16 |
| JP2004342771A (en) | 2004-12-02 |
| KR20040098586A (en) | 2004-11-20 |
| KR100809648B1 (en) | 2008-03-05 |
| TWI242634B (en) | 2005-11-01 |
| CN100378944C (en) | 2008-04-02 |
| JP4268447B2 (en) | 2009-05-27 |
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