CN1525145A - Thermal bubble type minitype inertia sensing element - Google Patents
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- CN1525145A CN1525145A CNA031064507A CN03106450A CN1525145A CN 1525145 A CN1525145 A CN 1525145A CN A031064507 A CNA031064507 A CN A031064507A CN 03106450 A CN03106450 A CN 03106450A CN 1525145 A CN1525145 A CN 1525145A
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Abstract
The invention provides a hot bubble micro inertial sensing cell, a micro device formed by micro-manufacturing technique, setting a heater on a basal plate and four groups of temperature sensing cells around the heater symmetrically, to sense the temperature change, setting a sealed cover on the basal plate, which is sealed to coat the heater and temperature sensors to make a liquid phase filled in a space formed by the sealed cover and basal plate; using the heater to heat the liquid phase fluid to form a hot bubble in the liquid phase fluid, controlling the size of bubble by water surface tension and temperature control to make the temperature sensing cells able to sense the change of temperature distribution, the inclined direction and magnitude as an incline meter, and the direction and magnitude of acceleration as an acceleration gauge.
Description
Technical field
The present invention is a relevant a kind of minitype inertial sensing unit, particularly about a kind of minitype inertial sensing unit of thermal vapor bubble type, quickens rule to take into account as inclination, in order to the variation of sense position, angle of inclination and acceleration.
Background technology
Existing inertia sensing unit as quicken rule and gyroscope, it is as the indispensable element of Navigation Control, yet, because it is bulky and cost an arm and a leg, so be not suitable for promoting.Micro-electromechanical technology is a kind of micro-processing technology (Micromachining Technology) of rising in recent years, utilize this technology to make minitype inertial sensing unit, particularly little acceleration rule (Micro-accelerometer), that the comparable traditional process technology of its characteristic is made is better, sensitivity is higher, the microgravity acceleration of institute's sensing can reach μ g grade, and little acceleration rule have advantages such as compact, the suitable a large amount of manufacturings of volume, low price again, extremely are fit to extend to consumption electronic products such as automobile, recreation rocking bar and 3-D slide-mouse.Its pertinent literature sees also " Micromachined InertialSensors " (referring to annexes one) that the people delivered such as Yazdi.
On prior art, little acceleration rule major part is a solid-state sensing unit, its structure has an elastic qualities piece and support at least one flexible feet of mass movably usually, existing manufacturing technology is quite a lot of, mainly be to utilize silicon micromachining technology development person, comprise with polycrystalline silicon face type micro-processing technology (Poly-silicon Surface Micromachining) development person, as United States Patent (USP) numbering US6223598B1, US5487305, US5417111, US5565625, US5817942 and US5665915 etc.: or with SOI (Silicon on Insulator) face type micro-processing technology development person, as United States Patent (USP) numbering US6294400B1, US5495761, US5747353 and US5447067 etc.Yet the disadvantage of this kind structure is destroyed for the external force collision that the elastic qualities piece is subject to happen suddenly.
For this reason, then develop and a kind of gas thermal convection formula acceleration rule, to overcome above-mentioned shortcoming, it is to utilize the natural principle of gas thermal convection to replace the migration of above-mentioned mass, as United States Patent (USP) numbering US2445394, US2554512, US3241374 and US5581034, see also U.S. Pat 5719333 and US6171880 and form gas thermal convection formula acceleration rule person by micro-processing technology; Though this kind method can overcome the easy ruined problem of mass, yet, because it is slower that the heat of gas passes characteristic, make the reaction velocity of this kind gas thermal convection formula acceleration rule all quite slow (～30Hz), and limited its application, because its packaged type need be airtight fully,, therefore also increased the weight of cost on the implementation simultaneously with the force value that controls environment.
Supervise in this, The present invention be directed to above-mentioned variety of problems, propose a kind of new sensing mechanism, borrow a thermal bubble type minitype inertial sensing unit as an inclinometer or acceleration rule, to reach no mass and rapid-action advantage simultaneously.
Summary of the invention
Fundamental purpose of the present invention, be that a kind of thermal bubble type minitype inertial sensing unit is being provided, it is to utilize between the hot steam bubble of heat conduction is good, molecular density is fine and close liquid phase fluid and high temperature formation to be formed with the quite clearly characteristic at interface, take into account acceleration rule as inclination, variation with sense position, angle of inclination and acceleration, advantage and the fast effect of reaction velocity with no mass are improved the shortcoming that prior art exists with effective.
Another object of the present invention, be to propose a kind of well heater and temperature sensing meta structure that utilizes silicon micromachining technology to form and be suspended on the substrate, with the efficiency of heating surface of raising well heater and the sensitivity of temperature sensing unit, and then effectively improve the measurement degree of accuracy of minitype inertial sensing unit.
A further object of the present invention is that a kind of thermal bubble type minitype inertial sensing unit is being provided, and it is to integrate interlock circuit on single wafer by micro-processing technology, not only can reduce cost, and with the little advantage of volume.
For reaching above-mentioned purpose, the thermal bubble type minitype inertial sensing unit that the technology of the present invention solution provides is provided with a well heater by micro-processing technology on a substrate, around well heater and be positioned at and be symmetrically arranged with at least two temperature sensing units on the substrate respectively, with the temperature variation around the sensing well heater; Well heater and temperature sensing unit are located on the substrate and are coated to one capping to seal it, and a liquid phase fluid is filled in the space of capping and substrate formation.
Described thermal bubble type minitype inertial sensing unit, wherein, substrate is a silicon substrate.
Described thermal bubble type minitype inertial sensing unit, wherein, the material of well heater is to be selected from wherein a kind of of metal material, polysilicon and monocrystalline silicon.
Described thermal bubble type minitype inertial sensing unit, wherein, the material of temperature sensing unit is to be selected from wherein a kind of of metal material, polysilicon and monocrystalline silicon.
Described thermal bubble type minitype inertial sensing unit, wherein, metal material is to be selected from wherein a kind of of platinum and tungsten.
Described thermal bubble type minitype inertial becomes to survey unit, and wherein, liquid phase fluid is a water.
Described thermal bubble type minitype inertial sensing unit, wherein, when heter temperature was higher than the boiling point of liquid phase fluid, the liquid phase stream that is positioned at the well heater top was known from experience partly and is become gas phase by liquid phase, and produces steam bubble.
Described thermal bubble type minitype inertial sensing unit wherein, can offer a groove on substrate, make well heater and temperature sensing unit be suspended in the groove top of substrate.
Described thermal bubble type minitype inertial sensing unit, wherein, well heater is made up of the elongated leg of several symmetries that a suspension thin plate and the outside parallel suspension thin plate of periphery thereof extend, and well heater is to be suspended in above the substrate by the support of elongated leg.
Described thermal bubble type minitype inertial sensing unit, wherein, groove is to utilize the anisotropy etching method to form.
Described thermal bubble type minitype inertial sensing unit, wherein, temperature sensing unit is supported and is suspended in above the substrate by at least one elongated leg.
Described thermal bubble type minitype inertial sensing unit, wherein, temperature sensing unit is a thermistor.
Described thermal bubble type minitype inertial sensing unit, wherein, temperature sensing unit is a thermopair.
Described thermal bubble type minitype inertial sensing unit, wherein, temperature sensing unit is a thermoelectric pile that is connected in series by several thermopairs.
Described thermal bubble type minitype inertial sensing unit, wherein, each thermoelectricity occasionally thermoelectric pile position that is adjacent to well heater is the groove top that is suspended in substrate, and the other end is to be connected on the substrate.
Described thermal bubble type minitype inertial sensing unit, wherein, thermopair is to comprise one first thermocouple material and one second thermocouple material.
Described thermal bubble type minitype inertial sensing unit, wherein, first thermocouple material is to be selected from wherein a kind of of polysilicon and monocrystalline silicon, and second thermocouple material is to be metal connecting line.
Described thermal bubble type minitype inertial sensing unit, it can be applicable to little acceleration rule.
Described thermal bubble type minitype inertial sensing unit, it can be applicable to inclinometer.
Description of drawings
Fig. 1 is the structure cut-open view of thermal bubble type minitype inertial sensing of the present invention unit;
Fig. 2 is first high temperature steam bubble and the temperature gradient distribution synoptic diagram that forms of thermal bubble type minitype inertial sensing of the present invention;
Fig. 3 becomes to survey unit by the principle explanation synoptic diagram of hot steam bubble principle as inclinometer for thermal bubble type minitype inertial of the present invention;
Fig. 4 for thermal bubble type minitype inertial sensing of the present invention unit by hot steam bubble principle as the principle explanation synoptic diagram that quickens rule;
Fig. 5 is the structure cut-open view of the present invention by the minitype inertial sensing unit that little procedure for processing is finished;
Fig. 6 is the vertical view of Fig. 5;
Fig. 7 is the synoptic diagram that the minitype inertial sensing unit of Fig. 5 and Fig. 6 arranges by bridge circuit;
Fig. 8 is the structure cut-open view of the present invention by another embodiment of minitype inertial sensing unit that little procedure for processing is finished;
Fig. 9 is the vertical view of Fig. 8;
Figure 10 is the measuring equipment synoptic diagram that the minitype inertial sensing unit of Fig. 7 and Fig. 8 arranges by differential amplifier.
Embodiment
Thermal bubble type minitype inertial sensing of the present invention unit is that the principle explanation that can see through Fig. 1 to Fig. 4 be understood as the action principle of quickening rule and inclinometer.At first, see also Fig. 1, it is to be the structure cut-open view of thermal bubble type minitype inertial sensing of the present invention unit, and as shown in the figure, a thermal bubble type minitype inertial sensing unit 1 comprises a substrate 10, it typically is silicon substrate; On substrate 10, be provided with a well heater 12, on substrate 10 and around being positioned at well heater 12 2 sides, be symmetrically arranged with temperature sensing unit 14 and 16, so as to the temperature variation around the sensing well heater 12, the material of well heater 12 and temperature sensing unit 14,16 is generally metals such as platinum or tungsten, also can be monocrystalline silicon common in the integrated circuit manufacture process or polycrystalline silicon material, when well heater 12 did not heat, temperature sensing unit the 14, the 16th did not measure any temperature variable; Above substrate 10 and be provided with a capping 18, and it is to coat well heater 12 and temperature sensing unit 14,16 with sealing, other has a liquid phase fluid 20 to be filled in the space of capping 18 and substrate 10 formation, make well heater 12 and temperature sensing unit the 14, the 16th, be in the liquid phase fluid environment, liquid phase fluid 20 is a high-purity deionized water at this.
When 1 running of thermal bubble type minitype inertial sensing unit, well heater 12 can heat and its environment temperature is risen, and when well heater 12 temperature were higher than the boiling point of water, the water that is positioned at well heater 12 tops can partly become water vapour by liquid phase, and along with the lifting of temperature, water vapour is steeped oneself-meeting and is grown up gradually.The generation type of this steam bubble is similar to the drive principle of Thermal Bubble Ink-jet Printer printer, and difference is that the energy that does not need to provide too much breaks away from well heater in the water vapour bubble to make it quick-fried dashing.In the present invention,, can control the size of steam bubble, and then control the sensitivity of thermal bubble type minitype inertial sensing unit 1 and fix its position by the surface tension and the temperature control of water.
As shown in Figure 2, in formed high temperature steam bubble 22, be one to have the steam bubble of continous way temperature gradient distribution in fact, its isotherm 22a, 22b and 22c as shown in FIG., wherein, the temperature near well heater 12 places is high more more, and form the isotherm that the interface joins with liquid phase fluid 20, its temperature is the boiling point of fluid, is example with water, and its temperature is 100 ℃.Do not change its inertial time when thermal bubble type minitype inertial sensing unit 1 is subjected to external force, the temperature sensing unit 14 and 16 that is arranged in well heater 12 2 sides detects identical temperature variation A and B (in the size of Fig. 2 with circle size expression temperature variation).
See also shown in Figure 3, its for thermal bubble type minitype inertial sensing of the present invention unit 1 by of the principle explanation of hot steam bubble principle as inclinometer.When an angle θ tilts in thermal bubble type minitype inertial sensing unit 1, the normal direction N with perpendicular to thermal bubble type minitype inertial sensing unit 1 of the gravity direction Z meeting nature of steam bubble 22 forms same angle θ, make temperature sensing unit 16 detect bigger temperature variation C, its pairing temperature sensing unit 14 then detects less temperature variation D, and tranmittance is than C and the D then direction and the size of recoverable inclination.
Again referring to shown in Figure 4, its for thermal bubble type minitype inertial sensing of the present invention unit 1 by hot steam bubble principle as the principle explanation of quickening rule.When thermal bubble type minitype inertial sensing unit 1 is subjected to linear acceleration, the liquid phase fluid 20 of high density D can produce the steam bubble 22 that inertial force is pushed low-density d around the steam bubble 22, make it stressed translation, therefore cause temperature sensing unit 14 sensed temperature to change E and change F greater than temperature sensing unit 16 sensed temperature, tranmittance is than E and F then can differentiate and the direction and the size of corrected acceleration.The liquid phase fluid characteristic that heat conduction is good because the present invention utilizes, molecular density is fine and close, and has quite clearly interface between the hot steam bubble of liquid phase fluid and high temperature formation, so on reaction velocity, can effectively overcome gas thermal convection formula quicken the slow shortcoming of rule reaction velocity (～30Hz), can reach 100Hz even higher.
For the efficiency of heating surface that improves well heater 12 and the sensitivity of temperature sensing unit 14,16, the present invention further can utilize silicon micromachining technology to form above-mentioned well heater 12 and temperature sensing unit 14,16 structures, the well heater 12 and the temperature sensing unit 14,16 that particularly have suspension structure with formation by CMOS processing procedure and follow-up micro-processing method thereof, this measure biggest advantage is can integrate relevant circuit in single wafer, and volume-diminished is also effectively reduced cost.
See also Fig. 5 and shown in Figure 6, it is to be respectively structure cut-open view and the vertical view of the present invention by the minitype inertial sensing unit that CMOS processing procedure and back segment micro-processing technology are finished, liquid phase fluid 20 and capping 18 wherein are not shown, because the CMOS processing procedure is a prior art, only do description at material and formation method that the present invention uses at this, all the other are not given unnecessary details.Thermal bubble type minitype inertial sensing unit 2 comprises a silicon substrate 200, it typically is the silicon wafer of crystal orientation (100), on silicon substrate 200, utilize silicon anisotropy etching method to offer a V-type groove 210, one well heater 220 is suspended on the V-type groove 210, well heater 220 is made up of the elongated leg 224 of four symmetries that the outside parallel suspension thin plate 222 of a suspension thin plate 222 and periphery thereof extends, and suspension thin plate 222 is suspended on the V-type groove 210 of silicon substrate 200 by the support of elongated leg 224; Corresponding X-Y direction of principal axis is equidistant around well heater 220 is provided with four groups of identical temperature sensing resistance 230,240,250 and 260, and it is to be supported by elongated leg 231,241,251,261 respectively and be suspended in V-type groove 210 tops.
Wherein, temperature sensing resistance 230,240,250,260 is thermistor, and are the polysilicons that are taken from the CMOS processing procedure as the material of well heater 220 and temperature sensing resistance 230,240,250,260, or by the dark etching technique of silicon (as induction coupled plasma etching, inductivelycoupled plasma-reactive ion etching, ICP-RIE) collocation XeF
2Come incision removal (undercutting) to close part silicon substrate 200 materials (for example: there is the commercial board that dual-use function is provided in Britain STS company) Deng gas etch, to form the material that the monocrystal silicon structure that suspends is used as well heater 220 and temperature sensing resistance 230,240,250,260.
Again as shown in Figure 7,2 arrangements by a bridge circuit of thermal bubble type minitype inertial sensing unit are can become one to quicken rule or the electrical measuring equipment of inclinometer, it is to make corresponding temperature sensing resistance 230 and 240 (or 250 and 260) be arranged at the both sides of bridge circuit exit point, and the setting of cooperation resistance R 1 and R2, to read its signal difference by a differential amplifier (Differential Amplifier) A1.In the present invention, be the measurement that the X-Y both direction is arranged, so need the arrangement of temperature sensing resistance 230,240 bridge circuits and two groups of bridge circuits of temperature sensing resistance 250,260 bridge circuits.
See also Fig. 8 and shown in Figure 9, it is respectively structure cut-open view and the vertical view of the present invention by the embodiment of another minitype inertial sensing unit that CMOS processing procedure and back segment micro-processing technology are finished, and liquid phase fluid 20 and capping 18 wherein equally also are not shown.This embodiment thermal bubble type minitype inertial sensing unit 3 is that with Fig. 5 and Fig. 6 difference temperature sensing unit becomes measuring resistance 230,240,250,260 to become the thermoelectric thermoelectric pile 310,320,330,340 that occasionally is connected in series by several thermopairs by temperature, the thermo-contact district 350a that each thermopair/thermoelectric pile 310,320,330,340 is close to well heater 220 is suspended on the V-type groove 210, is connected on the silicon substrate 200 away from the cold contact region 350b of well heater 220; Wherein, each thermopair is to include one first thermocouple material 360 and one second thermocouple material 362, first thermocouple material 360 is the monocrystalline silicon that polysilicon or said method form, and second thermocouple material 362 then is the metal connecting line in the CMOS processing procedure, is generally aluminium or its alloy.
Similarly, thermal bubble type minitype inertial sensing unit 3 also can become acceleration rule or the electrical measuring equipment of inclinometer by the arrangement of proper circuit, as shown in figure 10, it is the measuring equipment synoptic diagram of arranging by two differential amplifiers for thermal bubble type minitype inertial sensing unit 3, thermopair/thermoelectric pile 310 thermopair/the thermoelectric pile 320 corresponding with it that is positioned on the parameter of Building X is to be connected to a differential amplifier A2, and corresponding thermopair/ thermoelectric pile 330 and 340 is to be connected to another differential amplifier A3 on the parameter of Building Y, can determine the size and the direction at acceleration or angle of inclination by this arrangement.
Thermal bubble type minitype inertial sensing of the present invention unit utilizes between the hot steam bubble of heat conduction is good, molecular density is fine and close liquid phase fluid and high temperature formation and is formed with the quite clearly characteristic at interface, take into account acceleration rule as inclination, with the variation of sense position, angle of inclination and acceleration, therefore have the advantage and the fast effect of reaction velocity of no mass; On the other hand, the present invention utilizes silicon micromachining technology to form well heater and the temperature sensing meta structure that is suspended on the substrate, can improve the efficiency of heating surface of well heater and the sensitivity of temperature sensing unit, and then can effectively improve the measurement degree of accuracy of minitype inertial sensing unit, in addition, utilize micro-processing technology interlock circuit can be integrated on the single wafer, not only can reduce cost, and with the little advantage of volume.
The above is by embodiment characteristics of the present invention to be described, its purpose makes skilled person can understand content of the present invention and enforcement according to this, and non-limiting claim of the present invention, so, all other do not break away from equivalence modification or the modification that disclosed spirit is finished, and must be included in the described claim of this case.
Claims (19)
1. a thermal bubble type minitype inertial sensing unit is characterized in that, comprising:
One substrate;
One well heater is arranged on the substrate;
At least two temperature sensing units, be symmetricly set on respectively well heater around and be positioned on the substrate, with the temperature variation around the sensing well heater;
One capping is arranged on the substrate and coats well heater and temperature sensing unit to seal it; And
One liquid phase fluid is filled in the space of capping and substrate.
2. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that wherein, substrate is a silicon substrate.
3. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that, wherein, the material of well heater is to be selected from wherein a kind of of metal material, polysilicon and monocrystalline silicon.
4. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that, wherein, the material of temperature sensing unit is to be selected from wherein a kind of of metal material, polysilicon and monocrystalline silicon.
5. as claim 3 or 4 described thermal bubble type minitype inertial sensing units, it is characterized in that wherein, metal material is to be selected from wherein a kind of of platinum and tungsten.
6. thermal bubble type minitype inertial as claimed in claim 1 becomes to survey unit, it is characterized in that wherein, liquid phase fluid is a water.
7, thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that, wherein, when heter temperature was higher than the boiling point of liquid phase fluid, the liquid phase stream that is positioned at the well heater top was known from experience partly and become gas phase by liquid phase, and produces steam bubble.
8. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that, wherein, can offer a groove on substrate, makes well heater and temperature sensing unit be suspended in the groove top of substrate.
9. thermal bubble type minitype inertial sensing as claimed in claim 8 unit, it is characterized in that, wherein, well heater is made up of the elongated leg of several symmetries that the outside parallel suspension thin plate of a suspension thin plate and periphery thereof extends, and well heater is to be suspended in above the substrate by the support of elongated leg.
10. thermal bubble type minitype inertial sensing as claimed in claim 8 unit is characterized in that, wherein, groove is to utilize the anisotropy etching method to form.
11. thermal bubble type minitype inertial sensing as claimed in claim 8 unit is characterized in that, wherein, temperature sensing unit is supported and is suspended in above the substrate by at least one elongated leg.
12. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that wherein, temperature sensing unit is a thermistor.
13. thermal bubble type minitype inertial sensing as claimed in claim 8 unit is characterized in that wherein, temperature sensing unit is a thermopair.
14. thermal bubble type minitype inertial sensing as claimed in claim 8 unit is characterized in that, wherein, temperature sensing unit is a thermoelectric pile that is connected in series by several thermopairs.
15., it is characterized in that wherein, each thermoelectricity occasionally thermoelectric pile position that is adjacent to well heater is the groove top that is suspended in substrate as claim 13 or 14 described thermal bubble type minitype inertial sensing units, and the other end is to be connected on the substrate.
16. thermal bubble type minitype inertial sensing as claimed in claim 13 unit is characterized in that wherein, thermopair is to comprise one first thermocouple material and one second thermocouple material.
17. thermal bubble type minitype inertial sensing as claimed in claim 16 unit is characterized in that, wherein, first thermocouple material is to be selected from wherein a kind of of polysilicon and monocrystalline silicon, and second thermocouple material is to be metal connecting line.
18. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that, it can be applicable to little acceleration rule.
19. thermal bubble type minitype inertial sensing as claimed in claim 1 unit is characterized in that it can be applicable to inclinometer.
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| CN 03106450 CN1247965C (en) | 2003-02-26 | 2003-02-26 | Thermal bubble type minitype inertia sensing element |
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| CN 03106450 CN1247965C (en) | 2003-02-26 | 2003-02-26 | Thermal bubble type minitype inertia sensing element |
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| CN1247965C CN1247965C (en) | 2006-03-29 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738208B (en) * | 2008-11-05 | 2012-04-04 | 瑞鼎科技股份有限公司 | Sensor |
| CN102759417A (en) * | 2011-04-27 | 2012-10-31 | 东京毅力科创株式会社 | Temperature measuring device, temperature calibrating device and temperature calibrating method |
| CN102053167B (en) * | 2009-11-10 | 2012-11-21 | 中华大学 | Hot air bubble type angular accelerometer applying radio frequency identification tag technology |
| CN102012437B (en) * | 2009-09-08 | 2013-07-10 | 中华大学 | Hot-bubble type accelerometer using RFID (Radio Frequency Identification) and production method thereof |
| CN103543290A (en) * | 2012-07-16 | 2014-01-29 | 中华大学 | Thermal-bubble angular accelerometer |
| TWI456200B (en) * | 2012-07-03 | 2014-10-11 | Univ Chung Hua | Thermal bubble angular accelerometer |
| CN108020682A (en) * | 2017-12-08 | 2018-05-11 | 南昌航空大学 | A kind of optical-wireless acceleration transducer |
-
2003
- 2003-02-26 CN CN 03106450 patent/CN1247965C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738208B (en) * | 2008-11-05 | 2012-04-04 | 瑞鼎科技股份有限公司 | Sensor |
| CN102012437B (en) * | 2009-09-08 | 2013-07-10 | 中华大学 | Hot-bubble type accelerometer using RFID (Radio Frequency Identification) and production method thereof |
| CN102053167B (en) * | 2009-11-10 | 2012-11-21 | 中华大学 | Hot air bubble type angular accelerometer applying radio frequency identification tag technology |
| CN102759417A (en) * | 2011-04-27 | 2012-10-31 | 东京毅力科创株式会社 | Temperature measuring device, temperature calibrating device and temperature calibrating method |
| TWI456200B (en) * | 2012-07-03 | 2014-10-11 | Univ Chung Hua | Thermal bubble angular accelerometer |
| US9182423B2 (en) | 2012-07-03 | 2015-11-10 | Chung Hua University | Thermal convection type angular accelerometer |
| CN103543290A (en) * | 2012-07-16 | 2014-01-29 | 中华大学 | Thermal-bubble angular accelerometer |
| CN103543290B (en) * | 2012-07-16 | 2015-07-22 | 中华大学 | Thermal-bubble angular accelerometer |
| CN108020682A (en) * | 2017-12-08 | 2018-05-11 | 南昌航空大学 | A kind of optical-wireless acceleration transducer |
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|---|---|
| CN1247965C (en) | 2006-03-29 |
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