CN102053167B - Hot air bubble type angular accelerometer applying radio frequency identification tag technology - Google Patents
Hot air bubble type angular accelerometer applying radio frequency identification tag technology Download PDFInfo
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- CN102053167B CN102053167B CN2009102121387A CN200910212138A CN102053167B CN 102053167 B CN102053167 B CN 102053167B CN 2009102121387 A CN2009102121387 A CN 2009102121387A CN 200910212138 A CN200910212138 A CN 200910212138A CN 102053167 B CN102053167 B CN 102053167B
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Abstract
The invention provides a hot air bubble type angular accelerometer applying a radio frequency identification tag technology, which comprises a flexible substrate, a bottom layer, at least one groove and at least one sensing assembly. The bottom layer is arranged on the flexible substrate. The at least one groove is formed on the bottom layer. The at least one sensing assembly is suspended arranged on the at least one groove. Each sensing assembly comprises a heater and two temperature sensing elements, each temperature sensing element is provided with two end parts used for connection; relative to the heater, the two temperature sensing elements are virtually and symmetrically arranged at two sides of the heater; and each temperature sensing element and the heater are arranged in an endocentric radial manner. The technology for manufacturing the hot air bubble type angular accelerometer on the flexible substrate is combined with the radio frequency identification tag technology, therefore, the invention has the advantages of use convenience and reduced manufacturing cost.
Description
Technical field
The present invention relates to a kind of hot bubble type angular accelerometer, particularly a kind of hot bubble type angular accelerometer that uses the wireless identification label technology and use low temperature process to make.
Background technology
Many small-sized angular accelerometers based on the different measuring method are developed; To satisfy the demand that angular acceleration is measured; And wherein a kind of angular accelerometer is to have on silicon wafer, to produce exquisite microstructure, for example pectination (Comb Structure) or vibrational structure (Vibratory Structure) etc.Through measure the stray capacitance (Parasitic Capacitance) that these microstructures produce or the variation of resonant frequency (Resonant Frequency) when rotating, can calculate the rotational angular velocity or the angle of inclination of these microstructures.Yet, owing to these microstructures constantly produce distortion because of stressed, make its easy fatigue or aging, so this angular accelerometer with microstructure has the short life-span.In addition, on silicon wafer, make microstructure, need to use high-temperature technology, so manufacturing cost is expensive.
Other has a kind of accelerometer to measure the angle of inclination based on the thermal principle, and this type thermal accelerometer also is on silicon wafer, to make usually, and utilizes silicon dioxide to support the structure of its well heater and thermistor etc.But, make that the below air chamber temperature of hot bubble type accelerometer is lower, and cause the sensitivity meeting of thermistor relatively poor because the heat-conduction coefficient very little (1.5W/ (m-K)) of silicon dioxide causes heat-conduction effect bad.Likewise, thermistor is descended to the sensing sensitivity of acceleration.Therefore for improving the sensing sensitivity of acceleration, traditional hot bubble type accelerometer well heater more energy must be provided, so working temperature also can be higher.Thisly thus support the structure of well heater and thermistor with silicon dioxide, when each well heater start, shutdown, just be easy to produce the effect of expanding with heat and contract with cold, material is easy to fatigue and aging phenomenon, the lost of life.
Moreover, be to pour into air in the traditional hot bubble type accelerometer, or other easy evaporating liquids are as the medium of heat conduction.But because in the air oxygen is arranged, so well heater can wear out because of oxidation; And, also possibly produce chemical action to the material of each one of accelerometer if what pour into is to be prone to boil-off gas, the performance of using acceleration analysis of a specified duration can reduce the lost of life.
To sum up, tradition has the small-sized angular accelerometer of microstructure easily because of the fatigue aging of microstructure, makes its life-span short.And the making of traditional hot bubble type accelerometer will be used high-temperature technology, and cost is high, and sensitivity is lower, more not power saving, and material oxidation is arranged easily, the aging problem that reaches the performance reduction.Therefore, be necessary to develop the hot bubble type angular accelerometer that makes new advances.
Summary of the invention
In order to solve the problems referred to above that prior art exists; The present invention discloses hot bubble type angular accelerometer of a kind of employing wireless radio frequency identification tag technology (RFID) and preparation method thereof; The hot bubble type angular accelerometer that the present invention discloses is produced on angular accelerometer on the bendable base material, therefore can reduce the cost of manufacture of angular accelerometer.What deserves to be mentioned is that in addition hot bubble type angular accelerometer and RFID aerial integration are made, and can have the convenience in the use.
The hot bubble type angular accelerometer of the employing wireless radio frequency identification tag technology of one embodiment of the invention comprises a flexible substrate, a bottom, a plurality of first groove, a plurality of first sensing component, an embedded single chip system unit and a RFID antenna.Bottom is located at this flexible substrate.Said a plurality of first groove is formed at this bottom.Said a plurality of first sensing component is suspended on said at least one first groove.Each said first sensing component comprises a primary heater and two first temperature sensors; Each said first temperature sensor has the both ends that are used to connect; Wherein with respect to this primary heater, said two first temperature sensor essence are arranged at the both sides of this primary heater symmetrically respectively, and each said temperature sensor and well heater are all arranged with radial mode entad; Embedded single chip system unit is located on this flexible substrate, and comprises a modulation and a demodulation module; And the RFID dwi hastasana is formed on this flexible substrate, is coupled to this modulation and demodulation module, wherein; Between these first temperature sensors of two these first sensing components of being connected, connect into one first pair of differential type Wheatstone bridge, and this first pair of differential type Wheatstone bridge; Be coupled to this embedded single chip system unit; Make this embedded single chip system unit, poor through the output voltage of this first pair of differential type Wheatstone bridge, calculate with respect to this angular acceleration of first; The value of this angular acceleration is seen off through this RFID antenna after this modulation and demodulation module modulation and encrypting.Wherein said a plurality of first groove is around first setting perpendicular to this surface; And said a plurality of first sensing component is suspended in said a plurality of first groove accordingly; And equate substantially apart from this first; Wherein this primary heater of each said first sensing component and this first temperature sensor are arranged with respect to this first radially.
The present invention combines the technology that the hot bubble type angular accelerometer is made on the bendable base material with the wireless radio frequency identification mark technology, therefore have convenience in the use and the cost of manufacture that can reduce angular accelerometer.
Description of drawings
Fig. 1 is the hot bubble type angular accelerometer of the employing wireless radio frequency identification tag technology of demonstration one embodiment of the invention and the synoptic diagram of monitoring system thereof;
Fig. 2 for the multiaxis of the employing wireless radio frequency identification tag technology that shows one embodiment of the invention to the synoptic diagram of hot bubble type angular accelerometer with the integration of rfid card sheet;
The synoptic diagram that Fig. 3 integrates for the axial hot bubble type angular accelerometer of a Z and the rfid card sheet of demonstration another embodiment of the present invention;
Fig. 4 is the schematic equivalent circuit of the temperature sensor CC of demonstration one embodiment of the invention;
Fig. 5 is the schematic layout pattern of the axial hot bubble type angular accelerometer of Z of demonstration one embodiment of the invention;
Fig. 6 is the synoptic diagram of the X axis hot bubble type angular accelerometer of demonstration further embodiment of this invention;
Fig. 7 is the cut-open view of Fig. 6 along the A-A profile line;
Fig. 8 is for showing the synoptic diagram that is formed at the axial hot bubble type angular accelerometer of Z and rectangle capping and the integration of rfid card sheet on the flexible substrate of one embodiment of the invention;
Fig. 9 is the cut-open view of Fig. 8 along the B-B profile line;
Figure 10 is the synoptic diagram of semicircle sphere or semi-cylindrical rectangle capping and the integration of rfid card sheet for axial hot bubble type angular accelerometer of Z and the inside that shows another embodiment of the present invention;
Figure 11 is for showing the X axis hot bubble type angular accelerometer and the inner synoptic diagram for rectangle or semi-cylindrical rectangle capping and the integration of rfid card sheet on the flexible substrate that be formed at of another embodiment of the present invention;
Figure 12 is the cut-open view of Figure 11 along the C-C profile line;
Figure 13 is for showing the synoptic diagram that the rectangle capping inside on the flexible substrate is integrated for the X axis hot bubble type angular accelerometer and the rfid card sheet of semicircle sphere that is formed at of further embodiment of this invention;
Figure 14 is the structure side cross-sectional schematic of semicircle sphere or semi-cylindrical X axis hot bubble type angular accelerometer and the integration of rfid card sheet for the rectangle capping inside that shows one embodiment of the invention;
Figure 15 is suspended in the structural representation of groove for the X axis hot bubble type angular accelerometer structure that shows one embodiment of the invention and well heater and temperature sensor;
Figure 16 is the schematic top plan view of the sheet resistance of demonstration one embodiment of the invention;
Figure 17 is the cut-open view along the E-E profile line;
Figure 18 is the synoptic diagram of the thin-film capacitor of demonstration one embodiment of the invention; And
Figure 19 is the cut-open view along the F-F profile line.
Description of reference numerals in the above-mentioned accompanying drawing is following:
The hot bubble type angular accelerometer and the supervisory system of 100 employing wireless radio frequency identification tag technology
104 embedded single chip system unit
106 oscillation modules
The 108RFID antenna
110Z axial angle accelerator
112X axial angle accelerator
114Y axial angle accelerator
117 filtration modules
116 modulation and demodulation modules
118 rectification modules
120 amplifier modules
The 122RFID R-T unit
124 monitoring systems
129 electric connection pads
202 flexible substrates
204 circuit
206 sheet resistances
208 thin-film capacitors
210 signal lines
212 external power sources
214 well heaters
217 temperature sensors
218 pairs of differential type Wheatstone bridges
308 bottoms
316 surfaces
322 supporting constructions
332 chromium layers
334 nickel dams
348 viscoses
364 arc type sheet resistance bends
366 gold medal layers electrically connect weld pad
370 lower electrodes
372 chromium layers
374 nickel dams
376 gold medal layers
378 upper electrodes
380 gold medal leads
382 silicon nitride layers
384 colloids
102,102a, 102b, 102c, 102d hot bubble type angular accelerometer and rfid card sheet are integrated synoptic diagram
111,113,115 sensing components
125,127 line ends
220,221 electrical detection ends
310,310 ' groove
350a, 350b, 350c, 350d capping
The 501-506 weld pad
The 601-606 weld pad
The 701-706 silicon nitride layer
The 801-806 gold thread
R1, R2, R3, R4 temperature sensor
Embodiment
The present invention discloses the hot bubble type angular accelerometer of a kind of employing wireless radio frequency identification tag technology (RFID); The present invention combines the technology that the hot bubble type angular accelerometer is made on the bendable base material with the wireless radio frequency identification mark technology; Therefore have convenience in the use and the cost of manufacture that can reduce angular accelerometer.
One of characteristic of the present invention is to change the propping material that traditional hot bubble type accelerometer uses and is the higher material of thermal conductivity coefficient, and for example the thermal conductivity coefficient of aluminium nitride or silicon nitride, especially aluminium nitride is up to 160-320W/ (m-K), near the 400W/ (m-K) of copper.Classic method is to use silicon dioxide, its heat-conduction coefficient very little (being about 1.5W/ (m-K)).Because the heat-conduction effect of silicon dioxide is very poor,, therefore can reduce the sensing sensitivity of thermistor angular acceleration so the temperature of air plenum below can be lower.And be to reach the required sensing sensitivity of angular acceleration, must to improve the temperature of air chamber in the hot bubble type angular accelerometer, thus can be than consumed energy, and when well heater start in the future, shutdown, the thermal expansion differential contraction stress and the aging effect of generation also can compare seriously.
Two of characteristic of the present invention in addition; Be after space with the seal angle accelerometer vacuumizes, pour into the inert gas of HMW, like argon, krypton and xenon; The sensitivity of angular acceleration sensing be can promote, also can oxidation and aging effect do not caused well heater and temperature sensor.Traditional method is to pour into air or volatile liquid, can cause oxidation and aging effect to well heater and temperature-sensitive sticker, and influence the performance and the life-span of well heater and temperature-sensitive sticker.
Three of characteristic of the present invention is with the electron gun vapour deposition method, and vapor deposition contains the potpourri of powder such as P type doping (P-Type Impurity) and silicon, forms and contains P type doped amorphous silicon layer.Anneal (Laser Anneal) with laser again, amorphous silicon layer is transformed into contains P type doped polysilicon layer, with structure as thermistor or general resistance.This with low temperature process on bendable base material, make the method for P type DOPOS doped polycrystalline silicon, also nobody proposed.
Fig. 1 is the multiaxis of the employing wireless radio frequency identification tag technology that shows one embodiment of the invention system's 100 synoptic diagram to hot bubble type angular accelerometer 102.The system 100 that the present invention discloses comprises a monitoring system 124, a RFID R-T unit (RFID Reader) 122 and one hot bubble type angular accelerometer 102.Monitoring system 124 is connected in RFID R-T unit 122, and RFID R-T unit (RFID Reader) 122 utilizes radio frequency signal and hot bubble type angular accelerometer 102 to communicate.Hot bubble type angular accelerometer 102 comprises an embedded single chip system unit (Embedded System-On-Chip) 104, one oscillation module 106, a RFID antenna 108, one first angular acceleration 110, one second angular acceleration 112 and one the 3rd angular acceleration 114.Embedded single chip system unit 104 comprises a filtration module 117, and modulates and demodulation module 116, a rectification module 118 and an amplifier module 120.RFID antenna 108 is used to receive the radio frequency signal from RFID R-T unit 122; Or send radio frequency signal and get back to this RFID R-T unit 122; RFID antenna 108 is coupled to modulation and demodulation module 116, rectification module 118 and oscillation module 106; In the embodiment of the invention, RFID antenna 108 is formed on the flexible substrate with micro electronmechanical technology.
Modulation and demodulation module 116 are used for the radio frequency signal of demodulation from RFID R-T unit 122, and modulation is sent to the radio frequency signal of RFID R-T unit 122.This modulation passback action promptly is to inject a carrier wave, and makes it become the suitable electric wave signal that transmits.
Z axial angle accelerator 110, X axis angular acceleration 112 and Y axial angle accelerator 114 are coupled to embedded single chip system unit 104, and Z axial angle accelerator 110, X axis angular acceleration 112 and Y axial angle accelerator 114 can provide the angular acceleration of embedded single chip system unit 104 with respect to Z axle, X axle and Y axle respectively.Combination through Z axial angle accelerator 110, X axis angular acceleration 112, Y axial angle accelerator 114, RFID antenna 108 and modulation and demodulation module 116; Can be with the angular acceleration values of hot bubble type angular accelerometer 102 sensings; Mode with wireless microwave sends back RFID R-T unit 122; Make the angular acceleration monitoring system 124 that is connected to RFID R-T unit 122 can know the angular acceleration signal of multiaxis immediately, and these angular acceleration signals are delivered to a Surveillance center to hot bubble type angular accelerometer 102.
Fig. 2 is the synoptic diagram of the hot bubble type angular accelerometer 102a of the employing wireless radio frequency identification tag technology of demonstration one embodiment of the invention.With reference to Fig. 1 and shown in Figure 2; Micro electronmechanical technology capable of using forms a RFID antenna 108, a circuit 204 and comprises an oscillation module 106, a Z axial angle accelerator 110, an X axis angular acceleration 112 and a Y axial angle accelerator 114 on one flexible substrate 202, and wherein Z axial angle accelerator 110 comprises a plurality of sensing components 111; X axis angular acceleration 112 comprises a plurality of sensing components 113; And Y axial angle accelerator 114 comprises a plurality of sensing components 115.Oscillation module 106 comprises the thin-film component of at least one sheet resistance 206 and at least one thin-film capacitor 208 grades.Circuit 204 comprises the signal line 210 of Z axial angle accelerator 110, X axis angular acceleration 112 and Y axial angle accelerator 114, signal line 210 and 104 couplings of embedded single chip system unit, and each signal line 210 can comprise positive and negative signal wire and ground wire.More can provide on the flexible substrate 202 one be used to connect external power source 212 (for example battery) bindiny mechanism, this external power source 212 makes hot bubble type angular accelerometer 102a when active mode is operated, and can obtain enough electric power.
In the present embodiment, the sensing component 111 of Z axial angle accelerator 110 is symmetricly set on the flexible substrate 202 with respect to Z axle (perpendicular to X and Y axle), makes when flexible substrate 202 rotates with respect to the Z axle, can measure the angular acceleration of rotation; The sensing component 113 of X axis angular acceleration 112 is with respect to the X rotational symmetry setting on the surface that is parallel to flexible substrate 202, the angular acceleration when measuring flexible substrate 202 whereby and rotating with respect to the X axle; The sensing component 115 of Y axial angle accelerator 114 is with respect to the Y rotational symmetry setting on the surface that is parallel to flexible substrate 202, the angular acceleration when measuring flexible substrate 202 whereby and rotating with respect to the Y axle.Though present embodiment is an example so that 3 angular accelerations to be set on flexible substrate 202; But the invention is not restricted to this; The combination that other embodiment measure the out-of-alignment accelerator like the hot bubble type angular accelerometer 102 or wantonly two with single angular acceleration all is contained among the present invention.
With reference to Fig. 2, Fig. 3 and Fig. 4; Hot bubble type angular accelerometer 102b comprises a plurality of sensing components 111; Its substantially equidistance be arranged on the flexible substrate 202 around Z axle (perpendicular to drawing); Each sensing component 111 comprises a well heater 214a or 214b and two temperatures sensing element R1, R2 or R3, R4, and wherein well heater 214a and 214b and the also rough equidistance of two temperatures sensing element R1, R2, R3 and R4 dispose around the Z axle and with respect to the Z axle radially.These temperature sensors R1, R2, R3 are following with the circuit connecting mode between R4: temperature sensor R1 in the sensing component 111 that two are connected and temperature sensor R2; And temperature sensor R3 and temperature sensor R4 all are connected to the two-end-point A and the B of the power supply that single-chip sees off earlier; And on a sense of rotation around the Z axle; Weather when 111 of two sensing components are positioned at rotation and the temperature sensor R1 and the temperature sensor R4 in leeward reach temperature sensor R2 and temperature sensor R3 and are in series respectively.Form series connection electrical test side 220 and 221 between both series connection contacts respectively, so just form two differential type Wheatstone bridges as shown in Figure 4 (Double Difference Wheatstone Bridge) 218.
When sensing component 111 rotates toward a direction around the Z axle; Each sensing component 111 is positioned at temperature sensor R1 and R3 or the R2 and the R4 in leeward on the rotation direction; Its resistance value can be because near the lower environmental gas of temperature of contact; Cause its resistance value to change, and make the electrical detection end 220 and 221 on two differential type Wheatstone bridges 218 can produce a differential output voltage.Through measuring this differential output voltage, can determine Z axial angle acceleration, and after integral operation, can obtain rotational angular velocity or rotational angle.The size of aforementioned electric change in resistance is the relation that is directly proportional with angular acceleration, so available this device detects this angular acceleration.
With reference to shown in Figure 5, a plurality of sensing components 111 all be positioned at the XY plane and with Z axle arranged perpendicular, and a plurality of well heater 214 and all rough equidistance of a plurality of temperature sensor 217 are around setting of Z axle and arrangement radially.In other words; With sensing component 111 is example; Temperature sensor 217 has two external links 125 and 127; And because temperature sensor 217 is with respect to well heater 214 symmetries, so the end 125 of well heater 214 and temperature sensor 217 and 127 extensiblely meets at (shown in dotted line among Fig. 5) on the intersection point.And in the present embodiment, this intersection point is positioned on the Z axle.The periphery of sensing component 111 can be provided with a plurality of electric connection pads 129, and the end 125 and 127 of each well heater 214 and temperature sensor 217 then can be connected on these electric connection pads (Contact Pad) 129 accordingly.
With reference to Fig. 6 and shown in Figure 7, a plurality of sensing components 113 can be arranged on the flexible substrate 202 with respect to X axle essence symmetrically, and wherein the major axis of each sensing component 113 is to can be perpendicular to the X axle, but is not limited thereto.Each sensing component 113 be suspended in groove 310 ' on, and comprise a well heater 214 and two temperatures sensing element 217.Well heater 214 is arranged along Z-direction with temperature sensor 217, and wherein two temperatures sensing element 217 is symmetrical set with respect to well heater 214 essence.217 of the temperature sensors of the sensing component 113 that is oppositely arranged; Can connect into a pair of differential type Wheatstone bridge as before, the electrical detection end through two differential type Wheatstone bridges detects flexible substrate 202 because of the differential output voltage that rotation caused with respect to the X axle.Similarly; With respect to the Y axle; Also can be provided with in order to measure a plurality of sensing components of the angular acceleration that rotates around the Y axle at flexible substrate 202 like Fig. 6 embodiment; Its well heater and temperature sensor can be essence symmetry and equidistance in the Y axle, and form with stacked mode, and wherein the major axis of these well heaters and these temperature sensors is to can be perpendicular to the Y axle.
With reference to Fig. 8 and shown in Figure 9, the method that is disclosed in the patent of the hot bubble type Z shaft angle accelerometer 102c TaiWan, China patent application case capable of using that one embodiment of the invention discloses number 098127348 is made, and therefore no longer repeats.Hot bubble type angular accelerometer 102c comprises a flexible substrate 202, a bottom 308, a plurality of groove 310, a plurality of sensing component 111.Bottom 308 is located on the flexible substrate 202, and bottom 308 has a surface 316, and 310 of said a plurality of grooves are located on the surface 316 of this bottom 308, and are surrounded on the Z axle.A plurality of sensing components 111 are suspended in corresponding a plurality of groove 310, and equate apart from this Z axle essence.It is rough identical at a distance of the Z axle that the distance that this essence equates comprises a plurality of sensing components 111 corresponding position of taking up an official post, and correspondence position can be like arbitrary end of well heater 214 or temperature sensor 217 or middle position etc.
Each sensing component 111 comprises a well heater 214 and two temperatures sensing element 217; Each well heater 214 all is suspended in it on corresponding groove 310 with a supporting construction 322 with each temperature sensor 217; Wherein supporting construction 322 is striden frame on groove 310 and comprise aluminium nitride or silicon nitride; Wherein the thermal conductivity of aluminium nitride is up to 160-320W/ (m-K), near the 400W/ (m-K) of copper, so in the hot bubble type angular accelerometer 102c of the embodiment of the invention; The temperature of lower chamber can promote, and the sensitivity meeting of thermistor is better.In another embodiment; Because hydrofluorite buffer solution can etching of silicon nitride; Make it be prone in technology, use, so silicon nitride can replace aluminium nitride, as the material that supports well heater 214 and temperature sensor 217; Just its heat-conduction coefficient (being about 35W/ (m-K)) is lower than aluminium nitride (being about 160-320W/ (m-K)), but still is height than traditional silicon dioxide heat-conduction coefficient (being about 1.5W/ (m-K)).Capping 350a covers corresponding groove 310 and well heater 214 and temperature sensor 217 is hidden, and capping 350a and with viscose 348 sealings forms airtight.Viscose 348 can the wire mark mode be coated with.Viscose 348 is dried the back sealed space is vacuumized, and pours into the inert gas of HMW, like argon, krypton and xenon, can promote the sensitivity of angular acceleration sensing, and can not cause oxidation to reach ill effects such as aging to well heater 214 and temperature sensor 217.
The spy's, temperature sensor 217 comprises P type doped amorphous silicon layer, and it contains the potpourri of powder such as P type doping (P-Type Impurity) and silicon with the electron gun vapor deposition; Again with laser anneal (Laser Anneal); Amorphous silicon layer is transformed into contain P type doped polysilicon layer, with structure as thermistor or general resistance, this with low temperature process on bendable base material; Make the method for P type DOPOS doped polycrystalline silicon, also nobody proposed.The profile of temperature sensor 217 can comprise linear, bow font or serrate.
Well heater 214 bag chrome-containing layer 332 and nickel dams 334, wherein chromium layer 332 and nickel dam 334 electron gun vapor depositions capable of using form.The profile of well heater 214 can comprise linear, bow font or serrate.
Once more with reference to Fig. 8 and shown in Figure 9, hot bubble type angular accelerometer 102b can comprise a RFID antenna 108, an embedded single chip system unit 104 and a circuit (not shown) in addition.RFID antenna 108 is formed at flexible substrate 202; Embedded single chip system unit 104 is arranged at flexible substrate 202 and connects RFID antenna 108; The circuit (not shown) is formed on the flexible substrate 202; So that each interelement electrical interconnects (Electrical Interconnections) and element function adjustment in the hot bubble type angular accelerometer 102c to be provided, the circuit (not shown) can comprise many leads and electrically connect weld pad (Bonding Pad).RFID antenna 108 comprises gold layer, chromium layer and nickel dam respectively with the circuit (not shown), and wherein chromium layer and nickel dam electron gun vapor deposition capable of using forms, and gold layer electroless plating method capable of using (Electroless-Plating) is plated on the nickel dam.Because the tack of gold is good and resistance is less, therefore be suitably for the material of RFID antenna 108, lead and weld pad (Pad).Embedded single chip system unit 104 is with crystal covering type welding (Flip Chip Bonding) technology, and utilization thermal friction extrusion (Thermal Compression) is welded on embedded single chip system unit 104 on the RFID antenna 108.
With reference to shown in Figure 10, in another embodiment, sensing component 111 can be that inside is half round post or the spherical rectangle capping 350b of semicircle seals; Temperature Distribution in the bubble cavity like this; Can arrive balance very soon, and not have sinuous flow (Turbulent Flow), so can significantly promote the reaction bandwidth of this device; Angular acceleration is measured, the linearity and scope.And rectangle capping 350b outside still must be planar rectangular, in order to identification marking, the name of an article, production sequence number and date.
With reference to Figure 11 and shown in Figure 12, the hot bubble type angular accelerometer 102d of further embodiment of this invention comprise a flexible substrate 202, a bottom 308, a plurality of groove 310 ', a plurality of sensing component 111.Bottom 308 is located on the flexible substrate 202, and bottom 308 has a surface 316, said a plurality of grooves 310 ' then be located on the surface 316 of this bottom 308, and be positioned at the two opposite sides of the X axle on the surface that is parallel to flexible substrate 202.A plurality of sensing components 111 be suspended in corresponding a plurality of groove 310 ', and present symmetry with respect to the X axle.Each sensing component 111 comprises a well heater 214 and is positioned at the two temperatures sensing element 217 of well heater 214 two opposite sides; Well heater 214 is axially stacked along Z with two temperatures sensing element 217; And support with a supporting construction 322, wherein supporting construction 322 is striden frame in groove 310 ' go up and comprise aluminium nitride or silicon nitride.Capping 350c covers corresponding groove 310 ' and well heater 214 and temperature sensor 217 are hidden, capping 350c and with viscose 348 sealings, and pour into the inert gas of HMW, like argon, krypton and xenon.
Once more with reference to Figure 11 and shown in Figure 12, hot bubble type angular accelerometer 102d can comprise a RFID antenna 108, an embedded single chip system unit 104 and a circuit (not shown) in addition.RFID antenna 108 is formed at flexible substrate 202; Embedded single chip system unit 104 is arranged at flexible substrate 202 and connects RFID antenna 108; The circuit (not shown) is formed on the flexible substrate 202; So that each interelement electrical interconnects (electrical interconnections) and element function adjustment in the hot bubble type angular accelerometer 102d to be provided, the circuit (not shown) can comprise many leads and electrically connect weld pad (Bonding Pad).
With reference to Figure 13; Rectangle capping inside among another embodiment is the spherical X axis hot bubble type angular accelerometer of semicircle, and sensing component 111 can be capping 350d and seals, like this Temperature Distribution in the bubble cavity; Can arrive balance very soon, and not have sinuous flow (Turbulent Flow).With reference to Figure 14, the rectangle capping inside that shows one embodiment of the invention is that semicircle is spherical, or semi-cylindrical X axis hot bubble type angular accelerometer, with the structure side cross-sectional schematic of rfid card sheet integration.
With reference to shown in Figure 15; In the embodiment of Figure 11 to Figure 14; Its well heater 214 and temperature sensor 217 stacked settings, and the method for making stacked well heater 214 and temperature sensor 217 is alternately to repeat to steam chromium coating 332, nickel dam 334, supporting construction 322; Silicon nitride layer 701-706 and between the silicon dioxide sacrificial layer (not shown) of 217 of well heater 214 and temperature sensors; To become the sandwich homeotropic texture, wherein be located in each silicon nitride layer 701-706 week corresponding air plenum groove 310 ', to become support.In groove 310 ' periphery; Make a plurality of with gold, nickel, the formed weld pad 501-506 of chromium three-layer metal; Its objective is that carrying out routing with gold thread 801-806 connects (Wire-Bond); With the weld pad 602 that connects well heater 214 and 605 and the weld pad 601,606,603 and 604 that connects temperature sensor 217 be connected to peripheral weld pad 501-506, shown in figure 15.In order to reduce radian and the height (Wire Loop and Height) of gold thread in weld pads such as well heater 214 and temperature sensor 217 part; Weld pad 501-506 during routing on substrate 202 is first solder joint (First Bond), and second solder joint (Second Bond) is only the weld pad (being labeled as 601-606) of well heater 214 and temperature sensor 217.After routing is accomplished, with colloid 384 gold thread 601-606 is covered again, to protect these gold threads 601-606.Then use buffered hydrofluoric acid solution, or with the gaseous plasma etching method (like SF
6), silicon dioxide sacrificial layer is etched away.So, well heater and upper and lower temperature sensor 217 and supporting construction 322 aln layers thereof, just can separate and be suspended in each other groove 310 ' in.
With reference to Fig. 2, Figure 16 and Figure 17, circuit 204 comprises a plurality of sheet resistances 206, and it can have a bend 364 of " bow word " shape, so can save its shared area.Among one embodiment, sheet resistance 206 can comprise metallic chromium layer and nickel dam.Among another embodiment, sheet resistance 206 comprises P type DOPOS doped polycrystalline silicon.Benefit with the sheet resistance 206 of this material is, comparable have a bigger resistance value scope with what chromium layer and nickel dam were made.The size requirement of visual film resistance and area constraints when historical facts or anecdotes is executed are selected the material of above-mentioned technology.After bend 364 completes, form a gold medal layer weld pad 366 at the two ends of bend 364, so just accomplish the making of sheet resistance 206.
Shown in Fig. 2, Figure 18 and 19, thin-film capacitor 208 comprises a upper electrode 378 and lower floor's electrode 370, and lower electrode 370 comprises P type DOPOS doped polycrystalline silicon, and upper electrode 378 bag chrome-containing layers 372, nickel dam 374 and gold layer 376.Thin-film capacitor 208 comprises golden lead 380 in addition and externally is connected leads as upper and lower layer electrode 378 with 370, reaches silicon nitride layer 382 or other insulating medium materials (height lures electrostrictive coefficient), as upper and lower layer of electrode 378 and 370 s' insulation course.Thin-film capacitor 208 can be coupled to the RFID antenna to adjust its resonance frequency value; Thin-film capacitor 208 also can be used in the usefulness of power supply and signal filtering.
In addition, the present invention has four characteristics: first characteristics are that angular accelerometer is produced on the bendable base material, but not are to be produced on traditional silicon wafer.Second characteristic is to be produced on the bendable base material with active formula RFID aerial integration.The 3rd characteristic are that the material that supports well heater and temperature-sensitive sticker in the technology is to use aluminium nitride.The 4th characteristics are that capping inside can also be that half round post or semicircle are spherical.Above-mentioned first and the 3rd character of innovation is conventional condenser accelerometer or heat conduction bubble formula accelerometer, all is on silicon wafer, to make, and silicon dioxide is used as propping material, so will use high-temperature technology and cost is very expensive.Again it; The heat-conduction coefficient of the used silicon wafer substrate of traditional hot conduction bubble type accelerometer is far above the used bendable base material of the present invention, like polyethylene terephthalate (Polyethylene Terephthalate; PET); Or polyimide (Polyimide PI) waits plastic material, so the present invention is than the power saving of traditional hot conduction bubble type accelerometer.And the heat-conductive characteristic of propping material aluminium nitride of the present invention, again much larger than the used silicon dioxide of traditional hot conduction bubble type accelerometer, so the present invention is conducted the power saving of bubble type accelerometer than traditional hot, and the sensitivity meeting is higher.What will propose especially at last is that capping of the present invention inside can also be that half round post or semicircle are spherical, so the Temperature Distribution in the bubble cavity; Can arrive balance very soon, and not have sinuous flow, so can significantly promote the reaction bandwidth of this device; Angular acceleration is measured, the linearity and scope.
Technology contents of the present invention and technical characterstic disclose as above, yet those of ordinary skills still maybe be based on instruction of the present invention and announcements and done all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to the scope that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by following claim.
Claims (19)
1. the hot bubble type angular accelerometer of an employing wireless radio frequency identification tag technology comprises:
One flexible substrate;
One bottom is arranged at this flexible substrate, and this bottom has a surface;
A plurality of first grooves are formed at this bottom; And
A plurality of first sensing components, it is suspended on said a plurality of first groove, and this first sensing component comprises:
One primary heater; And
Two first temperature sensors; Each said first temperature sensor has the both ends that are used to electrically connect; Wherein said two first temperature sensors are arranged at the both sides of this primary heater symmetrically respectively, and each said temperature sensor and well heater are all arranged with radial mode entad
Wherein said a plurality of first groove is around first setting perpendicular to this surface; And said a plurality of first sensing component is suspended in said a plurality of first groove accordingly; And equate apart from this first; Wherein this primary heater of each said first sensing component and this first temperature sensor are arranged with respect to this first radially
One embedded single chip system unit, it is located on this flexible substrate, and comprises a modulation and a demodulation module; And
One RFID antenna is formed on this flexible substrate, is coupled to this modulation and demodulation module;
Wherein, Between these first temperature sensors of two these first sensing components of being connected, connect into one first pair of differential type Wheatstone bridge, and this first pair of differential type Wheatstone bridge; Be coupled to this embedded single chip system unit; Make this embedded single chip system unit, poor through the output voltage of this first pair of differential type Wheatstone bridge, calculate with respect to this angular acceleration of first; The value of this angular acceleration is seen off through this RFID antenna after this modulation and demodulation module modulation and encrypting.
2. hot bubble type angular accelerometer according to claim 1, it also comprises:
A plurality of second grooves, be formed at this surface and be positioned at one be parallel to this surface second opposite side; And
A plurality of second sensing components are suspended on these second grooves and with respect to this second rotational symmetry setting, each said second sensing component comprises accordingly:
One secondary heater; And
Two second temperature sensors, wherein this secondary heater of each said second sensing component is arranged along this direction of first with these second temperature sensors, and said two second temperature sensors are with respect to this secondary heater symmetry;
Wherein, Between these second temperature sensors of two these second sensing components of being oppositely arranged, connect into one second pair of differential type Wheatstone bridge, and this second pair of differential type Wheatstone bridge; Be coupled to this embedded single chip system unit; Make this embedded single chip system unit, poor through the output voltage of this second pair of differential type Wheatstone bridge, calculate with respect to this angular acceleration of second; The value of this angular acceleration is seen off through this RFID antenna after this modulation and demodulation module modulation and encrypting.
3. hot bubble type angular accelerometer according to claim 2, wherein the major axis of this secondary heater and this second temperature sensor is to perpendicular to this second.
4. hot bubble type angular accelerometer according to claim 2, it also comprises:
A plurality of the 3rd grooves, be formed at this surface and be positioned at one be parallel to this surface the 3rd opposite side, wherein the 3rd perpendicular to this second; And
A plurality of the 3rd sensing components are suspended on these the 3rd grooves accordingly, and with respect to the 3rd rotational symmetry, each said the 3rd sensing component comprises:
One the 3rd well heater; And
Two the 3rd temperature sensors, wherein the 3rd well heater of each said the 3rd sensing component and these the 3rd temperature sensors arrange along this direction of first, and this two the 3rd temperature sensor are symmetrical with respect to the 3rd well heater;
Wherein, Between these the 3rd temperature sensors of two these the 3rd sensing components of being oppositely arranged, connect into one the 3rd pair of differential type Wheatstone bridge, and the 3rd pair of differential type Wheatstone bridge; Be coupled to this embedded single chip system unit; Make this embedded single chip system unit, poor through the output voltage of the 3rd pair of differential type Wheatstone bridge, calculate angular acceleration with respect to the 3rd; The value of this angular acceleration is seen off through this RFID antenna after this modulation and demodulation module modulation and encrypting.
5. hot bubble type angular accelerometer according to claim 4, wherein the major axis of the 3rd well heater and the 3rd temperature sensor is to perpendicular to the 3rd.
6. hot bubble type angular accelerometer according to claim 4, wherein this RFID antenna comprises a chromium layer, a nickel dam and a gold medal layer, wherein should the gold layer with the electroless-plating gold process, be formed on this chromium layer and this nickel dam.
7. hot bubble type angular accelerometer according to claim 4, wherein this primary heater, this secondary heater and the 3rd well heater comprise nickel and chromium.
8. hot bubble type angular accelerometer according to claim 4; It also comprises inert gas and a plurality of capping of a HMW; Wherein these cappings are arranged on these first grooves, these second grooves and these the 3rd grooves accordingly, and with the inert gas seal of this HMW therebetween.
9. according to Claim 8 hot bubble type angular accelerometer, wherein the inert gas of this HMW is argon, krypton or xenon.
10. according to the hot bubble type angular accelerometer of claim 4; It also comprises a plurality of supporting constructions; These supporting constructions are arranged under these primary heaters, these first temperature sensors, these secondary heaters, these second temperature sensors, these the 3rd well heaters, these the 3rd temperature sensors accordingly, and wherein each said supporting construction is striden and is located on corresponding this first groove, this second groove or the 3rd groove.
11. hot bubble type angular accelerometer according to claim 10, wherein the material of this supporting construction is aluminium nitride or silicon nitride.
12. hot bubble type angular accelerometer according to claim 4, wherein the material of this first temperature sensor, this second temperature sensor and the 3rd temperature sensor comprises P type DOPOS doped polycrystalline silicon.
13. hot bubble type angular accelerometer according to claim 4; It also comprises an oscillation module; This oscillation module is formed on this flexible substrate; And couple with this embedded single chip system unit, this oscillation module is used to provide embedded single chip system unit one time clock signal, and wherein this oscillation module comprises at least one the first film resistance and at least one thin-film capacitor.
14. hot bubble type angular accelerometer according to claim 13, it also comprises one second sheet resistance, and this embedded single chip system unit also comprises an amplifier module, and wherein this second sheet resistance is connected in this amplifier module.
15. hot bubble type angular accelerometer according to claim 14; Wherein this thin-film capacitor comprises lower floor's electrode, a upper electrode; And the insulation course between between this upper electrode and lower electrode; Wherein this at least one the first film resistance and this second sheet resistance, with P DOPOS doped polycrystalline silicon material, this upper electrode comprises a chromium layer, a nickel dam and a gold medal layer and integrates formation.
16. hot bubble type angular accelerometer according to claim 14, wherein this amplifier module is by being made up of a plurality of instrument amplifiers.
17. hot bubble type angular accelerometer according to claim 4, its also comprise one be electrically connected to this RFID antenna rectification module, this rectification module utilizes a microwave signal to produce a direct current power supply.
18. hot bubble type angular accelerometer according to claim 1, wherein the material of this flexible substrate is polyethylene terephthalate or polyimide.
19. hot bubble type angular accelerometer according to claim 1, wherein this bottom comprises a photoresist layer.
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| CN103185810B (en) * | 2011-12-31 | 2015-11-25 | 中华大学 | Wireless type hot bubble type accelerometer and preparation method thereof |
| TWI456200B (en) | 2012-07-03 | 2014-10-11 | Univ Chung Hua | Thermal bubble angular accelerometer |
| CN103543290B (en) * | 2012-07-16 | 2015-07-22 | 中华大学 | Thermal-bubble angular accelerometer |
| CN103983184B (en) * | 2014-05-22 | 2016-09-28 | 山西大学 | A kind of angular transducer of internet of things oriented |
| CN108090552B (en) * | 2017-12-19 | 2020-12-18 | 武汉瑞纳捷电子技术有限公司 | CPC card of changeable power supply mode |
| CN112665537B (en) * | 2020-12-16 | 2022-07-08 | 武汉航空仪表有限责任公司 | Differential pressure type angle measurement system and method |
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| US5581034A (en) * | 1995-01-13 | 1996-12-03 | Remec, Inc. | Convective accelerometer and inclinometer |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
| CN1525145A (en) * | 2003-02-26 | 2004-09-01 | 祥群科技股份有限公司 | Thermal bubble type minitype inertia sensing element |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581034A (en) * | 1995-01-13 | 1996-12-03 | Remec, Inc. | Convective accelerometer and inclinometer |
| CN1525145A (en) * | 2003-02-26 | 2004-09-01 | 祥群科技股份有限公司 | Thermal bubble type minitype inertia sensing element |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
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