CN100399032C - Athermal flow speed-direction sensor based on micro mechanical system - Google Patents

Athermal flow speed-direction sensor based on micro mechanical system Download PDF

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Publication number
CN100399032C
CN100399032C CNB2006100405997A CN200610040599A CN100399032C CN 100399032 C CN100399032 C CN 100399032C CN B2006100405997 A CNB2006100405997 A CN B2006100405997A CN 200610040599 A CN200610040599 A CN 200610040599A CN 100399032 C CN100399032 C CN 100399032C
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China
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bluff body
quadrature
fixed electorde
mechanical system
substrate
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CN1851470A (en
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魏泽文
秦明
黄庆安
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Southeast University
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Southeast University
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Abstract

The present invention relates to an athermal flow velocity-direction sensor based on a micro mechanical system, which is a capacitive flow velocity-direction sensor processed by utilizing the micro mechanical system and comprises a supporting beam and a flow preventing body. The flow preventing body (2) is arranged on a substrate (7) of the sensor, and center of a circle of the flow preventing body is provided with a supporting column (1) fixed on the substrate (7); the supporting column (1) is connected with the inner circumference of the flow preventing body (2) by a plurality of isotropic damping supporting beams (8), and the flow preventing body (2) is composed of two concentric circular rings which are connected by four connecting plates (21). Annular space between the two concentric circular rings is divided into four subspace, and a first, a second, a third and a fourth orthogonal fixed electrodes (3), (4), (5) and (6) are respectively positioned in the four subspace between the two concentric circular rings. The sensor has the advantages of capacity of measuring two-dimensional wind directions, small power consumption, rapid response, low temperature drift, high reliability, etc.

Description

Athermal flow speed-direction sensor based on micro mechanical system
Technical field
The present invention relates to a kind of micromechanics Athermal flow speed-direction sensor, especially a kind of MEMS (micro mechanical system) that utilizes processes, and contains the condenser type flow speed and direction sensor of brace summer and bluff body.
Background technology
Fluid measurement all has important use in departments such as industrial and agricultural production, meteorology, environmental protection, national defence, scientific research, aviations, and wherein flow rate and direction is measured as ingredient important in the fluid measurement, has developed a lot of years.Measuring methods such as vane and weathervane measurement, pitot tube measurement, float measurement, mechanical meaurement, acoustic measurement, optical measurement, thermal conduction study measurement, electromagnetic measurement have successively appearred.It is little to have a volume based on the miniature current velocity flow direction sensor of MEMS process technology, and price is low, and the characteristics of good product consistency are the focuses of fluid sensor research in recent years.Van Putten has proposed first flow sensor based on silicon micromachining technology (Putten V in 1974, Middelheok S. " Integrated silicon anemometer " .Electron.Lett.1974 (21): 425-426), the principle of work of this sensor is based on thermal conduction study, promptly changes by the mobile thermal field that causes of measurement fluid and comes measurement flow rate to flow to information.Through the development in surplus 30 years, the hot type microfluid sensor became main flow now, particularly in the wind gage field.But the hot type microfluid sensor also has its intrinsic shortcoming.For example power consumption heat conduction big, substrate causes measuring error, zero point with environment temperature drift, response time length etc.In addition, because want convection cell heating, so just limited the application of hot type microfluid sensor aspect biological.Non-hot type microfluid sensor then can overcome above-mentioned shortcoming.Kersjes has proposed to measure method (the Kersjes R of pressure reduction, Eichholz J, Langerbein A, et al. " An integrated sensor for invasiveblood-velocity measurement " .Sensors and Actuators A, 1993,37 (38): 674-678), Oosterbroek has proposed to measure method (the Oosterbroek E of pressure drop, Lammerink J, Berenschot W, et al. " Design; reallzation and characterization of novel capacitive pressure/flow sensor " .Proc.Transducers ' 97,1997:151-154), Svedin proposed to measure method (the Svedin N of lift, Stemme E, Stemme G. " A new bi-directional gas flow sensor based on lift force " .Proc.Transducers ' 97,1997:145-148), Ng proposed to measure method (the Ng K of viscous force, Shajii K, Schmidt M A. " A liquid shear stress sensor fabricated using wafer bonding technology " .Proc Transducers ' 91,1991.931-934).At present, be exactly the little and energy measurement two dimension wind direction not of range based on the common shortcoming of the flow speed and direction sensor of non-hot type principle.
Summary of the invention
Technical matters: the purpose of this invention is to provide a kind of Athermal flow speed-direction sensor based on micro mechanical system, have can measure two-dimentional wind direction, power consumption is little, response is fast, temperature is floated little and advantage such as good reliability.
Technical scheme: the present invention is a kind of Athermal flow speed-direction sensor based on micro mechanical system, and this invention is the condenser type flow speed and direction sensor that is used to measure rate of flow of fluid and flows to signal.This sensor comprises the vertical bluff body of several brace summers that the isotropy damping can be provided, beam upper support, vertical electrode and stationary substrate and the lead-in wire that quadrature is provided with; On substrate, be provided with bluff body, be provided with a pillar that is fixed on the substrate in the center of circle of bluff body, be connected by many isotropy damping brace summers between the inner periphery of pillar and bluff body; Bluff body is made of two concentric annulus, connected by four web joints between two concentric annulus and the annular space between two concentric annulus is divided into four sub spaces, the first quadrature fixed electorde, the second quadrature fixed electorde, the 3rd quadrature fixed electorde, the 4th quadrature fixed electorde lay respectively in four sub spaces between two concentric annulus; Described pillar, brace summer, bluff body material are the N-type semiconductor silicon of conduction; Described mount supports beam and bluff body structure form by bonding techniques.
When sensor was in the fluid, fluid flowed bluff body is produced pressure, and bluff body transfers the pressure on the brace summer, brace summer generation strain, and vertical bluff body is subjected to displacement with respect to fixing vertical electrode, thus capacitance between the two changes.By the size variation of electric capacity between four groups of electrodes measuring quadrature, just can obtain flow velocity and flow to information.Promptly obtain flowing to information with flow velocity by measuring quadrature electric capacity differential variation that fluid is subjected to displacement bluff body to bring.Isotropy damping brace summer and bluff body had both served as movable displacement component, served as the electrode of measuring capacitance variations again.
Beneficial effect: the present invention can adopt the manufacturing of MEMS process technology, and method for making and structure are all comparatively simple, good reliability.Traditional heat type fluid sensor is by heater block is set, and allows the fluid heater block of flowing through again, measures the variation of thermal field or the temperature variation of heater block and obtains flow velocity and flow to information.Owing to want the convection cell heating, power consumption is big, temperature effect is obvious.The present invention adopts mechanics principle to measure, and by measuring fluid the displacement that the acting force of bluff body causes is obtained flow velocity and flows to information.Thereby avoided this defective.Traditional non-heat type fluid sensor utilizes bernoulli principle to measure pressure reduction or pressure drop mostly, can not obtain two-dimensional directional information.The present invention's employing is provided with the quadrature fixed electorde and solves this problem, by detecting the changes in capacitance between the mutually orthogonal electrode respectively, can obtain the directional information of two dimension.The present invention adopts capacitance type structure to detect, and temperature drift is little, and is highly sensitive, and antijamming capability is strong.The N-type semiconductor silicon chip that utilizes surface oxidation is as structured material, form the space between the electrode by ICP (plasma enhancing etching), then pillar and glass bonding are fixed and lead-in wire to finish, formed the release of brace summer and bluff body at last again by ICP.Discharge the formation space with traditional sacrifice layer and compare, the bonding method of this novelty can form vertical electrode gap, has effectively increased initial capacitance and sensitivity.And realize fixing and lead-in wire by silicon and glass bonding because be.Can effectively reduce stray capacitance.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Pillar 1 is arranged, bluff body 2, the first quadrature fixed electordes 3, the second quadrature fixed electorde 4, the 3rd quadrature fixed electorde 5, the 4th quadrature fixed electorde 6, substrate 7, isotropy damping brace summer 8 among the above figure.
Embodiment
The present invention is a kind of fluid sensor that measurement flow rate flows to that is used for.By pillar 1, bluff body 2, the first quadrature fixed electordes 3, the second quadrature fixed electorde 4, the 3rd quadrature fixed electorde 5, the 4th quadrature fixed electorde 6, substrate 7, isotropy damping brace summer 8 constitutes.Substrate 7 is a glass, and is leaded on it.Pillar 1 and glass are bonded together, and the first quadrature fixed electorde 3, the second quadrature fixed electorde 4, the 3rd quadrature fixed electorde 5, the 4th quadrature fixed electorde 6 also all are bonded together with glass.The material of pillar 1, brace summer 8 and bluff body 2 is a N-type semiconductor silicon, is obtained by two-sided twice corrosion.As shown in Figure 1, promptly the first quadrature fixed electorde 3, the second quadrature fixed electorde 4, the 3rd quadrature fixed electorde 5, the 4th quadrature fixed electorde 6 constitute four electric capacity for the bluff body 2 of conduction and four fixed electordes.Bluff body 2 is connected from glass substrate 7 lead-in wires by brace summer 8 and pillar 1.When fluid acted on bluff body 2, bluff body 2 was stressed, the direction of power with flow to identically, the size of power depends on the flow velocity size.Brace summer 8 provides isotropic damping.Bluff body 2 produces in-plane displancement on the flow velocity direction.Four capacitance size change.The value that changes depends on the direction and the size of bluff body 2 displacements.So the size variation of measuring four electric capacity just can obtain the information of the flow velocity and the flow direction.
The manufacturing process of this ratio sensor is: prepare N-type semiconductor silicon chip 1#; Back-etching N-type semiconductor silicon chip forms the step of bluff body 2; Back-etching N-type semiconductor silicon chip forms the step of brace summer 8; Glass 7 splash-proofing sputtering metals lead-in wire; The N-type semiconductor silicon chip 1# back side and glass 7 bondings; Positive etching N N-type semiconductor N silicon chip 1# forms bluff body 2, brace summer 8, the first quadrature fixed electorde 3, the second quadrature fixed electorde 4, the 3rd quadrature fixed electorde 5, the 4th quadrature fixed electorde 6 and pillar 1.
Isotropy damping brace summer 8 is connected in series mutually by a plurality of hollow rhombuses and forms.
It is glass material that substrate 7 adopts, and pillar 1 and bluff body 2 adopt the N-type semiconductor silicon materials.

Claims (2)

1. Athermal flow speed-direction sensor based on micro mechanical system, this sensor comprises: severally can provide the vertical bluff body (2) of isotropy damping brace summer (8), beam upper support, vertical electrode and stationary substrate (7) and the lead-in wire that quadrature is provided with; On substrate (7), be provided with bluff body (2), be provided with a pillar (1) that is fixed on the substrate (7) in the center of circle of bluff body (2), be connected by many isotropy damping brace summers (8) between the inner periphery of pillar (1) and bluff body (2); Bluff body (2) is made of two concentric annulus, connected by four web joints between two concentric annulus and the annular space between two concentric annulus is divided into four sub spaces, the first quadrature fixed electorde (3), the second quadrature fixed electorde (4), the 3rd quadrature fixed electorde (5), the 4th quadrature fixed electorde (6) lay respectively in four sub spaces between two concentric annulus; The material of described pillar (1), brace summer (8), bluff body (2) is the N-type semiconductor silicon of conduction; The structure of mount supports beam (8) and the bluff body that suspends (2) forms by bonding techniques.
2. the Athermal flow speed-direction sensor based on micro mechanical system according to claim 1 is characterized in that: the brace summer of described isotropy damping (8) is connected in series mutually by a plurality of hollow rhombuses and forms.
CNB2006100405997A 2006-05-29 2006-05-29 Athermal flow speed-direction sensor based on micro mechanical system Expired - Fee Related CN100399032C (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101646948B (en) * 2007-02-01 2013-09-25 法国空中客车公司 Device and method for measuring the flow speed and direction of a gaseous fluid

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3433227B2 (en) * 2001-02-05 2003-08-04 東京大学長 Flow rate sensor element, flow rate sensor, method of manufacturing flow rate sensor element, method of manufacturing flow rate sensor, and method of measuring flow rate
CN1441253A (en) * 2003-04-09 2003-09-10 重庆大学 Full-optical silicon microresonant two-dimensional acceleration sensor
JP2004061412A (en) * 2002-07-31 2004-02-26 Horiba Ltd Fluid sensor
CN1480733A (en) * 2002-07-26 2004-03-10 ���µ繤��ʽ���� Semiconductor acceleration sensor adopting dopted semiconductor layer as wiring
CN1588091A (en) * 2004-10-14 2005-03-02 东南大学 Wind speed sensor based on micro mechanic working and its producing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3433227B2 (en) * 2001-02-05 2003-08-04 東京大学長 Flow rate sensor element, flow rate sensor, method of manufacturing flow rate sensor element, method of manufacturing flow rate sensor, and method of measuring flow rate
CN1480733A (en) * 2002-07-26 2004-03-10 ���µ繤��ʽ���� Semiconductor acceleration sensor adopting dopted semiconductor layer as wiring
JP2004061412A (en) * 2002-07-31 2004-02-26 Horiba Ltd Fluid sensor
CN1441253A (en) * 2003-04-09 2003-09-10 重庆大学 Full-optical silicon microresonant two-dimensional acceleration sensor
CN1588091A (en) * 2004-10-14 2005-03-02 东南大学 Wind speed sensor based on micro mechanic working and its producing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101646948B (en) * 2007-02-01 2013-09-25 法国空中客车公司 Device and method for measuring the flow speed and direction of a gaseous fluid

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