CN1514760A - 可调节力作用空气台板与主轴系统及其使用方法 - Google Patents
可调节力作用空气台板与主轴系统及其使用方法 Download PDFInfo
- Publication number
- CN1514760A CN1514760A CNA02811065XA CN02811065A CN1514760A CN 1514760 A CN1514760 A CN 1514760A CN A02811065X A CNA02811065X A CN A02811065XA CN 02811065 A CN02811065 A CN 02811065A CN 1514760 A CN1514760 A CN 1514760A
- Authority
- CN
- China
- Prior art keywords
- polishing pad
- air
- platen
- pallet body
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims abstract description 107
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000013461 design Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000012190 activator Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
- B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/823,593 US6561870B2 (en) | 2001-03-30 | 2001-03-30 | Adjustable force applying air platen and spindle system, and methods for using the same |
US09/823,593 | 2001-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1514760A true CN1514760A (zh) | 2004-07-21 |
CN1236895C CN1236895C (zh) | 2006-01-18 |
Family
ID=25239183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB02811065XA Expired - Fee Related CN1236895C (zh) | 2001-03-30 | 2002-03-29 | 化学机械平整系统,化学机械抛光系统和可调台板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6561870B2 (zh) |
EP (1) | EP1381492A1 (zh) |
JP (1) | JP2004524700A (zh) |
KR (1) | KR20030087028A (zh) |
CN (1) | CN1236895C (zh) |
TW (1) | TW533493B (zh) |
WO (1) | WO2002078901A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100369713C (zh) * | 2005-04-11 | 2008-02-20 | 广东工业大学 | 一种化学机械法金刚石膜抛光装置及其抛光方法 |
CN1987661B (zh) * | 2005-12-22 | 2011-06-08 | 优志旺电机株式会社 | 平面载物台装置 |
CN103817589A (zh) * | 2012-11-15 | 2014-05-28 | 株式会社荏原制作所 | 基板保持装置以及研磨装置 |
CN106670970A (zh) * | 2016-12-23 | 2017-05-17 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种用于cmp设备的抛光垫活化器施压机构及其运行方法 |
CN107116460A (zh) * | 2016-02-24 | 2017-09-01 | 台湾积体电路制造股份有限公司 | 半导体制造装置、系统及方法 |
CN107666985A (zh) * | 2015-04-27 | 2018-02-06 | 菲尔罗伯蒂克斯顺从式机器人技术有限公司 | 表面加工设备 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6939203B2 (en) * | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
US20050118932A1 (en) * | 2003-07-03 | 2005-06-02 | Homayoun Talieh | Adjustable gap chemical mechanical polishing method and apparatus |
US20050221736A1 (en) * | 2004-03-30 | 2005-10-06 | Nikon Corporation | Wafer polishing control system for chemical mechanical planarization machines |
US6886387B1 (en) * | 2004-04-28 | 2005-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Brush pressure calibration apparatus and method |
KR20080098155A (ko) * | 2007-05-04 | 2008-11-07 | 엘지전자 주식회사 | 곡면과 평면에 걸쳐 헤어라인이 연속 가공된 금속판재,곡면과 평면을 포함한 금속판재의 연속 헤어라인 가공 장치및 방법 |
CN102273329B (zh) * | 2008-12-10 | 2014-09-10 | 朗姆研究公司 | 清洁硅电极的沉浸式氧化和蚀刻方法 |
KR101941586B1 (ko) * | 2011-01-03 | 2019-01-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 압력 제어되는 폴리싱 플래튼 |
KR102503611B1 (ko) * | 2017-11-23 | 2023-02-24 | 주식회사 케이씨텍 | 기판 처리 장치 |
WO2019236678A1 (en) * | 2018-06-06 | 2019-12-12 | 240 Tech Llc | Reconfigurable support pads for fabric image transfers |
US11717936B2 (en) * | 2018-09-14 | 2023-08-08 | Applied Materials, Inc. | Methods for a web-based CMP system |
KR102597763B1 (ko) * | 2018-10-23 | 2023-11-03 | 주식회사 케이씨텍 | 기판 처리 장치 |
WO2020139605A1 (en) | 2018-12-26 | 2020-07-02 | Applied Materials, Inc. | Polishing system with platen for substrate edge control |
CN109759954B (zh) * | 2019-03-19 | 2024-04-26 | 王承辉 | 打磨抛光力度控制装置及含有该装置的自动打磨抛光设备 |
US11919120B2 (en) * | 2021-02-25 | 2024-03-05 | Applied Materials, Inc. | Polishing system with contactless platen edge control |
CN114260775B (zh) * | 2021-11-29 | 2022-09-20 | 漳州市盈励塑胶制品有限公司 | 圆孔抛光去毛刺机构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593344A (en) * | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
US5916012A (en) * | 1996-04-26 | 1999-06-29 | Lam Research Corporation | Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher |
US6111634A (en) * | 1997-05-28 | 2000-08-29 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5980368A (en) * | 1997-11-05 | 1999-11-09 | Aplex Group | Polishing tool having a sealed fluid chamber for support of polishing pad |
US6186865B1 (en) * | 1998-10-29 | 2001-02-13 | Lam Research Corporation | Apparatus and method for performing end point detection on a linear planarization tool |
US6419559B1 (en) * | 2000-07-10 | 2002-07-16 | Applied Materials, Inc. | Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet |
-
2001
- 2001-03-30 US US09/823,593 patent/US6561870B2/en not_active Expired - Lifetime
-
2002
- 2002-03-26 TW TW091105833A patent/TW533493B/zh not_active IP Right Cessation
- 2002-03-29 KR KR10-2003-7012660A patent/KR20030087028A/ko not_active Application Discontinuation
- 2002-03-29 WO PCT/US2002/009674 patent/WO2002078901A1/en active Application Filing
- 2002-03-29 JP JP2002577150A patent/JP2004524700A/ja active Pending
- 2002-03-29 EP EP02733909A patent/EP1381492A1/en not_active Withdrawn
- 2002-03-29 CN CNB02811065XA patent/CN1236895C/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100369713C (zh) * | 2005-04-11 | 2008-02-20 | 广东工业大学 | 一种化学机械法金刚石膜抛光装置及其抛光方法 |
CN1987661B (zh) * | 2005-12-22 | 2011-06-08 | 优志旺电机株式会社 | 平面载物台装置 |
CN103817589A (zh) * | 2012-11-15 | 2014-05-28 | 株式会社荏原制作所 | 基板保持装置以及研磨装置 |
CN103817589B (zh) * | 2012-11-15 | 2017-08-25 | 株式会社荏原制作所 | 基板保持装置以及研磨装置 |
CN107666985A (zh) * | 2015-04-27 | 2018-02-06 | 菲尔罗伯蒂克斯顺从式机器人技术有限公司 | 表面加工设备 |
CN107116460A (zh) * | 2016-02-24 | 2017-09-01 | 台湾积体电路制造股份有限公司 | 半导体制造装置、系统及方法 |
CN107116460B (zh) * | 2016-02-24 | 2020-10-16 | 台湾积体电路制造股份有限公司 | 半导体制造装置、系统及方法 |
CN106670970A (zh) * | 2016-12-23 | 2017-05-17 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种用于cmp设备的抛光垫活化器施压机构及其运行方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2002078901A1 (en) | 2002-10-10 |
EP1381492A1 (en) | 2004-01-21 |
TW533493B (en) | 2003-05-21 |
KR20030087028A (ko) | 2003-11-12 |
US6561870B2 (en) | 2003-05-13 |
US20020142710A1 (en) | 2002-10-03 |
CN1236895C (zh) | 2006-01-18 |
JP2004524700A (ja) | 2004-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: APPLIED MATERIAL CO., LTD. Free format text: FORMER OWNER: LAMB RESEARCH CO., LTD. Effective date: 20090612 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090612 Address after: American California Patentee after: Applied Materials Inc. Address before: American California Patentee before: Lam Research Corp. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: American California Patentee after: Applied Materials Inc. Address before: American California Patentee before: Applied Materials Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060118 Termination date: 20150329 |
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EXPY | Termination of patent right or utility model |