CN1514759A - 焊媒添加剂 - Google Patents

焊媒添加剂 Download PDF

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CN1514759A
CN1514759A CNA028114663A CN02811466A CN1514759A CN 1514759 A CN1514759 A CN 1514759A CN A028114663 A CNA028114663 A CN A028114663A CN 02811466 A CN02811466 A CN 02811466A CN 1514759 A CN1514759 A CN 1514759A
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acid
solder
ester
solder paster
additive
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CN1262389C (zh
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黛博拉·马伦
安德鲁·大卫·普里斯
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莱拉·约瑟芬·塞凯拉
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罗伯特·德里克·威廉斯
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lubricants (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

本发明提供一种焊锡膏制剂，其含有焊锡膏粉末和非水性的焊媒，其特征在于，所述焊媒中含有至少一种润滑添加剂，该添加剂是支链的脂肪醇或脂肪酸或它们的酯。本发明的焊锡膏在印刷过程中具有改善的从模板释放的优点，并因此适用于精细间距的雕板印刷。

Description

焊媒添加剂
技术领域
本发明涉及一种焊媒(soldering flux vehicle)，其含有一种用来增强精细间距的雕版印刷的添加剂，并涉及用在电子工业中的焊锡膏，其用所述焊媒制备。
背景技术
在电子工业中有向自动化制造印刷电路板(PCBs)的趋向和向具有越来越精细间距的电子装置小型化的趋向。焊锡膏通常通过不锈钢的或经电铸的模板而印刷到基材上。用于PCB制造的工业标准模板的厚度通常为0.125mm或0.150mm，并需要含有直径为25-45微米的焊剂粉末颗粒的焊锡膏以在0.5mm的间距印刷0.25mm直径的孔穴。
焊锡膏从不锈钢的或经电铸的模板释放，并且随后的在PCB上印刷的垫片的确定受焊锡膏，特别是焊媒的化学性质的影响。焊锡膏必需有一定的“粘着性”，以使得元件可被准确地放置在经印刷的焊锡膏垫片的位置处而没有损失。然而，将元件保持在所述位置处的焊锡膏的粘着度常常阻止了焊锡膏通过模板在基材上的良好印刷，也就是说，可能阻止焊锡膏在印刷上的良好的孔穴释放。
因此，有改进焊媒和焊锡膏制剂的需求，经改进的焊媒和焊锡膏制剂可以在印刷过程中改善从模板的释放，同时保持焊锡膏内在的粘着度从而阻止在元件装配到PCB的位置上的过程中元件的损失。
发明内容
因此，本发明提供一种焊锡膏制剂，其含有焊锡膏粉末和非水性的焊媒，其特征在于所述焊媒含有至少一种润滑添加剂，该添加剂是支链的脂肪醇或脂肪酸或它们的酯，所述支链的脂肪醇或脂肪酸含有总数为8-50个碳原子，其中在较短的烷链上有至少4个碳原子。
用在本发明的特别优选的润滑添加剂是含有支链的脂肪醇或脂肪酸或它们的酯的那些润滑添加剂，其中支化点是在第二个碳原子处。这些化合物通常被称为格尔伯特醇或格尔伯特酸。
用在本发明中的格尔伯特醇和格尔伯特酸的具体例子是2-丁基-1-辛醇、2-丁基-1-癸醇、2-己基-1-辛醇、2-己基-1-癸醇、2-己基-1-十二烷醇、2-辛基-1-十二烷醇、2-癸基-1-十四烷醇、2-丁基辛酸、2-丁基癸酸、2-己基癸酸、2-己基十二烷酸、2-辛基十二烷酸、2-癸基十四烷酸或2-十六烷基二十烷酸。
所述润滑添加剂可以是上述脂肪醇与脂肪酸、二元酸或三元酸的酯。其例子是硬脂酸酯、油酸酯、棕榈酸酯、异硬脂酸酯、己二酸酯、苯三酸酯、硫代二丙酸酯或季戊四醇酯。
本发明的焊锡膏组合物一般含有75-95重量％的焊剂粉末，优选为85-90重量％的焊剂粉末。所述焊剂粉末通常具有10-80微米的平均颗粒大小，优选为25-45微米。
焊锡膏由合适的合金成分形成，例如SnPb(如Sn37Pb63)、SnPbBi、SnBi、SnPbAg、SnAgCu、SnAgCuBi、SnZnBi。
在本发明的焊锡膏组合物中使用的焊媒通常含有至少一种极性有机溶剂，例如包括乙二醇、二甘醇、丙二醇、山梨醇、季戊四醇的多元醇和它们的衍生物，丁基二甘醇二甲醚、衣康酸二丁基酯、二(丙二醇)丁基醚、2-乙基己基二甘醇、γ-丁内酯、己基卡必醇、N-甲基吡咯烷酮、N-乙基吡咯烷酮、萜品醇或四甘醇二甲醚。特别优选三(丙二醇)丁基醚。
如果需要，所述焊媒通常还含有一种或多种增稠剂，其能够改变焊媒的流变特性。合适的增稠剂包括聚丙烯酸、加氢的蓖麻油和它们的衍生物、聚酰胺或树脂，其含量最高为30重量％。
这可能也是必要的，即加入其他的组分到焊媒中以提供例如用于焊剂回流的助熔活性。可以使用本领域专业人员已知的典型的助熔添加剂。在焊锡膏组合物中可含有最高7重量％的活性剂。其他的添加剂可包括小于5重量％水平的粘合剂和/或抗氧化剂和/或表面活性剂。
本发明的焊锡膏含有0-1-2重量％的润滑添加剂。
本发明的焊锡膏在印刷过程中具有改善的从模板释放的优点，并因此适用于精细间距的雕板印刷。
下列非限制的实施例举例说明了本发明。
具体实施方式
实施例1-10
用表1中给出的下列组分制成一些助熔剂凝胶，然后其与焊剂粉末(25-45微米直径的Sn62Pb36Ag2)混合而制得含10％助熔剂凝胶和90％焊剂粉末的焊锡膏。
表1
实施例序号元件     比较例     1     2     3      4   5   6     7     8     9     10
    ％     ％     ％     ％     ％   ％   ％     ％     ％     ％     ％
  松脂(KE604)     40     35     35     35     35   35   35     35     35     35     35
  TPNB     54     54     54     54     54   54   54     58     39     58     39
  苯乙烯二溴化物     2     2     2     2     2   2   2     2     2     2     2
  Thixatrol +     4     4     4     4     4   4   4     4     4     4     4
  Isocarb 24     5   2.5   4     1     20
  Isocarb 36     5
  Isocarb酯1605     5   2.5   1     1     20
  Isofol 24     5
表的脚注
松脂(KE604)           Arakawa    酸改性的加氢的松脂
TPNB                  DOW        三(丙二醇)丁基醚
Thixatrol+            Rheox      流变添加剂
Isocarb 24            Condea     2-癸基十四烷酸
Isocarb36             Condea     2-十六烷基二十烷酸
Isocarb酯1605         Condea     2-己基癸酸-季戊四醇酯
Isofol 24         Condea        2-癸基十四烷醇
用0.125mm厚的电铸模板和在MPM AP27印刷机上通过一系列的250微米的孔穴印刷每种焊锡膏。
用视觉检验第一、第五和第十种印刷并用视觉标准比较。此外第一印刷的外观在90和45度下用SPIDA(焊锡膏检验数据分析仪)记录。
用来判断评价印刷清晰度的视觉标准用图1描述。根据图1，T表示模板厚度，A表示孔穴直径，D表示所述焊锡膏的直径，H表示所述焊锡膏的高度。给出了下列的评价体系。
  等级   描述     数据
    1   没有焊锡膏或几乎没有焊锡膏     D＜1/2AH＜1/3T
    2   多于1/2的垫片区域被覆盖但是不足够高     D＞1/2AH＜2/3T
    3   多于2/3垫片区域被覆盖，焊锡膏达到相同的高度     D＞2/3A对于＜1/3A，H＝T
    4   多于2/3垫片区域被覆盖，顶部的直径＞孔穴的1/3     D＞2/3A对于＜1/2A，H＝T
5   最好的覆盖，如模板孔穴相同的形状     D＝A对于＞2/3A，H＝T
结果
视觉检验的结果列于下表2
    实施例   添加剂(％)     等级
    比较例   无     2
    1   Isocarb 24     3
    2   Isocarb 36     5
    3   Isocarb酯1605     4
    4   Isofol 24     4
    5   Isocarb 24(2.5)/Isocarb酯1605(2.5)     4
    6   Isocarb 24(4)/Isocarb酯1605(1)     3
    7   Isocarb 24(1)     3
    8   Isocarb 24(20)     4
    9   Isocarb酯1605(1)     3
    10   Isocarb酯1605(20)     3
从表2给出的结果可以看出，与用不含润滑添加剂的助熔剂凝胶制得的焊锡膏相比，用含有润滑添加剂的助熔剂凝胶制得的焊锡膏具有改善了的印刷清晰度。

Claims (10)

1.一种焊锡膏制剂，其含有焊锡膏粉末和非水性的焊媒，其特征在于，所述焊媒含有至少一种润滑添加剂，该润滑添加剂是支链的脂肪醇或脂肪酸或它们的酯，所述支链的脂肪醇或脂肪酸含有总数为8-50个碳原子，其中在较短的烷链中有至少4个碳原子。
2.根据权利要求1所述的焊锡膏制剂，其中所述添加剂是支链的脂肪醇或脂肪酸，其中的支化点在第二个碳原子处。
3.根据权利要求1或2所述的焊锡膏制剂，其中所述添加剂是2-丁基-1-辛醇、2-丁基-1-癸醇、2-己基-1-辛醇、2-己基-1-癸醇、2-己基-1-十二烷醇、2-辛基-1-十二烷醇、2-癸基-1-十四烷醇、2-丁基辛酸、2-丁基癸酸、2-己基癸酸、2-己基十二烷酸、2-辛基十二烷酸、2-癸基十四烷酸或2-十六烷基二十烷酸。
4.根据权利要求1或2所述的焊锡膏制剂，其中所述添加剂是所述的脂肪醇与脂肪酸、二元酸或三元酸的酯。
5.根据权利要求4所述的焊锡膏制剂，其中所述酯是硬脂酸酯、油酸酯、棕榈酸酯、异硬脂酸酯、己二酸酯、苯三酸酯、硫代二丙酸酯或季戊四醇酯。
6.根据上述权利要求之一所述的焊锡膏制剂，其含有75-95重量％焊剂粉末。
7.根据权利要求6所述的焊锡膏制剂，其中焊剂粉末是SnPb、SnPbBi、SnBi、SnPbAg、SnAgCu、SnAgCuBi或SnZnBi的合金成分。
8.根据上述权利要求之一所述的焊锡膏制剂，其中所述焊剂粉末具有10-80微米的平均颗粒尺寸。
9.根据权利要求8所述的焊锡膏制剂，其中所述焊剂粉末具有25-45微米的平均颗粒尺寸。
10.根据上述权利要求之一所述的焊锡膏制剂，其含有0.1-2重量％的润滑添加剂。
CNB028114663A 2001-06-07 2002-05-02 焊媒添加剂 Expired - Fee Related CN1262389C (zh)

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GB0113897.3 2001-06-07
GB0113897A GB2376200B (en) 2001-06-07 2001-06-07 Soldering flux vehicle additive

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CN1514759A true CN1514759A (zh) 2004-07-21
CN1262389C CN1262389C (zh) 2006-07-05

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CN104203492B (zh) * 2012-04-05 2015-09-30 千住金属工业株式会社 助焊剂及焊膏
JP5731555B2 (ja) * 2013-01-29 2015-06-10 株式会社タムラ製作所 フラックスおよびソルダペースト
US10300090B2 (en) 2017-03-15 2019-05-28 Orca Biosystems, Inc. Compositions of hematopoietic stem cell transplants
JP7312534B2 (ja) * 2018-09-28 2023-07-21 株式会社タムラ製作所 微小チップ部品用はんだ組成物

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CN104827198A (zh) * 2015-04-28 2015-08-12 苏州永创达电子有限公司 一种焊锡膏

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WO2002098601A1 (en) 2002-12-12
CN1262389C (zh) 2006-07-05
JP2005505422A (ja) 2005-02-24
DE60216922T2 (de) 2007-07-05
GB0113897D0 (en) 2001-08-01
CA2449849A1 (en) 2002-12-12
EP1406745A1 (en) 2004-04-14
ATE348683T1 (de) 2007-01-15
GB2376200A (en) 2002-12-11
BR0210286B1 (pt) 2010-10-05
GB2376200B (en) 2005-03-02
BR0210286A (pt) 2004-06-29
DE60216922D1 (de) 2007-02-01
EP1406745B1 (en) 2006-12-20

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