CN1513812A - Ceramic particle reinforced composite brazing alloy used for ceramic soldering - Google Patents
Ceramic particle reinforced composite brazing alloy used for ceramic soldering Download PDFInfo
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- CN1513812A CN1513812A CNA031324622A CN03132462A CN1513812A CN 1513812 A CN1513812 A CN 1513812A CN A031324622 A CNA031324622 A CN A031324622A CN 03132462 A CN03132462 A CN 03132462A CN 1513812 A CN1513812 A CN 1513812A
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Abstract
A ceramic particles reinforced composite solder for the soldering of ceramics is prepared from the mixture of Ag powder (65-79 wt.%), Cu powder (20-30) and Ti powder (1-5) and ceramic particles through mixing in ratio of 75-97 vol%: 3-25 vol%. Its advantages are high isotropism and good mechanical distribution in soldered position.
Description
Technical field: the present invention relates to a kind of composition that is used for the brazing solder of fine ceramics connection.
Background technology: in ceramic brazing process, relatively Chang Yong solder is an active solder, this solder has excellent wetting capacity energy, good air-tightness, but because stupalith has lower thermal expansivity with respect to solder alloy, make the bigger coefficient of thermal expansion differences of existence between stupalith and the solder, cause that ceramic joint after the soldering is inner to exist very high unrelieved stress, thereby make that the mechanical property of joint is poor after the soldering.The composite soldering method for welding is compared with common active solder soldering, owing to added wild phase in the solder, make the thermal expansivity of solder integral body reduce, thereby make and mate more between the thermal expansivity of solder and stupalith, help reducing the unrelieved stress of joint after the soldering.But present employed composite soldering mainly is to use fibre-reinforced composite soldering.The composite solderings that the people studied such as Jimin.Cao (Welding Journal as the U.S., Jan.1992:pp21s～24s.), (71.7wt～%Ag, 28wt～%Cu and 0.3wt～%Li) the middle method that adds the nickel plating short carbon fiber has prepared a kind of solder to Powdered silver-bearing copper eutectic solder Bag8a.Wherein the length of carbon fiber is 400 μ m, and by the vacuum coat technology, at carbon fiber outsourcing one deck nickel, the weight ratio of final fiber is 70wt～%Ni and 30wt～%C.When being 20.0%, the volume ratio of nickel plating fiber can obtain the joint that shearing resistance is 8.86 ± 1.16MPa behind this solder brazing.Than volume content is that 0% solder intensity has had large increase.But can not react between carbon fiber itself and the solder, thereby just must carry out Nickel Plating Treatment at fiber surface, making the brazing process more complicated needs to add very big pressure, thereby has limited its application in addition in the brazing process.
Summary of the invention: the object of the present invention is to provide a kind of ceramic granule reinforced composite material that is used for ceramic soldering, it has the technological process of simplification, increases work efficiency, reduces the requirement to brazing equipment, the characteristics of strength of joint height, solder highly versatile.The present invention be the metal-powder A that mixes by Ag powder, Cu powder, Ti powder and ceramic particle B by volume percentage mix form; Metal-powder A accounts for 75～97%, ceramic particle B accounts for 3～25%; Metal-powder A mixes by weight percentage; The Ag powder accounts for 65～79%, the Cu powder accounts for 20～30%, the Ti powder accounts for 1～5%; The diameter of ceramic particle B is 1 μ m～10 μ m.The present invention compares with existing fibre-reinforced composite soldering:
1, wild phase does not need special surface treatment, just can guarantee that the solder matrix has good wetting wild phase particle, makes that corresponding technological process obtains simplifying, and has improved working efficiency.
2, the use of granular wild phase requires to reduce for the force value to workpiece in the brazing process, only needs 0.05MPa, and for fibre-reinforced composite soldering, its corresponding force value is 10MPa.The requirement that this can reduce brazing equipment makes the easier realization of brazing process.
3, for fibrous wild phase, the ordered state of fiber has a significant impact for the final performance of joint, make the thermal expansivity on the different directions that bigger difference is arranged simultaneously, make stressed condition more complicated after the joint brazing, and attempt to realize the fibre array direction is controlled relatively difficulty.By comparison, ceramic particle wild phase enhanced composite soldering has good isotropy, and this can guarantee the good mechanical distribution characteristics of ceramic joint after the soldering.
Embodiment one: present embodiment be the metal-powder A that mixes by Ag powder, Cu powder, Ti powder and ceramic particle B by volume percentage mix form; Metal-powder A accounts for 75～97%, ceramic particle B accounts for 3～25%.
Embodiment two: metal-powder A accounts for 80～90% in the composite soldering of present embodiment, and ceramic particle B accounts for 10～20%.
Embodiment three: metal-powder A accounts for 85% in the composite soldering of present embodiment, and ceramic particle B accounts for 15%.
Embodiment four: the metal-powder A of present embodiment mixes by weight percentage; The Ag powder accounts for 65～79%, the Cu powder accounts for 20～30%, the Ti powder accounts for 1～5%.
Embodiment five: the Ag powder accounts for 68～76% among the metal-powder A of present embodiment, the Cu powder accounts for 22～29%, the Ti powder accounts for 2～4%.
Embodiment six: the Ag powder accounts for 71% among the metal-powder A of present embodiment, the Cu powder accounts for 27%, the Ti powder accounts for 2%.
Embodiment seven: the diameter of present embodiment ceramic particle B is 1 μ m～10 μ m.
Embodiment eight: the diameter of present embodiment ceramic particle B is 3 μ m～9 μ m.
Embodiment nine: the diameter of present embodiment ceramic particle B is 8 μ m.
Six blending means is ordinary method from embodiment one to embodiment.
Claims (9)
1, the ceramic granule reinforced composite material that is used for ceramic soldering, it is characterized in that it be the metal-powder A that mixes by Ag powder, Cu powder, Ti powder and ceramic particle B by volume percentage mix form; Metal-powder A accounts for 75～97%, ceramic particle B accounts for 3～25%.
2, the ceramic granule reinforced composite material that is used for ceramic soldering according to claim 1 is characterized in that metal-powder A accounts for 80～90% in the composite soldering, and ceramic particle B accounts for 10～20%.
3, the ceramic granule reinforced composite material that is used for ceramic soldering according to claim 1 is characterized in that metal-powder A accounts for 85% in the composite soldering, and ceramic particle B accounts for 15%.
4, according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering, it is characterized in that metal-powder A mixes by weight percentage; The Ag powder accounts for 65～79%, the Cu powder accounts for 20～30%, the Ti powder accounts for 1～5%.
5,, it is characterized in that among the metal-powder A that the Ag powder accounts for 68～76%, the Cu powder accounts for 22～29%, the Ti powder accounts for 2～4% according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering.
6,, it is characterized in that among the metal-powder A that the Ag powder accounts for 71%, the Cu powder accounts for 27%, the Ti powder accounts for 2% according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering.
7, according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering, the diameter that it is characterized in that ceramic particle B is 1 μ m～10 μ m.
8, according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering, the diameter that it is characterized in that ceramic particle B is 3 μ m～9 μ m.
9, according to claim 1, the 2 or 3 described ceramic granule reinforced composite materials that are used for ceramic soldering, the diameter that it is characterized in that ceramic particle B is 8 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNA031324622A CN1513812A (en) | 2003-06-26 | 2003-06-26 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
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| CNA031324622A CN1513812A (en) | 2003-06-26 | 2003-06-26 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
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| CN1513812A true CN1513812A (en) | 2004-07-21 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100457371C (en) * | 2007-03-12 | 2009-02-04 | 贵研铂业股份有限公司 | Mixed powder solder and its production process |
| DE102009060938A1 (en) | 2009-12-22 | 2011-06-30 | HTM Reetz GmbH, 12555 | Method for producing sealed ceramic-ceramic-compound and ceramic-metal-compound, comprises soldering the compound using a metallic solder, where the first metallic solder zone is converted in a chemical-thermal process |
| CN102554385A (en) * | 2011-12-13 | 2012-07-11 | 河南科技大学 | Brazing and casting process of metal ceramic composite lining board |
| CN101224992B (en) * | 2006-01-17 | 2013-01-02 | 气体产品与化学公司 | Method of forming a ceramic to ceramic joint |
| CN103056553A (en) * | 2013-01-18 | 2013-04-24 | 哈尔滨工业大学 | Solder, preparation method thereof and method for connecting sapphire and niobium or niobium alloys by using solder |
| CN105397336A (en) * | 2015-12-30 | 2016-03-16 | 哈尔滨工业大学 | Composite brazing filler material for sealing flat plate type solid oxide fuel battery and brazing method of composite brazing filler material |
| CN107009050A (en) * | 2017-06-01 | 2017-08-04 | 合肥邦诺科技有限公司 | A kind of ceramic granule reinforced composite material |
| CN108115308A (en) * | 2018-01-03 | 2018-06-05 | 重庆大学 | A kind of Al18B4O33Silver-bearing copper composite soldering of whisker reinforcement and preparation method thereof |
| CN108213771A (en) * | 2018-01-15 | 2018-06-29 | 合肥工业大学 | A kind of composite soldering and its soldering processes for soldering silicon carbide ceramics in vacuum |
| CN109369208A (en) * | 2018-10-31 | 2019-02-22 | 广东工业大学 | A kind of silicon carbide connection solder and its preparation method and application |
| CN111761155A (en) * | 2020-06-01 | 2020-10-13 | 中国电子科技集团公司第十四研究所 | Novel preparation method of integrated water hinge friction pair |
| CN112372178A (en) * | 2020-04-11 | 2021-02-19 | 湖北中烟工业有限责任公司 | Composite brazing filler metal and preparation method thereof |
| CN114273813A (en) * | 2021-12-24 | 2022-04-05 | 钢铁研究总院 | Thermal shock resistant gradient composite material and preparation method thereof |
-
2003
- 2003-06-26 CN CNA031324622A patent/CN1513812A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101224992B (en) * | 2006-01-17 | 2013-01-02 | 气体产品与化学公司 | Method of forming a ceramic to ceramic joint |
| CN100457371C (en) * | 2007-03-12 | 2009-02-04 | 贵研铂业股份有限公司 | Mixed powder solder and its production process |
| DE102009060938A1 (en) | 2009-12-22 | 2011-06-30 | HTM Reetz GmbH, 12555 | Method for producing sealed ceramic-ceramic-compound and ceramic-metal-compound, comprises soldering the compound using a metallic solder, where the first metallic solder zone is converted in a chemical-thermal process |
| CN102554385A (en) * | 2011-12-13 | 2012-07-11 | 河南科技大学 | Brazing and casting process of metal ceramic composite lining board |
| CN102554385B (en) * | 2011-12-13 | 2013-09-04 | 河南科技大学 | Brazing and casting process of metal ceramic composite lining board |
| CN103056553A (en) * | 2013-01-18 | 2013-04-24 | 哈尔滨工业大学 | Solder, preparation method thereof and method for connecting sapphire and niobium or niobium alloys by using solder |
| CN103056553B (en) * | 2013-01-18 | 2015-08-05 | 哈尔滨工业大学 | A kind of solder and preparation method thereof and the method utilizing solder to be connected sapphire and niobium or niobium alloy |
| CN105397336A (en) * | 2015-12-30 | 2016-03-16 | 哈尔滨工业大学 | Composite brazing filler material for sealing flat plate type solid oxide fuel battery and brazing method of composite brazing filler material |
| CN107009050A (en) * | 2017-06-01 | 2017-08-04 | 合肥邦诺科技有限公司 | A kind of ceramic granule reinforced composite material |
| CN108115308A (en) * | 2018-01-03 | 2018-06-05 | 重庆大学 | A kind of Al18B4O33Silver-bearing copper composite soldering of whisker reinforcement and preparation method thereof |
| CN108115308B (en) * | 2018-01-03 | 2020-06-19 | 重庆大学 | Al (aluminum)18B4O33Whisker reinforced silver-copper composite solder and preparation method thereof |
| CN108213771A (en) * | 2018-01-15 | 2018-06-29 | 合肥工业大学 | A kind of composite soldering and its soldering processes for soldering silicon carbide ceramics in vacuum |
| CN108213771B (en) * | 2018-01-15 | 2020-05-22 | 合肥工业大学 | Composite brazing filler metal for brazing silicon carbide ceramic in vacuum and brazing process thereof |
| CN109369208A (en) * | 2018-10-31 | 2019-02-22 | 广东工业大学 | A kind of silicon carbide connection solder and its preparation method and application |
| CN109369208B (en) * | 2018-10-31 | 2021-07-09 | 广东工业大学 | Brazing filler metal for silicon carbide connection and preparation method and application thereof |
| CN112372178A (en) * | 2020-04-11 | 2021-02-19 | 湖北中烟工业有限责任公司 | Composite brazing filler metal and preparation method thereof |
| CN111761155A (en) * | 2020-06-01 | 2020-10-13 | 中国电子科技集团公司第十四研究所 | Novel preparation method of integrated water hinge friction pair |
| CN114273813A (en) * | 2021-12-24 | 2022-04-05 | 钢铁研究总院 | Thermal shock resistant gradient composite material and preparation method thereof |
| CN114273813B (en) * | 2021-12-24 | 2022-10-11 | 钢铁研究总院 | Thermal shock resistant gradient composite material and preparation method thereof |
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