CN107009050A - A kind of ceramic granule reinforced composite material - Google Patents
A kind of ceramic granule reinforced composite material Download PDFInfo
- Publication number
- CN107009050A CN107009050A CN201710402845.7A CN201710402845A CN107009050A CN 107009050 A CN107009050 A CN 107009050A CN 201710402845 A CN201710402845 A CN 201710402845A CN 107009050 A CN107009050 A CN 107009050A
- Authority
- CN
- China
- Prior art keywords
- reinforced composite
- composite material
- ceramic
- granule reinforced
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
Abstract
The invention discloses a kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes the raw material of following percentage by weight：Metal dust A 90 99%, nano-ceramic particle B 1 10%；The metal dust A includes the raw material of following percentage by weight：Au powder 73 89%, Sn powder 11 27%.The ceramic granule reinforced composite material can reduce the generation of hard crisp phase, strengthen the thermal fatigue resistance of weld seam, so as to obtain the welding with high air-tightness, high intensity；The ceramic granule reinforced composite material is used for glass (ceramics)/glass (ceramics) or glass (ceramics)/solder bonding metal in vacuum and protective atmosphere; suitable for the sealing-in of photoelectric device, the encapsulation of various optical communications and light transmission window is particularly suitable for use in.
Description
Technical field
The present invention relates to welding technology field, specifically a kind of ceramic granule reinforced composite material.
Background technology
During Ceramic brazing, connect to obtain good glass (ceramics)/glass (ceramics), glass (ceramics)/metal
Head, has intensity high using the golden tin solder of low-temperature welding, and antioxygenic property is good, and thermal fatigue resistance and creep properties are excellent, and fusing point is low,
The features such as good flowing properties so that the optimal solder as optoelectronic packaging, with the fast development of opto-electronic device, to Au-
The demand of Sn solders is also increasing, has become wide variety of low temperature solder materials.
But it is due to that Au is I, the element of B races, Sn is IV, A races element, and Au and Sn flooding mechanism are gap mechanism, institute
With diffusion velocity quickly, golden tin binary alloy phase diagram is very complicated, there are many interphases, and these interphases are all hard crisp phase, gold
The alloy of tin all the components is all the phase composition in the middle of these golden tin, and the generation process for how reducing interphase turns into current
Urgent problem to be solved.Therefore, the present invention provides a kind of ceramic granule reinforced composite material, by increasing in Au-Sn solder
Plus ceramic powder additive reduces the generation process of interphase, promote micro-structural evenly more reasonable.
The content of the invention
It is an object of the invention to provide a kind of ceramic granule reinforced composite material, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the present invention provides following technical scheme：
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 90-99%, nano-ceramic particle B 1-10%；The metal dust A includes following percentage by weight
Raw material：Au powder 73-89%, Sn powder 11-27%.
It is used as further scheme of the invention：The nano-ceramic particle B is indium oxide, tin oxide, cupric oxide or oxidation
Aluminium.
It is used as further scheme of the invention：The metal dust A includes the raw material of following percentage by weight：Au powder
78%th, Sn powder 22%.
It is used as further scheme of the invention：The particle diameter of the ceramic particle B is 1-500nm.
It is used as further scheme of the invention：The particle diameter of the ceramic particle B is 10-200nm.
It is used as further scheme of the invention：The ceramic granule reinforced composite material includes the original of following percentage by weight
Material：Metal dust A 95-99%, nano-ceramic particle B 1-5%.
It is used as further scheme of the invention：The ceramic granule reinforced composite material includes the original of following percentage by weight
Material：Metal dust A 98%, nano-ceramic particle B 2%.
It is used as further scheme of the invention：The ceramic granule reinforced composite material be powder, alloy strip or B alloy wire,
Or the form of cream.
It is used as further scheme of the invention：Described ceramic granule reinforced composite material is in semiconductor, optoelectronic package
Application.
It is used as further scheme of the invention：Described ceramic granule reinforced composite material is in optical communication window, infrared window
Application in the encapsulation of mouth.
Compared with prior art, the beneficial effects of the invention are as follows：
The ceramic granule reinforced composite material can reduce the generation of hard crisp phase, strengthen the thermal fatigue resistance of weld seam, so that
Obtain the welding with high air-tightness, high intensity；The ceramic granule reinforced composite material is used in vacuum and protective atmosphere
In glass (ceramics)/glass (ceramics) or glass (ceramics)/solder bonding metal, it is adaptable to the sealing-in of photoelectric device, it is particularly suitable
In the encapsulation of various optical communications and light transmission window.
Embodiment
The technical scheme of this patent is described in more detail with reference to embodiment.
Embodiment 1
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 90%, nano-ceramic particle B 10%；The metal dust A includes the raw material of following percentage by weight：
Au powder 73%, Sn powder 27%, metal dust A are mixed by Au powder with Sn powder；The nano-ceramic particle B is indium oxide.Institute
The particle diameter for stating ceramic particle B is 1nm.The ceramic granule reinforced composite material is the form of powder.Described ceramic particle increases
Strong composite soldering can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the encapsulation of infrared window etc..
Embodiment 2
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 99%, nano-ceramic particle B 1%；The metal dust A includes the raw material of following percentage by weight：
Au powder 89%, Sn powder 11%, metal dust A are mixed by Au powder with Sn powder.The nano-ceramic particle B is tin oxide.Institute
The particle diameter for stating ceramic particle B is 500nm.The ceramic granule reinforced composite material is the form of alloy strip.Described ceramics
Grain enhancing composite soldering can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the envelope of infrared window etc.
Dress.
Embodiment 3
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 98%, nano-ceramic particle B 2%；The metal dust A includes the raw material of following percentage by weight：
Au powder 78%, Sn powder 22%, metal dust A are mixed by Au powder with Sn powder.The nano-ceramic particle B is cupric oxide.Institute
The particle diameter for stating ceramic particle B is 50nm.The ceramic granule reinforced composite material is the form of B alloy wire.Described ceramic particle
Strengthen composite soldering and can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the encapsulation of infrared window etc..
Embodiment 4
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 95%, nano-ceramic particle B 5%；The metal dust A includes the raw material of following percentage by weight：
76%Au powder, 24%Sn powder, metal dust A are mixed by Au powder with Sn powder.The nano-ceramic particle B is aluminum oxide.Institute
The particle diameter for stating ceramic particle B is 10nm.The ceramic granule reinforced composite material is the form of cream.Described ceramic particle enhancing
Composite soldering can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the encapsulation of infrared window etc..
Embodiment 5
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 99%, nano-ceramic particle B 1%；The metal dust A includes the raw material of following percentage by weight：
85%Au powder, 15%Sn powder, metal dust A are mixed by Au powder with Sn powder.The nano-ceramic particle B is tin oxide.Institute
The particle diameter for stating ceramic particle B is 200nm.The ceramic granule reinforced composite material is the form of powder.Described ceramic particle
Strengthen composite soldering and can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the encapsulation of infrared window etc..
Embodiment 6
A kind of ceramic granule reinforced composite material, the ceramic granule reinforced composite material includes following percentage by weight
Raw material：Metal dust A 92%, nano-ceramic particle B 8%；The metal dust A includes the raw material of following percentage by weight：
88%Au powder, 12%Sn powder, metal dust A are mixed by Au powder with Sn powder.The nano-ceramic particle B is aluminum oxide.Institute
The particle diameter for stating ceramic particle B is 7nm.The ceramic granule reinforced composite material is the form of powder.Described ceramic particle increases
Strong composite soldering can be used for semiconductor, optoelectronic package, especially various windows：Optical communication window, the encapsulation of infrared window etc..
Powder type is made in the ceramic granule reinforced composite material of the present invention using the method for mixing；Can be by adding
Enter 75-90 mass % binding agent, the terpineol solution of such as ethyl cellulose, or triethanolamine and Decanol and simply
Mixing, cream form is made by the ceramic granule reinforced composite material of the present invention；The method that powder metallurgy can also be utilized, this
Alloy strip (or B alloy wire) is made in the ceramic granule reinforced composite material of invention.Thus, ceramic particle enhancing of the invention is compound
Solder can be used for semiconductor, optoelectronic package, in particular for various windows：Optical communication window, in the encapsulation of infrared window etc..
Using the ceramic granule reinforced composite material carry out soldering method be：Soldering paste even application is stained with writing brush to pottery
Until coating layer thickness is in the range of 0.05mm~0.5mm on porcelain solder side, then ceramics or metal are superimposed to the cored solder of coating
On, position and assemble by the higher viscosity of soldering paste, and apply certain pressure, then by assembly parts be heated to above solder liquidus curve but
Less than the temperature of mother metal solidus, held for some time completes material connection；The melting temperature of the composite soldering of the present invention is 280
More than DEG C, welding temperature is at 310 DEG C.The composite soldering of the present invention has good coefficient of thermal expansion matching, predetermined bit function viscosity
Higher, temperature is low, can be carried out under atmosphere, reduce the requirement to brazing equipment, brazing process is easier realization.
The ceramic granule reinforced composite material can reduce the generation of hard crisp phase, strengthen the thermal fatigue resistance of weld seam, so that
Obtain the welding with high air-tightness, high intensity；The ceramic granule reinforced composite material is used in vacuum and protective atmosphere
In glass (ceramics)/glass (ceramics) or glass (ceramics)/solder bonding metal, it is adaptable to the sealing-in of photoelectric device, it is particularly suitable
In the encapsulation of various optical communications and light transmission window.
The better embodiment to this patent is explained in detail above, but this patent is not limited to above-mentioned embodiment party
, can also be on the premise of this patent objective not be departed from formula, the knowledge that one skilled in the relevant art possesses
Make a variety of changes.
Claims (10)
1. a kind of ceramic granule reinforced composite material, it is characterised in that the ceramic granule reinforced composite material includes following heavy
Measure the raw material of percentage：Metal dust A 90-99%, nano-ceramic particle B 1-10%；The metal dust A includes following heavy
Measure the raw material of percentage：Au powder 73-89%, Sn powder 11-27%.
2. ceramic granule reinforced composite material according to claim 1, it is characterised in that the nano-ceramic particle B is
Indium oxide, tin oxide, cupric oxide or aluminum oxide.
3. ceramic granule reinforced composite material according to claim 1, it is characterised in that the metal dust A include with
The raw material of lower percentage by weight：Au powder 78%, Sn powder 22%.
4. ceramic granule reinforced composite material according to claim 1, it is characterised in that the particle diameter of the ceramic particle B
For 1-500nm.
5. ceramic granule reinforced composite material according to claim 1, it is characterised in that the particle diameter of the ceramic particle B
For 10-200nm.
6. ceramic granule reinforced composite material according to claim 1, it is characterised in that the ceramic particle enhancing is compound
Solder includes the raw material of following percentage by weight：Metal dust A 95-99%, nano-ceramic particle B 1-5%.
7. ceramic granule reinforced composite material according to claim 1, it is characterised in that the ceramic particle enhancing is compound
Solder includes the raw material of following percentage by weight：Metal dust A 98%, nano-ceramic particle B 2%.
8. ceramic granule reinforced composite material according to claim 1, it is characterised in that the ceramic particle enhancing is compound
Solder is the form of powder, alloy strip or B alloy wire or cream.
9. application of the ceramic granule reinforced composite material according to claim 1 in semiconductor, optoelectronic package.
10. ceramic granule reinforced composite material according to claim 1 is in optical communication window, the encapsulation of infrared window
Using.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710402845.7A CN107009050A (en) | 2017-06-01 | 2017-06-01 | A kind of ceramic granule reinforced composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710402845.7A CN107009050A (en) | 2017-06-01 | 2017-06-01 | A kind of ceramic granule reinforced composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107009050A true CN107009050A (en) | 2017-08-04 |
Family
ID=59451120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710402845.7A Pending CN107009050A (en) | 2017-06-01 | 2017-06-01 | A kind of ceramic granule reinforced composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107009050A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647642A (en) * | 2022-11-05 | 2023-01-31 | 郑州机械研究所有限公司 | Low-melting alloy brazing filler metal powder and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1513812A (en) * | 2003-06-26 | 2004-07-21 | 哈尔滨工业大学 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
| US20080217382A1 (en) * | 2007-03-07 | 2008-09-11 | Battelle Memorial Institute | Metal-ceramic composite air braze with ceramic particulate |
| CN101288928A (en) * | 2008-05-09 | 2008-10-22 | 中国科学技术大学 | Ceramic granule reinforced composite material |
| JP4375730B2 (en) * | 2004-04-23 | 2009-12-02 | 本田技研工業株式会社 | Brazing material for joining copper and ceramics or carbon-based copper composite material and joining method therefor |
| CN102633517A (en) * | 2012-04-28 | 2012-08-15 | 滁州中星光电科技有限公司 | Nano-ceramic composite brazing solder for ceramics or glass |
| CN103934589A (en) * | 2014-05-05 | 2014-07-23 | 滁州中星光电科技有限公司 | Aluminum-based quasi-crystal alloy composite brazing solder for ceramic or glass |
| CN106141507A (en) * | 2016-07-01 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of preparation method of the ceramic granule reinforced composite material film of low content of organics |
-
2017
- 2017-06-01 CN CN201710402845.7A patent/CN107009050A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1513812A (en) * | 2003-06-26 | 2004-07-21 | 哈尔滨工业大学 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
| JP4375730B2 (en) * | 2004-04-23 | 2009-12-02 | 本田技研工業株式会社 | Brazing material for joining copper and ceramics or carbon-based copper composite material and joining method therefor |
| US20080217382A1 (en) * | 2007-03-07 | 2008-09-11 | Battelle Memorial Institute | Metal-ceramic composite air braze with ceramic particulate |
| CN101288928A (en) * | 2008-05-09 | 2008-10-22 | 中国科学技术大学 | Ceramic granule reinforced composite material |
| CN102633517A (en) * | 2012-04-28 | 2012-08-15 | 滁州中星光电科技有限公司 | Nano-ceramic composite brazing solder for ceramics or glass |
| CN103934589A (en) * | 2014-05-05 | 2014-07-23 | 滁州中星光电科技有限公司 | Aluminum-based quasi-crystal alloy composite brazing solder for ceramic or glass |
| CN106141507A (en) * | 2016-07-01 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of preparation method of the ceramic granule reinforced composite material film of low content of organics |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647642A (en) * | 2022-11-05 | 2023-01-31 | 郑州机械研究所有限公司 | Low-melting alloy brazing filler metal powder and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4753090B2 (en) | Solder paste and electronic device | |
| TWI538763B (en) | Pb-free solder alloy | |
| JP2007331028A (en) | Solder alloy | |
| TWI492810B (en) | Tin-copper lead-free solder alloy | |
| JPH06297185A (en) | Dynamic solder paste composition | |
| JP5849421B2 (en) | Solder, semiconductor device using solder, and soldering method | |
| WO2013145471A1 (en) | Method for manufacturing power module, and power module | |
| JP5187465B1 (en) | High temperature lead-free solder alloy | |
| JP4560830B2 (en) | Au-Sn alloy powder for solder paste | |
| JP2013229457A (en) | Semiconductor device and manufacturing method of the same | |
| CN107009050A (en) | A kind of ceramic granule reinforced composite material | |
| CN103934589B (en) | For aluminium base quasicrystalline alloy composite brazing material that is ceramic or glass | |
| KR101360142B1 (en) | Lead-free solder composition | |
| CN102633517A (en) | Nano-ceramic composite brazing solder for ceramics or glass | |
| WO2018139209A1 (en) | Joining material and joined body | |
| CN102543893A (en) | Preparation method of semiconductor device | |
| JP2011251330A (en) | High-temperature lead-free solder paste | |
| CN106312369A (en) | Solder for connecting ceramics with kovar alloys | |
| JP2009226472A (en) | Au-Sn ALLOY SOLDER PASTE FOR PIN TRANSFER | |
| JP6509469B1 (en) | Junction structure, semiconductor device and method of manufacturing the same | |
| CN105609426A (en) | Preparation method of no-clean nano-slurry for low-temperature welding | |
| JP6887420B2 (en) | Lead-free low melting point composition, encapsulant, conductive material and electronic components | |
| Peng et al. | Die bonding of silicon and other materials with active solder | |
| JPH05170552A (en) | Aluminum nitride substrate having metallized layer and metallization of the substrate | |
| WO2016170906A1 (en) | Au-Sn-Ag BASED SOLDER PASTE, AND ELECTRONIC COMPONENT JOINED OR SEALED BY USING Au-Sn-Ag BASED SOLDER PASTE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170804 |
|
| RJ01 | Rejection of invention patent application after publication |