CN1507603A - 用于制造具有线圈的芯片卡的方法和半成品 - Google Patents

用于制造具有线圈的芯片卡的方法和半成品 Download PDF

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CN1507603A
CN1507603A CNA028096347A CN02809634A CN1507603A CN 1507603 A CN1507603 A CN 1507603A CN A028096347 A CNA028096347 A CN A028096347A CN 02809634 A CN02809634 A CN 02809634A CN 1507603 A CN1507603 A CN 1507603A
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��Τ����˹
安多·韦林
马赛厄斯·伯格曼
乔基姆·霍普
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Giesecke and Devrient GmbH
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    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本发明涉及一种制造非接触和/或接触式运行的芯片卡(1)的方法，该芯片卡包括一多层卡体、一集成电路和至少一个用于数据交换和供给电源的线圈(2、21)。通过印刷工艺将线圈(2、21)涂敷到卡体的一层或多层(11)上。在制造印刷线圈后，将金属膜(4、41)置于线圈端子(32、33)之上并层层压在卡体中，从而产生印刷线圈的接触面(32、33)与金属膜(4、41)之间的连接。

Description

用于制造具有线圈的芯片卡的方法和半成品
技术领域
本发明涉及一种制造芯片卡的方法和半成品，该芯片卡包括用于与外部设备进行非接触式和/或接触式的数据交换的一个线圈和/或若干接触面。
背景技术
德国公开申请(Laid-Open Print)DE 4416697 A1公开了一种数据载体和制造该数据载体的方法，其中为了供应电源和/或使集成电路与外部设备数据交换，将线圈置于单-或多层卡结构内。包括集成电路的模块具有两个用于连接线圈接触面的接触单元。该线圈优选是导线绕制的、穿过金属箔或导电塑料箔引出，或者由蚀刻的铜线圈构成，并被涂敷到卡体的绝缘层上。
通过在已知的接触方法中使用导电粘合剂或各向异性导电粘合剂，来制造或者改善线圈接触面与集成电路接触面之间的电连接。或者，焊接线圈和集成电路的接触面。优选利用倒装法达到该目的。
使用印刷线圈时，有利的是该印刷线圈还具有印刷线圈端子区，结果是，印刷线圈和由银导电胶构成的端子区并不参与与各向异性导电粘合剂的可靠连接，或者在制造过程和运行中双接口模块与印刷线圈的直接连接涉及到可靠性问题。因此产生了以下问题：需要拟订芯片卡、半成品和制造芯片卡或半成品的方法的技术条件，使得所述的芯片卡、半成品和制造芯片卡或半成品的方法允许线圈和准备使用印刷线圈制造的集成电路之间具有可靠的电连接。
这个问题是从独立权利要求1、6和8的前序部分的特征开始，通过所述权利要求的特征部分的特征来解决的。
从属权利要求中陈述了本发明的有利实施方案。
发明内容
根据本发明，在载体元件，例如它可以是在层叠卡结构之内的芯箔，上制造印刷线圈后，设置一个金属箔使它至少部分地覆盖线圈的端子区，该金属箔的一部分位于以后将要引入的模块的接触面的对面。将具有印刷线圈和金属箔的层层压入卡体。层压工艺将金属箔和印刷线圈的接触面层压在一起，从而产生印刷线圈和金属箔之间的电连接。
根据本发明的有利的实施方案，将导电粘合剂置于线圈接触面上，或者线圈接触面区域内的金属箔上，或者整个面之上。配置导电粘合剂增加了线圈与金属箔之间的电连接的可靠性。
特别是当将模块随后引入卡体中时，在卡体内加工一间隙以引入模块，所述的间隙被确定尺寸，使得在朝向集成电路的接触面的连接区域内金属箔是暴露的。插入模块时，就产生了接触面背面的线圈端子区。
根据本发明的有利实施方案，研磨模块用的间隙。这种情况下，轻微研磨朝向集成电路的接触面的连接区域内的金属箔被证明是有利的。这样，一引入模块就得到了与集成电路接触面的更可靠的电连接。
如果在两端子区之间引入各向异性导电粘合剂，就可以改善金属箔与集成电路的端子区之间的电连接。这种情况下，将各向异性导电粘合剂有利地预先涂布到集成电路的端子区。一将模块层压进卡体，各向异性导电粘合剂就产生了与金属箔的电连接。
本发明方法允许将印刷线圈用于非接触式卡或双接口卡，从而可以增加集成电路与印刷线圈之间的连接可靠性，使得它比得上例如使用蚀刻铜线圈的连接可靠性。
本发明不仅涉及到制造非接触式和/或接触式运行的芯片卡的方法，而且涉及到准备用于制造所述芯片卡的半成品。所述半成品包括载体层，该载体层上放置有在线圈端部具有线圈端子区的印刷线圈。在每个所述的线圈端子区上，放置金属箔使得金属箔至少部分地覆盖端子区并且进一步伸进后来准备引入集成电路或模块的区域。
最好将导电粘合剂涂布到金属箔上或者接触区域内的线圈接触面上，以在金属箔与线圈接触面之间产生可靠的连接。特别是当在后面仅加工半成品、即具有印刷线圈和金属箔的载体箔时，这是有利的。
另外，本发明涉及到非接触式运行的芯片卡或者双接口卡，其中卡体的内层置于印刷线圈上，金属箔覆盖该印刷线圈的端子区，放置金属箔使得它与集成电路的接触面相连接。
有利地，将各向异性导电粘合剂置于金属箔与集成电路的接触面之间。这具有增加连接可靠性和连接耐久性的优点。
附图说明
下面，参考附图1至4更详细地解释本发明，其中：
图1显示了双接口卡的前面，
图2显示了双接口卡的后面，
图3显示了根据本发明的双接口卡的层结构，以及
图4显示了根据图1、2和3的卡的横断面。
具体实施方法
图1显示了芯片卡1的前面。这里假定覆盖层是由透明材料制备的，以使得可以识别出本发明的元件。
将具有端子区31和32的线圈2置于卡体1的芯层11中。将第一线圈端子区31电镀贯通(throughplating)到位于芯箔(core foil)11背面的线圈21的线圈端子区31’。图1进一步显示了端子区33，将它同样电镀贯通到载体元件背面的线圈21。线圈接触面32和33用于接通线圈与模块5中所包含的集成电路的端子区。不直接连接，而是通过分别部分地覆盖端子区32和33并通向模块5中的集成电路的端子区的金属箔4或41，来实现这种连接。
金属箔4和41优选由铜、银或镀银的铜制得以保证良好的导电性和可靠的连接。
图2显示了卡1的背面。这一面承载有具有端子区31’和33’的线圈的第二部分21，所述的端子区与前面的端子区31和33是电镀贯通的。图2中的虚线表示位于前面的端子区33。正如可以从图2中看出的，金属箔4、41(图2显示了背面的4’和41’)通向集成电路的端子区，在该图中没有明确显示出集成电路的端子区。
图3显示了多层卡结构的横断面。所述的卡结构包括载体箔11，它承载具有线圈端子区31、32、33和31’、33’的线圈2和2’(图3未显示出)。置于线圈端子区32和33之上的是金属箔4、4’，用导电粘合剂有利地将金属箔连接到线圈端子区32。
图3中为了连接模块5、即模块5的端子区7，将各向异性导电粘合剂6置于集成电路的端子区区域内。同样可以将导电粘合剂置于金属箔4和线圈端子区32、33之间。
图4显示了适于非接触式和接触式数据交换的卡的横断面。模块5含有图中未显示的集成电路。集成电路可以经由接触面51通过接触式的数据交换与外部世界联系。使用线圈2、21来实现非接触数据交换，图中仅显示了线圈的端子区32和33。通过将金属箔4、41施加到线圈端子区32和33，可以实现线圈2、21与集成电路端子区7的接触。为了实现接触，优选使用如图中所示，在插入模块5之前涂布到箔4、41上的，或者已经置于集成电路的接触面7上的各向异性导电粘合剂6。

Claims (8)

1.一种制造非接触和/或接触式运行的芯片卡(1)的方法，该芯片卡包括一多层卡体、一集成电路和至少一个用于数据交换和供给电源的线圈(2、21)，通过印刷工艺将线圈(2、21)涂敷在该卡体的一个层或多个层(11)上，其特征在于：制造印刷线圈后，将金属箔(4、41)置于线圈端子(32、33)之上并层压入卡体，从而产生印刷线圈的接触面(32、33)与金属箔(4、41)之间的连接。
2.如权利要求1所述的方法，其特征在于：将导电粘合剂置于线圈接触面(32、33)上或者线圈接触面(32、33)区域内的金属箔(4、41)上。
3.如权利要求1或2所述的方法，其特征在于：为了引入含有集成电路的模块(5)，制造卡体内空隙，确定其尺寸，使得至少在朝向集成电路的接触面的连接区域内金属箔(4、41)是暴露的。
4.如权利要求3所述的方法，其特征在于：研磨模块(5)用的空隙，至少在朝向集成电路的接触面的连接区域内金属箔(4、41)是暴露的或研磨过的。
5.如权利要求1至4中任意一项所述的方法，其特征在于：将各向异性导电粘合剂置于金属箔(4、41)与集成电路的端子区之间。
6.一种用于制造非接触式运行的芯片卡(1)的半成品，该芯片卡包括一多层卡体、一集成电路和至少一个用于数据交换和电源供应的线圈(2、21)，通过印刷工艺将线圈(2、21)涂敷在卡体的一个层或多个层上，其特征在于：将具有以同样方式被印刷的线圈端子区(32、33)的印刷线圈(2、21)置于芯箔(11)的一面或两面，将金属箔(4、41)置于线圈端子区(32、33)之上。
7.如权利要求6所述的半成品，其特征在于：通过导电粘合剂将金属箔(4、41)与线圈端子区(32、33)连接。
8.一种非接触式运行的芯片卡，它包括一多层卡体、一集成电路和至少一个用于数据交换和供给电源的线圈(2、21)，通过印刷工艺将线圈(2、21)涂敷在卡体的一个层上，其特征在于：印刷线圈(2、21)安装在卡体的芯箔(11)上，并具有被金属箔(4、41)覆盖的线圈端子区(32、33)。
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