CN1498060A - 印刷电路板的连接方法 - Google Patents

印刷电路板的连接方法 Download PDF

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CN1498060A
CN1498060A CNA2003101007724A CN200310100772A CN1498060A CN 1498060 A CN1498060 A CN 1498060A CN A2003101007724 A CNA2003101007724 A CN A2003101007724A CN 200310100772 A CN200310100772 A CN 200310100772A CN 1498060 A CN1498060 A CN 1498060A
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circuit board
printed circuit
pcb
wire portion
group
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CN1262156C (zh
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̫��¡
太田隆
山田一秋
����һ
辻井清
真锅秀一
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Denso Ten Ltd
Toyota Motor Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/10742—Details of leads
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/3421—Leaded components
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    • H05K3/3447—Lead-in-hole components
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Abstract

本发明提供一种印刷电路板的连接方法。在导线框的导线部前端形成接线端子，通过将该接线端子与在第一印刷电路板上形成的焊盘相紧固而将导线框安装于第一印刷电路板。从第一印刷电路板安装的导线框将框架部及连接杆部切除使导线部分离，导线部的前端部向第一印刷电路板的上方延伸而形成。在将向上方延伸的导线部插入穿过第二印刷电路板的贯通孔后，通过将导线部与贯通孔的紧固而实现所述第一印刷电路板与所述第二印刷电路板之间的电连接。由此能够简易且高精度地连接叠层的印刷电路板。

Description

印刷电路板的连接方法
技术领域
本发明涉及印刷电路板的连接结构及连接方法，特别是关于叠层配置的印刷电路板的连接方法。
背景技术
为了控制从电源向负载供给的电力，在电力供给线中插入控制模块。
在该控制模块中，除了控制电力的电力控制元件之外，一般还装载有控制该电力控制元件的控制元件。
所以，普通的控制模块是由控制元件的控制基板与装载有电力控制元件的电力基板、即由两种基板所构成。基板之间的电连接是使用铜导线。
而且，导线一般是被树脂制的框架固定在所规定的位置(参照专利文献1)。
进而也使用以下的连接结构。
图1是历来的连接结构的立体图，使用在铸模成形的树脂框架内插入导线的接线端子，使上下两层配置的控制基板与电力基板相连接。
接线端子10从铸模成形为“口”字型的框架100的一侧边的外侧中央向控制导线101的上方延伸。控制导线101贯通框架100内，至100的内侧从一侧边的内侧中央向下延伸，在下端向水平方向弯折而形成连接部。
在与该边相对面的另一边上，同样安装有电力导线102。
控制导线101及电力导线102是由在电力基板11上形成的连接焊盘111及112通过锡焊构成电连接，框架100与电力基板11例如用螺钉固定。
控制基板(未图示)具有贯通孔，在该贯通孔内插入控制导线101及电力导线102的上端后，通过锡焊构成电连接。
[专利文献1]特开平10-229261号公报(第3页、图7)。
但是，在历来的结构中存在以下的问题。
1.由于必须由形成后的导线贯通框架，使导线与框架一体形成的铸模成形来制作接线端子，所以接线端子自身的价格高。
2.由于导线的上端要插入控制基板的贯通孔，所以要求对导线与连接孔的相对位置进行规定精度的管理，单由铸模成型来维持所规定的精度是困难的。
3.由于接线端子的框架是“口”字型，所以在基板上接线端子的面积大，致使实际可安装元件的面积减少。
4.由于接线端子材料树脂具有温度界限，所以在对连接部与基板的连接接头进行焊接连接时，必须进行严格的温度管理与工程管理。
也就是说，在历来的连接结构中，由于在成形后将铸模形成的接线端子进行安装装配于基板，所以就难以确保导线与基板的相对精度。
发明内容
鉴于上述问题，本发明的目的在于，提供一种印刷电路板的连接方法置，能够简易且高精度地将印刷电路板叠层连接。
本发明之一的印刷电路板的连接方法，包括：在导线框的导线部的一端形成接线端子；通过将所述接线端子紧固在形成于第一印刷电路板的表面上的连接焊盘上，将所述导线框安装于所述第一印刷电路板上；从所述导线框将框架部及连接杆部切除；使所述导线部的另一端向所述第一印刷电路板的上方延伸；将所述导线部插入形成在第二印刷电路板上的贯通孔内；通过将所述导线部固定在所述贯通孔内，使所述第一印刷电路板与所述第二印刷电路板构成电连接。
本发明之二的印刷电路板的连接方法是基于本发明之一的印刷电路板的连接方法，其中，所述切除是：将所述导线部与所述框架部及所述连接杆部分离。
本发明之三的印刷电路板的连接方法是基于本发明之一的印刷电路板的连接方法，其中，所述延伸是：将所述导线部弯折，使其向第一印刷电路板的法线的外侧倾斜，所述方法是，进一步在所述插入之前，通过用夹具支撑所述导线部，使其沿着第一印刷电路板的所述法线方向延伸。
本发明之四的印刷电路板的连接方法是基于本发明之三的印刷电路板的连接方法，其中，所述导线部是多个导线部，使从所述导线框一侧的边所延伸的第一群的导线部比从另一侧边所延伸的第二群的导线部要长地进行切除，所述延伸是：将所述第一群的导线部弯折成沿着第一印刷电路板的法线延伸，将所述第二群的导线部弯折成向所述第一印刷电路板的法线的外侧倾斜，所述支撑是：在所述插入之前，用所述夹具支撑所述第二群的导线部。
本发明之五的印刷电路板的连接方法是基于本发明之三的印刷电路板的连接方法，其中，所述导线部是多个导线部，第一群的导线部从所述导线框的一边延伸，第二群的导线部从所述导线框的另一边延伸，所述延伸是：将所述第一群的导线部弯折，使其沿着所述第一印刷电路板的法线方向延伸，将所述第二群的导线部弯折，使其向所述所述第一印刷电路板的法线的外侧倾斜，所述支撑是：在所述插入之前用所述夹具支撑所述第二群的导线部，在所述延伸后，从所述第一群的弯折部到所述另一端的长度比从第二群的导线部的弯折部到所述另一端的长度长。
在本发明中，在将导线框架安装于印刷电路板时，将框架及连接杆去除，导线向第一印刷电路板上方延伸而形成。而且，通过将导线插入穿孔第二印刷电路板的贯通孔而使第一印刷电路板与第二印刷电路板相连接。
附图说明
图1是历来的连接结构的立体图。
图2是本发明中印刷电路板的连接结构的立体图。
图3是导线框的立体图(之一)。
图4是导线框的立体图(之二)。
图5是本发明中印刷电路板连接结构的组装方法的说明图(之一)。
图6是本发明中印刷电路板连接结构的组装方法的说明图(之二)。
图7是本发明中印刷电路板连接结构的组装方法的说明图(之三)。
图8是本发明中印刷电路板连接结构的组装方法的说明图(之四)。
图中：20-基片；21-电力基板；211-控制导线；212-电力导线；22-控制基板；221-控制贯通孔；222-电力贯通孔；23-盖。
具体实施方式
图2是本发明中印刷电路板的连接结构的立体图，由基片20、电力基板21、控制基板22、以及盖23所构成。
基片20是铝的铸造制品，在排放紧固安装的电力基盘所发生的热的同时，固定有电力基板21、控制基板22、以及盖23。
在电力基板21中，例如装载有IGBT的电力控制元件，同时，通过锡焊连接曲柄型的控制导线211及电力导线212，但不是历来结构中的树脂框架，而是控制导线211及电力导线212自立在基板21上。
向电力基板21安装控制导线211及电力导线212的方法在后面叙述。
该电力基板21通过绝缘材料由螺钉紧密固定在基片上所形成的底座上。
例如，装载有微机控制元件的控制基板22，在电力基板21的上方以既定的间隔叠层。在控制基板22上穿孔有控制贯通孔221与电力贯通孔222，叠层控制基板22时，将控制导线211及电力导线212分别插入控制贯通孔221及电力贯通孔222。
其后，将控制导线211及电力导线212与控制贯通孔221及电力贯通孔222进行锡焊，使其电连接。
还有，将控制基板22以螺钉固定在基片20的四角上所形成的支柱202上。
最后将盖固定在基片20上，完成部件。
图3是导线框210的立体图(之一)，控制导线211及电力导线212从框架213向内部延伸。框架213与控制导线211及电力导线212，以及控制导线211及电力导线212相互之间，通过连接杆214而连接。
具有上述结构的导线框210，可以通过对铝板的冲裁穿孔而容易地制作。
图4是导线框210的立体图(之二)，将控制导线211及电力导线212的前端压力加工为曲柄形状，形成接线端子。
图5～7是本发明中印刷电路板连接结构的组装方法的说明图，将压力加工后的导线框210焊锡焊接于电力基板21。还有，在图5以后的图中，为了容易判别，将控制导线211及电力导线212都画为一条线，但本组装方法也同样适用于如图3、图4中所示的控制导线211及电力导线212有多条的情况。
在这个步骤，由于控制导线211及电力导线212是固定于框架213，所以，只要决定了框架213相对于电力基板21的位置，就没有必要分别决定控制导线211及电力导线212相对于电力基板21的位置。
在电力基板21形成有安装控制导线211及电力导线212的接线端子的连接焊盘215。接线端子与连接焊盘215，例如可以由软溶焊接所连接(图5(A))。
其后，将框架213及连接杆214切除，使各个控制导线211及电力导线212分离(图5(B))。
接着，用夹子51夹持控制导线211及电力导线212的弯折部分，以适当的方法进行使控制导线211及电力导线212的前端向上弯折的形成加工。还有，弯折的角度为比90度略小5度的85度，控制导线211及电力导线212的前端以向外侧扩展的状态而形成(图5(C))。
也就是说，根据本发明，由于是在将控制导线211及电力导线212安装于电力基板21后而对控制导线211及电力导线212进行的形成加工，所以能够对在将框架213安装于电力基板21时所产生的控制导线211及电力导线212与控制基板22的控制贯通孔221及电力贯通孔222之间的偏差在形成时进行修正，从而能够确保其相对位置精度。
结果，完成了焊锡焊接有控制导线211及电力导线212的电力基板21(图6(A))。
将该电力基板21配置在基片20的底座201上，用螺钉等适宜的方式固定于基片20上(图6(B))。
接着，用夹具61的抑制使控制导线211及电力导线212的前端自外侧略呈垂直，从上方配置控制基板22。
在控制基板22上穿孔有控制贯通孔221及电力贯通孔222，将控制导线211及电力导线212分别插入控制贯通孔221及电力贯通孔222(图7(A))。
也就是说，根据本发明，由于能够确保控制导线211及电力导线212与控制贯通孔221及电力贯通孔222的相对位置精度，所以能够容易地组装电力基板21与控制基板22。
除去夹具61后，控制导线211及电力导线212会因弹性而向外扩张，控制导线211及电力导线212就与控制贯通孔221及电力贯通孔222呈接触状态。
也就是说，根据本发明，由于在进行焊锡焊接之前导线与贯通孔就相互接触，所以能够更加确保二者的结合。
其后，控制导线211及电力导线212与控制贯通孔221及电力贯通孔222，例如可以由局部软溶焊接而实现电连接。如果有必要，还可以将在控制基板22上方延伸的控制导线211及电力导线212的前端切断。最后将盖23覆盖在基片20上，完成制品(图7(B))。
上述是以控制导线211及电力导线212双方都可以用夹具61进行抑制为前提，但也有由于基板上装载有大的部件，用夹具61仅能对单侧的导线进行抑制的情况。
图8是说明在这种情况下的组装方法的说明图，由于在控制基板22的下面装载有大型的部件223，所以就不能用夹具对电力导线212进行抑制。
在这种情况下，使电力导线212(不能用夹具进行抑制的导线)比控制导线211(能够用夹具进行抑制的导线)长约1mm。
进而，在弯折前端的形成工序(图5(C))中，控制导线211的弯折角度维持为约85度，但电力导线212的弯折角度为90度，与前端垂直。
在这种状态下用夹具61从外侧推压控制导线211，将控制基板从上方配置控制基板22。
这样，先将电力导线212插入电力贯通孔222，其后再将控制导线211插入控制贯通孔221。
也就是说，在这种情况，即使是在不能用夹具对导线进行抑制的情况下，也能够确保将导线插入贯通孔。
然后，去除夹具61，将控制导线211及电力导线212焊锡焊接于控制贯通孔221及电力贯通孔222。
根据本发明的印刷电路板的连接方法，由于是在一侧的基板上安装导线之后再进行导线的形成，所以能够简易且高精度到将印刷电路板叠层连接。

Claims (5)

1.一种印刷电路板的连接方法，其特征在于：包括：
在导线框的导线部的一端形成接线端子；
通过将所述接线端子紧固在形成于第一印刷电路板的表面上的连接焊盘上，将所述导线框安装于所述第一印刷电路板上；
从所述导线框将框架部及连接杆部切除；
使所述导线部的另一端向所述第一印刷电路板的上方延伸；
将所述导线部插入形成在第二印刷电路板上的贯通孔内；
通过将所述导线部固定在所述贯通孔内，使所述第一印刷电路板与所述第二印刷电路板构成电连接。
2.根据权利要求1所述的印刷电路板的连接方法，其特征在于：
所述切除是：将所述导线部与所述框架部及所述连接杆部分离。
3.根据权利要求1所述的印刷电路板的连接方法，其特征在于：所述延伸是将所述导线部弯折，使其向第一印刷电路板的法线的外侧倾斜，
所述方法，进一步在所述插入之前，通过用夹具支撑所述导线部，使其沿着第一印刷电路板的所述法线方向延伸。
4.根据权利要求3所述的印刷电路板的连接方法，其特征在于：
所述导线部是多个导线部，
使从所述导线框一侧的边所延伸的第一群的导线部比从另一侧边所延伸的第二群的导线部要长地进行切除，
所述延伸是：将所述第一群的导线部弯折成沿着第一印刷电路板的法线延伸，将所述第二群的导线部弯折成向所述第一印刷电路板的法线的外侧倾斜，
所述支撑是：在所述插入之前，用所述夹具支撑所述第二群的导线部。
5.根据权利要求3所述的印刷电路板的连接方法，其特征在于：
所述导线部是多个导线部，
第一群的导线部从所述导线框的一边延伸，
第二群的导线部从所述导线框的另一边延伸，
所述延伸是：将所述第一群的导线部弯折，使其沿着所述第一印刷电路板的法线方向延伸，将所述第二群的导线部弯折，使其向所述所述第一印刷电路板的法线的外侧倾斜，
所述支撑是：在所述插入之前用所述夹具支撑所述第二群的导线部，
在所述延伸后，从所述第一群的弯折部到所述另一端的长度比从第二群的导线部的弯折部到所述另一端的长度长。
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