CN1495889A - 具有导管的高性能被动冷却装置 - Google Patents

具有导管的高性能被动冷却装置 Download PDF

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Publication number
CN1495889A
CN1495889A CNA031472486A CN03147248A CN1495889A CN 1495889 A CN1495889 A CN 1495889A CN A031472486 A CNA031472486 A CN A031472486A CN 03147248 A CN03147248 A CN 03147248A CN 1495889 A CN1495889 A CN 1495889A
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CN
China
Prior art keywords
stem
cooling device
airflow
passive cooling
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA031472486A
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English (en)
Chinese (zh)
Inventor
S
S·赫奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of CN1495889A publication Critical patent/CN1495889A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Air-Flow Control Members (AREA)
CNA031472486A 2002-09-10 2003-07-10 具有导管的高性能被动冷却装置 Pending CN1495889A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/238,144 US6631756B1 (en) 2002-09-10 2002-09-10 High performance passive cooling device with ducting
US10/238144 2002-09-10

Publications (1)

Publication Number Publication Date
CN1495889A true CN1495889A (zh) 2004-05-12

Family

ID=28791690

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA031472486A Pending CN1495889A (zh) 2002-09-10 2003-07-10 具有导管的高性能被动冷却装置

Country Status (5)

Country Link
US (1) US6631756B1 (enExample)
EP (1) EP1398833A3 (enExample)
JP (1) JP4078266B2 (enExample)
CN (1) CN1495889A (enExample)
TW (1) TWI290453B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714446A (zh) * 2009-10-01 2012-10-03 贝克曼考尔特公司 声音减弱的散热器和马达外壳
CN101970935B (zh) * 2007-12-07 2014-07-23 奥斯兰姆有限公司 散热装置以及包括散热装置的发光装置
CN112438003A (zh) * 2018-07-13 2021-03-02 Abb瑞士股份有限公司 用于高压开关设备的散热器
CN115195035A (zh) * 2021-04-01 2022-10-18 恩格尔奥地利有限公司 用于成型机的旋转设备

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US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US6779593B1 (en) * 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
US6789610B1 (en) * 2003-08-28 2004-09-14 Hewlett-Packard Development Company, L.P. High performance cooling device with vapor chamber
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
USD535737S1 (en) * 2004-08-09 2007-01-23 Jdu Jianjun CPU cooler
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
US7028757B1 (en) 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
TWM279917U (en) * 2005-07-06 2005-11-01 Delta Electronics Inc Heat dissipation device
USD535013S1 (en) * 2005-07-14 2007-01-09 Jianjun Du CPU cooler
USD604869S1 (en) 2006-09-14 2009-11-24 S.C. Johnson & Son, Inc. Candle holder
US20080149305A1 (en) * 2006-12-20 2008-06-26 Te-Chung Chen Heat Sink Structure for High Power LED Lamp
EP1998108B1 (en) * 2007-05-30 2015-04-29 OSRAM GmbH Cooling apparatus
TW200919165A (en) * 2007-10-17 2009-05-01 liang-he Chen Turbo-guiding type cooling apparatus
CN103322539B (zh) * 2013-06-21 2015-06-03 华南理工大学 Led球泡灯散热本体开小孔的散热器
CN103335290B (zh) * 2013-06-21 2015-12-02 华南理工大学 一种用于led球泡灯的散热器
TW202024553A (zh) * 2018-12-27 2020-07-01 圓剛科技股份有限公司 散熱裝置
US11204204B2 (en) * 2019-03-08 2021-12-21 Toyota Motor Engineering & Manufacturing North America, Inc. Acoustic absorber with integrated heat sink
CN112987465B (zh) * 2021-03-09 2022-10-04 深圳市火乐科技发展有限公司 散热装置及投影设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US6109340A (en) 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
US5946190A (en) 1997-08-29 1999-08-31 Hewlett-Packard Company Ducted high aspect ratio heatsink assembly
US6134108A (en) 1998-06-18 2000-10-17 Hewlett-Packard Company Apparatus and method for air-cooling an electronic assembly
US6205799B1 (en) 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
TW562395U (en) * 2000-09-26 2003-11-11 Foxconn Prec Components Co Ltd Heat dissipating device
USD464938S1 (en) * 2001-07-27 2002-10-29 Hewlett Packard Company High performance cooling device
US6505680B1 (en) * 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink
US6543522B1 (en) * 2001-10-31 2003-04-08 Hewlett-Packard Development Company, L.P. Arrayed fin cooler

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101970935B (zh) * 2007-12-07 2014-07-23 奥斯兰姆有限公司 散热装置以及包括散热装置的发光装置
CN102714446A (zh) * 2009-10-01 2012-10-03 贝克曼考尔特公司 声音减弱的散热器和马达外壳
US8951181B2 (en) 2009-10-01 2015-02-10 Beckman Coulter, Inc. Sound abating heat sink and motor housing
CN112438003A (zh) * 2018-07-13 2021-03-02 Abb瑞士股份有限公司 用于高压开关设备的散热器
US11521807B2 (en) 2018-07-13 2022-12-06 Abb Schweiz Ag Heat sink for a high voltage switchgear
CN115195035A (zh) * 2021-04-01 2022-10-18 恩格尔奥地利有限公司 用于成型机的旋转设备
US11975467B2 (en) 2021-04-01 2024-05-07 Engel Austria Gmbh Rotating apparatus for a tool part of a shaping machine
CN115195035B (zh) * 2021-04-01 2024-05-24 恩格尔奥地利有限公司 用于成型机的工具部件的旋转设备、成型机及其合模单元

Also Published As

Publication number Publication date
EP1398833A2 (en) 2004-03-17
US6631756B1 (en) 2003-10-14
TWI290453B (en) 2007-11-21
TW200404492A (en) 2004-03-16
JP4078266B2 (ja) 2008-04-23
JP2004104112A (ja) 2004-04-02
EP1398833A3 (en) 2005-03-16

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