CN1487783A - Manufacture of multilayer magnetic circuit board with built-in metal and resistor - Google Patents

Manufacture of multilayer magnetic circuit board with built-in metal and resistor Download PDF

Info

Publication number
CN1487783A
CN1487783A CNA021348812A CN02134881A CN1487783A CN 1487783 A CN1487783 A CN 1487783A CN A021348812 A CNA021348812 A CN A021348812A CN 02134881 A CN02134881 A CN 02134881A CN 1487783 A CN1487783 A CN 1487783A
Authority
CN
China
Prior art keywords
resistance
circuit board
resistor
built
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA021348812A
Other languages
Chinese (zh)
Inventor
谢凡荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN CHANG'AN YONGTOU HONGBAN CIRCUIT BOARD FACTORY
Original Assignee
DONGGUAN CHANG'AN YONGTOU HONGBAN CIRCUIT BOARD FACTORY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN CHANG'AN YONGTOU HONGBAN CIRCUIT BOARD FACTORY filed Critical DONGGUAN CHANG'AN YONGTOU HONGBAN CIRCUIT BOARD FACTORY
Priority to CNA021348812A priority Critical patent/CN1487783A/en
Publication of CN1487783A publication Critical patent/CN1487783A/en
Pending legal-status Critical Current

Links

Images

Abstract

The present invention relates to electronic product technology, and is the manufacture of multilayer magnetic circuit board with built-in metal and resistor. The manufacture includes following steps: pressing electrolytic copper foil with rough surface and plated Ni-P alloy onto Rogers 4000 magnetic board, etching the copper foil to form conducting circuits, further etching the conducting circuit to form Ni-P alloy resistors where they are needed, and final pressing Rogers 4400 magnetic adhering sheets and the etched Rogers 4000 magnetic board to make the multilayer magnetic circuit board. The circuit board of the present invention is suitalbe for use in high temperature and high frequency and its built-in resistor in stable in performance, long in service life and flexible in design and may be manufactured in several layers.

Description

The manufacture method of multilayer magnetic circuit board with built-in metal and resistor
Technical field:
The present invention relates to technical field of electronic products, refer in particular to a kind of manufacture method of multilayer magnetic circuit board with built-in metal and resistor.
Background technology:
The existing ceramic thick film resistor plate of Shi Yonging, it is that silk-screen, sintering make lead on pottery, adopt the way of silk-screen conductive paste to stamp resistance then, the resistance of the thick-film resistor of Zhi Zuoing is subjected to the influence of ambient temperature bigger in this way, resistance and conductive line surfaces contact position touch the bad resistance change that easily causes, especially multilayer technology complexity, material and facility costliness, production efficiency is low, and cost is expensive.
Summary of the invention:
The object of the present invention is to provide a kind of embedded resistors stable performance, the manufacture method of the multilayer magnetic circuit board with built-in metal and resistor of higher serviceability temperature and high frequency performance is arranged equally, its technological process is simple.
The present invention is achieved through the following technical solutions: the magnetic sticky piece that is filled with the Rogers4400 series of pottery in using earlier is crimped on the electrolytic copper foil that hair side is coated with one deck nickel-phosphorus alloy on the magnetic sheet of Rogers4000 series, then on above-mentioned electrolytic copper foil surface, etch the conducting wire earlier, copper according to the certain-length of specific location on the big young pathbreaker conducting wire of required resistance etches away again, the ni-p alloy coating that stays bottom is done resistance, and the resistance material of isolated area also etches away, the last plank that will etch resistance with the magnetic sticky piece of Rogers4400 series again is pressed into multi-layer sheet, simultaneously also can be on skin crimping resistance Copper Foil again, produce resistance at skin.
Resistance board after the described etching also can carry out resistance trimming with the laser resistor trimming device after brown oxidation or black oxidation handles.
Technological process of the present invention is:
The resistance material in the lamination → figure etching commentaries on classics → first time first time/take off film → etch isolates district → second time figure transfer → etching for the third time/take off film → brown oxidation (black oxidation) → outer layer process of lamination → common multi-layer PCB board
Its embedded resistors stable performance of circuit board, long service life that the present invention produces are applicable to high frequency; And the embedded resistors flexible design, but multilayer is buried resistance, technological process is simple, and production cost is low.
Description of drawings:
A four layers of buried resistor magnetic sheet schematic diagram that accompanying drawing 1 is produced for the present invention;
Accompanying drawing 2 is a production procedure schematic diagram of the present invention.
Embodiment:
The present invention includes following steps:
The magnetic sticky piece that is filled with the Rogers4400 series of pottery in a, the usefulness is crimped onto the electrolytic copper foil that hair side is coated with nickel-phosphorus alloy on the magnetic sheet of Rogers4000 series;
B, on above-mentioned electrolytic copper foil surface, etch the conducting wire earlier, copper according to the certain-length of specific location on the big young pathbreaker conducting wire of required resistance value etches away again, the ni-p alloy coating that stays bottom is as resistance, and the resistance material of isolated area also etches away;
C, the plank that will etch resistance with the magnetic sticky piece of Rogers4400 series again are pressed into multi-layer sheet.
See accompanying drawing 1,2, the magnetic sticky piece 1 that is filled with the Rogers4400 series of pottery in using earlier during production is crimped on the electrolytic copper foil 3 that hair side is coated with nickel-phosphorus alloy 2 on the magnetic sheet 4 of Rogers4000 series; Then shift with secondary image and make conducting wire and resistance with three etchings: figure transfer is the same with the etch process flow process with the figure transfer of ordinary circuit board with etching for the first time, by pressing sticking one deck light-sensitive surface against corrosion or applying wet film 5, produce common conducting wire through exposure, development, etching.After finishing etching for the first time, do not take off earlier film, etch away with the sulfuric acid solution of the copper sulphate of 80 ℃~90 ℃ 250G/L and 5ML/L nickel-phosphorus alloy 2 the lead isolated area, and then the film on the circuit that fades away.To take off plank behind the film presses again and is stained with one deck light-sensitive surface against corrosion or applies wet film 5, same with exposure, development, etching, take off the film flow process, etch away with the copper of alkaline etching liquid with the certain-length circuit on the conducting wire, the nickel-phosphorus alloy 2 that keeps bottom is done resistance usefulness.Nickel-phosphorus alloy resistance also can carry out resistance trimming with the laser resistor trimming device after brown oxidation or black oxidation handles, and the tolerance behind the resistance trimming is about 0.5%.This kind multilayer magnetic circuit board with built-in metal and resistor serviceability temperature height (TG:280 ℃), resistance value is highly stable, and the life-span is long, applicable to high frequency; While embedded resistors flexible design, but multilayer is buried resistance, its technological process is simple, and production cost is low.

Claims (3)

1, the manufacture method of multilayer magnetic circuit board with built-in metal and resistor, it is characterized in that: it includes following steps:
The magnetic sticky piece that is filled with the Rogers4400 series of pottery in a, the usefulness is crimped onto the electrolytic copper foil that hair side is coated with nickel-phosphorus alloy on the magnetic sheet of Rogers4000 series;
B, on above-mentioned electrolytic copper foil surface, etch the conducting wire earlier, copper according to the certain-length of specific location on the big young pathbreaker conducting wire of required resistance value etches away again, the ni-p alloy coating that stays bottom is as resistance, and the resistance material of isolated area also etches away;
C, the plank that will etch resistance with the magnetic sticky piece of Rogers4400 series again are pressed into multi-layer sheet.
2, the manufacture method of multilayer magnetic circuit board with built-in metal and resistor according to claim 1 is characterized in that: the resistance board after the described etching also can carry out resistance trimming with the laser resistor trimming device after brown oxidation or black oxidation handles.
3, the manufacture method of multilayer magnetic circuit board with built-in metal and resistor according to claim 1 is characterized in that: described step c also can be on skin when carrying out crimping resistance Copper Foil again, produce resistance at skin.
CNA021348812A 2002-09-30 2002-09-30 Manufacture of multilayer magnetic circuit board with built-in metal and resistor Pending CN1487783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA021348812A CN1487783A (en) 2002-09-30 2002-09-30 Manufacture of multilayer magnetic circuit board with built-in metal and resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA021348812A CN1487783A (en) 2002-09-30 2002-09-30 Manufacture of multilayer magnetic circuit board with built-in metal and resistor

Publications (1)

Publication Number Publication Date
CN1487783A true CN1487783A (en) 2004-04-07

Family

ID=34145991

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA021348812A Pending CN1487783A (en) 2002-09-30 2002-09-30 Manufacture of multilayer magnetic circuit board with built-in metal and resistor

Country Status (1)

Country Link
CN (1) CN1487783A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550637C (en) * 2006-12-12 2009-10-14 中国科学院物理研究所 A kind of magnetic materials logic circuit and manufacture method
CN107567185A (en) * 2017-08-25 2018-01-09 奇酷互联网络科技(深圳)有限公司 Board structure of circuit and preparation method thereof and electronic equipment
CN109733021A (en) * 2019-02-27 2019-05-10 浙江九通电子科技有限公司 Bury planar resistor Noryl glass cloth high-frequency multilayer backboard and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550637C (en) * 2006-12-12 2009-10-14 中国科学院物理研究所 A kind of magnetic materials logic circuit and manufacture method
CN107567185A (en) * 2017-08-25 2018-01-09 奇酷互联网络科技(深圳)有限公司 Board structure of circuit and preparation method thereof and electronic equipment
CN107567185B (en) * 2017-08-25 2020-11-24 奇酷互联网络科技(深圳)有限公司 Circuit board structure, preparation method thereof and electronic equipment
CN109733021A (en) * 2019-02-27 2019-05-10 浙江九通电子科技有限公司 Bury planar resistor Noryl glass cloth high-frequency multilayer backboard and preparation method thereof

Similar Documents

Publication Publication Date Title
US7521779B2 (en) Roughened printed circuit board
JP2008218966A (en) Method for manufacturing printed circuit board with built-in capacitor, and printed circuit board with built-in capacitor
CN110012605A (en) A kind of thickness copper hollow out window FPC production method
JP4984855B2 (en) Thin film chip resistor, thin film chip capacitor, and thin film chip inductor manufacturing method
CN1487783A (en) Manufacture of multilayer magnetic circuit board with built-in metal and resistor
CN107008004A (en) A kind of game paddle thin film switch and its manufacture method
US20070143991A1 (en) Method for the Production of a Circuit Board Element and Circuit Board Element
CN111475064B (en) Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device
JPH08138941A (en) Multilayer ceramic chip inductor and manufacture thereof
JPH04127492A (en) Material for printed wiring, manufacture thereof and printed wiring board
CN1090892C (en) Method for mfg. of double-side conductive metal foil type circuit board and products thereof
JPH0265194A (en) Manufacture of printed wiring board with thick film element
CN206181546U (en) Circuit board that contains aluminium etched circuit
CN213694262U (en) Substrate for printed circuit
JPH08279438A (en) Method of manufacturing ceramic multilayer electronic part
CN112186103B (en) Resistor structure and manufacturing method thereof
CN114245569B (en) LCP-based high-frequency ultrahigh-frequency flexible circuit board manufacturing method
TWI811014B (en) Thin film resistor and method for producing the same
CN104105346B (en) A kind of manufacture method with bump pad printed board
CN112735769B (en) Aluminum FPC (flexible printed circuit) type coil structure and manufacturing method thereof
JP2001085264A (en) Manufacture of laminated ceramic capacitor
CN2340146Y (en) Double-side metal film
CN213733795U (en) Copper-clad plate and copper-clad plate hot pressing assembly
CN102752961B (en) Method for manufacturing circuit substrate with smooth surface
JPH1041611A (en) Manufacture of printed wiring board and printed wiring board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication