CN1480724A - Method for bonding and encapsulating plastic biochip and its device - Google Patents
Method for bonding and encapsulating plastic biochip and its device Download PDFInfo
- Publication number
- CN1480724A CN1480724A CNA031283462A CN03128346A CN1480724A CN 1480724 A CN1480724 A CN 1480724A CN A031283462 A CNA031283462 A CN A031283462A CN 03128346 A CN03128346 A CN 03128346A CN 1480724 A CN1480724 A CN 1480724A
- Authority
- CN
- China
- Prior art keywords
- bonding
- laser
- vacuum suction
- chip
- fixed head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The method includes following steps: (1) aligning chip with close over and making plastic parts to be bonded contact tightly; (2) guiding laser beam to penetrate through transparent plastic layer to reach the location to be bonded, laser irradiation making plastic layer and coating layer be melted; (3) controlling time and intensity of laser energy, making congruent melting between two materials. The device includes laser light source system, laser beam transformation system, workpiece alignment platform, offset table, servo controller and microcomputer main control system. The advantages of the invention are fast heating up and small heat affected zone, easy to be controlled by computer, high efficiency and reliability.
Description
Technical field
The invention belongs to MEMS (micro electro mechanical system) (MEMS) technical field, be specifically related to a kind of bonding and method for packing and device thereof of plastic biochips.
Background technology
Processing technology based on non-silastomer material comes into one's own day by day in the research of micro flow chip and biochip MEMS, has formed the new biological MEMS device of a class.The plastics macromolecular material not only has the advantage with the biological molecular chemistry compatibility, and plastics kind is various, cheap, and be easy to realize the production of large-scale low-cost, overcome the expensive low-producing limitation of producing biological MEMS based on the processing technology of silicon or glass material by mold pressing, injection moulding and other reproduction technologies.
Along with the decline of biochip manufacturing cost, the shared proportion of packaging cost increases greatly.At present, the encapsulation of biochip is the same with other MEMS, remains and do some little improvement on the technology basis of microelectronic encapsulation, with some specific (special) requirements (as airtight, vacuum, liquid, rotation etc.) that adapt to MEMS, do not have versatility, do not form consistent standard yet.Therefore, with respect to the manufacturing technology of biochip and other microfluid systems, its little bonding, encapsulation and package technique are greatly backward.Bonding encapsulation and package technique that development is suitable for the low cost and high reliability of " poor-man chips " become the micro flow chip practicability and the industrialized task of top priority.
Traditional MEMS bonding method all is not suitable for the bonding and the encapsulation of biochip as methods such as anode linkage, fusion bonding and eutectic bondings.Because these methods are had relatively high expectations to the flatness on the surface of need bonding, and at high temperature could obtain enough bonded energies (Si-Si anode linkage: 300～450 ℃, the fusion bonding then needs＞1000 ℃, 363 ℃ of Si-Au bondings), obviously polymkeric substance can not bear so high temperature.Though gluing the connecing with ultrasonic bond of other two kinds of method UV photosensitive avoided temperature problem, bonding method is very strong to the dependence of the selectivity of adhesives and surface appearance thereof, do not have versatility, and ultrasonic bond is easy to shatter the micro element among the MEMS.Other are used for the plastics MEMS that the heating of general purpose plastics bonding method such as hot plate, fusion bonding methods such as vibration friction heating, resistance heated and induction heating are not suitable for microscale yet, because they generally all have the heat-affected zone to be difficult to control, easily to cause weak points such as heat distortion, bonding speed is slow and efficient is low.
L.W.Lin etc. have proposed after chip manufacturing is finished to adopt the local electrical resistance heating to make the regional area fusion bonding that needs bonding and other positions of chip are in the back method for packing of low-temperature condition.(L.W.Lin，″MEMS?Post-Packaging?by?Localized?Heating?and?Bonding，″IEEE?Trans.on?Advanced?Packaging，Vol?23，pp.608-616，Nov.2000)。But this method complex process has increased the operation of deposit micro-heater, and heat time heating time and difficult control of temperature, and the power-sharing of micro-heater is difficult to guarantee.This method and above-mentioned several classic methods are used for the encapsulation of biochip, all have possible pollution problem.
Summary of the invention
The purpose of this invention is to provide a kind of bonding and method for packing of plastic biochips, adopt this method, can realize that noncontact, low temperature and the low high speed spot heating bonding that pollutes of said chip encapsulates.
The device that the realization said method is provided of another object of the present invention is to satisfy the particularly requirement of the low cost and high reliability high efficiency of biological MEMS of MEMS.
For achieving the above object, a kind of bonding of plastic biochips and method for packing, with continuous or pulse near-infrared laser light source as the irradiation energy source, the parts that need bonding or be packaged together are thermoplastic components, wherein have at least parts transparent to optical maser wavelength, if two kinds of parts are all transparent to optical maser wavelength, then need to the steps include: at the coating of the position of two parts bondings or filling one deck absorbing membrane
(1) with behind chip and the capping aligning, making needs the plastic components of bonding closely to contact;
(2) the guiding laser beam penetrates clarity plastic layer to needing the bonding position, carries out laser irradiation, makes to absorb plastics or film coating and absorb fusion behind the energy, makes plastics fusion contacted with it subsequently;
(3) application time and the intensity of control laser energy make two kinds of materials reach congruent melting, and the heat-affected zone are controlled in the allowed band, and then natural cooling forms to ooze and melts the bonding zone.For realizing the bonding of high-accuracy high-efficiency rate, plastic biochips is preferably with the specific alignment mark, and the capping of bonding also has the alignment mark that is complementary with it.Another kind of form is that chip and capping produce the concavo-convex bonding structure line that has certain width and mate mutually by the means of duplicating such as hot pressing or casting, to realize autoregistration.In above-mentioned processing procedure, by visible light and infrared imaging method, obtain bonding process visual image and temperature colour temperature figure, by Computer Processing, bonding parameters such as laser power and processing time are carried out FEEDBACK CONTROL.
Realize the device of said method, comprise laser source system, laser beam transformation system, workpiece alignment platform, displacement platform, servo controller and microcomputer master control system.The laser that the laser optical origin system sends forms point, line or face laser beam through the optical beam transformation parts, acts on then on the plastic biochips on the work alignment stage; Alignment stage is fixed on the displacement platform, provide treat the bonding workpiece fixing, aim at and contact function; The displacement platform has x at least, and function is adjusted in y two axial translations; Servo controller links to each other with microcomputer master control system displacement platform, and it obtains instruction from the microcomputer master control system, the motion of control displacement platform.
The inventive method is compared with other spot heating bonding method, and its advantage is: laser is a kind of high-energy-density heating source that can produce controlled cross sectional shape and size by optical transform; Laser spot diameter after the focusing can be little to several～tens micron, the energy density height, be bonded absorbed after local heating fast, thereby the heat-affected zone is little, to parts are harmless on every side; Laser head can be away from the bonding workpiece, thereby light source heating system para-linkage material is pollution-free; Be easy to computer controlled automatic, the bonding speed height can reach the speed of several meters to tens meters of per minutes thereby efficient height.
Apparatus of the present invention and existing bonding apparatus relatively, have simple in structure, be easy to automatic control, bonding efficiency height and high reliability features.It is the fexible unit that is applicable to this class of plastic chip MEMS device bonding and encapsulation.
Description of drawings
Fig. 1 is a kind of laser bonding encapsulation synoptic diagram of plastics micro-fluid chip;
Fig. 2 is the another kind of laser bonding encapsulation synoptic diagram of plastics micro-fluid chip;
Fig. 3 is the universal architecture block diagram of a kind of implementation of apparatus of the present invention;
Fig. 4 is the structural representation of a kind of specific implementation of apparatus of the present invention;
Fig. 5 is a kind of chip and capping alignment stage;
Fig. 6 is the structural drawing of optical system in a kind of contrive equipment;
Fig. 7 is the profile scanning electromicroscopic photograph of PMMA plastic chip bonding.
Embodiment
Below in conjunction with accompanying drawing particular content of the present invention and embodiment are described in further detail.
With typical biochip plastics micro-fluid chip is example.In Fig. 1 (a), chip 10 and capping 11 utilize existing Micrometer-Nanometer Processing Technology or reproduction technology to make respectively.Capping 11 is used for sealing the miniflow groove 12 on the chip 10, avoids fluid to flow through or leaks into other zones, playing simultaneously to be hedged off from the outer world the protection chip and the effect of watch window is provided.In order to control the precision of bonding and encapsulation, in chip 10 and capping 11, make the alignment mark 13 and 14 that is complementary respectively, aim to make things convenient for bonding.Fig. 1 (B) has provided the synoptic diagram of laser bonding miniflow groove.Laser bonding is used for miniflow groove 12 peripheral regions of micro-fluid chip 10 and capping 11 bondings, realizes the sealing of miniflow groove.Incident laser 15 sees through transparent cover 11 heating by the plastic chip 10 with higher absorption rate.Utilize device for exerting that two plastics are closely contacted, then when the sufficiently high LASER HEATING energy of plastic chip 10 absorptions reaches its fusing point or a certain temperature more than the fusing point, also cause the surface of contact fusing on transparent cover 11 and the chip 10, the position of LASER HEATING forms congruent melting zone 16 on the surface of contact of two plastics like this.After LASER HEATING disappeared, the melting zone natural cooling solidified, and forms stable and firm bonding region.The heat-affected zone 15 that high-octane lf produces can be passed through the focused spot size of control laser beam and implement accurate control action time, thereby the size in whole laser effect district can be limited to below the 100 μ m.
Fig. 2 has provided the method for another kind of laser bonding.The moulding technology manufacturing is all adopted in micro flow chip 20 and capping 21.Their bonding surface for the treatment of all has the concavo-convex bonding line 22 that cooperatively interacts of certain width, generally is positioned near the miniflow groove 23.Concavo-convex bonding line 22 in chip 20 and the capping 21 is engaged, can realize autoregistration, need not alignment mark.Under pressure, chip 20 closely contacts with concavo-convex bonding line 22 in the capping 21.During laser bonding, the zone of action of laser is not only limited to the planar section of concaveconvex structure contact, and can extend to its both sides, makes the surface area of bonding bigger, and bond strength is higher, but the transverse area of bonding does not increase.Therefore, under reasonably designing, the diffusion of the heat-affected zone of laser bonding and molten stream can be limited in the bonding line, and is littler to the influence of peripheral region.
The structured flowchart of typical laser bonding and packaging system as shown in Figure 3.This device mainly is made up of laser source system 30, laser beam transformation system 31, workpiece (comprising chip and capping) alignment stage 33, binocular vision or CCD micro imaging system 32, automatically controlled displacement platform 34, thermal infrared imager temp measuring system 36 and microcomputer master control system 35 etc.The laser that sends from laser optical origin system 30 forms point, line or face laser beam through optical beam transformation parts 31, acts on then on the plastic chip on the alignment stage 33.Alignment stage 33 is fixed on the automatically controlled displacement platform 34 of multiaxis, provide treat the bonding workpiece fixing, aim at and contact function.Automatically controlled displacement platform 34 has x at least, and function is adjusted in y two axial translations.Servo controller 37 obtains instruction from microcomputer master control system 35, the motion of control displacement platform 34.Visual or CCD micro imaging system 32 provides the observation approach of workpiece alignment, bonding location and bonding situation.According to the different situations of point, line or face laser beam, laser beam beam shaping system 31 and micro-imaging optical system 32 can arranged coaxial, also can separate configurations.Infrared temperature measurement system 36 is measured the Temperature Distribution in bonding zone, and real-time monitoring information is provided, and feedback control signal is provided for laser source system 30, is used to adjust laser power.The bonding mode can have various ways, and promptly laser head is fixed, worktable scanning; Perhaps stationary table, laser head scanning; Perhaps use mask to limit the laser bonding spot size.
The process of bonding can be divided into aims at and bonding two big steps.Particularly, earlier chip and capping are loaded in respectively on two vacuum suction fixed heads of alignment stage 33, move one of them fixed head then along the vertical direction, make chip and capping near but do not contact.Obtain alignment mark image in chip and the capping respectively by binocular visor or CCD micro imaging system 32.If use CCD micro imaging system 32, alignment mark image on the workpiece such as can store earlier, the alignment mark image on another workpiece is obtained in focusing again, and horizontal adjustment moves alignment stage then, and first marking image of second marking image and storage is aimed at.Move alignment stage along the Z direction subsequently, two workpiece are in contact with one another, contact pressure shows after being obtained by pressure transducer.Under certain contact pressure, start laser, implement laser bonding.Bonding process is monitored in real time by CCD micro-imaging observing system.Utilize the thermal infrared imager temp measuring system to obtain the thermal map information of bonding process, and convert colour temperature figure to, by the temperature control unit preset temperature range in main control system, can FEEDBACK CONTROL laser energy and bonding speed, guarantee bonding quality.
The noncontact high speed localized heat source of the near-infrared laser Shu Zuowei plastic biochips that apparatus of the present invention employing semiconductor laser sends is different from traditional contact-type heating sources such as ultrasonic or resistance micro-heater.Semiconductor laser has the compact and the direct characteristics of High Speed Modulation.The semiconductor laser wavelength scope of choosing is preferably 0.7～1 μ m.Most of pure plastic materials all have higher transmittance at this wave band, it is moderate in the absorptivity of this wave band that but great majority add the plastics of coating and absorbing agent, the lf degree of depth is easy to reach tens microns, thereby the bond strength of thicker chip and capping and can be guaranteed to the sealing property of liquid.Reasonably design of Optical System can guarantee that laser focusing point beam diameter or Line beam width are controlled at below the 50 μ m.
Apparatus of the present invention can adopt thermal infrared imager temp measuring system 36 to implement multifunctional monitoring and FEEDBACK CONTROL.The infrared radiation that the plastics fusion produces in the laser bonding process sees through plastic closure or plastic-substrates is accepted by thermal infrared imager, forms thermal-induced imagery, and the Flame Image Process through the high speed signal processing unit is converted to colour temperature figure.The Temperature Distribution in the bonding zone that colour temperature figure provides has reflected the temperature variation of plastics fusions and the area size of heat affecting in real time.By temperature range and the heat affecting scope size that in Control Software, preestablishes fusion, can FEEDBACK CONTROL laser energy and bonding speed, thus the control bonding quality.In addition, be stored in after-action review and the analysis that colour temperature figure in the microcomputer also can be used for bonding quality.Be used for thermal infrared imager of the present invention for to have the non-refrigeration medium wave infrared focus plane thermal imaging system of higher response below 500 ℃.
The workpiece alignment platform 33 of apparatus of the present invention, employing CCD camera obtains the alignment mark information on the workpiece, and three aligning transfer tables are implemented to aim at, and pressure transducer provides workpiece contact pressure information, can realize that accurate the aligning contacts with the controlled of workpiece.This platform has stronger adaptability, goes for multiple bonding mode, fixes as laser head, automatically controlled worktable scanning; Perhaps stationary table, laser head scanning; Also be applicable to the situation of mask.
In the concrete process of implementing the laser bonding machine, different at laser bonding purpose and performance requirement, the laser bonding mode can adopt different configurations with optical system.Provide the configuration of several bonding modes below.
As a kind of preferred disposition of the present invention, Fig. 4 has provided some beam profile line sweep bonding apparatus synoptic diagram.This embodiment device is simple, is specially adapted to the application scenario of optical fiber coupling output miniwatt semiconductor laser.
In Fig. 4, it is 808nm that laser instrument adopts wavelength, the fiber coupled laser diode of power below 30W, optical fiber core diameter≤200 μ m.The laser that semiconductor laser 301 sends through optical fiber coupling output terminal 302 outgoing after the lens beam-expanding collimation, again after dichroscope 311 deflections by Focused Optical system 310, focus on the treating on the bonding workpiece of alignment stage 33.Micro imaging system is made up of ccd image sensor 321, micro-imaging light path 320 and industrial display 322.Laser focusing light path and CCD micro-imaging light path coaxial are configured in the lens barrel.Lens barrel can move to adjust operating distance along the z direction.In this configuration, laser head does not have mobile in the horizontal direction, and laser relies on the automatically controlled displacement platform 34 of servo controller 37 drivings to finish along the scanning of bonding outline line.Initiating key is fashionable after the chip aligning is finished, and main control microcomputer is given automatically controlled displacement platform and Laser Power Devices enabled instruction simultaneously by servo-control system, makes the bright dipping of laser and the synchronized movement of displacement platform.Because the focus point light beam is to carry out two-dimensional scan along outline line, therefore need not mask.The infrared radiation that the plastics fusion produces in the laser bonding process sees through plastic closure or plastic-substrates is accepted by thermal infrared imager 360, forms thermal-induced imagery, through signal processing unit 361 Flame Image Process, is converted to colour temperature figure.The Temperature Distribution in the bonding zone that colour temperature figure provides has reflected the temperature variation of plastics fusions and the area size of heat affecting in real time.The thermal infrared imager that is used for this embodiment is that wavelength is 320 * 240 yuan of infrared focus plane thermal imaging systems of non-refrigeration of 8～12 microns.
When using mask, choose the higher plastic material of heat radiation transmitance as substrate, thermal infrared imager is placed chip back one side.
Fig. 5 has provided the basic block diagram of alignment stage.Alignment stage by four little stroke transfer tables 40, go up vacuum suction fixed head 41, slidably descend the base plate 43, pressure transducer 44 of vacuum suction fixed head 42, band sliding tray and on four sides supporting walls 45 form.The base of pressure transducer 44 is fixed on the transfer table 40, the base plate 43 of its stress surface connecting band sliding tray.Following vacuum suction fixed head 42 can slide at dull and stereotyped upper edge sliding tray; Last vacuum suction fixed head 41 is positioned at the top of vacuum suction fixed head 42 down, is supported by the four sides supporting walls; Leave certain space between last vacuum suction fixed head 41 and the following vacuum suction fixed head 42, so that load chip 46 and capping 47.Capping 47 and chip 46 are individually fixed on the upper and lower vacuum suction fixed head 41,42.Last vacuum suction fixed head 41 adopts to be made visible light and near infrared light material transparent, as quartz glass and transparent organic glass.Following vacuum suction fixed head 42 can freely be twitched on the base plate 43 of band sliding tray, makes things convenient for the loading of chip.Last vacuum suction fixed head 41 is fastened on its two edges part on the supporting walls 45 by pair of metal press strip (not shown).Fastening bolt on the loosening pressing plate can be gone up vacuum suction fixed head 41 direction extraction from supporting walls 45 upper edges, the capping 47 of convenient loading.After chip 46 and capping 47 were fixing respectively, mobile z axle was adjusted their spacing, can make chip 46 and capping 47 reach near but discontiguous state.The composition lens 49 of mobile micro imaging system then obtains earlier the sharply defined image of the alignment mark of capping on display, after the storage, adjust micro-49 focal length again, makes at the sharply defined image that also obtains alignment mark on the chip 46 on the display.Adjust mobile platform, the picture of alignment mark all overlaps in the picture that makes quasi-mark on each chip and the corresponding capping, and mobile then z axle makes chip contact with capping, and the contact pressure reading on pressure transducer 44 reaches suitable value.Can implement laser bonding then.Under contour scanning bonding mode, alignment stage is fixed on the worktable 48.If laser head is motionless, and movable workbench, then alignment stage and worktable key and the time will move together.
The material that last vacuum suction fixed head uses is that visible light and the high material transparent of near infrared light are formed.
As another kind of preferred disposition of the present invention, Fig. 6 has provided the optical system synoptic diagram that produces Line beam laser in the Line beam scanning bonding apparatus.
In Fig. 6, the laser that each unit on one or more laser diode bar shaped arrays 40 placed side by side sends during through the solid or hollow rectangle glass waveguide 41 of certain-length will up and down and about constantly reflection and form the bar shaped light beam that distributes along duct width direction isocandela on four faces at the exit portal of waveguide, focus on back formation fillet shape Line beam 43 through post lens 42 again.Utilize photic zone definition bonding figure and light beam effect width on the mask.When Line beam along perpendicular to the beam direction one-dimensional scanning time, the beam energy bonding action travels through the rectangular area that a width is a Line beam length.Repeat this one-dimensional scanning process, can in very short time, travel through entire chip.The Line beam width generally requires at the hundreds of micron, greater than the width (4～5 times) of photic zone on the mask.This bonding mode is suitable for utilizing the occasion of High power laser diode array bonding large size chip.
In a kind of configuration in back, need to use mask to define the bonding zone.The use of mask has stopped the propagation of infrared emanation, thereby thermal infrared imager can not place front one side of chip again.A possible approach is that thermal infrared imager is placed chip back one side.Because heat radiation will see through thicker plastic-substrates, to consider that it should have higher transmittance at the medium wave infrared band when therefore selecting the substrate plastic material.
As a kind of embodiment, plastic chip is microfluid molding organic glass (PMMA) chip that two negative and positive cooperate.Wherein scribble absorption layer on the bonding line of chip piece.Typical absorption layer is black ink or the coating that is mixed with carbon black, uses miniature ink-jet apparatus to spray along bonding line.The laser instrument that is used for bonding is that wavelength is the semiconductor optical fiber coupling output laser of 808nm, and the focal beam spot diameter is 50 microns.Adopt some beam profile line sweep mode, bonding speed is adjustable second at 5～50mm/, regulates laser diode current and sweep velocity, can regulate laser power density, and the corresponding bonding width and the degree of depth also change.Parameters such as control laser power, laser spot size, bonding time and contact pressure make the bonding zone reach the eutectic temperature of two kinds of materials, then by natural cooling, form stable the oozing of required width that have and melt the bonding zone.
Fig. 7 is the profile scanning electromicroscopic photograph of PMMA chip bonding, and under the situation that has certain defocusing amount, the fusion width that laser bonding causes is about 120 microns.
Claims (10)
1, a kind of bonding of plastic biochips and method for packing, with continuous or pulse near-infrared laser light source as the irradiation energy source, the parts that need bonding or be packaged together are thermoplastic components, wherein have at least parts transparent to optical maser wavelength, if two kinds of parts are all transparent to optical maser wavelength, then need to the steps include: at the coating of the position of two parts bondings or filling one deck absorbing membrane
(1) with behind chip and the capping aligning, making needs the plastic components of bonding closely to contact;
(2) the guiding laser beam penetrates clarity plastic layer to needing the bonding position, carries out laser irradiation, makes to absorb plastics or film coating and absorb fusion behind the energy, makes plastics fusion contacted with it subsequently;
(3) application time and the intensity of control laser energy make two kinds of materials reach congruent melting, and the heat-affected zone are controlled in the allowed band, and then natural cooling forms to ooze and melts the bonding zone.
2, method according to claim 1, it is characterized in that: in above-mentioned processing procedure,, obtain bonding process visual image and temperature colour temperature figure respectively by visible light and infrared imaging method, by Computer Processing, bonding parameters such as laser power and processing time are carried out FEEDBACK CONTROL.
3, method according to claim 1 and 2 is characterized in that: plastic biochips has the specific alignment mark, and the capping of bonding also has the alignment mark that is complementary with it.
4, method according to claim 1 and 2 is characterized in that: the concavo-convex bonding structure line that is complementary that has certain width in chip of making by hot pressing or casting and the capping.
5, method according to claim 1 and 2 is characterized in that: the bonding laser instrument is a semiconductor laser, and wavelength coverage is 0.7～1 μ m, and laser focusing point beam diameter is below 50 μ m.
6, realize the device of the described method of claim 1, comprise laser source system (30), laser beam transformation system (31), workpiece alignment platform (33), displacement platform (34), servo controller (37) and microcomputer master control system (35); The laser that laser optical origin system (30) sends forms point, line or face laser beam through optical beam transformation parts (31), acts on then on the plastic biochips on the work alignment stage (33); Alignment stage (33) is fixed on the displacement platform (34), provide treat the bonding workpiece fixing, aim at and contact function; Displacement platform (34) has x at least, and function is adjusted in y two axial translations; Servo controller (37) links to each other with microcomputer master control system (35) displacement platform (34), and it obtains instruction from microcomputer master control system (35), the motion of control displacement platform (34).
7, device according to claim 6, it also comprise separate configurations or with the CCD micro imaging system (32) of laser beam transformation system (31) arranged coaxial, it provides the observation approach of workpiece alignment, bonding location and bonding situation.
8, according to claim 6 or 7 described devices, it is characterized in that: this device also comprises infrared temperature measurement system (36), it is connected between alignment stage (33) and the microcomputer master control system (35), be used to measure the Temperature Distribution in bonding zone, real-time monitoring information is provided, and feedback control signal is provided for laser source system (30), be used to adjust laser power.
9, according to claim 6 or 7 described devices, it is characterized in that: described alignment stage by the flat board of four little stroke transfer tables, pressure transducer, band sliding tray, slidably descend the vacuum suction fixed head, go up the vacuum suction fixed head and the four sides supporting walls is formed; Pressure sensor base is fixed on the transfer table, the flat board of connecting band sliding tray on its stress surface; Following vacuum suction fixed head can slide at dull and stereotyped upper edge sliding tray; Last vacuum suction fixed head is positioned at the top of vacuum suction fixed head down, is supported by the four sides supporting walls; Leave the space between last vacuum suction fixed head and the following vacuum suction fixed head, so that load chip and capping; The material that last vacuum suction fixed head uses is that visible light and the high material transparent of near infrared light are formed.
10, according to claim 6 or 7 described devices, it is characterized in that: described laser source system comprises one or more laser diodes, and it is placed side by side to be the bar shaped array, and solid or hollow rectangle glass waveguide is close to its surface of emission; Laser that each transmitter unit sends is during through glass waveguide, waveguide up and down and about constantly reflection and produce the bar shaped laser beam that distributes along duct width direction isocandela on four faces at the exit portal of waveguide, through forming fillet shape Line beam after the post lens focus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03128346 CN1209619C (en) | 2003-07-18 | 2003-07-18 | Method for bonding and encapsulating plastic biochip and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03128346 CN1209619C (en) | 2003-07-18 | 2003-07-18 | Method for bonding and encapsulating plastic biochip and its device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1480724A true CN1480724A (en) | 2004-03-10 |
| CN1209619C CN1209619C (en) | 2005-07-06 |
Family
ID=34153357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03128346 Expired - Fee Related CN1209619C (en) | 2003-07-18 | 2003-07-18 | Method for bonding and encapsulating plastic biochip and its device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1209619C (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102756474A (en) * | 2012-07-27 | 2012-10-31 | 苏州大学 | Bonding device for polymer microfluidic chip |
| CN102886281A (en) * | 2012-10-18 | 2013-01-23 | 哈尔滨工业大学 | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
| CN102945054A (en) * | 2012-10-12 | 2013-02-27 | 上海大学 | Photoelectric device encapsulation and laser bonding temperature collection and control system and method |
| CN103474588A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device and OLED packaging method |
| CN103474587A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device |
| CN105140158A (en) * | 2015-09-28 | 2015-12-09 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching non-uniformity |
| CN107195560A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser package system and method for IC-card |
| CN108311177A (en) * | 2018-01-15 | 2018-07-24 | 中国科学院上海微系统与信息技术研究所 | Align structures, alignment assemble method and application thereof for 3D PDMS facture of microchip |
| US10099218B2 (en) | 2015-11-19 | 2018-10-16 | Capitalbio Corporation | Method for manufacturing and/or packaging a chip |
| CN109164080A (en) * | 2018-09-29 | 2019-01-08 | 江苏瑞明生物科技有限公司 | Suitable for the lossless fluorescence detection spectrometer of cellular level |
| CN111133293A (en) * | 2017-07-24 | 2020-05-08 | 宽腾矽公司 | Hand-held large-scale parallel biological photoelectric instrument |
| CN111450909A (en) * | 2020-05-15 | 2020-07-28 | 北京隆庆智能激光装备有限公司 | Laser bonding equipment and method for glass-based microfluidic chip |
| CN114096905A (en) * | 2019-05-27 | 2022-02-25 | 先进微晶圆私人有限公司 | Improvements in or relating to photonic integrated circuits |
| CN114768895A (en) * | 2022-03-12 | 2022-07-22 | 北京化工大学 | Laser bonding method suitable for thermoplastic polymer material microfluidic chip |
| CN115483120A (en) * | 2022-08-04 | 2022-12-16 | 北京理工大学 | Micro-connection process based on laser ultrasonic coupling |
| US12123834B2 (en) | 2020-06-12 | 2024-10-22 | Quantum-Si Incorporated | Active-source-pixel, integrated device for rapid analysis of biological and chemical specimens |
-
2003
- 2003-07-18 CN CN 03128346 patent/CN1209619C/en not_active Expired - Fee Related
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102756474A (en) * | 2012-07-27 | 2012-10-31 | 苏州大学 | Bonding device for polymer microfluidic chip |
| CN102945054A (en) * | 2012-10-12 | 2013-02-27 | 上海大学 | Photoelectric device encapsulation and laser bonding temperature collection and control system and method |
| CN102886281A (en) * | 2012-10-18 | 2013-01-23 | 哈尔滨工业大学 | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
| CN103474588B (en) * | 2013-09-30 | 2016-04-13 | 上海大学 | OLED packaging system and OLED encapsulation method |
| CN103474588A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device and OLED packaging method |
| CN103474587A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device |
| CN103474587B (en) * | 2013-09-30 | 2015-12-02 | 上海大学 | OLED packaging system |
| CN105140158B (en) * | 2015-09-28 | 2018-10-16 | 北京七星华创电子股份有限公司 | A kind of heteropical device and method of improvement wafer corrosion |
| CN105140158A (en) * | 2015-09-28 | 2015-12-09 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching non-uniformity |
| US10099218B2 (en) | 2015-11-19 | 2018-10-16 | Capitalbio Corporation | Method for manufacturing and/or packaging a chip |
| CN107195560A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser package system and method for IC-card |
| US12078596B2 (en) | 2017-07-24 | 2024-09-03 | Quantum-Si Incorporated | Hand-held, massively-parallel, bio-optoelectronic instrument |
| CN111133293A (en) * | 2017-07-24 | 2020-05-08 | 宽腾矽公司 | Hand-held large-scale parallel biological photoelectric instrument |
| CN108311177A (en) * | 2018-01-15 | 2018-07-24 | 中国科学院上海微系统与信息技术研究所 | Align structures, alignment assemble method and application thereof for 3D PDMS facture of microchip |
| CN108311177B (en) * | 2018-01-15 | 2020-07-31 | 中国科学院上海微系统与信息技术研究所 | Manufacturing method of 3D PDMS micro-fluidic chip alignment assembly structure |
| CN109164080A (en) * | 2018-09-29 | 2019-01-08 | 江苏瑞明生物科技有限公司 | Suitable for the lossless fluorescence detection spectrometer of cellular level |
| CN114096905A (en) * | 2019-05-27 | 2022-02-25 | 先进微晶圆私人有限公司 | Improvements in or relating to photonic integrated circuits |
| CN111450909A (en) * | 2020-05-15 | 2020-07-28 | 北京隆庆智能激光装备有限公司 | Laser bonding equipment and method for glass-based microfluidic chip |
| US12123834B2 (en) | 2020-06-12 | 2024-10-22 | Quantum-Si Incorporated | Active-source-pixel, integrated device for rapid analysis of biological and chemical specimens |
| CN114768895A (en) * | 2022-03-12 | 2022-07-22 | 北京化工大学 | Laser bonding method suitable for thermoplastic polymer material microfluidic chip |
| CN115483120A (en) * | 2022-08-04 | 2022-12-16 | 北京理工大学 | Micro-connection process based on laser ultrasonic coupling |
| CN115483120B (en) * | 2022-08-04 | 2024-04-09 | 北京理工大学 | Micro-connection process based on laser ultrasonic coupling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1209619C (en) | 2005-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1209619C (en) | Method for bonding and encapsulating plastic biochip and its device | |
| JP6105781B2 (en) | Laser synchro welding process and equipment | |
| CN104968483B (en) | Laser engagement device and laser bonding | |
| CN102601529A (en) | Method for improving machining efficiency of micro-channel preparation through femtosecond laser | |
| CN101898419B (en) | Plastic laser welding method | |
| JP2000218698A (en) | Method and apparatus for bonding resins by laser | |
| JP2013031879A (en) | Processing of transparent material by ultra-short pulse laser | |
| CN201320841Y (en) | Optical-fiber laser welding device based on thermoplastics scanned through vibration mirrors | |
| CN208374472U (en) | A kind of the 3D printing laser and system of high-rate laser sintering | |
| CN110153417A (en) | A kind of laser formation equipment | |
| CN201033467Y (en) | Ultraviolet light solidifying fast-shaping equipment | |
| CN110756986A (en) | Method and device for preparing micro-lens array by laser-induced forward transfer | |
| CN102508324A (en) | Method and device for processing low-cost large Fresnel lens array | |
| CN110524874A (en) | Photocuring 3D printing device and its Method of printing | |
| CN207811563U (en) | A kind of multi-laser beam closes the device of beam welding glass material | |
| CN107738036B (en) | A method of uniform, controllable microlens structure is prepared using femtosecond laser | |
| CN105984128A (en) | Laser welding method for plastic | |
| CN111873436A (en) | Laser butt welding device and method for transparent plastic | |
| Nguyen et al. | Absorber-free quasi-simultaneous laser welding for microfluidic applications | |
| JP3167821B2 (en) | Stereolithography | |
| JP2010184490A (en) | Resin melt welding method by laser beam and resin melt welding apparatus by laser beam | |
| CN104785779A (en) | Laser scanning head, three-dimensional printing device and printing method | |
| CN104149241A (en) | Photo-curing molding device | |
| CN109203468A (en) | A kind of rapid photocuring 3D printing device | |
| CN215375455U (en) | Ultraviolet laser liquid self-driven platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |