CN208374472U - A kind of the 3D printing laser and system of high-rate laser sintering - Google Patents
A kind of the 3D printing laser and system of high-rate laser sintering Download PDFInfo
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- CN208374472U CN208374472U CN201820836247.0U CN201820836247U CN208374472U CN 208374472 U CN208374472 U CN 208374472U CN 201820836247 U CN201820836247 U CN 201820836247U CN 208374472 U CN208374472 U CN 208374472U
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- laser
- printing
- semiconductor optical
- optical amplifier
- sintered
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The utility model relates to laser sintered fields, and in particular to a kind of 3D printing laser of high-rate laser sintering.The 3D printing laser includes laser light source, beam splitter, semiconductor optical amplifier array and scanner, the laser light source transmitting laser beam is into beam splitter, and it is divided into multi-path laser light beam and is incident in the correspondence semiconductor optical amplifier of semiconductor optical amplifier array respectively, each laser beam is incident to the metal powder material of sintered surface using scanner, solidifies the metal powder material.The utility model further relates to 3D printing laser system.Using a light source, output light passes through semiconductor optical amplifier array, the completely the same multichannel light beam of available wavelength, it is laser sintered can to carry out simultaneously multiple focus points, and amplification of the realization to light source output power, processing efficiency is improved, and realize the good laser sintered solidification of consistency.
Description
Technical field
The utility model relates to laser sintered fields, and in particular to a kind of 3D printing laser of high-rate laser sintering and be
System.
Background technique
In LS (laser sintered, Laser Sintering) 3D printing technique, the light beam that laser issues focuses on burning section
Point is previously applied on the metal powder material for burning node under the irradiation of laser, complete point-by-point solidification to realize 3D printing at
Type.
With specific reference to Fig. 1, Fig. 1 is one layer of schematic diagram of the entire target part of laser sintered 3D printing, and entire part needs
Multilayer is wanted to realize.The laser that light source 110 exports, is scanned mirror 120, pointwise illumination is in equipotentials such as particle 1, particle 2 and particles 3
It sets, each particle forms a pixel of 3D printing, is needing cured particle point to open laser, is completing metal powder material
Solidification；Laser scanning surface forms one layer of target part after entire sintered surface, applies next layer of metal powder material later
Material, then completes next layer of sintering point by point again.
Meanwhile to improve the speed of laser sintered 3D printing, worked at the same time using multichannel light beam.Due to the environment of laser
Temperature influences the output wavelength of laser, and after the output wavelength of laser influences the solidification hardness of metal powder material and solidifies
Particle precision, i.e. the precision of 3D printing；It, can be due to each laser when being worked together using multiple lasers generation multichannel light beam
The variation of device temperature environment causes the non-uniform phenomenon of adjacent particle precision after printing.
Utility model content
The technical problem to be solved by the present invention is in view of the above drawbacks of the prior art, it is sharp provide a kind of high speed
The 3D printing laser and system of light sintering, the speed for solving laser sintered 3D printing are slow and more using the generation of multiple lasers
Road light beam can cause non-uniform phenomenon of adjacent particle precision etc. after printing to be asked due to the variation of each laser temperature environment
Topic.
The technical scheme adopted by the utility model to solve the technical problem is as follows: the 3D for providing a kind of high-rate laser sintering is beaten
Laser is printed, the 3D printing laser includes laser light source, beam splitter, semiconductor optical amplifier array and scanner,
The laser light source transmitting laser beam is divided into multi-path laser light beam and is incident to semiconductor light respectively into beam splitter
In the correspondence semiconductor optical amplifier of amplifier array, each laser beam is incident to the gold of sintered surface using scanner
Belong to dusty material, solidifies the metal powder material.
Wherein, preferred version is: the beam splitter includes a first input end and multiple first output ends, Mei Yisuo
It states the first output end to be aligned with the second input terminal of the corresponding semiconductor optical amplifier of semiconductor optical amplifier array, the laser
The laser beam of light source transmitting is incident to beam splitter by first input end, and carries out defeated from multiple first after laser beam splitter
Outlet exports respectively, reenters the second input terminal for being incident upon corresponding semiconductor optical amplifier.
Wherein, preferred version is: the beam splitter includes the reflecting surface of Partial coatings glass group, by incident laser
Light beam carries out light beam light splitting in the reflecting surface Jing Guo coated glass group.
Wherein, preferred version is: the beam splitter is planar optical waveguide splitter.
Wherein, preferred version is: the 3D printing laser includes more with the semiconductor optical amplifier array respectively
The power conditioning module of a semiconductor optical amplifier connection, the power conditioning module adjust each semiconductor optical amplifier respectively
Input current.
Wherein, preferred version is: the semiconductor optical amplifier array includes at least one control chip, each described
Chip is controlled at least provided with semiconductor image intensifer, the semiconductor optical amplifier array arrangement.
Wherein, preferred version is: the scanner includes reflecting mirror and motion module, and the motion module refers to according to processing
Enable the movement of the X-axis and Y-axis of control reflecting mirror.
Wherein, preferred version is: the metal laser that the 3D printing laser is suitable for selective laser melting is sintered 3D
Print system, or the metal laser sintering 3D printing system suitable for selective laser sintering.
The technical scheme adopted by the utility model to solve the technical problem is as follows: the 3D for providing a kind of high-rate laser sintering is beaten
Laser system is printed, the 3D printing laser system includes 3D printing laser and sintered surface, and the sintered surface includes preparatory
Coated in the metal powder material for burning node.
Wherein, preferred version is: the 3D printing laser system further includes the elevator for controlling sintered surface and vertically moving
Structure, and according to the lifting of processing progress realization sintered surface.
The beneficial effects of the utility model are that compared with prior art, the utility model is sharp by designing a kind of high speed
The 3D printing laser and system of light sintering, using a light source, output light passes through semiconductor optical amplifier array, available
The completely the same multichannel light beam of wavelength can carry out multiple focus points laser sintered simultaneously, and realize to light source output power
Amplification improves processing efficiency, and realizes the good laser sintered solidification of consistency；Simultaneously as laser beam is all from together
One light source, so the wavelength of input light is completely the same, this consistency is not influenced by ambient temperature.
Detailed description of the invention
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing:
Fig. 1 is existing 3D printing laser Hu structural schematic diagram；
Fig. 2 is the structural schematic diagram of the utility model 3D printing laser.
Specific embodiment
Now in conjunction with attached drawing, elaborate to the preferred embodiment of the utility model.
As shown in Fig. 2, the utility model provides a kind of preferred embodiment of the 3D printing laser of high-rate laser sintering.
A kind of 3D printing laser of high-rate laser sintering, the 3D printing laser include laser light source 210, light beam point
Road device 220, semiconductor optical amplifier array 230 and scanner 240, the laser light source 210 emit laser beam to light beam point
In road device 220, and it is divided into multi-path laser light beam and is incident to the correspondence semiconductor light of semiconductor optical amplifier array 230 respectively and put
In big device 231, each laser beam is incident to the metal powder material of sintered surface 201 using scanner 240, solidifies institute
State metal powder material.
Further, a kind of 3D printing laser system of high-rate laser sintering is provided, the 3D printing laser system includes
3D printing laser and sintered surface 201, the sintered surface 201 include being previously applied on the metal powder material for burning node 20
Material.
Specifically, laser light source 210 emits laser beam, and successively passes through beam splitter 220, semiconductor optical amplifier
Array 230 and scanner 240 are incident to the burning node 20 of sintered surface 201, burn and are pre-coated with metal powder material on node 20
Material, and solidify under the action of laser beam.And the laser beam that laser light source 210 emits is incident to beam splitter 220
Afterwards, multi-path laser light beam is projected in parallel, laser light splitting is realized, certainly, in beam splitter 220 and semiconductor optical amplifier array
Settable corresponding optical mirror slip between 230, such as collimation lens are incident to after assembling the laser beam of dispersion to semiconductor light
In the correspondence semiconductor optical amplifier 231 of amplifier array 230.And laser beam passes through semiconductor optical amplifier array 230
It realizes power adjustment, preferably improves the power of laser beam, convenient for sintering.And accurately different are swashed by scanner 240
Light light beam is incident to the burning node 20 of sintered surface 201, certainly, corresponding light is arranged between scanner 240 and sintered surface 201
Learn eyeglass, such as focusing lens, by the burning node 20 of laser beam focusing to sintered surface 201.
In the present embodiment, beam splitter 220 is also known as optical splitter, is one of passive device important in optical fiber link,
It is the optical fiber tandem device with multiple input terminals and multiple output ends.
The beam splitter 220 includes a first input end and multiple first output ends, each first output end
It is aligned with the second input terminal of the corresponding semiconductor optical amplifier 231 of semiconductor optical amplifier array 230, the laser light source
The laser beams of 210 transmittings are incident to beam splitter 220 by first input end, and carry out after laser beam splitter from multiple first
Output end exports respectively, reenters the second input terminal for being incident upon corresponding semiconductor optical amplifier 231.
And the beam splitter 220 of the present embodiment provides two schemes.
Scheme one, the beam splitter 220 include the reflecting surface of Partial coatings glass group, and incident laser beam is existed
Reflecting surface by coated glass group carries out light beam light splitting.
Scheme two, the beam splitter 220 are planar optical waveguide splitter.Planar optical waveguide splitter uses semiconductor
Technique (technologies such as photoetching, burn into development) production, optical waveguide array are located at the upper surface of chip, and branch function is integrated in chip
On, that is, the branches such as 1,1 are realized on a chip；Then, couple input and output end are distinguished at chip both ends
Multi-channel optical fiber array is simultaneously packaged.
In the present embodiment, semiconductor optical amplifier 231 is a kind of luminescent device, and semiconductor laser structure is used as and puts
The device that big device uses is because with band structure its gain bandwidth is than using the wide of fiber amplifier.Wherein, it partly leads
Shining for body can be divided into luminescence generated by light, electroluminescent and cathodoluminescence etc. according to the difference of mode of excitation.Luminescence generated by light refers to use
The optical absorption of semiconductor generates nonequilibrium carrier, the process that actually a kind of light is converted to another light.It is electroluminescent
It shines and refers to and nonequilibrium carrier electrically directly infuse to people into semiconductor and generate and shine, this is often by means of PN junction
It completes.
The 3D printing laser includes multiple semiconductor optical amplifications with the semiconductor optical amplifier array 230 respectively
The power conditioning module that device 231 connects, the power conditioning module adjust the input electricity of each semiconductor optical amplifier 231 respectively
Stream.
Further, the semiconductor optical amplifier array 230 includes at least one control chip, each control
Chip at least provided with semiconductor image intensifer 231, arrange by the semiconductor optical amplifier array 230.
In the present embodiment, the scanner 240 includes reflecting mirror and motion module, and the motion module refers to according to processing
Enable the movement of the X-axis and Y-axis of control reflecting mirror.
Wherein, the namely laser scanner 240 of scanner 240, is also laser galvanometer, and by X-Y optical scanning head, electronics is driven
Dynamic amplifier and optical reflecting lens composition.The signal that computer controller provides passes through the optical scanner of drive amplification circuit drives
Head, thus in the deflection of X-Y plane control laser beam.And scan pattern is two-dimensional effects pattern, so scan module uses
X, two motor controls of Y, a moment determine the position of a point, are reached by the position that scan frequency controls different moments point
The transformation of entire scan pattern, the lower pattern flickers of scan frequency (speed) are more obvious, can be managed with the principle of film
Solution.
In the present embodiment, the metal laser that the 3D printing laser is suitable for selective laser melting is sintered 3D printing
System, or the metal laser sintering 3D printing system suitable for selective laser sintering.
Wherein, SLM:Selective laser melting (selective laser melting), one kind of increasing material manufacturing, metal
The rapid shaping technique of powder is gone out with its energy straight forming close to complete consistency, the metal parts of good mechanical properties.SLM
Technology overcomes selective laser sintering (Selective Laser Sintering.SLS) technology manufactures metal parts technique mistake
The puzzlement of journey complexity；And selective laser sintering is that SLS method uses infrared laser to make the energy, the Modeling Material used is more
For dusty material.When processing, powder is preheating to the temperature of slightly less than its fusing point first, it then will under the action of striking off rod
Powder is paved；Laser beam under the control of the computer according to layering cross section information be selectively sintered, one layer after the completion again into
Next layer of sintering of row, removes extra powder after being all sintered, then can be obtained by a part sintered.
In the present embodiment, the 3D printing laser system further includes the elevator for controlling sintered surface 201 and vertically moving
Structure, and according to the lifting of processing progress realization sintered surface 201.
As described above, only the best embodiment of the utility model is not intended to limit the scope of the utility model,
All equivalent change or modifications made according to the patent scope of the utility model are all that the utility model is covered.
Claims (10)
1. a kind of 3D printing laser of high-rate laser sintering, it is characterised in that: the 3D printing laser include laser light source,
Beam splitter, semiconductor optical amplifier array and scanner, the laser light source emit laser beam into beam splitter,
And be divided into multi-path laser light beam and be incident in the correspondence semiconductor optical amplifier of semiconductor optical amplifier array respectively, using
Each laser beam is incident to the metal powder material of sintered surface by scanner, solidifies the metal powder material.
2. 3D printing laser according to claim 1, it is characterised in that: the beam splitter includes one first input
End and multiple first output ends, the corresponding semiconductor optical amplifier of each first output end and semiconductor optical amplifier array
The alignment of the second input terminal, the laser beam of laser light source transmitting is incident to beam splitter by first input end, and
It is exported respectively after carrying out laser beam splitter from multiple first output ends, reenters the second input for being incident upon corresponding semiconductor optical amplifier
End.
3. 3D printing laser according to claim 2, it is characterised in that: the beam splitter includes Partial coatings glass
Incident laser beam is carried out light beam light splitting in the reflecting surface Jing Guo coated glass group by the reflecting surface of glass group.
4. 3D printing laser according to claim 2, it is characterised in that: the beam splitter is planar optical waveguide point
Road device.
5. 3D printing laser according to claim 1, it is characterised in that: the 3D printing laser include respectively with institute
State the power conditioning module of multiple semiconductor optical amplifiers connection of semiconductor optical amplifier array, the power conditioning module point
The input current of each semiconductor optical amplifier is not adjusted.
6. 3D printing laser according to claim 5, it is characterised in that: the semiconductor optical amplifier array packet
At least one control chip is included, each control chip is at least provided with semiconductor image intensifer, the semiconductor optical amplification
Device array arrangement.
7. 3D printing laser according to claim 1, it is characterised in that: the scanner includes reflecting mirror and movement mould
Block, the motion module control the movement of the X-axis and Y-axis of reflecting mirror according to Machining Instruction.
8. 3D printing laser according to any one of claims 1 to 7, it is characterised in that: the 3D printing laser is applicable in
It is sintered 3D printing system in the metal laser of selective laser melting, or the metal laser suitable for selective laser sintering is burnt
Tie 3D printing system.
9. a kind of 3D printing laser system of high-rate laser sintering, it is characterised in that: the 3D printing laser system includes as weighed
Benefit requires 1 to 8 any the 3D printing laser and sintered surface, and the sintered surface includes being previously applied on to burn node
Metal powder material.
10. 3D printing laser system according to claim 9, it is characterised in that: the 3D printing laser system further includes
The elevating mechanism that control sintered surface vertically moves, and according to the lifting of processing progress realization sintered surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820836247.0U CN208374472U (en) | 2018-05-31 | 2018-05-31 | A kind of the 3D printing laser and system of high-rate laser sintering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820836247.0U CN208374472U (en) | 2018-05-31 | 2018-05-31 | A kind of the 3D printing laser and system of high-rate laser sintering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208374472U true CN208374472U (en) | 2019-01-15 |
Family
ID=64968798
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820836247.0U Expired - Fee Related CN208374472U (en) | 2018-05-31 | 2018-05-31 | A kind of the 3D printing laser and system of high-rate laser sintering |
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| Country | Link |
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| CN (1) | CN208374472U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986079A (en) * | 2019-03-29 | 2019-07-09 | 西北大学 | Laser linear array 3D metallic print machine and its file conversion, print control program |
| CN110389121A (en) * | 2019-07-24 | 2019-10-29 | 中国科学院半导体研究所 | Multifocal Structured Illumination fluoroscopic imaging systems |
| CN110434333A (en) * | 2019-08-13 | 2019-11-12 | 浙江工业大学 | A kind of face forming metal increasing material manufacturing method |
| CN110497618A (en) * | 2019-08-05 | 2019-11-26 | 湖南华曙高科技有限责任公司 | Light path system and 3D printing equipment for 3 D-printing |
| CN112793155A (en) * | 2020-12-18 | 2021-05-14 | 华南理工大学 | Cartilage repair device and method adopting parallel mechanical arm 3D printing |
| CN112846238A (en) * | 2020-12-30 | 2021-05-28 | 同济大学 | Metal surface exposure type powder bed melting additive manufacturing system |
| CN112993732A (en) * | 2019-12-17 | 2021-06-18 | 华为技术有限公司 | Optical amplification device and signal amplification method by using same |
-
2018
- 2018-05-31 CN CN201820836247.0U patent/CN208374472U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986079A (en) * | 2019-03-29 | 2019-07-09 | 西北大学 | Laser linear array 3D metallic print machine and its file conversion, print control program |
| CN109986079B (en) * | 2019-03-29 | 2020-04-14 | 西北大学 | Laser linear array 3D metal printer and file conversion and printing control method thereof |
| CN110389121A (en) * | 2019-07-24 | 2019-10-29 | 中国科学院半导体研究所 | Multifocal Structured Illumination fluoroscopic imaging systems |
| CN110497618A (en) * | 2019-08-05 | 2019-11-26 | 湖南华曙高科技有限责任公司 | Light path system and 3D printing equipment for 3 D-printing |
| CN110497618B (en) * | 2019-08-05 | 2021-06-01 | 湖南华曙高科技有限责任公司 | Optical path system for three-dimensional printing and three-dimensional printing equipment |
| CN110434333A (en) * | 2019-08-13 | 2019-11-12 | 浙江工业大学 | A kind of face forming metal increasing material manufacturing method |
| CN110434333B (en) * | 2019-08-13 | 2021-11-23 | 浙江工业大学 | Surface-forming metal additive manufacturing method |
| CN112993732A (en) * | 2019-12-17 | 2021-06-18 | 华为技术有限公司 | Optical amplification device and signal amplification method by using same |
| CN112793155A (en) * | 2020-12-18 | 2021-05-14 | 华南理工大学 | Cartilage repair device and method adopting parallel mechanical arm 3D printing |
| CN112793155B (en) * | 2020-12-18 | 2022-06-24 | 华南理工大学 | Cartilage repair device and method adopting parallel mechanical arm 3D printing |
| CN112846238A (en) * | 2020-12-30 | 2021-05-28 | 同济大学 | Metal surface exposure type powder bed melting additive manufacturing system |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 Termination date: 20200531 |