CN1468162A - 包括填充的半透明区域的抛光垫 - Google Patents

包括填充的半透明区域的抛光垫 Download PDF

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Publication number
CN1468162A
CN1468162A CNA018169481A CN01816948A CN1468162A CN 1468162 A CN1468162 A CN 1468162A CN A018169481 A CNA018169481 A CN A018169481A CN 01816948 A CN01816948 A CN 01816948A CN 1468162 A CN1468162 A CN 1468162A
Authority
CN
China
Prior art keywords
polishing pad
filler
matrix polymer
translucent
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA018169481A
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English (en)
Chinese (zh)
Inventor
J������Ŧ��
凯利·J·纽厄尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cabot Corp
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN1468162A publication Critical patent/CN1468162A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
CNA018169481A 2000-10-06 2001-09-20 包括填充的半透明区域的抛光垫 Pending CN1468162A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23886200P 2000-10-06 2000-10-06
US60/238,862 2000-10-06

Publications (1)

Publication Number Publication Date
CN1468162A true CN1468162A (zh) 2004-01-14

Family

ID=22899630

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA018169481A Pending CN1468162A (zh) 2000-10-06 2001-09-20 包括填充的半透明区域的抛光垫

Country Status (7)

Country Link
US (1) US6537134B2 (https=)
EP (1) EP1324858A1 (https=)
JP (1) JP2004511108A (https=)
CN (1) CN1468162A (https=)
AU (1) AU2001291143A1 (https=)
TW (1) TW531467B (https=)
WO (1) WO2002030617A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100493847C (zh) * 2004-03-25 2009-06-03 卡伯特微电子公司 包含疏水区及终点检测口的抛光垫
CN100562402C (zh) * 2004-03-23 2009-11-25 卡伯特微电子公司 低表面能的化学机械抛光垫
CN1934208B (zh) * 2004-03-23 2011-08-10 卡伯特微电子公司 具有成分填充孔的多孔化学机械抛光垫
CN107685281A (zh) * 2016-08-04 2018-02-13 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法

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US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
KR100771738B1 (ko) * 2003-04-03 2007-10-30 히다치 가세고교 가부시끼가이샤 연마패드, 그 제조방법 및 그것을 이용한 연마방법
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
US20070294090A1 (en) * 2006-06-20 2007-12-20 Xerox Corporation Automated repair analysis using a bundled rule-based system
WO2011059498A1 (en) 2009-11-11 2011-05-19 Nuvasive, Inc. Surgical access system and related methods
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100562402C (zh) * 2004-03-23 2009-11-25 卡伯特微电子公司 低表面能的化学机械抛光垫
CN1934208B (zh) * 2004-03-23 2011-08-10 卡伯特微电子公司 具有成分填充孔的多孔化学机械抛光垫
CN100493847C (zh) * 2004-03-25 2009-06-03 卡伯特微电子公司 包含疏水区及终点检测口的抛光垫
CN107685281A (zh) * 2016-08-04 2018-02-13 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法
CN107685281B (zh) * 2016-08-04 2019-06-04 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法

Also Published As

Publication number Publication date
AU2001291143A1 (en) 2002-04-22
US20020049033A1 (en) 2002-04-25
TW531467B (en) 2003-05-11
WO2002030617A1 (en) 2002-04-18
JP2004511108A (ja) 2004-04-08
EP1324858A1 (en) 2003-07-09
US6537134B2 (en) 2003-03-25

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication